EP2815177A1

EP2815177A1 - Light-emitting module

Info

Publication number: EP2815177A1
Application number: EP13707575.0A
Authority: EP
Inventors: Thomas Preuschl; Dieter EISENHUT
Original assignee: Osram GmbH
Current assignee: Osram GmbH
Priority date: 2012-02-16
Filing date: 2013-02-14
Publication date: 2014-12-24
Anticipated expiration: 2033-02-14
Also published as: WO2013120962A1; CN104126095A; DE102012202354A1; US9279574B2; US20150049484A1; EP2815177B1

Abstract

The light-emitting module (11) has a housing (12) with an open rear side (14), a light source substrate (18) with at least one light source (20) arranged thereon, a driver printed circuit board (15) accommodated in the housing (12), at least one electrical connecting element (17) for electrically connecting the driver printed circuit board (15) to the light source substrate (18), and a closure element (29) for closing the open rear side (14), wherein the closure element (29) is designed for passing through at least one electrical connection (30, 31).

Description

Description Light-emitting module The invention relates to a light-emitting module comprising a

A housing, a light source substrate having at least one light source disposed thereon, a driver board accommodated in the housing and at least one electrical

Connecting element for the electrical connection of

Driver board with the light source substrate.

So far, light emitting diode (LED) modules are created in different structures. This makes it difficult in practice

considerably, identical parts concepts for such LED modules

implement. The geometric form factors of the LED modules are specified by single-sided boards. LED modules containing multiple boards are typically connected by cable connections. It is the object of the present invention to at least partially overcome the disadvantages of the prior art and in particular to provide lighting modules which have an improved suitability for identical-part concepts. This object is achieved according to the characteristics of the independent

Claims solved. Preferred embodiments are

in particular the dependent claims.

The object is achieved by a light module having a housing with an open rear side, a light source substrate having at least one light source arranged thereon, a driver board accommodated in the housing, at least one electrical connection element for the electrical connection of the driver board to the light source substrate and a

Closure element for closing the open back, wherein the closure element is adapted for performing at least one electrical connection. Such a light module allows a reduction in the thermal processes required for assembly. Also, a particularly compact design is possible. moreover

Such a modular construction simplifies the use of

Similar part concepts or an interchangeability of

Light modules. By the closure element is the

Driver board easy and housable in the housing. The housing is tightly closable, so that the light module can in particular also fulfill different protection classes, e.g. Class I, II or III protection classes.

It is a development that the driver board at least one electrical and / or electronic component or

A device for operating the at least one light source, e.g. an integrated circuit, resistor, capacitor, etc. This allows a particularly high

Density of light sources on the light source substrate and a protected housing for operating the

Light sources needed driver. It is a development that the driver (or its electrical and

electronic components) are arranged exclusively on the driver board. It is furthermore a development that the at least one light source has at least one semiconductor light source. Preferably, the at least one

Semiconductor light source at least one light emitting diode. at

If several LEDs are present, they can be lit in the same color or in different colors. A color may be monochrome (e.g., red, green, blue, etc.) or multichrome (e.g., white). This can also be done by the at least one

LED emitted light is an infrared light (IR LED) or an ultraviolet light (UV LED). Several

Light emitting diodes can produce a mixed light; eg a white mixed light. The at least one light-emitting diode may contain at least one wavelength-converting phosphor (Conversion LED). The phosphor may alternatively or additionally be arranged away from the light-emitting diode

("Remote Phosphor"). The at least one light-emitting diode can be in the form of at least one individually housed light-emitting diode or in the form of at least one LED chip. Several LED chips can be mounted on a common substrate ("submount"). The at least one light emitting diode may be equipped with at least one own and / or common optics for beam guidance, e.g. at least one Fresnel lens,

Collimator, and so on. Instead of or in addition to inorganic light emitting diodes, e.g. based on InGaN or AlInGaP, organic LEDs (OLEDs, for example polymer OLEDs) can generally also be used. Alternatively, the at least one semiconductor light source may be e.g. have at least one diode laser.

Under a light module, in particular a light

radiating unit or module are understood, which is not intended for independent lighting, but typically for installation in a parent

Lighting unit is provided, e.g. in a lamp or a lighting system. This is how the light bulb points

typically no own power connector or similar. on. On the other hand, the lighting module is typically not as simple as a lamp or a lighting device

Consumable provided.

It is an embodiment that the at least one

electrical connection element at least two electrically conductive (contact) pins, e.g. made of copper. These allow in particular a simple and safer

Contacting or at least preparing a contact already at an insertion or insertion of the carrier board in the housing.

However, only one pen or more than two pens may be used. It is a development that the pins (mechanical and electrical or 'electromechanical') firmly with the

Driver board are connected, which facilitates handling and their precise positioning. The fixed connection with the driver board can be made for example by soldering.

It is preferred to provide a particularly stable and non-thermally stressing compound

Design that the pins on the driver board

caulked, in particular cold-welded or cold-caulked (by means of 'Pressfit'), are attached. Alternatively or additionally, the pins may be e.g. also on the

Light source substrate cold staked be attached.

It is one for a safe contacting, simple

Handling and precise, in particular vertical, alignment preferred development that the pins are inserted into a respective, in particular narrow, passage through the driver board. The implementation can be implemented in particular by an electrically conductive sleeve or tube, which facilitates electrical contact, in particular in a frictional connection with the respective pin.

It is another embodiment that the

Light source substrate is disposed outside of the housing. It is an embodiment of that

Light source substrate is disposed outside of the housing. This allows a high light output without one

Influenced by the housing. In addition, an effective heat dissipation from the light sources is made possible by thermal convection. It is an alternative embodiment of that

Light source substrate is disposed within the housing. Thus, a dense housing is also the Light source substrate and thus the light sources allows. The housing can then be radiated by the

at least one light source produced light, for example, a translucent, especially the front side

arranged, have cover.

It is another embodiment that the case

is electrically conductive. This especially likes one

Protective conductor to be connected to the housing. In addition, as well as a good thermal conductivity and consequently

Heat dissipation provided. The housing may in particular be made of metal, e.g. Aluminum, which provides a particularly inexpensive, easily moldable and very well electrically and thermally conductive housing.

It is yet another embodiment that the housing has at least one passage or cutout through which the pins are guided. It is preferred for easy contacting that an outwardly guided by the housing end face of the

Contact pin serves as an electrical contact surface. The

Contact surface, for example, serve as a contact surface for a bonding wire, on the other hand with the

Light source substrate is connected.

The bonding wire may e.g. made of gold, silver, copper and / or aluminum. The contact surface may be provided with a suitable material layer for producing or improving its bondability, e.g. Ni / Au for

Bonding wires made of aluminum or Ni / Pd / Au for bonding wires made of gold.

In particular, in the case that the light source substrate is arranged outside the housing, the pins can at least in a guided through the housing portion of be surrounded by electrical insulation to prevent electrical connection to the housing.

It is further an embodiment that the closure element for performing at least one electrical connection has at least one via and the

Driver board at least one (n) spring contact (device) for electrically contacting a through-connection of the closure element.

This provides a simple, without further soldering, etc. auskommende electrical contact.

The spring contact may be an elastic, electrically conductive spring element, e.g. a leaf spring, which allows a simple design. By contacting the

End plate via the spring contacts can provide a simple, safe and versatile electrical contact, which supports identical part concepts. The spring contact may in particular be a spring contact pin. A spring contact pin may in particular have two mutually elastically displaceable parts, in particular a sleeve with a resiliently displaceably mounted therein pin.

Except the at least one spring contact like the

Driver board still have other electrical contacts, e.g. Bond pads and / or bushings. It is an embodiment that the at least one

Spring contact in a reflow soldering on the

Printed circuit board has been applied. This provides the advantage that the spring contacts need not be applied in a separate process, if at least one further applied to the driver board component (or component or block) also with a reflow soldering is applied. Such components are often used, eg surface mounted components (SMD components).

It is still an embodiment that at least two

Spring contacts for connecting an operating voltage to an associated light module are provided. The operating voltage may include, for example, a low voltage or a mains voltage. The operating voltage may in particular be between 10 and 250 volts.

It is a further development that the closure element has the same number of plated-through holes as

Spring elements are present on the driver board. So is a light module with a comparatively small

Material expenditure provided.

It is still a development that the closure element has a higher number of plated-through holes

Spring elements are present on the driver board. This simplifies the use of a standardized closure element, each with different driver boards.

It is also a development that the closure element has a smaller number of plated-through holes than spring elements are present on the driver board. This allows use of a via for

Current supply of several spring contacts and so a simplified structure, in particular wiring of the driver board. It is another embodiment that at least one

Through contact of the closure element

is configured rotationally symmetrical. As a result, a rotationally independent contacting of the lighting module is made possible in a light device receiving the lighting device, such as a lamp, a lighting system, etc. Even so may the closure element simply be screwed into the housing. For this purpose, the symmetry axis of the rotationally symmetrical through-hole expediently together with the axis of rotation of the closure element.

It is yet a further embodiment that at least one via is annular.

As an annular and / or rotationally symmetric

Through-connection in this sense should also

Through-contacts are understood, each having on one or both sides of the closure element annular and / or rotationally symmetrical contact surfaces, wherein the shape of the connection between the contact surfaces can be designed arbitrarily. It can therefore, for example, a rotationally symmetrical contact path via a pin-shaped intermediate element with a further rotationally symmetrical

Contact track to be connected on the opposite side.

In particular, a through hole in the form of a

Connection point are present, which is arranged concentrically to the at least one annular through-hole. The connection point may in particular be arranged centrally with respect to the closure element. This simplifies, for example, a confusion-proof contacting. It is also an embodiment that a contact surface of the at least one spring contact and / or a contact surface of the at least one via has a surface layer with a high abrasion resistance. The

Surface layer may in particular be thick gold or a Ni / Au mixture, in particular alloy. This provides a mechanically particularly robust and fail-safe contacting.

It is also an embodiment that the

Closure element is a printed circuit board, in particular of the type FR or CEM. This type of circuit board allows one particularly simple and inexpensive way of a

Integration of galvanic processes.

It is a development of this that has a base material of the circuit board CEM-1 to CEM-5, in particular CEM- 3. Alternatively or additionally may like a base material of the circuit board FR-2 to FR-5, in particular FR-4 have.

It is also an embodiment that the closure element for performing at least one electrical connection has a, in particular central, cable channel. In particular, at least one electrical connection, in particular cables, may be brought to the driver board and routed outwards or routed through the cable channel.

It is also an embodiment that the

Closing element at its side edge at least one

Fastening element which is engageable with at least one arranged on an inner wall of the housing fastening counter-element can be brought.

It is also an embodiment that the

Closing element at its side edge at least one

Fastening element in the form of recesses, in which on an inner wall of the housing arranged projections (which form the at least one fastening counter-element) engage. This will be a snap fastening of the

Closing element allows on the housing. The

Locking attachment may in particular be realized without tools and by simply pressing the closure element into the housing. The projections may have a triangular shape or a sawtooth shape in cross section, for example. The recess and the projection are in particular circumferentially formed, the recess, for example in the form of an annular groove. The fastening element and the counter-fastening element can generally be parts of a latching connection. The fastening element and the counter-fastening element can alternatively form a screw connection, for example with the

Fastener as an external thread and the

Fastening counter element as an internal thread, or

vice versa. However, the closure element may alternatively or additionally also be glued to the housing, can be pressed into it, etc.

It is still an embodiment that the driver board is potted in the housing. This has the advantage that it is particularly firmly fastened in the housing. In addition, such an effective electrical insulation of the current-carrying areas located on the driver board relative to the housing can be ensured (if the potting material is electrically insulating, for example made of silicone). In addition, the potting compound increases a heat spreading. In the presence of contact pins for electrical

Connection between the driver board and the

Light source substrate, these can also be encapsulated, which also strengthens their electrical insulation and mechanical attachment.

It is a development that the housing is completely filled with the potting compound.

In particular, it is one in the case of presence of spring contacts between the driver board and the

Closure element preferred alternative embodiment, that the housing is only partially filled with the potting compound, and in particular leaves free a movable part of the at least one spring contact, so it forms an exemption. This provides the advantage that an attachment, an adjustment and / or an exchange of the cover also at

Potting is easily possible. It is one Further, that the potting compound provides an exemption with respect to the closure element, so this is not shed. For large-area distribution of the associated potting compound, the driver board may have at least one channel, preferably a plurality of channels, for example potting / vent holes. In the event that the casting in already set

Closing element is to be performed, it will

in that the closure element has at least one channel, preferably several channels, e.g. Grouting / bleed holes.

It is yet another embodiment that the housing has a thread on a lateral outside.

It is also an embodiment that the housing has a hollow cylindrical basic shape with a closed

Has front side and at least the driver board and the closure element has a circular disk-shaped basic shape

have and are aligned parallel to each other. The hollow cylindrical basic shape simplifies one

rotation-independent installation. For example, a provision of a thread on the lateral outer side or outer lateral surface of the housing for the installation of the light module is facilitated.

It is a development that the light source substrate has a circular disk-shaped basic shape and to the

Driver board and parallel to the closure element

is aligned.

It is still an embodiment that the light source substrate is a ceramic substrate, in particular of an electrically insulating ceramic such as A1N. Ceramics have the advantage of typically very good heat conduction of For example, more than 50 W / (mK), so A1N of about 180 W / (mK).

It is an alternative development of that

Substrate is a printed circuit board or board, e.g. a

Metal core board.

It is also a development that the housing at least one fastening device for (optionally) attaching at least one of the at least one light source

has downstream optics. The at least one optic may, for example, at least one translucent

cover (transparent or diffuse), reflector, lens, collimator, etc. It is a development of this that the fastening device has a groove arranged on an outer side of the housing, at least sector-wise (in particular completely). The groove likes

in particular the at least one light source substrate

be arranged laterally surrounding to allow a structurally simple coverage of the at least one light source.

It is an alternative or additional development that at least one optical system (for example a translucent cover) for one or more lighting modules is provided in common by a higher-level lighting device (light, etc.) in which the lighting module is installed.

In the following figures, the invention will be described schematically with reference to an embodiment schematically. In this case, the same or equivalent elements may be provided with the same reference numerals for clarity.

Fig.l shows a sectional view in side view

Lighting module according to a first embodiment; 2 shows the lighting module according to the first

Embodiment in a view from above; 3 shows the lighting module according to the first embodiment in a view from below;

4 shows a sectional side view of a

Section of a lighting module according to a second embodiment;

5 shows a sectional side view of a

Section of a lighting module according to a third embodiment;

6 shows a sectional view in side view

Light module according to a fourth

Embodiment; and

7 shows the lighting module according to the first

Embodiment in a view from below. Fig.l shows a light module 11 for installation in a lamp, a lighting system, etc.

The lighting module 11 has a metallic housing 12 with a hollow cylinder-like basic shape, which has a

basically closed front side 13 and an open back 14 has. In the housing 12 is a

circular disk-shaped driver board 15 housed with CEM-3 or FR-4 as their base material. For simple and correct positioning of the driver board 15, this lies with an outer edge of its front side on a

inside projection 16 or taper of the housing 12.

The driver board 15 is connected via two vertical, electrically conductive contact pins 17 with a

Light source substrate 18 electrically connected. The

Light source substrate 18 is outside of the housing 12

arranged, and indeed it lies with its back surface on the front side 13 of the housing 12, here via a thermal adhesive 40. A free front 19 of the

Light source substrate 18 is equipped with a plurality of light sources in the form of, for example, white, light-emitting diodes 20, as shown in Fig.2. The light source substrate 18 is made of aluminum nitride (A1N), so that the light emitting diodes 20 are electrically insulated from the housing 12, but are connected via a low thermal resistance with the then acting as a heat sink housing 12.

On the one hand, the contact pins 17 lead through the driver board 15 through respective narrow passages 21 and are electrically and mechanically connected to one another at a soldering point 41 on the back. On the other hand, they stand out

Contact pins 17 through corresponding passages 22 of the housing 12 and the light source substrate 18. To a

to prevent electrical connection between the housing 12 and the respective contact pin 17, with respect to the driver board 15 front-side portion of

Contact pins 17 from an electrically insulating sheath 23, e.g. made of plastic, laterally surrounded. An end face 24 of the contact pin 17 led out through the housing 12 serves as an electrical contact surface for a respective bonding wire 25. The respective bonding wire 25 is in turn connected to the light source substrate 18, e.g. via a so-called bond pad 42 thereof. Bonding pads 42 are connected to light emitting diodes 20 via wirings, not shown. Instead of a bonding pad 42, e.g. also a solder pad or 'Solderpad' can be used. The end face 24 of the

Contact pin 17 may have a particularly good bondable or solderable position (o.Fig.).

The driver board 15 has a plurality of electrical and / or electronic components 26 which a driver for

Operation of the LEDs 20 form. The driver board 15 thus serves as a driver board. An operating signal generated by means of the components 26 is applied to the light-emitting diodes 20 via the contact pins 17. The components 26 are at least partially SMD components, which is their ease of application

facilitated, in particular by means of a reflow soldering. Also located on the front side 13 of the housing 12 is a fastening device for fastening at least one light emitting diode 20 connected together optics

(O.Abb.). The fastening device is in the form of a radially laterally aligned, circumferentially around the

Light source substrate 18 and the light-emitting diodes 20 circumferential groove 27 formed which, for. Breakthroughs for attachment by means of a plug / turn connection or bayonet connection may have.

On the outer or outer circumferential surface of the housing 12 is an external thread 28 for installation of the

Luminous module 11. The open back 14 of the housing 12 with a

circular disk-shaped closure element in the form of a

another circuit board, the shutter board 29,

closed, as shown in plan view in Figure 3. The

Shutter circuit board 29 has an inner punctiform through-hole 30 and a concentrically arranged outer annular through-hole 31. This form of plated-through holes 30, 31 allows a

Rotation-independent, comparatively non-interchangeable contacting. On the underside and thus on the outside, the plated-through holes 30, 31 can be contacted in any manner, e.g. by soldering. The shutter board 29 seals the housing 12 and the housing received therein

Driver board 15 off, e.g. to achieve a desired protection class.

The plated-through holes 30, 31 have upper side (directed into the housing 12) and lower side (outside)

widened contact surfaces 30o and 30u or 31o and 31u, which facilitates their contacting, soldering, etc.

With the driver board 15, the plated-through holes 30, 31 or their upper-side contact surfaces 30 o, 31 o over two Spring contact pins 32, 33 connected. Consequently, the driver formed by means of the components 26 via the

Vias 30, 31 and further the spring contact pins 32, 33 are supplied or powered, e.g. with a

Mains voltage. The spring contact pins 32, 33 are on the

Bottom of the driver board 15 by reflow soldering

have been attached and generate at the vias 30 and 31, a pressure contact. At the contact surfaces 30o, 30u, 31o, 31u of the plated-through holes 30, 31 there is an abrasion-resistant surface layer in the form of e.g. a Ni / Au alloy.

For attachment to the housing 12, the

Shutter plate 29 on its side edge sawtooth-shaped recesses 36, in which on an inner wall of the

Housing 12 arranged, conformal projections 37 engage detent.

In particular, for electrical isolation from the housing 12, the driver board 15 is potted in the housing 12, e.g. with silicone as potting 38th The

Contact pins 17 and their sheaths 23 are mitvergossen.

However, the spring contact pins 32, 33 and their

slidably mounted pins 34 not shed so that they remain movable. This is achieved by a corresponding exemption 35.

For large-area distribution of the associated potting compound 38, both the driver board 15 and the closure circuit board 29 have several continuous channels in the form of

Potting / vent holes 39 on, wherein the

Grouting / vent holes 39 of the closure circuit board 29 are sealed.

4 shows a sectional side view of a section of a lighting module 51. The light module 51 is similar to the light module 11, except that now the contact pins 52, one of which is shown here by way of example, for connecting the driver board 55 with the

Light source substrate 18 as kaltverschweißbare or

kaltverstemmbare ('Pressfit-') contact pins 17 are configured.

The contact pin 52 has at its (lower) end attached to the driver board 55 a cold deformable end portion 53 which is inserted into the narrow passage 21 and may slightly protrude downwardly. For electrical contacting and mechanically stable mounting a metallic or metallized sleeve 54 is inserted into the passage of the driver board 55.

The end portion 53 is first inserted into the sleeve 54 and then widened by cold staking so that it in a press fit in the sleeve 54 frictionally or

is frictionally secured. The sleeve 54 serves as

electrical contact of the driver board 55, allowing for soldering or other thermal stress

Connection method can be dispensed with.

The insulating sheath 23 is present only at a portion of the contact pin 52 above the end portion 53.

5 shows a sectional side view of a section of a lighting module 61 according to a third embodiment. The light-emitting module 51 is constructed similarly to the light-emitting module 11, except that now the electrically insulating sheath 62 at its (upper) end region introduced into the light source substrate 18 has a circumferential taper, here in the form of a peripheral step 63, to lengthen a creepage distance and to provide a stop for a mechanism. 6 shows a sectional view in side view

Lighting module 71. Fig.7 shows the lighting module 71 according to the first embodiment in a view from below. The lighting module 71 is similar to the lighting module 11

constructed, but now the driver board 72 does not have spring contact pins with the shutter board 75th

connected is. Rather, two triple-insulated cables 73 are attached to the driver board 72, which are guided through a central cable channel 74 of the shutter board 75 to the outside.

The housing 12 is now also completely filled with the potting compound 38, which also the central cable channel 74th

seal.

Of course, the present invention is not limited to the embodiment shown. Thus, the cold-curable contact pins may additionally or alternatively be cold-caulked or cold-caulked on the light source substrate 18.

Also, for example, an upper-side end portion of the contact pin extending in the light source substrate may not have an insulating sheath.

In addition, like several driver boards in the housing

be accommodated, which in particular to each other

spaced apart and in particular are aligned parallel to each other. The driver boards may preferably be electrically connected to one another by contact pins.

In general, the occupancy of the printed circuit board (s) / substrate (s) is not limited to light sources or driver components. In general, the printed circuit board (s) / substrate (s) may be referred to as functional substrates, eg

Light source substrate as a possible formation of a first functional substrate and the driver board as a possible formation of a second functional substrate.

Reference sign list

11 light module

12 housing

13 closed front of the housing

14 open rear of the case

15 driver board

16 inside projection

17 contact pin

18 light source substrate

19 free front of the light source substrate

20 LED

21 Carrying out the driver board

22 Implementation of the housing

23 insulating sheath

24 end surface of the contact pin

25 bonding wire

26 component

27 groove

28 external thread

29 closure circuit board

30 inner punctiform via

30o widened top side contact surface

30u underside widened contact surface

31 outer, annular through-hole

31o widened surface at the top

31u underside widened contact surface

32 spring contact pin

33 Spring contact pin

34 slidably mounted pin

35 time off

36 recess

37 advantage potting compound

Grouting / vent hole

Thermal Adhesive

soldered point

bonding pad

light module

end

shell

driver board

light module

insulating shell

step

light module

driver board

electric wire

Cabel Canal

Shutter board

Claims

claims

1. light module (11; 51; 61; 71), comprising

a housing (12) having an open rear side (14), a light source substrate (18) having at least one light source (20) arranged thereon,

- One in the housing (12) accommodated

Driver board (15; 55; 72),

- At least one electrical connection element (17;

52) for the electrical connection of the driver board

(15; 55; 72) with the light source substrate (18) and

a closure element (29; 75) for closing the open rear side (14), wherein the closure element (29; 75) is designed to carry at least one

electrical connection (30, 31, 74) is set up.

2. lighting module (11; 51; 61; 71) according to claim 1, wherein the at least one electrical connection element

at least two electrically conductive pins (17, 52).

3. light module (51) according to claim 2, wherein the pins (52) to the driver board (55) caulked, in particular cold-caulked, are attached.

4. lighting module (11; 51; 61; 71) according to one of claims 2 or 3, wherein

the light source substrate (18) is arranged outside the housing (12),

the housing (12) is electrically conductive,

- The housing (12) has at least one cutout (22) through which the pins (17) are guided and

- The pins (17) at least in one through the housing

(12) guided portion of an electrical insulation (23; 62) are surrounded. Illuminating module (11; 51; 61) according to one of the preceding claims, wherein

- The closure element (29) for implementation

at least one electrical connection has at least one through-connection (30, 31) and

- The driver board (15) at least one

Spring contact, in particular spring contact pin (32, 33), for electrically contacting a

Through connection (30, 31) of the closure element (29).

A light module (11; 51; 61) according to claim 5, wherein

at least one via (30, 31) of the

Closure element (29) rotationally symmetrical

is designed.

A lighting module (11; 51; 61) according to claim 6, wherein

at least one via (31) is designed annular.

Lighting module (71) according to one of claims 5 to 7, wherein the closure element (75) for performing at least one electrical connection, in particular a central cable channel (74).

Light module (11; 51; 61; 71) according to one of

preceding claims, wherein the closure element

(29; 75) at least one at its margin

Fastening element (36) which engages with at least one on an inner wall of the housing

(12) arranged fastening counter-element (37) is bringb.

Light module (11; 51; 61; 71) according to one of

preceding claims, wherein the driver board (15; 55; 72) is potted in the housing (12).

A light module (11; 51; 61; 71) according to any one of the preceding claims, wherein the housing (12) has a thread (28) on a lateral outside.

12. lighting module (11; 51; 61; 71) according to one of

previous claims, wherein

- The housing (12) has a hollow cylindrical basic shape with a closed front side (13) and

- At least the driver board (15; 72) and the

Closing element (29, 75) have a circular disk-shaped basic shape and parallel to each other

are aligned.

13. lighting module (11; 51; 61; 71) according to one of

preceding claims, wherein the light source substrate (18) is a ceramic substrate.