EP2795264A1 - Pièce d'écartement pour un débitmètre thermique - Google Patents

Pièce d'écartement pour un débitmètre thermique

Info

Publication number
EP2795264A1
EP2795264A1 EP12798225.4A EP12798225A EP2795264A1 EP 2795264 A1 EP2795264 A1 EP 2795264A1 EP 12798225 A EP12798225 A EP 12798225A EP 2795264 A1 EP2795264 A1 EP 2795264A1
Authority
EP
European Patent Office
Prior art keywords
spacer
thin
film resistance
support surface
resistance thermometer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12798225.4A
Other languages
German (de)
English (en)
Inventor
Tobias Baur
Fanos Christodoulou
Martin Barth
Axel Pfau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Endress and Hauser Flowtec AG
Original Assignee
Endress and Hauser Flowtec AG
Flowtec AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102011089596A external-priority patent/DE102011089596A1/de
Priority claimed from DE102011089597A external-priority patent/DE102011089597A1/de
Application filed by Endress and Hauser Flowtec AG, Flowtec AG filed Critical Endress and Hauser Flowtec AG
Publication of EP2795264A1 publication Critical patent/EP2795264A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6842—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow with means for influencing the fluid flow
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
    • G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
    • G01F1/692—Thin-film arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/01—Mounting; Supporting

Definitions

  • the present invention relates to a spacer for a thermal flow meter which has a flat support surface for a thin-film resistance thermometer and an otherwise circular cylindrical surface.
  • Conventional thermal flow meters usually use two as similar designed temperature sensors, which are arranged in, usually pin-shaped, metal sleeves, so-called Stingers, and in thermal contact with the through
  • Measuring tube or through the pipeline flowing medium Measuring tube or through the pipeline flowing medium.
  • both temperature sensors are usually installed in a measuring tube; the
  • Temperature sensors can also be mounted directly in the pipeline.
  • One of the two temperature sensors is a so-called active temperature sensor, which is heated by means of a heating unit.
  • the heating unit is either an additional resistance heater, or the temperature sensor itself is a resistance element, e.g. one
  • RTD Resistance Temperature Device
  • Temperature sensor is a so-called passive temperature sensor: It measures the temperature of the medium.
  • the heatable temperature sensor is heated so that a fixed temperature difference between the two temperature sensors is established.
  • it has also become known to feed a constant heat output via a control / control unit.
  • the cooling of the heated temperature sensor is essentially dependent on the mass flow of the medium flowing past it. Since the medium is colder than the heated temperature sensor, heat is removed from the heated temperature sensor by the flowing medium. So in order to maintain the fixed temperature difference between the two temperature sensors in a flowing medium, an increased heating power for the heated temperature sensor is required.
  • the increased heating power is a measure of the mass flow or the mass flow of the medium through the pipeline.
  • the temperature difference between the two temperature sensors decreases as a result of the flow of the medium.
  • the respective temperature difference is then a measure of the mass flow of the medium through the
  • thermometers mainly RTD elements have been used with helically wound platinum wires in thermal flow meters.
  • thermometers For thin-film resistance thermometers
  • TFTDs conventionally a meandering platinum layer is deposited on a substrate. In addition, another glass layer is applied to protect the platinum layer.
  • the cross-section of the thin-film resistance thermometers is in contrast to that, a round
  • Resistance element and / or from the resistance element thus takes place via two opposite surfaces, which together form a majority of the total surface of a
  • the spacer has for this purpose a rectangular recess, which is made according to the outer dimensions of the thin-film resistance thermometer.
  • the spacer bushing should keep the thin film resistance thermometer tight. Spacer bushing and thin-film resistance thermometers form a kind of press fit. The spacer itself and the pin sleeve also form a press fit. As a result, the use of a potting compound or a different kind of filling material is unnecessary.
  • the advantage of this design is the good heat coupling between the thin-film resistance thermometer and the measuring medium through the spacer sleeve.
  • mechanical stresses occur in the thin-film resistance thermometer.
  • WO 2009/1 15452 A2 shows a spacer which, instead of a recess in the form of a bore, has a recess in the form of a groove, wherein the thin-film resistance thermometer can be soldered to the groove base. Since this spacer in a
  • Pin sleeve is pressed can also be too close groove flanks to tension in the
  • the object of the invention is a spacer for a thermal
  • FIG. 1 shows a spacer according to the invention in a first embodiment
  • FIG. 3 shows a spacer according to the invention in a third embodiment
  • Fig. 5 shows a further spacer according to the invention in a fifth embodiment.
  • Fig. 1 shows an inventive spacer 1 for a thermal flow meter with a flat support surface 2 and an otherwise circular cylindrical lateral surface 7 in
  • the support surface 2 is inclined to the longitudinal axis 6 of the spacer.
  • the longitudinal axis 6 lies in an imaginary plane which intersects the support surface 2 perpendicular.
  • the Longitudinal axis 6 of the spacer 1 also coincides with a longitudinal axis of an imaginary circular cylinder with a lateral surface which coincides with the circular cylindrical lateral surface of the spacer 1, together. It is therefore the imaginary axis of rotation of the imaginary cylindrical lateral surface of the spacer without the flat bearing surface.
  • An advantage of the invention is that excess solder can easily flow out onto the bearing surface of the spacer when soldering a thin-film resistance thermometer.
  • the longitudinal axis 6 of the spacer 1 and the longitudinal axis 6 of the spacer 1 projected perpendicularly into the support surface 2 encloses an angle ⁇ greater than 5 °, in particular greater than 10 ° and / or an angle ⁇ smaller than 30 °, in particular less than 20 °.
  • the angle is correspondingly measured in the plane which perpendicularly intersects the bearing surface 2 and in which the longitudinal axis 6 of the spacer 1 lies.
  • the planar support surface 2 forms a straight first edge 8 with a first end side of the spacer 1.
  • the edge 8 has a first distance and to the lateral surface 7, dimensioned perpendicular to the edge 8 and thus perpendicular in a plane to the flat bearing surface 2, in which plane the longitudinal axis 6 of the spacer 1 is located, which first distance to the longitudinal axis of the spacer 1 is greater than zero and which is smaller than a distance from the longitudinal axis 6 and lateral surface 7 of the spacer.
  • the spacer 1 further comprises straight-shaped second edge, which has a
  • the first edge 8 is below half of an imaginary circular cylinder with a lateral surface, which coincides with the circular cylindrical lateral surface 7 of the spacer 2, and the second edge is above half.
  • the thin-film resistance thermometer is arranged on the support surface 2 that connecting cable of the thin-film resistance thermometer from the thin-film resistance thermometer leading away in the ascending Direction of the flat bearing surface 2 have relative to the longitudinal axis 6 of the spacer.
  • the spacer 1 in Fig. 2 also has the support surface 2 limiting walls 3 on. Two walls 3 here limit the support surface 2 to a first width 4. Thus, a thin-film resistance thermometer can be held in position.
  • the distance between the walls 3 to each other over the entire length of the spacer 1 is constant. However, this can vary over the length of the spacer. This will be explained in more detail below.
  • FIGS. 3 and 4 each show spacers 1 with a flat support surface 2, which have no inclination to the longitudinal axis 6 of the spacer. However, their geometrical configurations are to be transferred to the spacer according to the invention.
  • Support surface 2 is not inclined for reasons of clarity in these figures.
  • the otherwise circular cylindrical surface 7 of the spacer 1 forms a circular arc in cross section through the
  • Spacer 1 is a circular segment with, formed by the cross sections of the walls 3 and 4, placed on the support surface 2 as a circular chord geometric shapes.
  • the first edge 8 has the second width.
  • Fig. 3 shows a spacer 1 with a flat support surface 2 and an otherwise
  • the support surface 2 is inclined to the longitudinal axis 6 of the spacer.
  • the longitudinal axis 6 lies in an imaginary plane which intersects the support surface 2 perpendicular.
  • the longitudinal axis 6 of the spacer 1 also coincides with a longitudinal axis of a circular cylinder with a lateral surface, which coincides with the circular cylindrical lateral surface of the spacer 2, together.
  • An angle of inclination, which is enclosed by the bearing surface 2 and the longitudinal axis 6 of the spacer 1 has proven to be advantageous between 5 ° and 30 °, in particular between 10 ° and 20 °.
  • One advantage is that excess solder can flow off in a given direction.
  • FIG. 3 an inventive spacer 1 for a thermal flow meter in front view, in plan view and three-dimensional is shown.
  • the spacer 1 has a groove along its longitudinal axis 6.
  • the groove base forms a bearing surface 2 for a thin-film resistance thermometer.
  • the groove flanks are formed by the walls 3 of the spacer 1.
  • the walls 3 have two different distances from each other. In a first area, the walls 3 are at a first distance from each other and in a second area they are at a second distance from one another.
  • the support surface 2 in the first region has a first width 4 and in the second region a second 5, according to the invention, the first width 4 of Support surface 2 is smaller than a second width 5 of the support surface.
  • the first width 4 of the support surface 2 is at least 10%, in particular at least 20% smaller than a second width 5 of the invention according to a development of the invention
  • Support surface 2 Since here the distances between the walls of the width of the support surface 2 correspond, the walls 3 in the region of the second width 4 one, here by at least 10%, in particular by at least 20%, greater distance from each other, as in the first Width 5.
  • a thermal flow meter with a spacer 1 according to the invention has a thin-film resistance thermometer, not shown here, arranged on the bearing surface 2 of the spacer 1.
  • the thin-film resistance thermometer is divided into two areas.
  • the thin-film resistance thermometer is arranged on the support surface 2 in such a way that the support surface has the second width 5 in the region of the connection cables on the thin-film resistance thermometer, ie in the connection region.
  • the measuring range is arranged in the first region of the spacer 1 with the first width 4.
  • the spacer 2 is designed for thin-film resistance thermometer so that the second width 5 of the support surface 2 is at least 40% larger, in particular at least 60% larger than a width of the thin-film resistance thermometer at the same location, ie in particular in the connection region of the cable of the thin film -Widerstandsthermometers.
  • the distance of the walls 3 is correspondingly larger than the width of the thin-film resistance thermometer.
  • the first width of the support surface ie in particular the distance of the walls 3 in the first region, at most 1 15%, in particular at most 105% of the width of the thin-film resistance thermometer at the same location, here corresponding to the measuring range of the thin-film resistance thermometer ,
  • a thermal flow meter with a device according to the invention is produced
  • Spacer for example, by solder is applied between the thin-film resistance thermometer and the support surface of the spacer, and the thin-film resistance thermometer is aligned on the support surface of the spacer that a mutual distance of the thin-film resistance thermometer in the range of connecting cables to the thin-film resistance thermometer to the limits the support surface of the spacer is at least 20% of the width of the thin film resistance thermometer at the same location.
  • the thin-film resistance thermometer is placed on the support surface of the thin-film resistance thermometer
  • the spacer with the soldered thin-film resistance thermometer is inserted into a sleeve, in particular a pin sleeve, in particular with this pressed.
  • FIG. 4 shows a technical drawing of the spacer 1 in a further embodiment.
  • the spacer 1 has no walls in the second region, which delimit the bearing surface 2. Again, the distance of the walls of the first width 4 of the support surface corresponds to 2.
  • Thin-film resistance thermometer would be arranged accordingly on the support surface, that the spacer 1 in the region of the connecting cable to the thin-film resistance thermometer has no walls bounding the second width 5 of the support surface 2 walls.
  • the walls may also define a bore, for example of rectangular cross-section, in the spacer.
  • the ratio of groove width to groove depth is to be adapted so that the said mechanical stresses during the pressing in of the
  • Spacer can be reduced in the pen sleeve to a minimum.
  • the groove depth could become so small that the solder extends beyond the groove edges during soldering and thus does not extend beyond the area of the connection cables.
  • the groove width is so large relative to the width of the thin film resistance thermometer that excess solder does not flow between the thin film resistance thermometer and the walls on the thin film resistance thermometer.
  • Fig. 5 is another inventive spacer 1 for a thermal
  • Spacer 1 has a groove along its longitudinal axis 6.
  • the groove bottom forms a
  • Support surface 2 for a thin-film resistance thermometer for a thin-film resistance thermometer.
  • the groove flanks are formed by the walls 3 of the spacer 1.
  • the walls 3 have two different distances from each other. In a first area, the walls 3 are at a first distance from each other and in a second area they are at a second distance from one another. Since the walls 3 limit the support surface 2 in this embodiment over the entire length of the spacer 1 in its width, thus, the support surface 2 in the first region has a first width 4 and in the second region a second 5, according to the invention, the first width 4 of
  • Support surface 2 is smaller than a second width 5 of the support surface. 2
  • the first width 4 of the support surface 2 is according to a development of the invention at least 15%, in particular at least 20% smaller than a second width 5 of

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Measuring Volume Flow (AREA)

Abstract

La présente invention concerne une pièce d'écartement (1) pour un débitmètre thermique, ladite pièce comporte une surface d'appui plane (2) pour un thermomètre à résistance à couche mince et une surface externe pour le reste cylindrique circulaire (7), la surface d'appui (2) étant inclinée dans un axe longitudinal (6) de la pièce d'écartement (1). La pièce d'écartement présente de préférence deux parois limitant une première largeur (4) de cette surface d'appui (2), la première largeur (4) de la surface d'appui (2) étant inférieure à la deuxième largeur (5) de la surface d'appui.
EP12798225.4A 2011-12-22 2012-11-22 Pièce d'écartement pour un débitmètre thermique Withdrawn EP2795264A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102011089596A DE102011089596A1 (de) 2011-12-22 2011-12-22 Distanzstück für ein thermisches Durchflussmessgerät
DE102011089597A DE102011089597A1 (de) 2011-12-22 2011-12-22 Distanzstück für ein thermisches Durchflussmessgerät
PCT/EP2012/073359 WO2013092102A1 (fr) 2011-12-22 2012-11-22 Pièce d'écartement pour un débitmètre thermique

Publications (1)

Publication Number Publication Date
EP2795264A1 true EP2795264A1 (fr) 2014-10-29

Family

ID=47324094

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12798225.4A Withdrawn EP2795264A1 (fr) 2011-12-22 2012-11-22 Pièce d'écartement pour un débitmètre thermique

Country Status (3)

Country Link
US (1) US20140366624A1 (fr)
EP (1) EP2795264A1 (fr)
WO (1) WO2013092102A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10571343B2 (en) 2014-10-24 2020-02-25 Watlow Electric Manufacturing Company Rapid response sensor housing

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2870305A (en) * 1955-04-04 1959-01-20 Ling Sung-Ching Constructions for anemometers of the hot wire type
US3061268A (en) * 1960-08-17 1962-10-30 Oil Ct Tool Company Wedge seal for valve body
US4507058A (en) * 1983-12-20 1985-03-26 Carr-Griff, Inc. Wobble plate pump and drive mechanism therefor
US4776214A (en) * 1985-08-09 1988-10-11 Motorola, Inc. Mass air flow sensor
JP2605297B2 (ja) * 1987-09-04 1997-04-30 株式会社村田製作所 白金温度センサおよびその製造方法
US4866411A (en) * 1988-03-25 1989-09-12 Caddock Richard E Film-type cylindrical resistor, and method of making it
EP0471316B1 (fr) * 1990-08-17 1996-09-18 Sensycon Gesellschaft Für Industrielle Sensorsysteme Und Prozessleittechnik Mbh Détecteur pour un débitmètre thermique
US5576488A (en) * 1994-11-21 1996-11-19 The United States Of America As Represented By The United States National Aeronautics And Space Administration Micro-sensor thin-film anemometer
JP3282773B2 (ja) * 1994-12-12 2002-05-20 東京瓦斯株式会社 熱式流量計
US6971274B2 (en) 2004-04-02 2005-12-06 Sierra Instruments, Inc. Immersible thermal mass flow meter
DE102008015359A1 (de) 2008-03-20 2009-09-24 Endress + Hauser Flowtec Ag Temperatursensor und Verfahren zu dessen Herstellung
US7748267B2 (en) * 2008-04-21 2010-07-06 Sierra Insturments, Inc. Mass flow meter with solder/braze-flow secured spacer
DE102009028848A1 (de) 2009-08-24 2011-03-03 Endress + Hauser Flowtec Ag Aufbau und Herstellungsverfahrens eines Sensors eines thermischen Durchflussmessgeräts

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
None *
See also references of WO2013092102A1 *

Also Published As

Publication number Publication date
WO2013092102A1 (fr) 2013-06-27
US20140366624A1 (en) 2014-12-18

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