EP2838126A4 - Semiconductor device, die attach material, and method for manufacturing semiconductor device - Google Patents

Semiconductor device, die attach material, and method for manufacturing semiconductor device

Info

Publication number
EP2838126A4
EP2838126A4 EP13775725.8A EP13775725A EP2838126A4 EP 2838126 A4 EP2838126 A4 EP 2838126A4 EP 13775725 A EP13775725 A EP 13775725A EP 2838126 A4 EP2838126 A4 EP 2838126A4
Authority
EP
European Patent Office
Prior art keywords
semiconductor device
die attach
attach material
manufacturing semiconductor
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13775725.8A
Other languages
German (de)
French (fr)
Other versions
EP2838126A1 (en
Inventor
Koji Makihara
Shuey Seng Low
Lynn Sum Man
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Sumitomo Bakelite Singapore Pte Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Sumitomo Bakelite Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd, Sumitomo Bakelite Singapore Pte Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of EP2838126A1 publication Critical patent/EP2838126A1/en
Publication of EP2838126A4 publication Critical patent/EP2838126A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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    • H01L2224/834—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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EP13775725.8A 2012-04-10 2013-04-10 Semiconductor device, die attach material, and method for manufacturing semiconductor device Withdrawn EP2838126A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012089337 2012-04-10
PCT/JP2013/002430 WO2013153803A1 (en) 2012-04-10 2013-04-10 Semiconductor device, die attaching material, and method for manufacturing semiconductor device

Publications (2)

Publication Number Publication Date
EP2838126A1 EP2838126A1 (en) 2015-02-18
EP2838126A4 true EP2838126A4 (en) 2015-10-28

Family

ID=49327387

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13775725.8A Withdrawn EP2838126A4 (en) 2012-04-10 2013-04-10 Semiconductor device, die attach material, and method for manufacturing semiconductor device

Country Status (9)

Country Link
US (1) US20150060889A1 (en)
EP (1) EP2838126A4 (en)
JP (1) JP6247204B2 (en)
KR (1) KR20150003287A (en)
CN (1) CN104221171B (en)
MY (1) MY170959A (en)
SG (1) SG11201405729QA (en)
TW (1) TWI577767B (en)
WO (1) WO2013153803A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6356582B2 (en) * 2014-11-25 2018-07-11 日東電工株式会社 Adhesive sheet, adhesive sheet with dicing sheet, and method for manufacturing semiconductor device
JP6675155B2 (en) * 2015-05-20 2020-04-01 京セラ株式会社 Die attach paste for semiconductor and semiconductor device
JP6791626B2 (en) * 2015-12-14 2020-11-25 デクセリアルズ株式会社 Manufacturing method of thermosetting adhesive sheet and semiconductor device
JP2018141106A (en) * 2017-02-28 2018-09-13 住友ベークライト株式会社 Thermosetting resin composition, resin sheet with carrier base material and semiconductor device
KR102376144B1 (en) 2018-11-14 2022-03-18 주식회사 엘지화학 Resin composition for bonding semiconductor, adhesive film for semiconductor, dicing diebonding film, and method for dicing of semiconductor wafer using the same
WO2020101236A1 (en) * 2018-11-14 2020-05-22 주식회사 엘지화학 Resin composition for semiconductor adhesion, semiconductor adhesive film using same, dicing die bonding film and semiconductor wafer dicing method

Citations (6)

* Cited by examiner, † Cited by third party
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CN104221171B (en) 2017-11-24
MY170959A (en) 2019-09-20
TW201345994A (en) 2013-11-16
JPWO2013153803A1 (en) 2015-12-17
KR20150003287A (en) 2015-01-08
CN104221171A (en) 2014-12-17
JP6247204B2 (en) 2017-12-13
US20150060889A1 (en) 2015-03-05

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