EP2875168A4 - Chemische vernickelungsbeschichtungen sowie zusammensetzungen und verfahren zur bildung derselben - Google Patents

Chemische vernickelungsbeschichtungen sowie zusammensetzungen und verfahren zur bildung derselben

Info

Publication number
EP2875168A4
EP2875168A4 EP13820572.9A EP13820572A EP2875168A4 EP 2875168 A4 EP2875168 A4 EP 2875168A4 EP 13820572 A EP13820572 A EP 13820572A EP 2875168 A4 EP2875168 A4 EP 2875168A4
Authority
EP
European Patent Office
Prior art keywords
coatings
compositions
methods
forming
electroless nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP13820572.9A
Other languages
English (en)
French (fr)
Other versions
EP2875168A2 (de
EP2875168B1 (de
Inventor
Matthew Joseph Wojcik
Ambrose Schaffer
Jean M Laplante
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coventya Inc
Original Assignee
Coventya Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Coventya Inc filed Critical Coventya Inc
Publication of EP2875168A2 publication Critical patent/EP2875168A2/de
Publication of EP2875168A4 publication Critical patent/EP2875168A4/de
Application granted granted Critical
Publication of EP2875168B1 publication Critical patent/EP2875168B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
EP13820572.9A 2012-07-17 2013-07-17 Chemische vernickelungsbeschichtungen sowie zusammensetzungen und verfahren zur bildung derselben Active EP2875168B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261672584P 2012-07-17 2012-07-17
PCT/US2013/050932 WO2014015063A2 (en) 2012-07-17 2013-07-17 Electroless nickel coatings and compositions and methods for forming the coatings

Publications (3)

Publication Number Publication Date
EP2875168A2 EP2875168A2 (de) 2015-05-27
EP2875168A4 true EP2875168A4 (de) 2016-04-06
EP2875168B1 EP2875168B1 (de) 2017-12-20

Family

ID=49949367

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13820572.9A Active EP2875168B1 (de) 2012-07-17 2013-07-17 Chemische vernickelungsbeschichtungen sowie zusammensetzungen und verfahren zur bildung derselben

Country Status (7)

Country Link
US (2) US20150159277A1 (de)
EP (1) EP2875168B1 (de)
BR (1) BR112015001113B1 (de)
CA (1) CA2879315C (de)
ES (1) ES2663684T3 (de)
MX (1) MX363621B (de)
WO (1) WO2014015063A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9520645B2 (en) * 2013-09-09 2016-12-13 Apple Inc. Electronic device with electromagnetic shielding structures
US9708693B2 (en) 2014-06-03 2017-07-18 Macdermid Acumen, Inc. High phosphorus electroless nickel
US9768063B1 (en) 2016-06-30 2017-09-19 Lam Research Corporation Dual damascene fill
US10577692B2 (en) * 2017-01-05 2020-03-03 International Business Machines Corporation Pretreatment of iron-based substrates for electroless plating
GB2560969A (en) * 2017-03-30 2018-10-03 Ajt Eng Ltd Electroless plating
EP3617350A1 (de) 2018-08-31 2020-03-04 Tubacex Upstream Technologies, S.A. Verfahren zur beschichtung eines metallteils, das dazu bestimmt ist, hohen anpressdrücken ausgesetzt zu werden, und daraus hergestelltes metallteil
US11054199B2 (en) 2019-04-12 2021-07-06 Rheem Manufacturing Company Applying coatings to the interior surfaces of heat exchangers
CN112359357B (zh) * 2020-10-28 2022-03-01 瑞声科技（南京）有限公司 钢片化学镀镍工艺、镀磷镍钢片以及均温板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007154223A (ja) * 2005-12-01 2007-06-21 Koa Corp 無電解ニッケルめっき液およびそれを使用しためっき方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1310921A (en) * 1970-04-13 1973-03-21 Gen Am Transport Electroless alloy coatings and processes
US3914126A (en) * 1973-02-12 1975-10-21 Xerox Corp Nickel oxide interlayers for photoconductive elements
CA1185404A (en) * 1981-07-27 1985-04-16 Glenn O. Mallory Electroless plating with reduced tensile stress
US4483711A (en) * 1983-06-17 1984-11-20 Omi International Corporation Aqueous electroless nickel plating bath and process
US4511614A (en) * 1983-10-31 1985-04-16 Ball Corporation Substrate having high absorptance and emittance black electroless nickel coating and a process for producing the same
US4984855A (en) * 1987-11-10 1991-01-15 Anritsu Corporation Ultra-black film and method of manufacturing the same
JP2901523B2 (ja) * 1995-08-09 1999-06-07 日本カニゼン株式会社 無電解黒色めっき浴組成と皮膜の形成方法
JP3696429B2 (ja) * 1999-02-22 2005-09-21 日本化学工業株式会社 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料
JP2003031028A (ja) * 2001-07-17 2003-01-31 Shin Etsu Chem Co Ltd 導電性組成物
DE10246453A1 (de) * 2002-10-04 2004-04-15 Enthone Inc., West Haven Verfahren zur stromlosen Abscheidung von Nickel
JP4203744B2 (ja) * 2003-12-02 2009-01-07 上村工業株式会社 無電解ニッケル−リンめっき浴及びこれを用いた黒色ニッケル皮膜の形成方法
JP2005290400A (ja) * 2004-03-31 2005-10-20 Ebara Udylite Kk 無電解ニッケルめっき浴及び無電解ニッケル合金めっき浴
JP4709731B2 (ja) * 2006-11-17 2011-06-22 三菱重工業株式会社 耐食性めっき層形成方法および回転機械
KR101261454B1 (ko) * 2010-12-14 2013-05-10 성열섭 무인 타입의 무전해 니켈 도금액 및 이를 이용한 무전해 도금 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007154223A (ja) * 2005-12-01 2007-06-21 Koa Corp 無電解ニッケルめっき液およびそれを使用しためっき方法

Also Published As

Publication number Publication date
CA2879315C (en) 2019-09-10
US20220145469A1 (en) 2022-05-12
EP2875168A2 (de) 2015-05-27
ES2663684T3 (es) 2018-04-16
BR112015001113A2 (pt) 2017-06-27
BR112015001113B1 (pt) 2021-05-18
WO2014015063A3 (en) 2014-03-20
MX363621B (es) 2019-03-28
CA2879315A1 (en) 2014-01-23
EP2875168B1 (de) 2017-12-20
MX2015000850A (es) 2015-08-20
US20150159277A1 (en) 2015-06-11
WO2014015063A2 (en) 2014-01-23

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