EP2785495B1 - Outil de rectification et son procédé deproduction - Google Patents

Outil de rectification et son procédé deproduction Download PDF

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Publication number
EP2785495B1
EP2785495B1 EP12816639.4A EP12816639A EP2785495B1 EP 2785495 B1 EP2785495 B1 EP 2785495B1 EP 12816639 A EP12816639 A EP 12816639A EP 2785495 B1 EP2785495 B1 EP 2785495B1
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EP
European Patent Office
Prior art keywords
wear
particle
grinding
grinding tool
matrix
Prior art date
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Active
Application number
EP12816639.4A
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German (de)
English (en)
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EP2785495A1 (fr
Inventor
Franz Egger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tyrolit-Schleifmittelwerke Swarovski KG
Original Assignee
Tyrolit-Schleifmittelwerke Swarovski KG
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Publication of EP2785495A1 publication Critical patent/EP2785495A1/fr
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Publication of EP2785495B1 publication Critical patent/EP2785495B1/fr
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0054—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impressing abrasive powder in a matrix
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/346—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties utilised during polishing, or grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B24D5/123—Cut-off wheels having different cutting segments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/12—Saw-blades or saw-discs specially adapted for working stone
    • B28D1/121—Circular saw blades

Definitions

  • the invention relates to a grinding tool, in particular a cutting disk, with a matrix, in particular with a sintered metal matrix, and diamonds embedded in the matrix. Furthermore, a method for producing the grinding tool according to the invention is to be specified.
  • Such grinding tools are state of the art and are used for example in the AT 506 578 B1 , the EP 1 297 928 A1 , the GB 1 374 513 A , the FR 2 149 833 A5 , the WO 2010/031089 A1 and the WO 91/10538 A1 described.
  • the abrasive action of these tools is based on the diamonds sticking out of the matrix a little and in contact with the object to be ground.
  • the abrasive effect can be adversely affected essentially by two effects: First, it can lead to premature breaking out of the diamond from the matrix. On the other hand, the effect was observed that the areas - viewed in the direction of grinding - "clog up" in front of the diamonds during the grinding process and thus the possibility of intervention of the diamonds is lost.
  • the object of the present invention is to avoid these disadvantages and to provide a comparison with the prior art improved grinding tool of the type mentioned, and a method for producing the same, wherein the grinding tool according to the invention is characterized in particular by an improved grinding action and increased life.
  • the diamonds are each assigned at least one wear-promoting particle and / or at least one wear-inhibiting particle, wherein the at least one wear-promoting particle or the at least one wear-inhibiting particle is likewise embedded in the matrix.
  • the grinding tool has a preferred grinding direction, and that in each case the at least one wear-promoting particles in the grinding direction before the diamond, which is assigned, is embedded in the matrix, or that in each case at least one wear-inhibiting particles in the grinding direction behind the diamond to which it is associated is embedded in the matrix.
  • the at least one wear-promoting particle then ensures that the region of the bond of the diamond in the matrix-seen in the grinding direction of the grinding tool-wears out sufficiently in front of the diamond, thus preserving the possibility of engagement of the diamond.
  • the at least one wear-inhibiting particle in each case causes the wear of the rear region, seen in the grinding direction of the grinding tool, to reduce the binding of the diamond in the matrix and thereby prevent premature break-out of the diamond from the matrix.
  • the described effect of the respective at least one wear-promoting particle or of the at least one wear-inhibiting particle can furthermore be increased by the fact that the at least one wear-promoting particle has a smaller distance from the grinding contact surface of the grinding tool than the diamond to which it is assigned or, as is provided according to the invention, in each case the at least one wear-inhibiting particle has a greater distance from the sliding contact surface with respect to the diamond to which it is assigned.
  • the at least one wear-promoting particle first of all comes into contact with the object to be ground, thereby breaks out and gives it something below arranged diamonds free. If this diamond is additionally assigned a wear-inhibiting particle which is arranged somewhat below the diamond, then this anti-wear particle causes a stabilization of the bond of the diamond in the matrix.
  • the at least one wear-promoting particle at least partially, preferably entirely, consists of pre-sintered granules, preferably of a binder phase and embedded molybdenum disulfide and / or graphite powder.
  • the binder phase may consist at least partially, preferably entirely, of copper, cobalt, iron, bronze or nickel.
  • the at least one wear-promoting particle is at least partially, preferably wholly, glass spheres, mineral granules (ceramics or ceramic fracture) or mineral fracture (e.g., soapstone, limestone, chamotte, silicates, carbonates, nitrides, sulfides).
  • the at least one wear-inhibiting particle is preferably at least partially, preferably entirely, of hard metal grit, corundum, silicon carbide and / or boron nitride.
  • the at least one wear-promoting particle and / or the at least one wear-inhibiting particle has a particle size between 250 ⁇ m and 600 ⁇ m. It is thus slightly smaller than the grain size preferably used in the diamonds of 350 microns to 700 microns.
  • the grinding tool comprises at least one grinding segment, wherein the at least one grinding segment is arranged on at least one carrier body, preferably made of steel.
  • the at least one abrasive segment can be welded or soldered to the at least one carrier body, for example.
  • recesses for receiving the diamonds and / or the respectively at least one wear-promoting particle or the respectively at least one wear-inhibiting particle are formed in the matrix layer.
  • Fig. 1 shows a preferred embodiment of a grinding tool 1 according to the invention in the form of a cutting disc.
  • This is generally a circular, flat disc, which is usually used as part of an angle or cutting grinder for workpiece machining.
  • cutting discs are also used in wall and floor cutting machines.
  • the cutting disc 1 consists of a support body 7 in the form of a steel disc (disc blade), on the outer circumference of a series of abrasive segments 6 are arranged. The abrasive segments 6 are welded to the outer edge 11 of the carrier body 7.
  • the support body 7 further comprises receiving or mounting holes 10 for installation of the cutting wheel 1 in an angle or cut grinder or in a wall or joint cutting machine.
  • the individual abrasive segments 6 are separated by slots 12.
  • the blade 1 is rotated, wherein the blade 1 has a preferred grinding direction D.
  • Cutting discs are usually used for separating material sections and therefore have a very narrow sliding contact surface S, which extends over the end face of the cutting wheel 1.
  • the basic component of the grinding segment 6 is a sintered metal matrix 2, in which a plurality of diamonds 3 are embedded.
  • the diamonds 3 have a grain size K d of 350 microns to 700 microns.
  • the distance between the centers of the diamonds 3 is 1 to 2 mm.
  • the majority of the diamonds 3 are each assigned a wear-promoting particle 4, the wear-promoting particles 4 being embedded in the matrix 2 before the diamonds 3, as seen in the grinding direction D.
  • they have a smaller distance A f to the sliding contact surface S with respect to the diamonds 3 to which they are associated.
  • the grain size K f of the wear-promoting particles 4 is 250 ⁇ m to 600 ⁇ m. It should also be pointed out that individual diamonds 3, in particular in the edge region of the grinding segment 6, are each assigned no wear-promoting particle 4. The distance of the center of the diamonds 3 to the center of their respective assigned wear-promoting particles 4 corresponds approximately to the grain size K f of the wear-promoting particles 4th
  • Fig. 2b is a schematic perspective view of the grinding segment 6 of the Fig. 2a shown.
  • the abrasive segment 6 in this case consists of four layers 2 ', which are arranged one above the other and constructed in much the same way as the upper layer facing the observer.
  • the layer structure is indicated by the three dashed dividing lines.
  • the width of the grinding segment 6 is provided with the reference symbol b.
  • each of the two wear-promoting particles 4 - seen in the grinding direction D of the grinding tool - are embedded in the matrix 2 in front of the diamond to which they are associated, and that one of the two particles 4 opposite the diamond 3 a smaller distance A f to the sliding contact surface S and the other of the two particles 4 has a greater distance A f to the sliding contact surface S.
  • Fig. 4 embodiment shown is characterized in that the diamond 3 is assigned in each case a wear-inhibiting particles 5, these wear-inhibiting particles 5 are each - embedded in the matrix 2 - seen in the direction of grinding D - behind the diamond 3, which they are assigned. In addition, they have a greater distance A h to the sliding contact surface S with respect to the diamonds to which they are associated.
  • the grain size K h of the wear-inhibiting particles 5 is again between 250 .mu.m and 600 .mu.m.
  • the fourth, in the Fig. 5 Seeing embodiment of the grinding segment 6 is finally characterized in that the plurality of diamonds 3 is assigned in each case at least one wear-promoting particle 4 and a wear-inhibiting particles 5, wherein the wear-promoting particles 4 each in the grinding direction D before the diamond 3, which it is assigned is embedded in the matrix 2 and the wear-inhibiting particles 5 are each embedded in the matrix 2 in the grinding direction D behind the diamond 3 to which it is associated.
  • Fig. 6 shows in a schematic flow diagram, the five main process steps for the production of the grinding tool according to the invention.
  • a matrix layer of a pulverulent, sinterable material is formed.
  • diamonds are placed in a predetermined setting pattern on the matrix layer.
  • at least one wear-promoting particle and / or at least one wear-inhibiting particle are placed on the matrix layer at a predetermined distance relative to at least the majority of the diamonds.
  • the matrix layer provided with the diamonds and the respectively at least one wear-promoting particle or the respectively at least one wear-resistant particle is pressed and finally sintered in a concluding process step v.
  • the matrix layer is formed by first pouring the powder-form sinterable material into a segment mold via a portioning device. After pouring, the surface is scraped to obtain a flat surface. Subsequently, the metal powder layer is slightly pressed. In the course of this pressing, the recesses for receiving the diamonds and the respectively at least one wear-promoting particle or each a wear-inhibiting particle in the matrix layer are formed at the same time, said recesses being e.g. have the shape of conical or truncated pyramids.
  • the diamonds and the wear-promoting particles or the wear-inhibiting particles are easily pressed into the metal powder when placed on the matrix layer.
  • the second and third method steps ii and iii are also carried out simultaneously.
  • preference is given to using either two different setting devices, one for the diamonds and the other for the wear-promoting and / or wear-inhibiting particles, or there is only a single setting device which can handle both the diamonds and the wear-promoting and / or or in the latter case, the setting of the diamonds and the wear-promoting and / or wear-inhibiting particles is carried out successively or simultaneously.
  • FIGS. 7a to 7b the method is carried out by means of a common setting device 13, the diamonds 3 and - in the case shown - the wear-promoting particles 4 successively on the matrix layer. 2 be set.
  • FIGS. 7a to 7d schematically an exemplary implementation of the second and the third method step is shown. Not shown is the preceding first method step, in which the metal matrix layer 2 is formed and then recesses 8 and 9 are formed for receiving the diamonds 3 and their associated wear-promoting particles 4.
  • the illustrated setting device 13 is substantially a perforated plate 14 which is provided with holes 15, wherein the bores 15 are penetrated by pins 17 which are connected to a die plate 16.
  • a negative pressure is generated, which propagates to the mouths of the bores 15, so that there each one diamond 3, a wear-promoting particle 4 or a wear-inhibiting particles 5 (not shown) can be recorded.
  • the perforated plate 14 is moved so close to the metal powder layer 2, that there is still no suction of powder.
  • the diamonds 3, the wear-promoting particles 4 or the wear-inhibiting particles 5 were simply dropped from the height thus caused, the diamonds 3, the wear-promoting particles 4 or the wear-inhibiting particles 5 would not be uniform 3, the wear-promoting particles 4 and the wear-inhibiting particles 5 are ejected by moving the die plate 14 in a suitable guide 18 by means of the pins 17. In the illustrated setting device 13, the diamonds 3, the wear-promoting particles 4 or the wear-inhibiting particles 5 are therefore not pressed into the metal powder, as may also be provided (see above).
  • the metal powder layer 2 provided with the diamonds 3 and the wear-promoting particles 4 is compressed, if necessary a further metal powder layer 2 is applied and the second, third and fourth process steps are repeated and finally the grinding segment is finished in a sintering process.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Claims (11)

  1. Outil de rectification (1), en particulier disque de coupe, avec une matrice (2), en particulier avec une matrice métallique frittée, et des diamants (3) incorporés dans la matrice (2), caractérisé en ce que
    - respectivement au moins une particule favorisant l'usure (4) et/ou au moins une particule empêchant l'usure (5) est associée à au moins la pluralité de diamants (3),
    - l'au moins une particule favorisant l'usure (4) ou l'au moins une particule empêchant l'usure (5) est également incorporée dans la matrice (2),
    - l'outil de rectification (1) présente une direction de rectification préférée (D),
    - respectivement l'au moins une particule favorisant l'usure (4) est incorporée dans la matrice (2) dans la direction de rectification (D) devant le diamant (3), auquel elle est associée, ou respectivement l'au moins une particule empêchant l'usure (5) est incorporée dans la matrice (2) dans la direction de rectification (D) derrière le diamant (3), auquel elle est associée,
    - l'outil de rectification (1) présente une surface de contact de rectification (S), laquelle est tournée vers l'objet à rectifier dans l'état d'utilisation, dans lequel respectivement l'au moins une particule empêchant l'usure (5) présente, par rapport au diamant (3) auquel elle est associée, une plus grande distance (Ah) à la surface de contact de rectification (S).
  2. Outil de rectification (1) selon la revendication 1, caractérisé en ce que respectivement l'au moins une particule favorisant l'usure (4) présente, par rapport au diamant (3) auquel elle est associée, une plus petite distance (Af) à la surface de contact de rectification (S).
  3. Outil de rectification (1) selon la revendication 1 ou 2, caractérisé en ce que l'au moins une particule favorisant l'usure (4) se compose au moins en partie, de préférence complètement, de granulat préfritté, de préférence d'une phase de liaison et de disulfure de molybdène incorporé et/ou poudre de graphite.
  4. Outil de rectification (1) selon la revendication 3, caractérisé en ce que la phase de liaison se compose au moins en partie, de préférence complètement, de cuivre, de cobalt, de fer, de bronze ou de nickel.
  5. Outil de rectification (1) selon l'une quelconque des revendications 1 à 4, caractérisé en ce que l'au moins une particule empêchant l'usure (5) se compose au moins en partie, de préférence complètement, de grit de métal dur, de corindon, de carbure de silicium et/ou de nitrure de bore.
  6. Outil de rectification (1) selon l'une quelconque des revendications 1 à 5, caractérisé en ce que l'au moins une particule favorisant l'usure (4) et/ou l'au moins une particule empêchant l'usure (5) présente une granulométrie (Kf, Kh) entre 250 µm et 600 µm.
  7. Outil de rectification (1) selon l'une quelconque des revendications 1 à 6, caractérisé en ce que l'outil de rectification (1) comprend au moins un segment de rectification (6), dans lequel l'au moins un segment de rectification (6) est agencé au niveau d'au moins un corps de support (7), de préférence en acier.
  8. Procédé de production d'un outil de rectification (1) selon l'une quelconque des revendications 1 à 7, caractérisé en ce que dans une première étape de procédé (i), une couche de matrice (2') en un matériau frittable pulvérulent est formée, dans une deuxième étape de procédé (ii), des diamants (3) sont posés selon un motif de pose prédéterminé sur la couche de matrice (2'), dans une troisième étape de procédé (iii), respectivement au moins une particule favorisant l'usure (4) et/ou au moins une particule empêchant l'usure (5) est posée sur la couche de matrice (2') à une distance prédéterminée par rapport à au moins la pluralité de diamants (3), dans une quatrième étape de procédé (iv), la couche de matrice (2') dotée des diamants (3) et de respectivement l'au moins une particule favorisant l'usure (4) ou de respectivement l'au moins une particule empêchant l'usure (5) est comprimée, et dans une étape de procédé finale (v), un processus de frittage est réalisé.
  9. Procédé selon la revendication 8, caractérisé en ce qu'avant l'étape de procédé finale (v), d'autres couches de matrice (2') sont appliquées l'une après l'autre et respectivement les deuxième, troisième et quatrième étapes de procédé (ii, iii, iv) sont répétées jusqu'à ce qu'une largeur prédéterminée (b) soit atteinte.
  10. Procédé selon la revendication 8 ou 9, caractérisé en ce qu'avant la deuxième étape de procédé (ii), des évidements (8, 9) sont formés dans la couche de matrice (2') pour la réception des diamants (3) et/ou de respectivement au moins une particule favorisant l'usure (4) ou de l'au moins une particule empêchant l'usure (5).
  11. Procédé selon l'une quelconque des revendications 8 à 10, caractérisé en ce qu'au moins les deuxième et troisième étapes de procédé (ii, iii) sont réalisées en même temps.
EP12816639.4A 2011-12-01 2012-11-28 Outil de rectification et son procédé deproduction Active EP2785495B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ATA1778/2011A AT511967B1 (de) 2011-12-01 2011-12-01 Schleifwerkzeug sowie verfahren zur herstellung desselben
PCT/AT2012/000299 WO2013078487A1 (fr) 2011-12-01 2012-11-28 Outil de rectification et son procédé de production

Publications (2)

Publication Number Publication Date
EP2785495A1 EP2785495A1 (fr) 2014-10-08
EP2785495B1 true EP2785495B1 (fr) 2019-05-01

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US (2) US9579774B2 (fr)
EP (1) EP2785495B1 (fr)
AT (1) AT511967B1 (fr)
AU (1) AU2012344710B2 (fr)
WO (1) WO2013078487A1 (fr)

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DE102019117796A1 (de) * 2019-07-02 2021-01-07 WIKUS-Sägenfabrik Wilhelm H. Kullmann GmbH & Co. KG Zerspanungswerkzeug mit Pufferpartikeln
AT522810B1 (de) * 2019-07-16 2023-02-15 Tyrolit Schleifmittelwerke Swarovski Kg Schleifsegment für eine Schleifwalze
KR102182704B1 (ko) * 2019-12-31 2020-11-25 주식회사 르본인터내셔널 정밀하고 신속한 래핑이 가능한 래핑방법

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Publication number Publication date
EP2785495A1 (fr) 2014-10-08
AT511967A4 (de) 2013-04-15
US20170120421A1 (en) 2017-05-04
AU2012344710A1 (en) 2014-06-26
US9579774B2 (en) 2017-02-28
US9751191B2 (en) 2017-09-05
US20140273778A1 (en) 2014-09-18
WO2013078487A1 (fr) 2013-06-06
AT511967B1 (de) 2013-04-15
AU2012344710B2 (en) 2016-02-25

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