EP2884818A2 - Dispositif de chauffage, procédés d'impression respectifs et utilisation - Google Patents
Dispositif de chauffage, procédés d'impression respectifs et utilisation Download PDFInfo
- Publication number
- EP2884818A2 EP2884818A2 EP13774822.4A EP13774822A EP2884818A2 EP 2884818 A2 EP2884818 A2 EP 2884818A2 EP 13774822 A EP13774822 A EP 13774822A EP 2884818 A2 EP2884818 A2 EP 2884818A2
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- European Patent Office
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- comprised
- printing
- carbon
- printed
- Prior art date
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/145—Carbon only, e.g. carbon black, graphite
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/267—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an organic material, e.g. plastic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/34—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/005—Heaters using a particular layout for the resistive material or resistive elements using multiple resistive elements or resistive zones isolated from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/011—Heaters using laterally extending conductive material as connecting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/016—Heaters using particular connecting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/026—Heaters specially adapted for floor heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/029—Heaters specially adapted for seat warmers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2214/00—Aspects relating to resistive heating, induction heating and heating using microwaves, covered by groups H05B3/00, H05B6/00
- H05B2214/02—Heaters specially designed for de-icing or protection against icing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2214/00—Aspects relating to resistive heating, induction heating and heating using microwaves, covered by groups H05B3/00, H05B6/00
- H05B2214/04—Heating means manufactured by using nanotechnology
Definitions
- the present application describes heating circuits composed of metallic and/or non-metallic conductive material in the form of thin films, printed on flexible or rigid substrates.
- WO2007076506A1 a system for effective defrosting of a plastic window is disclosed which includes a transparent plastic panel, a heating grill which includes a plurality of heating lines that are integrated in the plastic panel and equalizing means of the electrical currents that run through each one of the lines.
- a heating grill which includes a plurality of heating lines that are integrated in the plastic panel and equalizing means of the electrical currents that run through each one of the lines.
- This document does not present the same geometry/structure/form presented in this application, nor the possibility to process these systems on flexible substrates already mentioned and/or rigid substrates such as concrete and/or ceramic and/or wood agglomerates.
- the resistive material referred in the document is also different from the one presented in the present application, its use not being indicated in any claim.
- processing methods mentioned in the present application also enjoy novelty when combined with flexible and/or rigid substrates already mentioned, in the manufacturing of these heating systems.
- a printed heating device comprises:
- a control electronic system is coupled to the printed heating device, which comprises:
- the printed bus bars on the printed heating device present lengths ranging between 50 and 5000 mm.
- the printed tracks on the printed heating device may present a length that could vary between 40 and 200mm, a width comprised between 2.5 and 15 mm and a thickness that is comprised between 2 and 100 ⁇ m.
- the distance between the bus bars printed on the printed heating device is comprised between 40 and 100 mm.
- the distance between tracks printed on the printed heating device is comprised between 2.5 and 15 mm.
- the flexible substrate of the printed heating device is carried out in polyethylene terephthalate (PET), and/or polyethylene naphthalate (PEN), and/or cork, and/or thermoplastic polyolefin (TPO), and/or meshes coated with polymeric films.
- PET polyethylene terephthalate
- PEN polyethylene naphthalate
- TPO thermoplastic polyolefin
- the rigid substrate of the printed heating device is carried out in concrete, and/or glass and/or ceramic and/or wood agglomerates typically compatible with sheet to sheet systems.
- the materials used in the printing of the resistive tracks and/or films of the printed heating device comprise the following composition:
- the materials used in the printing of conductive tracks of the printed heating device comprise the following composition:
- the method for printing on a sheet to sheet system on flexible and/or rigid substrates of the printed heating device described comprises the following steps:
- the method for printing on a roll to roll system on flexible substrates of the printed heating device comprises the following steps:
- the method of printing by the rotogravure technology on a roll to roll system for obtaining the printed heating device comprises the following steps:
- the printing method by the inkjet technology on a sheet to sheet system for obtaining the printed heating device comprises the following steps:
- the heating device for heating indoor and outdoor floors, on chairs, sofas and seats, in particular on the seats and supports for legs and arms and also in the vehicles' doors and dashboards.
- the present application describes heating devices whose essential elements are: low electrical conductivity materials (resistive) responsible for the heating of the circuit, high electrical conductivity materials used in the bus bars of the heating circuit and the connections between the modules of the heating circuits and a flexible substrate, such as polyethylene terephthalate (PET) and/or polyethylene naphthalate (PEN) and/or cork and/or thermoplastic polyolefin (TPO) and/or meshes coated with polymer films, or rigid substrates such as concrete and/or glass and/or ceramic and/or wood agglomerates by printing techniques of screen printing and/or rotogravure and/or inkjet printing on roll to roll and/or sheet to sheet systems.
- a flexible substrate such as polyethylene terephthalate (PET) and/or polyethylene naphthalate (PEN) and/or cork and/or thermoplastic polyolefin (TPO) and/or meshes coated with polymer films, or rigid substrates such as concrete and/or glass and/or ceramic
- the circuits can be laminated and/or coated with different materials after printing for mechanical and electrical protection, depending on the desired final application.
- a final application in the building industry are used for heating indoor and outdoor floors, also being used in chairs, sofas and seats in the furniture industry.
- aeronautic industry are used in seats and foot rests and arms.
- car industry are used on seats, armrests, doors and dashboards.
- the heating devices are composed of metallic and/or non-metallic and/or composite materials, used as current conductors and as resistive systems.
- the combination of these two types of materials allows the heating of the structure by the known Joule effect.
- the printed circuit it flows an adjustable electric current, whose value is dependent on the applied electric voltage and of the resistance of the printed circuit to the passage of electric current.
- the passage of electric current gives rise to the heating of the previously dimensioned resistive tracks when projecting the electrical circuit.
- the dimensioning of the conductive tracks and the resistive tracks of the system enables to calibrate and dimensioning the circuit for obtaining different temperatures, operating modes, operating voltages and currents. Thus, one ensures a total adaptability of these circuits to external power supply systems.
- the devices now disclosed comprise three different geometries/designs/formats, presenting different advantages, being noteworthy that the possibility of obtaining a larger heating area and/or the opportunity to make the sectioning of the circuit to the required dimension in two different directions, without loss of any functionality.
- the temperature reached at the surface of the printed circuit depends on the electric voltage applied to the terminals of the same, the sizes of the respective lines, the thickness of the printed films, the substrate on which is printed, the materials used in their preparation, the type of association, i.e.
- the electrical dimensioning of the electronic control circuit and of the geometries/designs/formats of heating printed circuit is designed according to the area to be heated, to the properties of materials to be used and to the electric voltage available to carry out the power supply of the circuit.
- the same is carried out based on desired power per area. Based on this value it is possible to proceed to the dimensional calculation of the resistive material tracks, namely its width, length and thickness, and consequently its electrical resistance value, thereby enabling foreseen the amount of energy dissipated by the circuit as heat.
- the electrical resistivity values of the materials after its printing For the correct electrical dimensioning it is necessary to have in mind the electrical resistivity values of the materials after its printing.
- the power of the printed heating circuit varies with the electrical dimensioning previously carried out, the values obtained were comprised between 100 and 350 W/m 2 .
- the encapsulation of the printed heating circuits on flexible and/or rigid substrates is carried out by rolling, and/or hot-gluing, and/or slot die, and/or doctor blade, and/or knife-over-edge, and/or screen printing, and/or spray, of a polymeric material curable by UV and/or temperature.
- the use of techniques such as slot die and/or doctor blade and/or knife-over-edge presents a novelty compared to methods already known for flexible and/or rigid substrates.
- the main objectives of encapsulation are to protect the circuit against abrasion and humidity, and the electrical insulation of the system.
- the electronic control system regulates the temperature of the system according to the temperature previously set by the user.
- This system is integrated between the power supply and the printed heating circuit, thereby regulating the current intensity and/or time of application of electrical voltage to the heating circuit.
- This electronic control system is constituted by: a power supply for the circuits, temperature sensors for monitoring, electronic temperature control system, barrier film for electrical and mechanical protection.
- This type of devices whose intended application is the heating, offer many advantages such as low weight, small thickness and high flexibility and can be easily laminated with other type of materials. Once they are placed close to the surfaces to heat up, the power dissipated to the surface will be lower, resulting in lower energy consumptions compared to other conventional heating systems.
- resistive materials carbon pastes and/or carbon composite materials are used, capable of being processed by screen printing technology, and/or rotogravure and/or inkjet printing. These types of materials are used due to its higher sheet resistivity whose value is comprised between 10 and 100 ⁇ /sq/mil, in order to enable a high efficiency of heating through Joule effect. Due to its high strength, the long circuit dimensioning has some limitations due to the loss of electric voltage seen across these, thereby influencing the desired heating.
- bus bars With the aim of reducing the electrical resistance of circuits with larger dimensions, silver and/or copper and/or aluminum tracks are printed, typically denominated bus bars, along the circuits. These conductive materials present low sheet resistivity, whose value is comprised between 5 and 40 m ⁇ /sq/mil and, therefore does not dissipate too much energy by Joule effect. Through this configuration the bus bars transport electric current uniformly to the various terminals of the carbon and/or carbon composite material tracks, thus permitting uniform release of thermal energy throughout the various tracks of the resistive material used.
- the dimensioning of the heating circuits is developed, based on the electrical resistivity of the materials used and the voltages that are typically used in many applications where they may be embedded.
- the printed heating circuit is powered by electric voltage DC (direct current) or AC (alternating current), its value being able to be adjusted in order to control the temperature thereof, or the environment in which it is embedded.
- the type of electrical voltage applied to the circuit varies with the intended final product, which can be a DC for heating solutions whose intended final application is related to the aeronautic, car and furniture industries, or AC for solutions related to the building industry.
- the use of printed heating circuits is possible in this range of electrical voltages, through the use of an AC-DC transformer which allows the conversion of alternating current into direct current.
- the operating temperature of the printed circuits can be monitored and controlled through the placement of temperature sensors in contact with these.
- the acquired data are recorded and/or worked by the electronic circuit wherein these are inserted, thereby enabling the temperature control in real time.
- an association of these to an "on/off" circuit is carried out that allows to connect and/or disconnect the circuit, thereby maintaining the temperature on the surface between a maximum value and a minimum value.
- thermocontrol in the surface of the printed heating circuit it is possible the association of a circuit that allows the current control that flows through the circuit, based on the values acquired by the temperature sensors whose placement was previously carried out in the surface.
- printed bus bars (2, 3) are used with lengths ranging from 50 to 5000 mm. For lengths greater than the maximum mentioned there is a drop in electrical voltage that affects the normal functioning of the heating circuits.
- the widths of these tracks are comprised between 2.5 and 15 mm and its thickness ranges between 2 and 100 ⁇ m.
- the distance between the bus bars (2, 3), varies between 40 and 100mm, with this value being dimensioned according to the specifications of the carbon and/or carbon composite material tracks.
- the bus bars have a total electrical resistance comprised between 0.1 and 10 ⁇ , the sheet resistivity of the printed material being comprised between 5 and 40 m ⁇ /sq/mil.
- the printed carbon and/or carbon composite material tracks (1) have a length which may vary between 40 and 100mm, a width between 2.5 and 15mm, and a thickness comprised between 2 and 100 ⁇ m.
- the distance between the carbon and/or carbon composite material tracks (1) is equal to the width of the printed carbon and/or carbon composite material tracks, and may thus vary between 2.5 and 15 mm.
- carbon and/or carbon composite material tracks have a total electrical resistance comprised between 0.5 and 8K ⁇ , the sheet resistivity of the printed material being comprised between 10 and 100 ⁇ /sq/mil.
- carbon and/or composite material tracks (1) are printed with twice the length of the printed tracks of the geometry shown in Figure 1 , and for three silver and/or copper and/or aluminum bus bars (2).
- This geometry allows the heating of a superior area, maintaining the temperature uniform across the surface, following the operation principle present in the geometry illustrated in Figure 1 .
- the positive terminal of the power supply is applied to the exterior bus bars and the negative terminal is applied to the interior bus bar.
- printed bus bars (2) are used with lengths ranging from 50 to 5000 mm. For lengths greater than the maximum mentioned there is a drop in electrical voltage that affects the normal functioning of the heating circuits.
- the widths of these tracks are comprised between 2.5 and 15 mm, and its thickness ranges between 2 and 100 ⁇ m.
- the distance between the bus bars (2) varies between 40 and 100 mm, this value should be dimensioned according to the specifications of the printed carbon and/or carbon composite material tracks.
- the printed bus bars have a total electrical resistance comprised between 0.01 and 10 ⁇ , the sheet resistivity of the printed material being comprised between 5 and 40 m ⁇ /sq/mil.
- the printed carbon and/or carbon composite material tracks (1) have a length which may vary between 80 and 200mm, a width between 2.5 and 15 mm, and a thickness comprised between 2 and 100 ⁇ m.
- the distance between the printed carbon and/or carbon composite material tracks (1) is equal to the width of the carbon and/or carbon composite materials tracks, for this reason ranging between 2.5 and 15 mm.
- the printed carbon and/or carbon composite materials tracks have a total electrical resistance comprised between 1 and 16 K ⁇ , the sheet resistivity of the printed material being comprised between 10 and 100 ⁇ /sq/mil.
- silver and/or copper and/or aluminum bus bars (2) are printed, being subsequently printed a continuous film of carbon and/or carbon composite materials (1).
- silver and/or copper and/or aluminum bus bars are printed perpendicular to the previously printed ones.
- the main purpose of the geometry used for printing perpendicular bus bars is to allow the subsequent cutting of the printed circuits in two different directions, without any interruption in the conduction of the electric current through the bus bars. In this way it is ensured that, regardless of the cut that takes place, there will be conduction of electric current through the upper and/or lower bus bars.
- the use of a carbon continuous film and/or carbon composite materials has as main advantage the high temperature uniformity obtained along the entire surface of the device. However, this device is not as flexible as the devices composed of carbon and/or composite material tracks.
- printed bus bars are used (2) with lengths ranging between 50 and 500 mm. For lengths greater than the maximum mentioned there is a drop of electrical voltage that affects the normal functioning of the heating circuits.
- the widths of these tracks are comprised between 2.5 and 15 mm, and its thickness ranges between 2 and 100 ⁇ m.
- the distance between the printed bus bars (2) varies between 40 and 100mm, this value should be dimensioned according to the specifications of the printed carbon tracks and/or carbon composite materials.
- the printed bus bars have a total electrical resistance comprised between 0.01 and 35 ⁇ , the sheet resistivity of the printed material being comprised between 5 and 40 m ⁇ /sq/mil.
- the printed carbon film and/or carbon composite materials (1) have a length which may vary between 80 and 200 mm, a width between 2.5 and 15 mm, and a thickness comprised between 2 and 100 ⁇ m.
- printed carbon films and/or carbon composite material have a total electrical resistance comprised between 10 and 2000 ⁇ , the sheet resistivity of the printed material being comprised between 10 and 100 ⁇ /sq/mil.
- the two materials that compose the heating circuits are printed by screen printing and/or rotogravure and/or inkjet printing on roll to roll and/or sheet to sheet systems, being the chosen printing technology, tailored to the substrate used.
- the ink is forced to pass to the substrate through a frame which is perforated with the pattern that one wants to print out, this being constituted by polyester or metal.
- a squeegee is used composed of a natural or synthetic rubber, normally flexible polychloroprene or polyurethane.
- the printing process of the heating circuits by the screen printing technology may be carried out on a sheet to sheet and/or roll to roll systems.
- steps for printing a sheet to sheet system on flexible and/or rigid substrates are presented:
- the dimensions of the printed circuits, and the tracks that compose them, are defined by the frame used to make the printing.
- the amount of material which is printed is defined by the characteristics of the frame and the processing parameters used.
- the curing of the material after the printing is done in dryers/ovens with ventilation.
- the pattern that one wants to print out is previously engraved in a stainless steel cylinder. Subsequently it is forced to pass in a bath with the ink and/or paste that is intended to print, in order to ensure that all of it is coated with it. Prior to the printing, the ink and/or paste in excess that remains in the non-engraved roll surface is withdrawn by a metal blade (or a fabric) which is in permanent contact with the roll surface. A hydrodynamic counter pressure is exerted upon the blade, being this mainly caused by the contact angle of these, the velocity of the compression and of the viscosity of the material used, subsequently the engraved pattern is printed on the flexible substrate that is in motion on the roll to roll system.
- the pattern to be printed is previously drawn in digital format, being subsequently sent the information through electric pulses to the print head of the equipment, whose operation is based on transducers and/or piezoelectric actuators. This is responsible for the printing of metallic conductive materials and/or non-metallic resistive materials.
- the printing process of the heating circuits for the inkjet printing technology on a sheet to sheet system on flexible and/or rigid substrates follows the following steps:
- Printing of the heating circuits can be carried out on flexible substrates such as polyethylene terephthalate (PET), and/or polyethylene naphthalate (PEN), and/or cork, and/or thermoplastic polyolefin (TPO) and/or coated meshes with polymeric films typically compatible with roll to roll systems, or rigid substrates such as concrete, and/or glass and/or ceramic, and/or wood agglomerates typically compatible with sheet to sheet systems.
- PET polyethylene terephthalate
- PEN polyethylene naphthalate
- cork cork
- thermoplastic polyolefin (TPO) and/or coated meshes with polymeric films typically compatible with roll to roll systems or rigid substrates such as concrete, and/or glass and/or ceramic, and/or wood agglomerates typically compatible with sheet to sheet systems.
- TPO thermoplastic polyolefin
- the resistive non-metallic materials used are based on carbon pastes and/or carbon composite materials. These have a viscosity comprised between 5 and 250 Pa.s, a sheet resistivity comprised between 10 and 100 ⁇ /sq/mil, and are thermally cured at a temperature between 100 and 150°C, for 10 to 20 minutes.
- the materials used in the printing of the resistive patterns have graphite in its composition (10-15 weight %) and/or carbon black (10-15 weight %) and/or monomethyl ether of dipropylene glycol (60-65% weight %) and/or bisphenol-a-epichlorohydrin (15-20 weight %) and/or oil distillates (5-15 weight %) being their percentages altered in order to obtain the desired electrical resistivities.
- the use of oil distillates is optional, however its introduction allows obtaining a higher electrical, mechanical and chemical stability of the material developed after its printing and curing. On the occasion of its introduction it should be reduced the same percentage to the bisphenol-a-epichlorohydrin.
- the metallic conductor materials used are based on silver and/or copper and/or aluminum. These have a viscosity comprised between 5 and 200 Pa.s, a sheet resistivity comprised between 5 and 40 m ⁇ /sq/mil, and thermally cure at a temperature between 100 and 150°C, for 10 to 20 minutes.
- the materials used in printing of the conductive tracks have aluminum in its composition (60-85 weight %) or silver (60-90 weight %) or copper (60-90 weight %) and/or methyl-2-methoxyethoxy) propanol (20-30 weight %) and/or 2-(2 ethoxyethyl) ethyl acetate (7-10 weight %), being their percentages altered in order to obtain the desired electrical resistivities.
- the material used in the screen of the screen printing is composed of polyethylene terephthalate (PET) and/or metal, having between 50 and 110 wires per centimeter whose diameters can range between 30 and 60 ⁇ m.
- PET polyethylene terephthalate
- metal having between 50 and 110 wires per centimeter whose diameters can range between 30 and 60 ⁇ m.
- printed heating circuits are obtained by screen printing and/or rotogravure and/or inkjet printing on a sheet to sheet and/or roll to roll systems, in flexible and/or rigid substrates.
- the printed heating circuits are composed of metallic and/or nonmetallic materials, such as silver and/or aluminum and/or copper and/or carbon and/or carbon composite materials and have three geometries/designs/formats for heating of various types of surfaces.
- the circuits presented offer different advantages, being noteworthy that the possibility to obtain a larger heating area and/or the opportunity to perform the sectioning to the required size of the circuit in two different directions, without loss of any functionality.
- the temperature obtained on the surface of the printed circuits depends on the electric voltage applied to the terminals thereof, the dimensions of the printed circuit board and its respective lines, the thickness of the printed films, the substrate in which is printed, the materials used in its processing, the type of association (series or parallel) between the various circuit boards and the environment in which the heating circuit is embedded and/or laminated and/or printed.
- This type of devices whose application purpose is heating present several advantages such as low weight, small thickness and high flexibility, and can be easily laminated with other type of materials. Since they are placed close to the surfaces to heat, the dissipated power at the surface will be lower, resulting in lower energy consumptions, when compared to other heating systems.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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PT10649312 | 2012-08-08 | ||
PCT/IB2013/056498 WO2014024165A2 (fr) | 2012-08-08 | 2013-08-08 | Dispositif de chauffage, procédés d'impression respectifs et utilisation |
Publications (3)
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EP2884818A2 true EP2884818A2 (fr) | 2015-06-17 |
EP2884818B1 EP2884818B1 (fr) | 2023-06-07 |
EP2884818C0 EP2884818C0 (fr) | 2023-06-07 |
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EP13774822.4A Active EP2884818B1 (fr) | 2012-08-08 | 2013-08-08 | Dispositif de chauffage, procédés d'impression respectifs et utilisation |
Country Status (2)
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EP (1) | EP2884818B1 (fr) |
WO (1) | WO2014024165A2 (fr) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
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PT108334A (pt) * | 2015-03-31 | 2016-09-30 | Amorim Revestimentos Sa | Processo de produção de um sistema de aquecimento compreendendo um substrato de aglomerado de cortiça e circuitos de aquecimento impressos |
WO2017176208A1 (fr) * | 2016-04-05 | 2017-10-12 | Dou Yee Enterprises (S) Pte Ltd | Bande chauffante autoadhésive et procédé de fabrication correspondant |
CN110107405A (zh) * | 2019-05-22 | 2019-08-09 | 江鹏 | 一种发动机进气防护格栅 |
WO2020056128A1 (fr) * | 2018-09-13 | 2020-03-19 | De Luca Oven Technologies, Llc | Élément chauffant multi-plan destiné à être utilisé dans un four à grande vitesse |
WO2020056131A1 (fr) * | 2018-09-13 | 2020-03-19 | De Luca Oven Technologies, Llc | Élément chauffant incorporant un conducteur primaire destiné à être utilisé dans un four rapide |
EP3641492A1 (fr) * | 2018-10-16 | 2020-04-22 | Goodrich Corporation | Procédé d'utilisation de barres omnibus d'encre conductrice hautement flexible imprimée pour transférer de l'énergie à des composants chauffés |
CN112397107A (zh) * | 2019-08-16 | 2021-02-23 | 神讯电脑(昆山)有限公司 | 储存装置的加热及散热结构 |
FR3102908A1 (fr) * | 2019-11-06 | 2021-05-07 | Valeo Systemes Thermiques | Structure chauffante pour véhicule automobile |
CN113993430A (zh) * | 2019-02-06 | 2022-01-28 | 德卢卡炉灶技术有限责任公司 | 用于包括新型张紧系统的高速烤箱的多平面加热元件 |
CN113993430B (zh) * | 2019-02-06 | 2024-05-17 | 德卢卡炉灶技术有限责任公司 | 用于包括张紧系统的高速烤箱的多平面加热元件 |
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PT107488B (pt) | 2014-02-27 | 2019-01-10 | Cmp Cimentos Maceira E Pataias S A | Sistema para gestão ativa de energia em paredes e/ou pavimentos de betão |
CN104553587A (zh) * | 2015-01-08 | 2015-04-29 | 昆山金利表面材料应用科技股份有限公司 | 加热型装饰薄膜 |
US11376811B2 (en) | 2018-07-03 | 2022-07-05 | Goodrich Corporation | Impact and knife cut resistant pre-impregnated woven fabric for aircraft heated floor panels |
US20200015325A1 (en) * | 2018-07-03 | 2020-01-09 | Goodrich Corporation | Fusion welded positive temperature coefficient heater assemblies |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020011477A1 (en) * | 1999-05-06 | 2002-01-31 | Jones Barrie M. | Polymer thick film heating element on a glass substrate |
WO2007076506A1 (fr) * | 2005-12-29 | 2007-07-05 | Exatec, Llc | Connexion électrique à des circuits imprimés sur des panneaux en plastique |
US20080099456A1 (en) * | 2006-10-25 | 2008-05-01 | Schwenke Robert A | Dispensing method for variable line volume |
US20080099617A1 (en) * | 2005-02-09 | 2008-05-01 | Qinetiq Limited | Ice Protection of Aerodynamic Surfaces |
DE202010009208U1 (de) * | 2010-06-17 | 2010-09-16 | Futurecarbon Gmbh | Flexibles Heizelement |
EP2257120A2 (fr) * | 2008-03-17 | 2010-12-01 | LG Chem, Ltd. | Élément chauffant et procédé de fabrication de celui-ci |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997015171A2 (fr) | 1995-10-17 | 1997-04-24 | Magnus Kluge | Chauffage electrique par resistance pour la climatisation d'appartements et de batiments |
WO2007021528A1 (fr) | 2005-08-17 | 2007-02-22 | Thermion Systems International | Elements chauffants a barres omnibus perforees |
-
2013
- 2013-08-08 WO PCT/IB2013/056498 patent/WO2014024165A2/fr active Application Filing
- 2013-08-08 EP EP13774822.4A patent/EP2884818B1/fr active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020011477A1 (en) * | 1999-05-06 | 2002-01-31 | Jones Barrie M. | Polymer thick film heating element on a glass substrate |
US20080099617A1 (en) * | 2005-02-09 | 2008-05-01 | Qinetiq Limited | Ice Protection of Aerodynamic Surfaces |
WO2007076506A1 (fr) * | 2005-12-29 | 2007-07-05 | Exatec, Llc | Connexion électrique à des circuits imprimés sur des panneaux en plastique |
US20080099456A1 (en) * | 2006-10-25 | 2008-05-01 | Schwenke Robert A | Dispensing method for variable line volume |
EP2257120A2 (fr) * | 2008-03-17 | 2010-12-01 | LG Chem, Ltd. | Élément chauffant et procédé de fabrication de celui-ci |
DE202010009208U1 (de) * | 2010-06-17 | 2010-09-16 | Futurecarbon Gmbh | Flexibles Heizelement |
Non-Patent Citations (1)
Title |
---|
See also references of WO2014024165A2 * |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
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PT108334B (pt) * | 2015-03-31 | 2017-08-30 | Amorim Revestimentos Sa | Processo de produção de um sistema de aquecimento compreendendo um substrato de aglomerado de cortiça e circuitos de aquecimento impressos |
PT108334A (pt) * | 2015-03-31 | 2016-09-30 | Amorim Revestimentos Sa | Processo de produção de um sistema de aquecimento compreendendo um substrato de aglomerado de cortiça e circuitos de aquecimento impressos |
WO2017176208A1 (fr) * | 2016-04-05 | 2017-10-12 | Dou Yee Enterprises (S) Pte Ltd | Bande chauffante autoadhésive et procédé de fabrication correspondant |
WO2020056128A1 (fr) * | 2018-09-13 | 2020-03-19 | De Luca Oven Technologies, Llc | Élément chauffant multi-plan destiné à être utilisé dans un four à grande vitesse |
WO2020056131A1 (fr) * | 2018-09-13 | 2020-03-19 | De Luca Oven Technologies, Llc | Élément chauffant incorporant un conducteur primaire destiné à être utilisé dans un four rapide |
US20220053612A1 (en) * | 2018-09-13 | 2022-02-17 | De Luca Oven Technologies, Llc | Heater element incorporating primary conductor for use in a high-speed oven |
EP3641492A1 (fr) * | 2018-10-16 | 2020-04-22 | Goodrich Corporation | Procédé d'utilisation de barres omnibus d'encre conductrice hautement flexible imprimée pour transférer de l'énergie à des composants chauffés |
CN111056017A (zh) * | 2018-10-16 | 2020-04-24 | 古德里奇公司 | 使用印刷的高度柔韧的导电墨水汇流条将电力传递到受热部件的方法 |
US11242151B2 (en) | 2018-10-16 | 2022-02-08 | Goodrich Corporation | Method of using printed highly flexible conductive ink bus bars to transfer power to heated components |
CN113993430A (zh) * | 2019-02-06 | 2022-01-28 | 德卢卡炉灶技术有限责任公司 | 用于包括新型张紧系统的高速烤箱的多平面加热元件 |
CN113993430B (zh) * | 2019-02-06 | 2024-05-17 | 德卢卡炉灶技术有限责任公司 | 用于包括张紧系统的高速烤箱的多平面加热元件 |
CN110107405A (zh) * | 2019-05-22 | 2019-08-09 | 江鹏 | 一种发动机进气防护格栅 |
CN110107405B (zh) * | 2019-05-22 | 2021-05-28 | 江鹏 | 一种直升机发动机进气防护格栅 |
CN112397107A (zh) * | 2019-08-16 | 2021-02-23 | 神讯电脑(昆山)有限公司 | 储存装置的加热及散热结构 |
FR3102908A1 (fr) * | 2019-11-06 | 2021-05-07 | Valeo Systemes Thermiques | Structure chauffante pour véhicule automobile |
Also Published As
Publication number | Publication date |
---|---|
EP2884818B1 (fr) | 2023-06-07 |
WO2014024165A2 (fr) | 2014-02-13 |
WO2014024165A9 (fr) | 2014-04-10 |
EP2884818C0 (fr) | 2023-06-07 |
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