EP2795543A1 - Carte à puce multiformat - Google Patents

Carte à puce multiformat

Info

Publication number
EP2795543A1
EP2795543A1 EP12818517.0A EP12818517A EP2795543A1 EP 2795543 A1 EP2795543 A1 EP 2795543A1 EP 12818517 A EP12818517 A EP 12818517A EP 2795543 A1 EP2795543 A1 EP 2795543A1
Authority
EP
European Patent Office
Prior art keywords
card
card body
smart card
form factor
tab
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12818517.0A
Other languages
German (de)
English (en)
Inventor
Stéphane OTTOBON
Laurent Oddou
Alexis Froger
Jéremy RENOUARD
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales DIS France SA
Original Assignee
Gemalto SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemalto SA filed Critical Gemalto SA
Priority to EP12818517.0A priority Critical patent/EP2795543A1/fr
Publication of EP2795543A1 publication Critical patent/EP2795543A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
    • G06K19/07739—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier

Definitions

  • the invention relates to a multi-format smart card.
  • the invention also relates to a smart card body in the ISO 1D-1 format comprising a muiti-format smart card.
  • smart cards that are generally called SIM ⁇ Subscriber Identity Module (SIM ⁇ Subscriber Identity Module) cards.
  • SIM Subscriber Identity Module
  • Such smart cards contain personal data for subscriber identification.
  • Such smart cards can be transferred from one communication device to another.
  • the requirements for the miniaturisation of mobile communication devices have led to a reduction in the dimensions of these smart cards.
  • smaller cards can be difficult to handle, for example while disconnecting a card from a mobile communication device.
  • a device to remedy that problem has been described in the patent EP1 190378B1 .
  • the device includes the following:
  • a smart card comprising an integrated circuit chip, mounted on a card body in a first format
  • the tab makes it easier to handle the smart card, particularly to detach the smart card before inserting it in a mobile communications device.
  • card form factors coexist.
  • SIM card form factors have been defined by international standards. These are commonly called 1 FF, 2FF, 3FF and 4FF formats. These form factors define card bodies with different dimensions and thicknesses.
  • the 1 FF format is the so-called "credit card” ID-1 format ⁇ 85.80mm x 53.98mm x 0.82mm)
  • the 2FF format is the so-called mini SIM ID-G00 format (25mm x 15mm x 0.82mm)
  • the 3FF format is the so-called micro-SIM format (15mm x 12mm x 0,82mm)
  • the 4FF format is a new generation of format that is not yet fully defined but which will be smaller than 3FF, with thickness of 0.68mm.
  • the solution described limits the use of the smart card to mobile communication devices configured for the same form factor.
  • Adapters can be found that make it possible to use a smart card with a first form factor in a device configured to receive smart cards with a second form factor, where that second form factor is larger than the first.
  • These adapters take the form of a card body, comprising a contour and a slot configured to receive a smart card with a first form factor.
  • the production of such adapters for a pair of given form factors makes it necessary to develop specific tools, particularly because of their different thicknesses. That increases the cost of production. Besides, it leads to significant loss of material.
  • the invention is aimed at remedying one or more of these drawbacks.
  • the invention ' relates to a multi-format smart card comprising the following:
  • the second card body with a second form factor that is larger than the first form factor, the second form factor comprising a contour and a slot configured to accommodate the first card body, wherein the second card body is attached to the tab and is detachable from that tab.
  • the smart card includes adapters for several form factors, allowing a user to use the same chip in devices configured to accommodate smart cards with different form factors. Further, that smart card may be manufactured with manufacturing methods that are typically used in industry, therefore not necessitating the development of new tools. Lastly, the consumption of raw materials is reduced.
  • the contour of the second card body is thicker than the tab and the first card body.
  • the smart card comprises a third smart card body with a third form factor, where that third card body comprises another slot configured to accommodate the first card body.
  • the third card body is attached to the second card body and is detachable from that second card body.
  • the third card body is attached to the tab and is detachable from it.
  • the first form factor is 4FF.
  • either of the second or third form factor is 2FF or 3FF.
  • the invention relates to a card body in the ISO ID-1 format, comprising at least one multi-card smart card according to the invention.
  • FIG. 1 illustrates a multi-format smart card
  • FIG. 2 is a simplified view of a transverse section of the card in figure
  • FIG. 1 ; - figure 3 illustrates a multi-format smart card in another embodiment of the invention
  • FIG. 4 illustrates a multi-format smart card in another embodiment of the invention
  • FIG. 5 illustrates a mu!ti-format smart card in another embodiment of the invention
  • figure 6 illustrates a smart card contour comprising the smart card of figure 1 ;
  • figure 7 illustrates a smart card contour comprising several smart cards of figure ! .
  • the invention proposes a multi-format smart card.
  • the multi- format smart card 1 comprises:
  • That second card body 8 is attached to one end of the tab 6 and extends in a plane parallel to that tab 6. That second card body 8 is detachable from the tab 8, That second card body 8 comprises a contour 7 and a slot 9 configured to accommodate the first card body 4.
  • the slot 9 is a cavity here, with dimensions and thickness matching the dimensions of the first card body 4, That first card body 4 may thus be inserted in it, aier it is detached from the tab 8,
  • the second card body 8 is thicker than the first card body 4 and the tab 8, as illustrated in the figure 2.
  • the first form factor is 4FF. That form factor is being defined by the ETSI (European Telecommunications Standards Institute).
  • the second form factor is 2FF, as defined by the international standard !SO/!EC 7810:2003.
  • the contour 7 of the second card body 8 has thickness of ei ranging from 800pm to 840pm, preferably equal to 820pm.
  • the tab 6 has thickness of e 2 ranging from 650pm to 700 ⁇ , preferably equal to 680pm.
  • the thickness of the first card body 4 is equal to e 2 , within a 5% variance.
  • the smart card 1 is made in thermoplastic material, using an injection and moulding method.
  • the first 4 and the second 8 card bodies are attached to the tab 6 by a detachable joint 5. That joint is configured to facilitate the cutting of the card bodies 4, 8 from the tab with no cutting tool. The joint is achieved here by scoring notches 5 on the front and back of the smart card 1 .
  • Figure 3 represents a second embodiment, in which the second card body 8 has the 3FF form factor, such as that defined by the standard ETSl 102 221. That standard particularly defines length of 15 mm and width of 12 mm
  • Figure 4 represents a third embodiment, where the smart card 1 further comprises a third card body 10, with a third form factor, That third form factor 10 comprises a contour 11 and a slot 12 configured to accommodate the first card body 4, That third card body 10 is attached here to the tab 6, on one side of that tab 6, and extends in a plane parallel to that tab 6. That third card body 10 is advantageously attached by means of a detachable joint 5. That third card body 10 has a 3FF form factor here.
  • the first and second form factors are 4FF and 2FF respectively.
  • the slots 9 and 12 respectively of each of the two card bodies 8 and 10 are configured to accommodate the first card body 4, with a 4FF form factor.
  • Figure 5 represents another embodiment, wherein the third card body 10, with a 2FF form factor, is attached to the second card body 8 with a 3FF format on one of its sides.
  • Each of the two card bodies 8 and 10 comprises a slot, 9 and ' 12 respectively, configured to accommodate the first card body 4 with a 4FF form factor.
  • the slots 9 and 12 respectively of the second 8 and third 10 card bodies are not limited to accommodating card bodies in a first format.
  • the slot 12 of the third card body 10 with a 2FF form factor may be configured to accommodate the second card body 8 with the 3FF form factor.
  • Figure 6 represents a card medium 20 in the ISO ID-1 format comprising a detachable smart card 1 .
  • the dimensions of that card medium 20 are defined by the international standard ISO/IEC 7810:2003. That medium 20 has thickness ranging from 650pm to 700pm, preferably equal to 680pm,
  • the card medium is made in thermoplastic material, using an injection and moulding method.
  • the smart card 1 is detachable from the card medium.
  • the joint between the card 1 and the card medium 20 is for example made using the same technique as the detachable joint 5.
  • That card medium 20 may, in another embodiment, comprise more than one smart card 1 , as illustrated in figure 7.
  • the card medium 20 comprises four smart cards 1.
  • Each of these cards 1 comprises a first card body 4 with a 4FF form factor and a second card body 8 with a 3FF form factor.
  • That card body 8 comprises a slot 9 configured to accommodate the first card body 4,
  • each smart card 1 comprises no more than a second card body in a second format or a third card body in a third format.
  • these cards 1 may comprise more than one second card body in a second format or one third card body in a third format.
  • the first card body 4 has a form factor other than 4FF.
  • the card bodies and the tab may have two different thicknesses
  • the smart card 1 is made of thermosetting material.
  • the smart card 1 is manufactured by machining.
  • the detachable joint 5 of a card body is defined by partly cutting the contour of that card body or by punching.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention concerne une carte à puce (1) multiformat comprenant un microcircuit intégré (2), d'un seul tenant avec un premier corps de carte à puce (4) avec un premier facteur de forme, un onglet (8) fixé au premier corps de carte et détachable de ce premier corps de carte, un deuxième corps de carte à puce (8) avec un deuxième facteur de forme qui est plus grand que le premier facteur de forme, le deuxième facteur de forme (8) comportant un contour (7) et une fente (9) conçu pour loger le premier corps de carte. Le deuxième corps de carte (8) est fixé à l'onglet (6) et est détachable de cet onglet (6).
EP12818517.0A 2011-12-22 2012-12-24 Carte à puce multiformat Withdrawn EP2795543A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP12818517.0A EP2795543A1 (fr) 2011-12-22 2012-12-24 Carte à puce multiformat

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11306752.4A EP2608115A1 (fr) 2011-12-22 2011-12-22 Carte à puce multi-formats
EP12818517.0A EP2795543A1 (fr) 2011-12-22 2012-12-24 Carte à puce multiformat
PCT/EP2012/076878 WO2013093117A1 (fr) 2011-12-22 2012-12-24 Carte à puce multiformat

Publications (1)

Publication Number Publication Date
EP2795543A1 true EP2795543A1 (fr) 2014-10-29

Family

ID=47603559

Family Applications (2)

Application Number Title Priority Date Filing Date
EP11306752.4A Withdrawn EP2608115A1 (fr) 2011-12-22 2011-12-22 Carte à puce multi-formats
EP12818517.0A Withdrawn EP2795543A1 (fr) 2011-12-22 2012-12-24 Carte à puce multiformat

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP11306752.4A Withdrawn EP2608115A1 (fr) 2011-12-22 2011-12-22 Carte à puce multi-formats

Country Status (2)

Country Link
EP (2) EP2608115A1 (fr)
WO (1) WO2013093117A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9165237B2 (en) * 2012-12-19 2015-10-20 Stmicroelectronics S.R.L. SIM card adapter

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002054345A1 (fr) * 2000-12-28 2002-07-11 Gemplus Bretelle moulee a soudage superficiel detachable

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2783750B1 (fr) * 1998-09-29 2000-10-13 Schlumberger Ind Sa Carte a module secable
FR2794059B1 (fr) 1999-05-31 2001-08-10 Gemplus Card Int Dispositif portable a circuit integre et procede de fabrication
JP4402420B2 (ja) * 2003-08-06 2010-01-20 大日本印刷株式会社 板状枠体付きｕｉｍとその製造方法
FR2872946B1 (fr) * 2004-07-08 2006-09-22 Gemplus Sa Procede de fabrication d'un support de carte a puce mini uicc avec adaptateur plug-in uicc associe et support obtenu
FR2882175B1 (fr) * 2005-02-11 2007-06-22 Oberthur Card Syst Sa Support de carte, son procede d'utilisation et ensemble carte-adaptateur

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002054345A1 (fr) * 2000-12-28 2002-07-11 Gemplus Bretelle moulee a soudage superficiel detachable

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013093117A1 *

Also Published As

Publication number Publication date
WO2013093117A1 (fr) 2013-06-27
EP2608115A1 (fr) 2013-06-26

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