EP2889599A2 - Sensor zur Messung der physikalischen Quantität und Sensormodul - Google Patents

Sensor zur Messung der physikalischen Quantität und Sensormodul Download PDF

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Publication number
EP2889599A2
EP2889599A2 EP14196600.2A EP14196600A EP2889599A2 EP 2889599 A2 EP2889599 A2 EP 2889599A2 EP 14196600 A EP14196600 A EP 14196600A EP 2889599 A2 EP2889599 A2 EP 2889599A2
Authority
EP
European Patent Office
Prior art keywords
projection
sensor module
sensor
diaphragm
joint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP14196600.2A
Other languages
English (en)
French (fr)
Other versions
EP2889599A3 (de
EP2889599B1 (de
Inventor
Hironori Kobayashi
Shuji Tohyama
Yusuke Abe
Haruhiko Sekiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nagano Keiki Co Ltd
Original Assignee
Nagano Keiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2013253110A external-priority patent/JP6030539B2/ja
Priority claimed from JP2013253109A external-priority patent/JP5997686B2/ja
Application filed by Nagano Keiki Co Ltd filed Critical Nagano Keiki Co Ltd
Publication of EP2889599A2 publication Critical patent/EP2889599A2/de
Publication of EP2889599A3 publication Critical patent/EP2889599A3/de
Application granted granted Critical
Publication of EP2889599B1 publication Critical patent/EP2889599B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G01L19/0038—Fluidic connecting means being part of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/142—Multiple part housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means

Definitions

  • the present invention relates to a physical quantity measuring sensor that measures physical quantities, such as a pressure sensor that measures pressure of a target fluid, and a sensor module.
  • the physical quantity measuring sensor is exemplified by a pressure sensor including a sensor module that is provided in a joint, the sensor module including a detection portion that detects the pressure of the target fluid.
  • a typical ceramic sensor module includes: a plate-shaped diaphragm body; an annular supporting portion connected to the diaphragm body; a recess at the center of a first surface of the diaphragm body; a step formed between an inner surface of the recess and the first surface; and a connecting portion between the first surface of the diaphragm body and an inner surface of the annular supporting portion, in which a cross section from the connecting portion and the step is curved (Patent Literature 1: Japanese Patent No. 4828804 ).
  • the sensor module is integrally bonded to the projection of the joint. If both the sensor module and the joint are metallic, the sensor module and the joint can be integrally bonded to each other by welding. However, when the sensor module is ceramic, the sensor module cannot be welded to the metallic joint.
  • an O-ring is used for attaching the sensor module to the joint.
  • the O-ring is disposed between an inner wall of a cavity of a ceramic pressure-sensitive element and a cylindrical projection of a housing, and a washer is crimped to be fixed to a tip end of the cylindrical projection, thereby preventing the O-ring from slipping off (Patent Literature 2: JP-A-2006-78379 ).
  • a groove in which the O-ring is held is defined by a step, which is formed at a base end of the cylindrical projection and with which the O-ring is engaged, and the washer crimped at the tip end of the cylindrical projection.
  • this pressure sensor includes a connector provided with a terminal and a housing provided with the sensor module, in which a signal detected at the sensor module is transmitted to the terminal through an electronic component.
  • This pressure sensor is exemplified by a typical pressure sensor including: a diaphragm member having a detection portion; a flexible circuit board having a first end connected to the detection portion; an amplifier circuit provided by circuit components and mounted at a second end of the flexible circuit board; and a connector attached with the second end of the flexible circuit board at which the circuit components are mounted (Patent Literature 3: JP-A-2002-310826 ).
  • a typical pressure sensor in a different type includes: a sensitive-pressure element; an output terminal; a flexible circuit board connecting the sensitive-pressure element to the output terminal; an ASIC mounted on the flexible circuit board; and a connector connected to an end of the output terminal (Patent Literature 2).
  • Patent Literature 1 Although stress generating at the connecting portion between the diaphragm body and the annular support is reduced, a structure for attaching the ceramic sensor module to the metallic joint is not disclosed.
  • Patent Literature 1 in order to attach the sensor module to the joint using the O-ring, it is conceivable to form a projection on the joint and attach the sensor module to the projection via the O-ring.
  • a cross-sectionally square C-shaped groove for holding the O-ring needs to be separately machined to the projection, so that the manufacturing cost of the pressure sensor is increased.
  • the groove for holding the O-ring needs to have a depth and a width corresponding to the dimension of the O-ring.
  • the width of the groove is narrower than the O-ring, the O-ring cannot be fitted into the groove.
  • the width of the groove is wider, the width of the projection from the groove to a tip end is decreased, whereby the tip end of the projection is likely to be broken or the like. Such breakage or the like of the tip end of the projection is prevented by keeping a position of the groove apart from the tip end of the projection.
  • the projection itself is lengthened, and consequently, the physical quantity measuring sensor itself is also lengthened.
  • Patent Literature 2 the structure of crimping to fix the washer at the tip end of the cylindrical projection is applied for holding the O-ring to the cylindrical projection of the housing.
  • the structure of the cross-sectionally square C-shaped groove for holding the O-ring becomes complicated, thereby increasing the manufacturing cost of the pressure sensor.
  • the flexible circuit board since the flexible circuit board is easily bent, the flexible circuit board needs to be fixed to a holder or the like so as to attach the electronic component to a planar surface of the board, so that an operation is complicated. Further, in assembly of the pressure sensor, a first end of the flexible circuit board needs to be connected to the sensor module while a second end of flexible circuit board needs to be connected to the terminal. During this connection operation, the electronic component bonded to the flexible circuit board needs to be kept from slipping off from the flexible circuit board.
  • An object of the invention is to provide a physical quantity measuring sensor capable of holding an O-ring in a simple structure, a sensor module that is easily connectable to an electronic component, and the physical quantity measuring sensor provided with the sensor module.
  • a physical quantity measuring sensor includes: a joint having a cylindrical projection in which an introduction hole for introducing a target fluid is formed; a ceramic sensor module disposed on a downstream side of the projection in a flow direction of the target fluid, the ceramic sensor module comprising: a diaphragm to be displaced depending on a pressure of the introduced target fluid; and a cylindrical portion integrated with the diaphragm and provided to the projection; and an O-ring interposed between the cylindrical portion and the projection, in which the O-ring is interposed between a sensor-module flat portion extending in a direction orthogonal to an axial direction of the cylindrical portion and a joint flat portion extending in a direction orthogonal to an axial direction of the projection.
  • ceramic powders are formed into a compact in a die and the compact is sintered to manufacture the sensor module.
  • a step for forming the sensor-module flat portion is preferably formed in advance in the die.
  • the joint flat portion is formed by grinding the projection of the joint.
  • the O-ring is locked at the joint flat portion formed to the projection.
  • the sensor module is attached to the joint such that an outer circumferential surface of the projection faces the inner circumferential surface of the cylindrical portion.
  • the sensor-module flat portion and the joint flat portion function in a pair as a cross-sectionally square C-shaped groove for restricting the displacement of the O-ring in the axial direction of the projection.
  • an inclined surface for preventing the projection from interfering with an inner circumferential edge of the sensor-module flat portion is formed at an end of the projection.
  • the inclined surface prevents interference between the sensor module and the projection, the projection of the joint can be easily attached to the cylindrical portion of the sensor module. Further, when the O-ring is attached to the projection, the inclined surface functions as a guide, so that the O-ring is easily attachable.
  • the sensor-module flat portion is in parallel to a top flat surface of the diaphragm.
  • the sensor-module flat portion is also positioned in the same direction.
  • the O-ring can be prevented from slipping off from the projection.
  • the joint includes a retaining member for preventing the sensor module from slipping off from the projection.
  • the retaining member prevents the projection from slipping off from the sensor module.
  • a ceramic sensor module in another aspect of the invention, includes: a diaphragm having a displacement portion to be displaced depending on a pressure of a target fluid to be introduced; and a cylindrical portion integrated with the diaphragm, in which an electronic component is disposed on a planar surface of the diaphragm opposite to a surface of the diaphragm where the target fluid comes into contact, and the electronic component includes: a component body disposed away from a surface corresponding to the displacement portion of the planar surface; and a lead frame having a base end connected to the component body and a tip end bonded to a part other than the surface corresponding to the displacement portion on the planar surface of the diaphragm.
  • the tip end of the lead frame of the electronic component is disposed at a part other than the surface corresponding to the displacement portion on the planar surface of the diaphragm while the component body is away from the displacement portion. For this reason, even when the target fluid is introduced to displace the displacement portion, such a displacement is not disturbed, so that an appropriate measurement of the physical quantity can be conducted.
  • the electronic component can be directly attached to the sensor module. Accordingly, it is not required to attach the electronic component to the flexible circuit board that is easily bent. For this reason, the electronic component can be easily electrically connected to the sensor module.
  • the electronic component is preferably an ASIC.
  • the ASIC is an essential electronic component and is larger than other electronic components, the ASIC is suitably provided to the sensor module.
  • a physical quantity measuring sensor includes: a joint having a cylindrical projection in which an introduction hole for introducing a target fluid is formed; the sensor module according to the aspect of the invention disposed on a downstream side of the projection of the joint in a flow direction of the target fluid; and a flexible circuit board having a first end electrically connected to the sensor module and a second end electrically connected to a terminal, in which the flexible circuit board has an end connected to a part other than the surface corresponding to the displacement portion on the planar surface of the diaphragm.
  • the electronic component can be directly attached to the sensor module, it is not required to attach the electronic component to the flexible circuit board that is easily bent.
  • the electronic component can be easily attached to the sensor module. Further, since the electronic component is not attached to the flexible circuit board, the electronic component does not hamper connection of the flexible circuit board to the sensor module and the terminal, so that the physical quantity measuring sensor can be easily assembled.
  • the terminal is provided to a connector connected to the joint, a lid is provided to the connector, and the flexible circuit board is inserted in the lid.
  • the lid shields dropping of the resin mold. Accordingly, the resin mold can be prevented from adhering on the electronic component and the sensor module.
  • Fig. 1 shows an overall structure of a physical quantity measuring sensor in an exemplary embodiment.
  • a physical quantity measuring sensor is a pressure sensor including: a joint 1; a sensor module 2 provided to the joint 1; a connector 3 that covers the sensor module 2; a terminal 4 provided to the connector 3; a flexible circuit board 5 that electrically connects the terminal 4 to the sensor module 2; an electronic component 6 provided to the sensor module 2.
  • the joint 1 is a metallic member and includes a shaft 11 in which an introduction hole 1A for introducing the target fluid is formed; a flange 12 that radially extends from a center of the shaft 11; and a sleeve 13 integrally formed on a periphery of the flange 12.
  • One end of the shaft 11 is defined as a screw 14 to be screwed into an attachment portion (not shown).
  • the other end of the shaft 11 is defined as a projection 15 to which the sensor module 2 is provided.
  • a step is formed such that a diameter of a tip end of the projection 15 is smaller than that of a base end thereof.
  • a planar surface of the step is defined as a joint flat portion 15A that is a planar surface orthogonal to an axial direction of the projection 15 and radially extends.
  • an inclined surface 15B having a diameter decreasing toward the tip end is formed (see Figs. 2 and 3 ).
  • a space S divided by the flange 12, the projection 15 and the sleeve 13 is provided for housing the sensor module 2.
  • the space S is communicated with a recess S1 formed in a planar ring having a predetermined width on a peripheral planar surface of the flange 12.
  • the recess S1 is formed so as to properly locate corners of the sensor module 2.
  • a planar surface of the recess S1 is away from a bottom of the sensor module 2.
  • a planar shape of the space S for housing the sensor module 2 is circular and a planar shape of the sensor module 2 is substantially circular.
  • a diameter of the space S is approximately equal to a diameter of the sensor module 2.
  • An open end of the sleeve 13 is defined as a locking portion 13A that locks the connector 3.
  • the connector 3 is a synthetic resin-made component and includes an annular base 3A held by the locking portion 13A and a body 3B that is integrated with the base 3A and supports the terminal 4.
  • the base 3A is closed with a lid 30.
  • the lid 30 includes a metallic lid body 31 having an opening 30A at a center of the lid 30 and an insulative holding plate 32 provided over the opening 30A of the lid body 31.
  • the lid body 31 includes a plate portion 31 A and a peripheral portion 31B provided on a peripheral edge of the plate portion 31A.
  • the peripheral portion 31B is sandwiched between the sleeve 13 and the base 3A of the connector 3.
  • the holding plate 32 is a synthetic resin-made plate and has a holding hole for holding the flexible circuit board 5.
  • a resin mold (not shown) is provided in a space divided by the base 3A of the connector 3 and the lid 30 in order to avoid disconnection of the terminal 4 from the flexible circuit board 5 and to secure waterproof performance.
  • the terminal 4 is provided in a synthetic resin-made attachment member 40 by insert molding. Although only a single terminal 4 is shown in Fig. 1 , three terminals 4 are disposed in a paper penetration direction in Fig. 1 in the exemplary embodiment.
  • the attachment member 40 includes a body 40A that holds the terminal 4 and a leg 40B integrated with the body 40A.
  • the body 40A is attached to the base 3A.
  • An end of the terminal 4 is exposed from the body 40A of the attachment member 40.
  • An end of the flexible circuit board 5 is connected to the exposed end of the terminal 4.
  • the end of the flexible circuit board 5 is connected to the terminal 4 in a folded manner so that force is not likely to be applied to the connection portion with the terminal 4 even when the end of the flexible circuit board 5 swings.
  • Figs. 2 to 5 each show a specific structure of the sensor module 2.
  • Figs. 2 and 3 each show a cross section of a relevant part of the physical quantity measuring sensor.
  • Fig. 4 shows the sensor module 2.
  • the sensor module 2 is disposed on a downstream side of a flow direction of the target fluid relative to the projection 15 of the joint 1.
  • the sensor module 2 which is ceramic, includes: a diaphragm 21 provided close to an end of the projection 15 of the joint 1 on the downstream side in the flow direction of the target fluid; and a cylindrical portion 22 that is integrated with the diaphragm 21 and is attached to the projection 15.
  • the joint 1 includes a retaining member 23 for preventing the sensor module 2 from dropping off from the projection.
  • the retaining member 23 is a cross-sectionally rectangular spring ring that is fitted in a fitting cavity 13B circumferentially formed on an inner circumferential surface of the sleeve 13.
  • This spring ring is a C-shaped spring member in a plan view.
  • An outer circumferential portion of the spring ring is fitted in the fitting cavity 13B while a part of an inner circumferential portion thereof presses a peripheral edge of the diaphragm 21.
  • a surface opposite to a surface of the diaphragm 21 facing the projection 15 is defined as a top flat surface 20A.
  • a central portion of the diaphragm 21 is defined as a displacement portion 210 to be displaced by pressure of the target fluid.
  • the target fluid is introduced through the introduction hole 1A of the joint 1 into a space defined by a bottom of the displacement portion 210 and an inner circumferential surface of the cylindrical portion 22.
  • the target fluid to be measured in the exemplary embodiment encompasses liquid (e.g., water) and gas (e.g., air).
  • the bottom of the displacement portion 210 to come into contact with the target fluid is formed corresponding to a shape of a head of the projection 15.
  • the bottom of the displacement portion 210 may be flat, or may be curved so that the displacement portion 210 becomes thinner toward the center thereof.
  • a detection portion including a strain gauge and the like is provided at a planar central part 21A corresponding to the displacement portion 210 of the top flat surface 20A.
  • An inner circumferential portion of the cylindrical portion 22 located close to the diaphragm 21 is defined as a sensor-module flat portion 22A.
  • the sensor-module flat portion 22A is a planar surface orthogonal to an axial direction of the cylindrical portion 22 and extending in a radial direction.
  • the sensor-module flat portion 22A has a diameter larger than that of the displacement portion 210 and is in parallel to the top flat surface 20A of the sensor module 2.
  • the inner circumferential portion of the cylindrical portion 22 near the opening end is fitted to an outer circumferential portion of the projection 15 in a predetermined depth from the opening end.
  • An inclined portion 22B is formed from an edge of the fitted part to the opening end.
  • the inclined portion 22B may be flat or curved.
  • An O-ring 7 is located between the cylindrical portion 22 of the sensor module 2 and the projection 15 of the joint 1.
  • the O-ring 7 is disposed in a space between the sensor-module flat portion 22A and the joint flat portion 15A.
  • the sensor-module flat portion 22A and the joint flat portion 15A restrict displacement of the O-ring 7 in an axial direction of the projection 15 and are in parallel with each other in a state of the sensor module 2 being attached to the projection 15.
  • a width of each of the sensor-module flat portion 22A and the joint flat portion 15A in a radial direction of the cylindrical portion 22 is equal to or slightly smaller than a thickness of the O-ring 7 so that the O-ring 7 is held between the projection 15 and the cylindrical portion 22.
  • an axial dimension of the projection 15 from the joint flat portion 15A to the inclined surface 15B is at least the same as the thickness of the O-ring 7.
  • An inner circumferential edge of the sensor-module flat portion 22A is kept free from interference with the projection 15 due to the inclined surface 15B.
  • an axial dimension of the cylindrical portion 22 from the sensor-module flat portion 22A to the inclined portion 22B is at least the same as the thickness of the O-ring 7.
  • three outer grooves 2A are provided in parallel with the axial direction of the cylindrical portion 22.
  • the outer grooves 2A are used for positioning the sensor module 2 by a positioning device (not shown) when a detector and the like are pattern-printed on the top flat surface 20A of the sensor module 2.
  • the three outer grooves 2A are arranged at non-equal intervals. Specifically, two of the outer grooves 2A are opposite to each other across an axis core of the sensor module 2 and the last one of the outer grooves 2A is arranged at a position near one of the above two outer grooves 2A. It should be noted that, in the exemplary embodiment, in order to position the sensor module 2, the outer grooves 2A may be replaced by recesses 2B that are formed opposite to each other across the axis core of the sensor module 2.
  • Fig. 5 shows the electronic component 6 being attached to the sensor module 2.
  • the electronic component 6 in the exemplary embodiment is an ASIC (Application Specific Integrated Circuit) used for adjustment or the like of a measurement value.
  • ASIC Application Specific Integrated Circuit
  • the electronic component 6 is disposed on a (planar) surface of the diaphragm 21 opposite to a surface thereof where the target fluid comes into contact.
  • the electronic component 6 includes a plate-shaped component body 61 and a plurality of lead frames 62 each having a base end connected to the component body 61.
  • the component body 61 is disposed away from the planar central part 21A of the diaphragm 21.
  • a tip end of each of the lead frames 62 is bonded to a planar outer circumferential portion 21B located on a periphery of the planar central part 21A of the top flat surface 20A of the diaphragm 21.
  • the tip end of each of the lead frames 62 is bonded to the planar outer circumferential portion 21B with a conductive adhesive agent and the like.
  • a plurality of circuit elements 63 are bonded to the planar outer circumferential portion 21B.
  • the circuit elements 63 and the lead frames 62 are connected to a planar circuit (not shown) formed on the planar outer circumferential portion 21B.
  • the planar circuit is connected to a detection portion (not shown) provided in the displacement portion 210 and to three pads 21D.
  • Fig. 6 shows a detailed structure of the flexible circuit board 5.
  • Fig. 6 is a development view of the flexible circuit board 5.
  • the flexible circuit board 5 includes: a first end 51 connected to the terminal 4; a second end 52 connected to the diaphragm 21; and a middle portion 53 that is interposed between the second end 52 and the first end 51 and is held by the holding plate 32.
  • the first end 51 has an engaging hole 51A in which the terminal 4 is engaged.
  • the engaging hole 51 A and the terminal 4 are soldered to each other.
  • the second end 52 is fixed to the diaphragm 21 by thermocompression bonding.
  • the second end 52 has three terminals 52A to be soldered to the pads 21D (see Fig. 5 ) of the planar circuit.
  • the terminals 52A are electrically connected to the engaging hole 51A in a circuit pattern (not shown).
  • the sensor module 2 is made of ceramics.
  • Various methods are applicable to the manufacture of the sensor module 2. For instance, ceramic powders are filled in a die (not shown) to form a compact and the compact is sintered. In this method, a step for defining the sensor-module flat portion and the like is provided in advance in the die. With this arrangement, the sensor-module flat portion 22A is to be formed as a part of the compact.
  • the compact is put into a furnace (not shown), sintered at a predetermined temperature, and subsequently taken out of the furnace.
  • the planar circuit and the detection portion are formed on the diaphragm 21 of the sensor module 2 thus manufactured.
  • the electronic component 6 and the circuit elements 63 are attached to the diaphragm 21.
  • the second end 52 of the flexible circuit board 5 is bonded to the diaphragm 21.
  • a metallic block is ground or the like to form the joint 1.
  • the joint flat portion 15A is formed on the projection 15.
  • Other components for the physical quantity measuring sensor are manufactured.
  • the O-ring 7 is attached to the outer circumferential portion of the projection 15 of the joint 1.
  • the sensor module 2 to which the flexible circuit board 5, the electronic component 6, and other requisite members are attached is attached to the projection 15 (see Fig. 3 ). With this arrangement, the O-ring 7 is interposed between the sensor-module flat portion 22A of the sensor module 2 and the joint flat portion 15A of the projection 15.
  • the retaining member 23 is attached to the joint 1 to prevent the sensor module 2 from slipping off.
  • the middle portion 53 of the flexible circuit board 5 is held by the holding plate 32 located at the center of the lid 30.
  • the terminal 4 in advance provided to the attachment member 40 by insert molding is bonded to the first end 51 of the flexible circuit board 5.
  • the connector 3 is locked in the sleeve 13 of the joint 1.
  • the invention is not limited to the exemplary embodiments described above, but includes modifications and improvements as long as an object of the invention can be achieved.
  • the electronic component 6 is directly disposed on the planar surface of the diaphragm 21 in the above exemplary embodiment.
  • the board may be disposed away from the planar surface of the diaphragm 21 and the electronic component 6 may be attached to the board.
  • the electronic component 6 directly set in the diaphragm 21 is in a form of the ASIC.
  • the electronic component 6 may be a capacitor, an amplifier circuit and other elements as long as those have a lead frame.
  • the lid 30 is provided to the connector 3 and the flexible circuit board 5 is inserted into the lid 30.
  • the lid 30 may be omitted.
  • the sensor-module flat portion 22A is formed extending in the direction orthogonal to the axial direction of the cylindrical portion 22 and the joint flat portion 15A is formed extending in the direction orthogonal to the axial direction of the projection 15.
  • the angles at which the sensor-module flat portion 22A and the joint flat portion 15A are formed may not be limited to the directions orthogonal to the respective axial directions of the cylindrical portion 22 and the projection 15, but it is only required that the sensor-module flat portion 22A and the joint flat portion 15A intersect with the respective axial directions of the cylindrical portion 22 and the projection 15.
  • other arrangements may be applied for restricting the displacement of the O-ring 7 in the axial direction of the projection 15.
  • a groove for holding the O-ring 7 may be formed in the projection 15.
  • a processing method of the ceramic sensor module 2 and the joint 1 is not limited to the method described in the exemplary embodiment.
  • the compact which is to be the base material of the sensor module 2
  • the spring ring may be replaced by a plurality of locking pins provided on the inner circumferential surface of the joint 1.
  • the physical quantity measuring sensor of the invention is also applicable to, for instance, a differential pressure sensor and a temperature sensor.
  • the joint 1 is formed of the metallic member in the above exemplary embodiment, the joint may be formed of a synthetic resin member in the invention.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
EP14196600.2A 2013-12-06 2014-12-05 Sensor zur Messung einer physikalischen Größe und Sensormodul Active EP2889599B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013253110A JP6030539B2 (ja) 2013-12-06 2013-12-06 センサモジュール及び物理量測定センサ
JP2013253109A JP5997686B2 (ja) 2013-12-06 2013-12-06 物理量測定センサ

Publications (3)

Publication Number Publication Date
EP2889599A2 true EP2889599A2 (de) 2015-07-01
EP2889599A3 EP2889599A3 (de) 2016-03-23
EP2889599B1 EP2889599B1 (de) 2019-07-31

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EP14196600.2A Active EP2889599B1 (de) 2013-12-06 2014-12-05 Sensor zur Messung einer physikalischen Größe und Sensormodul

Country Status (3)

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US (2) US9772242B2 (de)
EP (1) EP2889599B1 (de)
CN (2) CN110763392A (de)

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DE102016210385A1 (de) * 2016-06-13 2017-12-14 Robert Bosch Gmbh Drucksensor für einen Hochdruckspeicher und Hochdruckspeicher

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US9581468B2 (en) * 2014-01-31 2017-02-28 DunAn Sensing, LLC Methods for fabricating apparatus having a hermetic seal
US10369852B2 (en) * 2014-03-28 2019-08-06 Pirelli Tyre S.P.A. Tyre sensor device with flexible printed circuit board
JP6703850B2 (ja) * 2016-02-16 2020-06-03 株式会社不二工機 圧力検出ユニット及びこれを用いた圧力センサ
JP6315025B2 (ja) * 2016-04-26 2018-04-25 株式会社デンソー 物理量センサおよびその製造方法
EP3318290B1 (de) * 2016-11-03 2020-04-22 This AG Wechselkassette für ophthalmologische apparatur
JP6564358B2 (ja) * 2016-12-08 2019-08-21 長野計器株式会社 物理量測定装置
JP2018163074A (ja) * 2017-03-27 2018-10-18 日本電産トーソク株式会社 油圧センサ取付構造
JP6939475B2 (ja) * 2017-11-28 2021-09-22 セイコーエプソン株式会社 物理量センサー、物理量センサーデバイス、複合センサーデバイス、慣性計測装置、移動体測位装置、携帯型電子機器、電子機器および移動体
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CN104697699B (zh) 2019-11-12
CN104697699A (zh) 2015-06-10
EP2889599A3 (de) 2016-03-23
CN110763392A (zh) 2020-02-07
US20170299453A1 (en) 2017-10-19
EP2889599B1 (de) 2019-07-31
US9772242B2 (en) 2017-09-26
US10113926B2 (en) 2018-10-30

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