EP2897997A1 - Präpolymer-schlagfestmacher für rissbeständige kleber für windmühlen - Google Patents

Präpolymer-schlagfestmacher für rissbeständige kleber für windmühlen

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Publication number
EP2897997A1
EP2897997A1 EP13766518.8A EP13766518A EP2897997A1 EP 2897997 A1 EP2897997 A1 EP 2897997A1 EP 13766518 A EP13766518 A EP 13766518A EP 2897997 A1 EP2897997 A1 EP 2897997A1
Authority
EP
European Patent Office
Prior art keywords
bisphenol
epoxy resin
formula
composition according
iii
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13766518.8A
Other languages
German (de)
English (en)
French (fr)
Inventor
Ulrich Gerber
Jürgen Finter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sika Technology AG
Original Assignee
Sika Technology AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sika Technology AG filed Critical Sika Technology AG
Priority to EP13766518.8A priority Critical patent/EP2897997A1/de
Publication of EP2897997A1 publication Critical patent/EP2897997A1/de
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6666—Compounds of group C08G18/48 or C08G18/52
    • C08G18/667—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
    • C08G18/6674—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/58—Epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
    • C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
    • C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks

Definitions

  • the invention relates to a composition containing a prepolymer impact modifier, a process for its preparation and its use as a toughener-containing A component of a 2K epoxy resin adhesive, which is particularly suitable for adhesive applications in windmills.
  • liquid rubber as impact modifier in epoxy resins, wherein the liquid rubber is a carboxyl- or epoxide-terminated acrylonitrile / butadiene copolymer or a derivative thereof (CTBN, CTBNX or ETBN).
  • thermosetting epoxy resin compositions having improved impact resistance by using an epoxy group-terminated impact modifier in the epoxy adhesive, wherein the impact modifier is obtained by reacting an isocyanate-terminated prepolymer with hydroxy-terminated epoxy compounds.
  • EP 1 972 646 A1 discloses epoxy group-terminated polyurethane polymers in which a prepolymer is first prepared from a di- / triisocyanate, a polymer polypol and an alkoxylated bisphenol, which is then reacted with an epoxide compound containing a primary or secondary hydroxyl group. These are used as impact modifiers in epoxy resin compositions, especially in adhesive compositions.
  • DE 41 29 936 A1 discloses a moisture-curable polyurethane resin composition containing in mixed form a urethane prepolymer prepared from a polyol reactant and a polyisocyanate, a catalyst for accelerating the moisture-induced curing of the composition and a stabilizer.
  • adhesive applications for windmill rotor blades there are high requirements for crack resistance and impact strength of the adhesive. Windmill rotor blades can be up to 60 meters in size, resulting in an adhesive requirement of up to 500 kg. Therefore, the cost of the adhesive is a factor not to be underestimated.
  • Epoxy rubbers based on CTBN used. These are quite expensive and the mechanical resistance leaves something to be desired. Epoxy adhesives with core / shell polymers are also used. But they have a high viscosity, which makes the application difficult, and are also quite expensive.
  • the solution should be economical.
  • composition comprising A) a chain-extended prepolymer obtainable from the reaction of
  • the composition containing the prepolymer impact modifier can be made relatively inexpensively and gives as the A component of a 2K epoxy adhesive cured materials having excellent mechanical properties, particularly high crack resistance (> 3% elongation). Due to the chain extension, an improved modulus of elasticity can be achieved. Further, the composition can be formulated with a relatively low viscosity so that it is easy to process, and yet exhibits the excellent mechanical properties. In the following, the invention will be explained in detail.
  • Prepolymers are oligomeric or even self-polymeric compounds which serve as precursors or intermediates for the synthesis of higher molecular weight substances.
  • the prefix poly in terms such as polyol or polyisocyanate means that the compound has two or more of the named groups, a polyol is thus a compound having two or more hydroxy groups.
  • the composition of the invention contains a chain extended prepolymer which is useful as a toughening agent.
  • the prepolymers are also referred to as polyurethane polymers or PU polymers.
  • the prepolymer is the reaction product of components a), b) and c) and optionally component d). If component d) is not used, an isocyanate-group-terminated prepolymer is obtained. When using the optional component d), the isocyanate end groups of the prepolymer is completely or preferably partially blocked, so that a completely or preferably partially epoxy-terminated prepolymer can be obtained.
  • the compounds of the formula (I) which carry XiH groups may be prepolymers or polymers.
  • One or more polymers of formula (I) may be used.
  • Preferred compounds of the formula (I) are polyols, for example the following commercially available polyols or any mixtures thereof:
  • Polyoxyalkylenpolyole also called polyether polyols, which are the polymerization of ethylene oxide, 1,2-propylene oxide, 1,2- or 2,3-butylene oxide, tetrahydrofuran or mixtures thereof, optionally polymerized using a starter molecule having two or three active H Atoms such as water or compounds with two or three OH groups.
  • a starter molecule having two or three active H Atoms such as water or compounds with two or three OH groups.
  • Both polyoxyalkylene polyols having a low degree of unsaturation (measured according to ASTM D-2849-69 and expressed in milliequivalents of unsaturation per gram of polyol (meq / g)) prepared, for example, with the aid of so-called double metal cyanide complex catalysts (abbreviated to DMC) can be used.
  • DMC double metal cyanide complex catalysts
  • Catalysts as well as polyoxyalkylene polyols having a higher degree of unsaturation, prepared for example with the aid of anionic catalysts such as NaOH, KOH or alkali metal alkoxides.
  • anionic catalysts such as NaOH, KOH or alkali metal alkoxides.
  • polyoxypropylene diols and triols in particular having a degree of unsaturation of less than 0.02 meq / g and / or having a molecular weight in the range from 1000 to 30,000 g / mol, polyoxybutylene diols and triols, polyoxypropylene diols and triols, especially one Molecular weight of 400 to 8,000 g / mol, as well as so-called "EO-endcapped” (provided with ethylene oxide-terminated) Polyoxypropylendiole or triols.
  • the latter are special polyoxypropylene polyoxyethylene polyols which are obtained, for example, by xoxy
  • Polyester polyols prepared, for example, from dihydric to trihydric alcohols, for example 1,2-ethanediol, diethylene glycol, 1,2-propanediol, dipropylene glycol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, neopentyl glycol, glycerol, 1,1,1-trimethylolpropane or mixtures of the abovementioned alcohols with organic dicarboxylic acids or their anhydrides or esters such as succinic acid, glutaric acid, adipic acid, suberic acid, sebacic acid, dodecanedicarboxylic acid, maleic acid, fumaric acid, phthalic acid, isophthalic acid, terephthalic acid and hexahydroic acid. Phthalic acid or mixtures of the aforementioned acids, as well as polyester polyols from lactones such as ⁇ -caprolactone
  • Polycarbonatepolyols as they are accessible by reacting, for example, the abovementioned alcohols used to build up the polyesterpolyols with dialkyl carbonates, diaryl carbonates or phosgene.
  • Preferred compounds of the formula (I) are ⁇ , ⁇ -polyalkylene glycols having C 2 -C 6 -alkylene groups or having mixed C 2 -C 6 -alkylene groups which are terminated by amino, thiol or hydroxyl groups, preferably hydroxyl groups.
  • polyether polyols such as polyethylene glycols, polypropylene glycols, polytetrahydrofurans, polyethylene glycol-polypropylene glycol block polymers and polybutylene glycols, polybutadiene polyols, such as hydroxyl-terminated polybutadiene and hydroxyl-terminated polybutadiene-co-acrylonitrile, hydroxyl-terminated synthetic rubbers, polyester polyols, polycarbonate polyols, amine-terminated polyethers such as polyvinyl lyetheramine with two, three or four amine (for example, Jeffamine ®), and mixtures thereof, polyether polyols are particularly preferred.
  • the compounds of the formula (I) carrying XiH groups are di- or higher-functional polyols having OH equivalent weights of 600 to 6,000 g / OH equivalent, preferably 700 to 2,200 g / OH equivalent.
  • the molecular weight of the polymers of the formula (I) used can vary within wide ranges. For example, they preferably have a weight average molecular weight (Mw), for example determined by light scattering, of less than 15,000, preferably zugt less than 4,000, for example in the range of about 1,500 to 3,000, especially 1,500 to 2,500 on.
  • Suitable polyethers are, for example, the commercially available polytetrahydrofuran such.
  • PolyTHF® from BASF such as PolyTHF®1800 PolyTHF®2000 or PolyTHF®2800, or polypropylene oxides such as Caradol® from Shell or Acclaim® from Bayer.
  • one or more polyisocyanates of the formula (II) are ⁇ sets
  • Suitable polyisocyanates of the formula (II) are diisocyanates or triisocyanates.
  • Ge ⁇ suitable diisocyanates are aliphatic, cycloaliphatic, aromatic or aliphatic ⁇ specific diisocyanates, especially commercial products such as Methylendiphenyldiiso- diisocyanate (MDI), hexamethylene diisocyanate (HDI), toluene diisocyanate (TDI), Tolidindi- diisocyanate (TODI), isophorone diisocyanate (IPDI), trimethylhexamethylene diisocyanate (TMDI), 2,5- or 2,6-bis (isocyanatomethyl) bicyclo [2.2.1] heptane, 1,5-naphthalene diisocyanate (NDI), dicyclohexylmethyl diisocyanate (Hi 2 MDI), p-phenylene diisocyanate (PPDI ), m-tetramethyl
  • Suitable triisocyanates are trimers or biurets of aliphatic, cycloali phatic ⁇ , aromatic or araliphatic diisocyanates, in particular the cyanurates and biurets of the diisocyanates described iso- the previous paragraph.
  • a further possibility for Yi in the formula (I) are residues of chain-extended Mole ⁇ cules after removal of XIh groups which formally by a reaction similar to the reaction between the above-mentioned diols or triols and / or di- or triamines and the already mentioned di- or triisocyanates are available. This is achieved by varying the stoichiometry of the reactants.
  • component c) an alkoxylated bisphenol is used as a chain extender.
  • Bisphenols are a well-known class of compounds bearing two hydroxyphenyl groups. In other words, have bisphenols two on via a hydrocarbon ⁇ -bonding connected phenol rings.
  • the hydroxy groups of the phenyl group are each in the para position to the hydrocarbon bridge and this is also preferred. However, the hydroxyl group may also be in the ortho or meta position to Brü ⁇ bridge.
  • the hydrocarbon bridge may be a complex bridge such as a diisopropylbenzene group, but is usually an unsubstituted, mono- or disubstituted methylene group.
  • Suitable substituents for the Methylengrup ⁇ pe include alkyl groups, particularly Ci -4 alkyl, such as methyl and ethyl, aryl such as phenyl, or with one or more Ci -4 alkyl substituted phenyl, and cycloalkylidene groups such as fluorenylidene, cyclohexylidene, and with a or more alkyl-substituted cyclohexylidene.
  • the phenyl groups may carry one or more further substituent in addition to the hydroxy group, for example, Ci -4 alkyl, such as methyl, ethyl, isopropyl and isobutyl, cycloalkyl such as cyclohexyl, or aryl such as phenyl.
  • the bisphenol is preferably bisphenol F or a derivative thereof, bisphenol F derivatives being substituted on the methylene group and / or on the phenyl groups, for example with one or more of the abovementioned substituents.
  • an alkoxylated bisphenol is used.
  • alkoxylation of hydroxyl groups is a common reaction in chemistry in which alkylene oxide adducts of the compounds bearing hydroxyl groups are formed. It is possible to use all customary alkylene oxide adducts of bisphenols, such as ethylene oxide, propylene oxide or butylene oxide adducts (1,2-butylene oxide or 2,3-butylene oxide) or mixtures thereof. Preference is given to ethoxylated bisphenols. It is possible to use mono- or dialkoxylated bisphenols, dialkoxylated bisphenols being preferred, ie in each case at least one alkylene oxide is added to both hydroxy groups.
  • the alkoxylated bisphenol may be an alkoxylated, especially ethoxylated, propoxylated or butoxylated bis (4-hydroxyphenyl) methane (bisphenol F), 1,1-bis (4-hydroxyphenyl) ethane (bisphenol E), 2,2-bis (4- hydroxyphenyl) propane (bisphenol A), 1,1-bis (4-hydroxyphenyl) -1-phenylethane (bisphenol AP), 2,2-bis (4-hydroxyphenyl) butane (bisphenol B), bis (4-hydroxyphenyl) diphenylmethane (bisphenol BP), 2,2-bis (3-methyl-4-hydroxyphenyl) propane (bisphenol C), 9,9-bis (4-hydroxyphenyl) fluorene (bisphenol FL), 2,2-bis (4- hydroxy-3-isopropyl-phenyl) propane (bisphenol G), 1,3-bis (2- (4-hydroxyphenyl) -2-propyl) -benzene (bisphenol M), 1,4-bis (2- (4-hydroxy
  • the degree of alkoxylation of bisphenol can vary widely.
  • the alkoxylated bisphenol may have, for example, 1 to 15 mol of alkyleneoxy units, preferably 3 to 15 mol of alkyleneoxy units, more preferably 2 to 10 moles of alkyleneoxy units or 3 to 10 moles of alkyleneoxy units, and more preferably 3 to 6 moles of alkyleneoxy units per 1 mole of bisphenol.
  • Alkoxylated bisphenols are commercially available.
  • Si mulsol ® BPIE of Sepie / Air Liquide a bisphenol A with 3 ethylene oxide units as shown below and Aduxol ® BP-TMC of His-bis GmbH / Schaerrer Rothrist, a bisphenol TMC shown with 3 or 5 ethylene oxide units as described below.
  • a primary or secondary hydroxy group-containing epoxy compound of the following formula (III) or at least one epoxy resin A, which contains an epoxy compound of the formula (III) can be used.
  • Epoxy resins are e.g. from the reaction of an epoxy compound such as e.g. Epichlorohydrin with a polyfunctional alcohol, i. a diol, triol or polyol.
  • an epoxy compound such as e.g. Epichlorohydrin
  • a polyfunctional alcohol i. a diol, triol or polyol.
  • the reaction of polyhydric alcohols with an epoxide compound such as, for example, gives rise to Epichlorohydrin as by-products and the corresponding hydroxy-epoxy compounds in different concentrations.
  • hydroxyl-containing epoxides in epoxy resins are trimethylolpropane diglycidyl ethers as a mixture in trimethylolpropane triglycidyl ether, glycerol diglycidyl ether as a mixture contained in glycerol triglycidyl ether, pentaerythritol triglycidyl ether as a mixture in pentaerythritol tetraglycidyl ether and epoxy resins comprising butanediol diglycidyl ether or cyclohexanedimethanol diglycidyl ether.
  • it is also possible to use other similar hydroxyl-containing epoxides in particular glycidol, 3-glycidyloxybenzyl alcohol or hydroxymethylcyclohexene oxide.
  • epoxy resins which are described below for the epoxy resins B, if they contain a primary or secondary hydroxy group-containing epoxy compound of the formula (III). Also, the primary or secondary hydroxy group-containing epoxy compound of the formula (III) of the epoxy resins B described below can be used here in isolation.
  • a Castorölglycidylether is preferably used as the epoxy resin A, which contains a hydroxyl-containing epoxy compound of the formula (III).
  • Such Castorölglycidylether are commercially available, for example as Erysis ® GE 35 H CVC / Emerald Thermoset Speciali- ties, Moorestown, NJ. Below is a simplified structure of castor oil glycidyl ether:
  • the castor oil glycidyl ether Erysis ® GE 35 H is a low-viscosity flexibilizing epoxy resin with an average epoxy equivalent weight of 550 to 650 g / equivalent. As can be seen from the stated epoxy equivalent weight and the simplified structure above, the reaction of castor oil and epichlorohydrin is incomplete, ie there are unreacted free hydroxyl groups. The hydroxyl number is about 80 mg KOH / g.
  • the components a), b), c) and optionally d) are preferably used in such proportions that the molar ratio of the isocyanate groups to the hydroxyl groups in these components is less than 1 and preferably in the range from 0.75 to 0.9 lies.
  • an excess of isocyanate groups is usually employed in the preparation of prepolymers of the prior art without chain extension. The greater the isocyanate content, the longer the prepolymer becomes.
  • the NCO content of the chain-extended prepolymer in the The composition may vary, but is typically 2.6 to 3.5% before the epoxy resin B is added.
  • the chain-extended prepolymer contained in the composition is useful as a toughening agent for epoxy resin formulations. Therefore, it is preferable to further add an epoxy resin B to the composition containing the chain-extended prepolymer.
  • the epoxy resin B may in principle be the same with the epoxy resin A, if it is used for the preparation of the prepolymer; however, the epoxy resin B is preferably different from the epoxy resin A when used.
  • the epoxy resin B usually also contains at least one epoxide compound of the formula (III) which, as explained above, are usually present as a by-product in epoxy resins.
  • These epoxide compounds of the formula (III) which are contained in the epoxy resin B can react with the NCO end groups of the chain-extended prepolymer, so that epoxide group-terminated prepolymers are finally present in the composition. This reaction usually takes place even when the optional component d) was used to prepare the prepolymer, since in this case only a part of the isocyanate groups of the chain-formed prepolymer formed with the component d) was blocked in the rule.
  • epoxide group-terminated chain-extended prepolymers are therefore generally formed in which the epoxide end groups are partially derived from the component d) and partly from the epoxy resin B or the epoxide compound contained therein of the formula (III) are derived.
  • the amount of chain extended prepolymer in the epoxy resin B may vary. The higher the viscosity and the higher the NCO content of the prepolymer, the lower the possible entry amount.
  • the composition preferably contains about 15 to 25% by weight of chain-extended prepolymer based on total weight of prepolymer and epoxy resin B.
  • the composition may further contain reactive diluents which are described in more detail below. Reactive thinner usually also have free OH groups that can react with the prepolymer.
  • the optionally and preferably used epoxy resin B as well as the optionally used epoxy resin A preferably comprises or is a reaction product of at least one epoxide such as epichlorohydrin and at least one diol, triol or higher-grade polyol or a reaction product of an epoxy resin and at least one monophenol.
  • the epoxy resin B for the composition may be an epoxy resin or a mixture of two or more epoxy resins.
  • the epoxy resin may be a solid epoxy resin or preferably a liquid epoxy resin.
  • the epoxy resin generally and preferably comprises a hydroxyl epoxy compound of formula (III) which can react with the prepolymer.
  • the epoxy or liquid epoxy resin may be a commercially available epoxy resin product.
  • epoxy resin B examples include, in particular, the di-vinylidyl ethers of the formula (IV)
  • R 4 is a divalent aliphatic or mononuclear aromatic or a dinuclear aromatic radical.
  • Particularly suitable diglycidyl ethers of the formula (IV) are
  • Diglycidyl ethers of difunctional saturated or unsaturated, branched or unbranched, cyclic or open-chain C 2 -C 30 -alcohols for example ethylene glycol, butanediol, hexanediol, octanediolglycidyl ether, cyclohexanedimethanoldigylcidyl ether, neopentylglycol diglycidyl ether;
  • Diglycidyl ethers of difunctional, low to high molecular weight polyether polyols such as, for example, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether;
  • Diglycidyl ethers of difunctional diphenols and optionally triphenols which are understood not only pure phenols, but optionally also substituted phenols.
  • the type of substitution can be very diverse. In particular, this is understood to mean a substitution directly on the aromatic nucleus to which the phenolic OH group is bonded.
  • phenols are understood to mean not only mononuclear aromatics but also polynuclear or condensed aromatics or heteroaromatics which have the phenolic OH group directly on the aromatic or heteroaromatic compounds.
  • epoxy resins based on diglycidyl ether of bisphenol A (BADGE), bisphenol F or bisphenol A / F.
  • BADGE diglycidyl ether of bisphenol A
  • These epoxy resins are on a large scale available in the stores. They can be obtained from the reaction of bisphenol A, bisphenol F or mixtures of bisphenol A and bisphenol F (also referred to as bisphenol A / F) with epichlorohydrin. Depending on the reaction procedure, high or low molecular weight reaction products can be prepared.
  • the epoxy resin B of the formula (III) particularly preferably contains the ⁇ -hydroxy ether of the formula (VI) as epoxide compound
  • Such an extension takes place, in particular, when a diglycidyl ether, in particular a diglycidyl ether of bisphenol A (BADGE) or of bisphenol F, is reacted with a bisphenol at elevated temperature. It is advantageous that such a bisphenol-extended diglycidyl ether with non-extended diglycidyl ether is used.
  • a diglycidyl ether in particular a diglycidyl ether of bisphenol A (BADGE) or of bisphenol F
  • the substituents R ', R “, R'” and R “" independently of one another are either H or CH 3 .
  • the index r stands for a value of 0.01 to 1, preferably 0.05 to 1.
  • r stands for a value of less than 1, in particular less than 0.3 and preferably less than 0.2.
  • the subscript s stands for a value of> 1, in particular> 1.5, in particular from 2 to 12.
  • Compounds of the formula (A-II) with an index s between 1 and 1.5 are referred to by the person skilled in the art as semisolid epoxy resins, But here are also counted to the epoxy solid resins.
  • the expression "independently of one another" in the definition of groups and radicals in this document means in each case that several groups occurring but identical in the formulas may each have different meanings.
  • epoxy resins can be used which result from the reaction of monophenols and epoxy resins, as obtainable, for example, by the conversion of p-methoxyphenol and DER 332.
  • different epoxides having a hydroxy ether group prepared by the reaction of (poly) epoxides with a deficit of monovalent nucleophiles such as carboxylic acids, phenols, thiols or sec-amines can also be used.
  • distillation residues which are obtained in the production of highly pure distilled epoxy resins are used. Such distillation residues such.
  • Epilox ® M850 contain significantly higher concentrations of hydroxy-containing epoxy compounds than standard epoxy resins.
  • the composition can be diluted with further epoxy resins as needed and depending on the resulting viscosity.
  • Preferred for this purpose are diglycidyl ethers of bisphenol A, bisphenol F and of bisphenol A / F, and epoxide group-carrying reactive diluents described below, in particular hexanediol diglycidyl ethers, polypropylene glycol diglycidyl ethers and trimethylolpropane triglycidyl ethers.
  • composition according to the invention which A) contains only the chain-extended prepolymer, is suitable as a toughening agent.
  • the addition of the epoxy resin B gives an epoxy resin composition containing a toughening agent which can be used as the A component of a two-component epoxy resin composition, in particular a 2-component epoxy resin adhesive.
  • the composition may also be used as a one-part epoxy adhesive after addition of suitable additives, but this is not preferred.
  • the A component is inherently mixed with a B component, i. the hardener component of the 2K epoxy resin adhesive used.
  • a B component i. the hardener component of the 2K epoxy resin adhesive used.
  • hardeners for epoxy resin compositions in the B component e.g. Polyamines, polymercaptans, poly amidoamines, amino-functional polyamine / polyepoxide adducts are used, which are well known in the art as a curing agent.
  • the composition may further contain other additives, such as are common for example for the A component of a 2K epoxy resin adhesive.
  • the composition may contain at least one additional optional impact modifier (SM). include.
  • SM additional impact modifiers
  • the additional impact modifiers (SM) may be solid or liquid.
  • SM additional impact modifiers
  • SM1 a liquid rubber
  • SM1 is a carboxyl- or epoxide-terminated acrylonitrile / butadiene copolymer or a derivative thereof.
  • Such liquid rubbers are, for example, under the name Hypro ® (formerly Hycar ®) CTBN and CTBNX and ETBN of Emerald Performance Materials LLC commercially available.
  • Other optional impact modifiers (SM) are polyacrylate liquid rubbers (SM1), available as, for example, 20208-XPA from Rohm and Haas.
  • the additional impact modifier may be a solid impact modifier which is an organic ion-exchanged layered mineral.
  • the ion-exchanged layered mineral may be a cation-exchanged and / or an anion-exchanged layered mineral.
  • Preferred cation-exchanged layered minerals are the skilled person ganoclay or- under the designation or nanoclay and are commercially available, for example, the group name Tixogel ® or Nanofil ® (Südchemie), Cloisite ® (Southern Clay Products), or Nanomer ® (Nanocor Inc.) or Garmite ® (Rockwood) available.
  • An example of an anion-exchanged layered mineral is a hydrotalcite in which at least part of the carbonate anions of the intermediate layers have been replaced by organic anions.
  • the additional impact modifier (SM) is a solid impact modifier which is a block copolymer (SM2).
  • SM2 block copolymer
  • ASA acrylate-styrene-acrylic acid
  • Particularly preferred block copolymers (SM2) are block copolymers of methyl methacrylate, styrene and butadiene. Such block copolymers are available, for example, as tri-block copolymers under the group designation SBM from Arkema.
  • the additional impact modifier (SM) is a core-shell polymer (SM3).
  • Preferred core-shell polymers are the so-called MBS polymers which are commercially available under the trade name from Arkema ® Clear Strength, Paraloid ® from Dow (formerly Rohm and Haas) or F-351 ® from Zeon Avail- lent. Particularly preferred are core-shell polymer particles which are already present as a dried polymer latex. Examples are GENIOPERL ® M23A from Wacker with polysiloxane core and acrylate, radiation-crosslinked rubber particles of the NEP series manufactured by Eliokem, or Nanoprene ® from Lanxess or Paraloid EXL ® from Dow. Other comparable examples of core-shell polymers advertising the Albidur ® Evonik Hanse GmbH, Germany, offered. Also suitable are nanoscale silicates in epoxy matrix, as they are offered under the trade name Nonopox Evonik Hanse GmbH, Germany.
  • the additional impact modifier (SM) is a reaction product (SM4) of a carboxylated solid nitrile rubber with excess epoxy resin.
  • the composition may, of course, include other ingredients.
  • these are filler (F), reactive diluents (G), such as reactive diluents carrying epoxide groups, catalysts, stabilizers, in particular heat and / or light stabilizers, thixotropic agents, plasticizers, solvents, mineral or organic fillers, blowing agents, dyes and pigments, corrosion inhibitors, Surfactants, defoamers and adhesion promoters.
  • F filler
  • G reactive diluents
  • G reactive diluents carrying epoxide groups
  • catalysts such as catalysts, stabilizers, in particular heat and / or light stabilizers
  • thixotropic agents such as reactive diluents carrying epoxide groups
  • plasticizers such as reactive diluents carrying epoxide groups
  • solvents such as solvents, mineral or organic fillers, blowing agents, dyes and pigments, corrosion inhibitors, Surfactants, defo
  • the fillers (F) are, for example, preferably mica, talc, kaolin, wollastonite, feldspar, syenite, chlorite, bentonite, montmorillonite, calcium carbonate (precipitated or ground), dolomite, quartz, silicas (pyrogenic or precipitated), Cristobalite, calcium oxide, aluminum hydroxide, magnesium oxide, ceramic hollow spheres, glass hollow spheres, organic hollow spheres, glass spheres, color pigments.
  • filler (F) are both the meant organic-coated as well as the uncoated commercially available and known in the art forms.
  • the total amount of the total filler (F) is from 3 to 50% by weight, preferably from 5 to 35% by weight, especially from 5 to 25% by weight, based on the weight of the total composition (A-component and B-component).
  • the reactive diluents (G) are in particular:
  • Glycidyl ethers of monofunctional saturated or unsaturated, branched or unbranched, cyclic or open-chain C 4 -C 30 -alcohols in particular selected from the group consisting of butanol glycidyl ether, hexanol glycidyl ether, 2-ethylhexanol glycidyl ether, allyl glycidyl ether, tetrahydrofurfuryl and furfuryl glycidyl ether, trimethoxysilyl glycidyl ether.
  • Glycidyl ether of difunctional saturated or unsaturated, branched or unbranched, cyclic or open-chain C2-C3o alcohols in particular selected from the group consisting of ethylene glycol, butanediol, hexanediol, Octandiolgylcidylether, Cyclohexandimethanoldigylcidylether and Neopentylglycoldi- glycidylether.
  • Glycidyl ethers of trifunctional or polyfunctional, saturated or unsaturated, branched or unbranched, cyclic or open-chain alcohols such as epoxied castor oil, epoxidized trimethylolpropane, epoxidized pentaerythrol or polyglycidyl ethers of aliphatic polyols, such as sorbitol, glycerol or trimethylolpropane.
  • Glycidyl ethers of phenolic and aniline compounds in particular selected from the group consisting of phenyl glycidyl ether, cresyl glycidyl ether, p-tert.-butyl phenyl glycidyl ether, nonyl phenol glycidyl ether, 3-n-pentadecenyl glycidyl ether (from cashew nut shell oil), N, N-diglycidyl aniline and Triglycidyl of p-aminophenol.
  • Epoxidized amines such as N, N-diglycidylcyclohexylamine.
  • Epoxidized mono- or dicarboxylic acids in particular selected from the group consisting of glycidyl neodecanoate, glycidyl methacrylate, benzoic acid acid glycidyl esters, phthalic acid, tetra- and hexahydrophthalic acid diglycidyl esters and diglycidyl esters of dimeric fatty acids and terephthalic acid and trimelitic acid glycidyl esters.
  • hexanediol diglycidyl ethers cresyl glycidyl ethers, p-tert-butylphenyl glycidyl ethers, polypropylene glycol diglycidyl ethers and polyethylene glycol diglycidyl ethers.
  • the composition is ideally suited as the A component of a 2K epoxy adhesive and is preferably used for bonding windmills, in particular windmill rotor blades.
  • 2K adhesives the curing at room temperature in the course of a few days to about 1 week can be carried out but also an accelerated curing regime such. B. 4h RT followed by 30 min 60 ° C or 85 ° C should be applicable.
  • the composition of the invention comprising the epoxy resin B is preferably prepared in a two-stage process.
  • components a), b) and c) and, if appropriate, d) are first reacted in a reactor in order to obtain the chain-extended prepolymer.
  • catalysts such as DBTL can be added.
  • the reaction is preferably carried out at elevated temperature, for example at more than 45 ° C.
  • a resin charge comprising and preferably consisting of the epoxy resin B, vented and optionally dehydrated.
  • the preferably still warm prepolymer is introduced and reacted.
  • the reaction is likewise preferably carried out at elevated temperature, for example at more than 45.degree.
  • Other ingredients which are customary for the A component of a 2-component epoxy resin adhesive may be admixed with the composition produced. Examples of such additives have been listed above. Examples of such additives have been listed above. Examples of such additives have been listed above. Examples of such additives have been listed above. Examples of such additives have been listed
  • the isocyanate content was determined in% by weight by means of a back titration with excess di-n-butylamine and 0.1 M hydrochloric acid. All determinations were performed semi-manually on a Mettler-Toledo T70 titrator with automatic potentiometric end point determination. For this purpose, in each case 600-800 mg of the sample to be determined were dissolved with heating in a mixture of 10 ml of isopropanol and 40 ml of xylene and then reacted with a solution of dibutylamine in xylene. Excess di-n-butylamine was titrated with 0.1M hydrochloric acid and the isocyanate content was calculated therefrom.
  • 650 g DER®331 (alternatively Epikote®828 LVEL) were degassed in a vacuum mixer for 1 hour under vacuum at 90 ° C and dehydrated.
  • the resin was at 80 ° C cooled.
  • 194 g of prepolymer 1 prepared above were introduced into the degassed and dehydrated resin.
  • the batch was allowed to react in vacuo at 70 ° C to a final NCO content of ⁇ 0.05% (about 3 hours).
  • the resulting epoxy resin has a theoretical epoxy equivalent weight of 240 g / mol.
  • Prepolymer 2 160 g PolyTHF 2000, 40 g Erisys GE 35 H and 40 g Simulsol BPIE were degassed in a vacuum mixer for 1 hour under vacuum at 90 ° C and dehydrated. Then the polyol was cooled to 70 ° C in vacuo. 86.8 g of liquefied MDI were added. The batch was allowed to react without catalyst for 1 hour at 70 ° C. Then the formulation was cooled to 60 ° C. Subsequently, 0.1 g of DBTL was added. The reaction was continued in vacuo at 60 ° C to a final NCO content of 3.1-3.3% (duration about 30 minutes).
  • Epoxy resin 2 668 g of DER ® 331 (alternatively Epikote ® 828 LVEL) were degassed and dehydrated in a vacuum mixer for 1 hour under vacuum at 90 ° C. The resin was cooled to 80 ° C. 157 g of prepolymer 2 prepared above was introduced into the degassed and dehydrated resin. The batch was allowed to react in vacuo at 70 ° C to a final NCO content of ⁇ 0.05% (about 3 hours). The resulting epoxy resin has a theoretical epoxy equivalent weight of 233 g / mol.
  • the epoxy resins 1 and 2 prepared above were used for the formulation of A component 1 or 2 according to Table 2 below and investigated in conjunction with a conventional curing agent according to Table 2 below. Which he- the invention according to component A and the hardener were mixed in a mixing apparatus (Mixer Speed ®) in a weight ratio of 2: 1 and then cured for 4 hours at 70 ° C. Subsequently, the mechanical properties of the cured product were examined. Although the A components 1 and 2 according to the invention have a lower viscosity in comparison to conventional commercial products (eg Kane Ace® MX 120), the mechanical properties are very good.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polyurethanes Or Polyureas (AREA)
EP13766518.8A 2012-09-24 2013-09-23 Präpolymer-schlagfestmacher für rissbeständige kleber für windmühlen Withdrawn EP2897997A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP13766518.8A EP2897997A1 (de) 2012-09-24 2013-09-23 Präpolymer-schlagfestmacher für rissbeständige kleber für windmühlen

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP12185699 2012-09-24
PCT/EP2013/069747 WO2014044851A1 (de) 2012-09-24 2013-09-23 Präpolymer-schlagfestmacher für rissbeständige kleber für windmühlen
EP13766518.8A EP2897997A1 (de) 2012-09-24 2013-09-23 Präpolymer-schlagfestmacher für rissbeständige kleber für windmühlen

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EP (1) EP2897997A1 (pt)
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WO (1) WO2014044851A1 (pt)

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EP3064518A1 (de) * 2015-03-04 2016-09-07 Sika Technology AG Verbesserte tieftemperaturschlagzähigkeit in ptmeg basierenden polyurethan-schlagzähigkeitsmodifikatoren
EP3303432A1 (en) * 2015-06-02 2018-04-11 Dow Global Technologies LLC Blocked polyurethane tougheners for epoxy adhesives
CN110330936B (zh) * 2019-06-10 2021-06-29 佳化化学科技发展（上海）有限公司 一种烷氧化双酚f在uv固化胶粘剂树脂制备中的应用及其胶粘剂
CN113980224B (zh) * 2021-12-03 2023-04-07 南京航空航天大学 针对热塑性聚氨酯/聚酰胺类聚合物合金相容剂及其制法

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ES2020299B3 (es) 1986-12-19 1991-08-01 Ciba-Geigy Ag Resinas epoxidicas con contenido de poliester sobre base de polialquilenglicol.
JP2885916B2 (ja) 1990-09-10 1999-04-26 サンアプロ株式会社 外科用キャスティングテープ
US5290857A (en) 1991-09-04 1994-03-01 Nippon Zeon Co., Ltd. Epoxy resin adhesive composition
EP1431325A1 (de) 2002-12-17 2004-06-23 Sika Technology AG Hitze-härtbare Epoxidharzzusammensetzung mit verbesserter Tieftemperatur-Schlagzähigkeit
EP1498441A1 (de) * 2003-07-16 2005-01-19 Sika Technology AG Hitzehärtende Zusammensetzungen mit Tieftemperatur-Schlagzähigkeitsmodifikatoren
EP1741734A1 (de) * 2005-07-05 2007-01-10 Sika Technology AG Tieftemperaturschlagzähe hitze-härtbare Epoxidharzzusammensetzung mit Epoxidfestharzen
EP1972646A1 (de) 2007-03-20 2008-09-24 Sika Technology AG Epoxidgruppen terminierte Polymer, deren Zusammensetzungen und deren Verwendung als Schlagzähigkeitsmodifikatoren
JP4240158B1 (ja) * 2007-07-19 2009-03-18 Ｄｉｃ株式会社 湿気硬化型ポリウレタンホットメルト接着剤及びそれを用いた積層体ならびに透湿フィルム

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Title
See references of WO2014044851A1 *

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US9562176B2 (en) 2017-02-07
WO2014044851A1 (de) 2014-03-27
JP2015535868A (ja) 2015-12-17
BR112015006555A2 (pt) 2017-07-04
CN104662057A (zh) 2015-05-27

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