EP2779182B1 - Elektronische Komponente und Verfahren zur Herstellung einer elektronischen Komponente - Google Patents

Elektronische Komponente und Verfahren zur Herstellung einer elektronischen Komponente Download PDF

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Publication number
EP2779182B1
EP2779182B1 EP14160000.7A EP14160000A EP2779182B1 EP 2779182 B1 EP2779182 B1 EP 2779182B1 EP 14160000 A EP14160000 A EP 14160000A EP 2779182 B1 EP2779182 B1 EP 2779182B1
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EP
European Patent Office
Prior art keywords
electronic component
wound
winding
component according
magnetic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
EP14160000.7A
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English (en)
French (fr)
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EP2779182A2 (de
EP2779182A3 (de
Inventor
Shinichi Sakamoto
Zhigang Cheng
Fernando Chan Mock
Mitsugu Kawarai
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Sumida Corp
Original Assignee
Sumida Corp
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Filing date
Publication date
Priority claimed from US13/804,857 external-priority patent/US9087634B2/en
Application filed by Sumida Corp filed Critical Sumida Corp
Priority to EP21170000.0A priority Critical patent/EP3879544B1/de
Priority to EP24161633.3A priority patent/EP4358104A3/de
Publication of EP2779182A2 publication Critical patent/EP2779182A2/de
Publication of EP2779182A3 publication Critical patent/EP2779182A3/de
Application granted granted Critical
Publication of EP2779182B1 publication Critical patent/EP2779182B1/de
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/045—Fixed inductances of the signal type  with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2847—Sheets; Strips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2847—Sheets; Strips
    • H01F27/2852—Construction of conductive connections, of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/045—Fixed inductances of the signal type  with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
    • H01F2017/046—Fixed inductances of the signal type  with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core helical coil made of flat wire, e.g. with smaller extension of wire cross section in the direction of the longitudinal axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F2017/048—Fixed inductances of the signal type  with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
    • H01F27/306—Fastening or mounting coils or windings on core, casing or other support

Definitions

  • the present invention relates to an electronic component and a method for manufacturing an electronic component.
  • a winding is assembled to a core (a wire is wound around a core).
  • An exterior body in which the core and the winding exist is formed with a magnetic material by (compression) molding.
  • an electronic component that has an edgewise coil
  • electrode terminals that are made as separate members from a flat wire are used in the edgewise coil to enable surface mounting.
  • the edgewise coil (winding) is a coil (winding) in which a flat wire is wound vertically in a state in which shorter sides of the flat wire are located at inner and outer circumferences of the coil, i.e., one of the shorter sides faces the center of the coil. Therefore, after the electrode terminals are connected to both ends of the flat wire, an exterior body for the electronic component can be formed by molding.
  • JP 2002-289442 describes such a component intended for surface mounting.
  • the coil is embedded in a parallelepiped-shaped core, non-wound ends of the coil exit from the core and wrap around the side and part-way underneath the core, with an adhesive sheet between the core and the wrapped ends of the coil.
  • JP 2001-060523 describes another such component in which the coil is clamped between two halves of a parallelepiped-shaped core, and non-wound ends of the coil exit from the core and wrap around one side, underneath, then up the opposite side of the core, in guide grooves.
  • the non-wound ends of the coil may be fixed to the outside of the core using adhesive.
  • US 2008/036566 describes another such component in which the coil is embedded in a parallellepiped-shaped core. In this case the non-wound ends of the coil wrap around a side of the core and are connected to electrodes provided on the bottom of the core.
  • US 2003/0218527 describes another such component in which a coil is mounted on a spool structure formed by a plate and a T-shaped spindle. The coil and the spool structure are covered by a plastic cover. Non-wound ends of the coil exit from the plastic cover, wrap around one side, underneath and up the opposite side of the spool where they hook onto notches.
  • An electronic component includes: a magnetic core member that is made of a magnetic material and that has a flat base and a core, the flat base having a top surface, a bottom surface, a first side surface and a second side surface opposite to the first side surface, the core is located on the top surface of the flat base; a winding that has an edgewise coil in which a flat wire is wound and in which the core is inserted, the winding having two non-wound flat wires that extend from the edgewise coil; and a magnetic exterior body that covers at least the core and the edgewise coil.
  • the two non-wound flat wires are non-wound sections of the winding (2), integral with the edgewise coil, and continuously extend along the top surface, the first side surface, the bottom surface and the second side surface of the flat base in this order. Further, the two non-wound flat wires located on the bottom surface work as electrodes and the ends of the non-wound flat wires at the second side surface are covered by the magnetic exterior body.
  • the two ends are covered by a resin.
  • the two non-wound wires may be connected to the bottom surface of the flat base with an adhesive.
  • the bottom surface of the flat base may have two electrode grooves.
  • the two non-wound wires may be respectively placed in the two electrode grooves.
  • the first and second side surfaces of the flat base may each respectively have first and second guide grooves.
  • the two non-wound wires may be respectively placed in the first and second guide grooves.
  • the two ends of the two non-wound wires may be bent toward the first side surface of the flat base.
  • the two ends of the two non-wound wires may contact the top surface of the flat base.
  • two side surfaces of the flat base respectively located between the first and second side surfaces may slant downward.
  • a resin adhesive may be provided on two side surfaces of the flat base respectively located between the first and second side surfaces.
  • the second side surface may slant upward.
  • a method for manufacturing an electronic component includes: forming a magnetic core member that is made of a magnetic material and that has a flat base and a core, the flat base having a top surface, a bottom surface, a first side surface and a second side surface opposite to the first side surface, the core is located on the top surface of the flat base; forming a winding that has an edgewise coil in which a flat wire is wound and in which the core is inserted, the winding having two non-wound flat wires that extend from the edgewise coil, said two non-wound flat wires being non-wound sections of the winding, integral with the edgewise coil, continuously extending along the top surface, the first side surface, the bottom surface and the second side surface of the flat base in this order; locating two elongate electrodes along the first side surface, the bottom surface and the second side surface of the flat base so as to mount the winding to the magnetic core; placing the winding and the magnetic core in a mold; filling a mixture of a magnetic
  • the mixture may be in a slurry state.
  • the treatment may be heating so that the mixture may be hardened (cured) by heat.
  • the mixture may be in a putty state.
  • the treatment may be heating so that the mixture may be hardened (cured) by heat.
  • the treatment is that the mixture in the mold may be pressed by a compression molding method.
  • the compressed magnetic exterior body may be taken out of the mold. Then, the compressed magnetic exterior body may be hardened (cured) by heat.
  • Fig. 1 is a perspective view that shows an electronic component according to a first embodiment of the present invention. Note that edges and corners of each of parts and configurations shown in Figs. 1-14 may be smoothed by cutting sharp edges and corners as desired.
  • the electronic component shown in Fig. 1 corresponds to an inductor and has a magnetic core 1, a winding 2 and a magnetic exterior body 3.
  • Fig. 2 is a perspective view that shows the magnetic core 1 shown in Fig. 1 .
  • the magnetic core 1 has a flat base part 11 that is in a substantially rectangular parallelepiped shape.
  • the flat base part 11 has four sides 11a, 11b, 11c and 11c, a bottom surface 11d and a top surface 11 e.
  • the magnetic core 1 has a core part 12 that is in a substantially cylindrical shape and that extends upward from the top surface 11e of the flat base part 11.
  • the magnetic core 1 corresponds to a ferrite core or a compression powder core that is formed by performing a compression molding for metal magnetic powder.
  • metal magnetic powder which has iron (Fe) as a main composition and respectively contains 1-10 wt% of silicon (Si) and chromium (Cr), for the compression powder core, because it has the excellent rust-prevention and relative permeability properties.
  • metal magnetic powder that is a mixture of the metal magnetic powder explained above and an amorphous metal.
  • the amorphous metal has iron (Fe) as a main composition, 1-10 wt% of silicon (Si), 1-10 wt% of chromium (Cr), and 0.1-5 wt% of carbon (C).
  • cut-out portions are respectively formed on edges of the first side 11a and the second side 11b.
  • a non-wound section (a non-wound flat wire) of the winding 2 is located at each cut-out portion.
  • the cut-out portions are formed by making predetermined surfaces of the cut-out portions closer to the core part 12 than the center surfaces of the first and second sides 11a and 11b. That is, they are recessed surfaces.
  • the flat base part 11 and the core part 12 can be integrally formed as a T-shaped core. Further, the flat base part 11 and the core part 12 can also be formed as separate members and can be connected, for instance, by an adhesive or a fitting structure.
  • Fig. 3 is a perspective view that shows the winding 2 shown in Fig. 1 .
  • Fig. 4 is a rear view that shows the electronic component according to the first embodiment of the present invention.
  • the winding 2 has an edgewise winding section 21 and two non-wound sections (two non-wound flat wires) 22 and 23 that are formed from the winding section 21 to two tips 22e and 23e.
  • the core part 12 of the magnetic core 1 is inserted in the winding section 21.
  • the edgewise coil (winding) is a coil (winding) in which a flat wire is wound vertically in a state in which shorter sides of the flat wire are located at inner and outer circumferences of the coil, i.e., one of the shorter sides faces the center of the coil.
  • a flat wire is wound in the edgewise method so as to vertically and helically pile up along a winding axis. Note that in the edgewise winding, a wider surface of the flat wire is substantially perpendicular to the winding axis.
  • Both of the two non-wound sections 22 and 23 are located substantially parallel to each other and along the first side 11a of the flat base part 11 of the magnetic core 1, the bottom surface 11d (a surface that is opposite to the top surface 11e) and the second side 11b that is opposite to the first side 11a.
  • the two non-wound sections 22 and 23 are formed so as to be pulled out in the same direction.
  • an automatic device can be easily used for a bending process.
  • this configuration is suited for improving productivity.
  • the two non-wound sections 22 and 23 can also be formed so as to be pulled out in different directions.
  • the two non-wound sections 22 and 23 are bent at a boundary, which corresponds to curved parts 22a and 23s, of the first side 11a and the bottom surface 11d and are bent at a boundary, which corresponds to curved parts 22b and 23b, of the bottom surface 11d and the second side 11b so as to be located along the flat base part 11 of the magnetic core 1.
  • Belt-shaped sections 22c and 23c (electrode sections) that are located along the bottom surface 11d of the magnetic core 1 in the two non-wound sections 22 and 23 are used as electrodes.
  • the flat wire that is used for the winding 2 is coated by an insulating layer.
  • the insulating layer located on an area for using as an electrode is removed as desired. For instance, the insulating layer located on only electrode sections 22c and 23c explained above is removed, however, the insulating layer located on other sections, which are closer to the tips 22e and 23e, is not removed.
  • the insulating layer located on the electrode sections is removed, the insulating layer located on only one surface of the flat wire, i.e., a surface that faces a substrate at mounting is removed. However, the insulating layer located on a surface opposite to the electrode sections 22c and 23c, i.e., the surface that faces the magnetic core 1, is not removed.
  • the entire insulation layer located toward the tips 22e and 23e explained above can be removed.
  • the insulation layer located on areas facing the magnetic core 1 can also be removed.
  • the magnetic exterior body 3 is formed by a mixture of a magnetic material (magnetic powder such as ferrite or metallic magnetics) and a resin so as to cover at least the winding section 21 and the core part 12.
  • the mixture is formed by a predetermined forming method.
  • metal magnetic power of the magnetic exterior body 3 is the same as that of the magnetic core 1.
  • the magnetic exterior body 3 is in a substantially rectangular parallelepiped outer shape. Because the mixture is filled inside of the substantially rectangular parallelepiped shape and is cured, the magnetic exterior body 3 is formed. Further, the magnetic exterior body 3 is, for instance, formed by a manufacturing method that will be explained below. An amount of the magnetic powder in the magnetic exterior body 3 and the material that is used therefor can also be changed as desired so as to adjust the electromagnetic characteristics.
  • the magnetic exterior body 3 is formed so as to completely cover the winding section 21 of the winding 2, areas located along the first side 11a and the second side 11b, the core part 12 of the magnetic core 1, the top surface 11e, the first side 11a, the second side 11b and the two sides 11c of the flat base part 11.
  • the magnetic exterior body 3 can also be formed without covering the two sides 11c. Also, because the magnetic exterior body 3 is formed so as to make a lower end of the magnetic exterior body 3 be at a predetermined position within a height of the side 11c, only a part of the side 11c can also be exposed (i.e., it is not covered by the magnetic exterior body 3).
  • the two non-wound sections 22 and 23 can also be bent at the curved parts 22d and 23d that correspond to the boundary between the second side 11b and the top surface 11e.
  • the tips 22e and 23e of the two non-wound sections 22 and 23 are located inside (e.g., inboard) of the second side 11b (i.e., a side closer to the core part 12).
  • the two non-wound sections 22 and 23 are bent at the curved parts 22d and 23d as discussed above.
  • sections of the two non-wound sections 22 and 23, which are closer to the tips 22e and 23e than positions that are located along (next to) the second side 11b of the flat base part 11, are bent toward the core part 12 from the second side 11b.
  • both ends of the two non-wound sections 22 and 23 are bent toward the first side surface 11a of the flat base part 11.
  • the first embodiment is not limited to the above configuration.
  • the curved parts 22d and 23d may not be provided and may be left standing straight up in a finished state.
  • both of the two non-wound sections 22 and 23 of the winding 2 are located substantially parallel to the sides 11a and 11b of the magnetic core 1 (the flat base part 11). Therefore, a bending process of the two non-wound sections 22 and 23 can be easily performed.
  • Fig. 5 is a perspective view that shows an electronic component according to a second embodiment of the present invention.
  • the electronic component according to the second embodiment of the present invention has a magnetic core 1 and a winding 2 that are the same as the first embodiment.
  • a magnetic exterior body 4 of the second embodiment is different from the magnetic exterior body 3 of the first embodiment.
  • the magnetic exterior body 4 is formed by a mixture of a magnetic material (magnetic powder such as ferrite or metallic magnetics) and a resin so as to cover at least the winding section 21 and the core part 12.
  • the mixture is formed by a predetermined forming method.
  • the magnetic exterior body 4 is, for instance, formed by a manufacturing method that will be explained below.
  • the magnetic exterior body 4 is formed so as to expose (not cover) sections located along the first side 11a and the second side 11b of the winding 2 and the side 11c of the magnetic core 1.
  • the sections located along the first side 11a and the second side 11b of the winding 2 are exposed. Therefore, when the electronic component is soldered on, for example, a circuit board, because a fillet is formed around the curved parts 22a, 22b, 23a and 23b, the electronic component having the magnetic core 1, the winding 2 and the magnetic exterior body 4 does not easily come off from the circuit board. Further, when the electronic component is mounted, for instance, on a board, the solder fillet can be visually checked. As a result, there is also an advantage that it is convenient with respect to an inspection.
  • the configuration with respect to the magnetic exterior body 4 of the electronic component according to the second embodiment of the present invention can also be adapted to electronic components according to other embodiments.
  • Fig. 6 is a perspective view that shows a magnetic core 1 and a winding 2 of an electronic component according to a third embodiment of the present invention.
  • the electronic component according to the third embodiment of the present invention has the magnetic core 1 and the winding 2 that are the same as the first embodiment. Further, the electronic component of the third embodiment has either of the magnetic exterior body 3 of the first embodiment or the magnetic exterior body 4 of the second embodiment.
  • covering members 41 and 42 which are made of an insulating material such as a resin, are formed on the tips 22e and 23e of the non-wound sections 22 and 23 of the winding 2.
  • the covering members 41 and 42 are fixed to the non-wound sections 22 and 23 of the winding 2 and have longer external circumferences (peripheries) than external circumferences of the tips 22e and 23e of the non-wound sections 22 and 23.
  • the covering members 41 and 42 are formed as follows: a resin solution is attached to the tips 22e and 23e by a dip coating method or by brush application; and then, the covering members 41 and 42 are formed by drying them at an ordinary temperature.
  • sections of the two non-wound sections 22 and 23, which are closer to the tips 22e and 23e than positions that are located along (next to) the second side 11b of the flat base part 11, are located above the top surface 11e of the flat base part 11 of the magnetic core 1. Further, the two tips 22e and 23e are covered with the resin.
  • the insulating layer does not usually exist on the cut surfaces (that is, end surfaces of the tips 22e and 23e) of the flat wire. Further, when the tips 22e and 23e touch the winding section 21, the insulating layer coated on the winding section 21 may be broken. Thus, a short circuit occurs. However, such a short circuit can be prevented by providing the covering members 41 and 42 for the tips 22e and 23e.
  • the covering members 41 and 42 are fixed to the non-wound sections 22 and 23 of the winding 2 and have longer external circumferences than external circumferences of the non-wound sections 22 and 23, respectively.
  • the tips 22e and 23e of the non-wound sections 22 and 23 do not easily come free from the magnetic core 1 and the magnetic exterior body 3 or 4 when the non-wound sections 22 and 23 are pulled downward.
  • the configuration with respect to the covering members 41 and 42 of the electronic component according to the third embodiment of the present invention can also be adapted to electronic components according to other embodiments.
  • Fig. 7 is a side view that shows a magnetic core 1 and a winding 2 of an electronic component according to a fourth embodiment of the present invention.
  • the electronic component according to the fourth embodiment of the present invention has the magnetic core 1 and the winding 2 that are the same as the first embodiment. Further, the electronic component of the fourth embodiment has either of the magnetic exterior body 3 of the first embodiment or the magnetic exterior body 4 of the second embodiment.
  • the belt-shaped sections 22c and 23c of the non-wound sections 22 and 23 are fixed to the bottom surface 11d of the flat base part 11 of the magnetic core 1 by an adhesive. It is preferred to use an insulating adhesive, for instance, a resin adhesive as the adhesive.
  • non-wound sections 22 and 23 may also be fixed to the first side 11a and the second side 11b of the flat base part 11 of the magnetic core 1 by the adhesive.
  • Fig. 8 is a side view that shows another winding of the winding 2 of the electronic component according to the fourth embodiment of the present invention.
  • the curved parts 22d and 23d shown in Fig. 3 of the non-wound sections 22 and 23 are omitted.
  • the tips 22e and 23e of the non-wound sections 22 and 23 do not project above the top surface 11e of the flat base part 11 of the magnetic core 1.
  • a short circuit does not easily occur between the tips 22e and 23e and the winding section 21 during the manufacturing processes.
  • the non-wound sections 22 and 23 of the winding 2 are fixed to at least the bottom surface 11d of the magnetic core 1 by the adhesive.
  • the belt-shaped sections 22c, 23c, which are located along the bottom surface 11d, of the two non-wound sections 22 and 23 and the bottom surface 11d of the flat base part 11 are fixed by the adhesive.
  • the configuration with respect to the adhesive fixing of the electronic component according to the fourth embodiment of the present invention can also be adapted to electronic components according to other embodiments.
  • Fig. 9 is a perspective view that shows a bottom surface 11d of a magnetic core 1 of an electronic component according to a fifth embodiment of the present invention.
  • the electronic component according to the fifth embodiment of the present invention has the magnetic core 1 and the winding 2 that are the same as the first embodiment. Further, the electronic component of the fifth embodiment has either of the magnetic exterior body 3 of the first embodiment or the magnetic exterior body 4 of the second embodiment.
  • electrode grooves 51 and 52 are formed in the bottom surface 11d of the flat base part 11 of the magnetic core 1.
  • the two electrode grooves 51 and 52 are formed parallel to each other between the first side 11a and the second side 11b.
  • the widths of the two electrode grooves 51 and 52 are substantially the same as the widths of the non-wound sections 22 and 23.
  • the depths of the two electrode grooves 51 and 52 are equal to or less than a height of the flat wire (a shorter thickness).
  • the belt-shaped sections 22c and 23c of the two non-wound sections 22 and 23 of the winding 2 are located at the electrode grooves 51 and 52 at the bottom surface 11d.
  • the two electrode grooves 51 and 52 are formed in the bottom surface 11d of the flat base part 11 of the magnetic core 1. Both of the two non-wound sections 22 and 23 of the winding 2 are respectively located at the electrode grooves 51 and 52 provided at the bottom surface 11d.
  • the non-wound sections 22 and 23 are accurately aligned at the bottom surface 11d and do not easily shift.
  • the configuration with respect to the electrode grooves 51 and 52 of the electronic component according to the fifth embodiment of the present invention can also be adapted to electronic components according to other embodiments.
  • Fig. 10 is a perspective view that shows a magnetic core 1 of an electronic component according to a sixth embodiment of the present invention.
  • the electronic component according to the sixth embodiment of the present invention has the magnetic core 1 and the winding 2 that are the same as the first embodiment. Further, the electronic component of the sixth embodiment has either of the magnetic exterior body 3 of the first embodiment or the magnetic exterior body 4 of the second embodiment.
  • guide grooves 61 and 62 are respectively formed in the first side 11a and the second side 11b of the flat base part 11 of the magnetic core 1.
  • the guide grooves 61 and 62 are formed parallel to each other between the top surface 11e and the bottom surface 11d of the flat base part 11.
  • the widths of guide grooves 61 and 62 are substantially the same as the widths of the non-wound sections 22 and 23.
  • the two non-wound sections 22 and 23 of the winding 2 are aligned at the guide grooves 61 and 62 located at the first side 11a and the second side 11b.
  • the two guide grooves 61 and 62 are respectively formed at the first side 11a and the second side 11b of the flat base part 11 of the magnetic core 1. Further, both of the two non-wound sections 22 and 23 of the winding 2 are located in the guide grooves 61 and 62 in the first side 11a and the second side 11b.
  • the non-wound sections 22 and 23 are accurately aligned at the bottom surface 11d as well as the first side 11a and the second side 11b and do not easily shift.
  • the configuration with respect to the guide grooves 61 and 62 of the electronic component according to the sixth embodiment of the present invention can also be adapted to electronic components according to other embodiments.
  • Fig. 11 is a side view that shows a magnetic core 1 and a winding 2 of an electronic component according to a seventh embodiment of the present invention.
  • the electronic component according to the seventh embodiment of the present invention has the magnetic core 1 and the winding 2 that are the same as the first embodiment. Further, the electronic component of the seventh embodiment has either of the magnetic exterior body 3 of the first embodiment or the magnetic exterior body 4 of the second embodiment.
  • sections of the two non-wound sections 22 and 23, which are closer to the tips 22e and 23e than positions that are located along (next to) the second side 11b of the flat base part 11, are bent so as to touch the top surface 11e of the flat base part 11. That is, the tips 22e and 23e are bent until the tips 22e and 23e contact the top surface 11e of the flat base part 11.
  • the two tips 22e and 23e touch the top surface 11e of the flat base part 11.
  • the tips 22e and 23e are surely spaced apart from the winding section 21. At the same time, the contact between the tips 22e and 23e and the winding section 21 during the manufacturing processes can be prevented. As a result, a short circuit does not easily occur.
  • the configuration with respect to the contact between the tips 22e and 23e and the top surface 11e of the flat base part 11 of the electronic component according to the seventh embodiment of the present invention can also be adapted to electronic components according to other embodiments.
  • Fig. 12 is a perspective view that shows an electronic component according to an eighth embodiment of the present invention.
  • the electronic component according to the eighth embodiment of the present invention has the magnetic core 1 and the winding 2 that are the same as the first embodiment. Further, the electronic component of the eighth embodiment has either of the magnetic exterior body 3 of the first embodiment or the magnetic exterior body 4 of the second embodiment.
  • the side 11c (both sides 11c) other than the first side 11a and the second side 11b of the flat base part 11 inclines toward the inside of the flat base part 11 from the top surface 11e toward the bottom surface 11d of the flat base part 11.
  • the side 11c (both sides 11c) slant downward.
  • an inner surface of the magnetic exterior body 3 that touches the side 11c of the flat base part 11 also inclines in the opposite direction to correctly accommodate with the side 11c.
  • the magnetic exterior body 3 does not easily come upwardly free from the magnetic core 1.
  • the configuration with respect to the slanted or inclined side 11c (both sides 11c) of the electronic component according to the eighth embodiment of the present invention can also be adapted to electronic components according to other embodiments.
  • An electronic component according to a ninth embodiment of the present invention has the magnetic core 1 and the winding 2 that are the same as the first embodiment. Further, the electronic component of the ninth embodiment has the magnetic exterior body 3 of the first embodiment.
  • a resin adhesive is applied to the side 11c (both sides 11c) other than (i.e., between) the first side 11a and the second side 11b of the flat base part 11 among the sides 11a, 11b and 11c of the magnetic core 1.
  • the surface roughness state is formed on the side 11c and their surface becomes rough.
  • the magnetic exterior body 3 is formed. Therefore, an internal surface of the magnetic exterior body 3 that touches with the side 11c is adhered to each other by the resin adhesive in the form according to the surface roughness. Further, an insulating coat that is formed at the side 11c of the magnetic core 1 explained below can be polished, for instance, by sandpaper so as to make the surface of the side 11c rough. Also, when the insulating coat is formed, surfaces of the side 11c can also be processed so as to become uneven surfaces.
  • the magnetic exterior body 3 is formed. As a result, the magnetic exterior body 3 does not easily come free from the magnetic core 1 in a vertical direction.
  • the configuration with respect to the application of the resin adhesive on the side 11c of the electronic component according to the ninth embodiment of the present invention can also be adapted to electronic component according to other embodiment.
  • Fig. 13 is a side view that shows a magnetic core 1 and a winding 2 of an electronic component according to a tenth embodiment of the present invention.
  • the electronic component according to the tenth embodiment of the present invention has the magnetic core 1 and the winding 2 that are the same as the first embodiment. Further, the electronic component of the tenth embodiment has either of the magnetic exterior body 3 of the first embodiment or the magnetic exterior body 4 of the second embodiment.
  • the second side 11b of the flat base part 11 inclines toward the inside of the flat base part 11 from the bottom surface 11d toward the top surface 11e of the flat base part 11. In other words, the second side 11b slants upward.
  • the non-wound sections 22 and 23 of the winding 2 are bent at a sharp angle at the curved part 22b.
  • the second side 11b of the flat base part 11 inclines toward the inside of the flat base part 11 from the bottom surface 11d toward the top surface 11e of the flat base part 11.
  • the non-wound sections 22 and 23 of the winding 2 do not easily come downwardly free from the magnetic core 1.
  • the configuration with respect to the slanted or inclined side 11b of the electronic component according to the tenth embodiment of the present invention can also be adapted to electronic components according to other embodiments.
  • a method for manufacturing an electronic component according to an eleventh embodiment of the present invention is for manufacturing the electronic components according to the first through tenth embodiments of the present invention explained above.
  • Fig. 14 is a cross-sectional view that explains a method for making a magnetic exterior body in a method for manufacturing an electronic component according to the eleventh embodiment of the present invention.
  • the winding section 21 of the winding 2 is formed by winding a flat wire (an edgewise winding (an edgewise coil)). Further, the flat wire is cut off so as to make the two non-wound sections 22 and 23 that each has an appropriate length.
  • the two non-wound sections 22 and 23 are linear and are substantially parallel to each other.
  • the predetermined areas of the insulating layer such as the electrode portions are removed.
  • the core part 12 of the magnetic core 1 is inserted into the winding section 21. Further, by using an appropriate jig or automatic machines, the two non-wound sections 22 and 23 are collectively and sequentially bent and located along the first side 11b, the bottom surface 11d and the second side 11b of the flat base part 11 of the magnetic core 1. As a result, the winding 2 is attached to the magnetic core 1. See, for example, Figs. 1 and 4 .
  • a slurry state mixture material 111 that contains magnetic materials and a resin is injected by a dispenser (not shown) and is filled in the mold 101.
  • the mixture material 111 is formed by adding a solvent (such as acetone) to a mixture of metal magnetic powder and a resin.
  • a solvent such as acetone
  • the metal magnetic power has iron (Fe) as a main composition with chromium and silicon as additional materials.
  • the resin can be chosen from a group comprising an epoxy resin, a silicone resin or a mixture thereof. As a result, the mixture material 111 has relatively high fluidity.
  • the mixture material 111 that is filled in the mold 101 is dried by evaporating the solvent from the mixture material 111.
  • the mixture material 111 is solidified (less fluidity).
  • the mixture material 111 is cured by heat in the mold 101.
  • the magnetic exterior bodies 3 and 4 are formed.
  • the surfaces of the magnetic exterior bodies 3 and 4 are polished as desired.
  • the electronic components explained in the first through tenth embodiments above can be manufactured.
  • a method for manufacturing an electronic component according to a twelfth embodiment of the present invention is accomplished in order to manufacture the electronic components according to the first through tenth embodiments explained above.
  • the winding 2 and the magnetic core 1 after the forming process are placed in a mold.
  • the mold 101 or the blade 102 that are the same as the eleventh embodiment can be used.
  • a viscosity of a mixture material is higher as compared with the mixture material in the thirteenth embodiment, conditions for a filling pressure during a filling process of the mixture material and a scraping force for the surplus portion by the blade 102 are appropriately changed.
  • a putty state mixture material (a clayish state) that contains the magnetic material and the resin is injected by the dispenser (not shown) and is filled in the mold 101.
  • the mixture material is formed by adding a solvent (such as terpineol) to a mixture of metal magnetic powder and a resin such as an epoxy resin or a silicon resin as desired.
  • a solvent such as terpineol
  • the metal magnetic powder has iron (Fe) as a main composition with chromium, silicon and manganese as additional materials.
  • a mixing ratio of the metal magnetic powder and the epoxy resin is between 91 wt%: 9 wt% and 95 wt%: 5 wt%.
  • the metal magnetic powder is formed by mixing amorphous metal magnetic powder (including at least iron (Fe), silicon, chromium and manganese) and alloy powder (iron-silicon-chromium system) with a mixing ratio of 1:1 (we%).
  • the mixture material is formed by adding the solvent of less than 2 wt% (alternative the solvent is not added).
  • the mixture material has the solvent that is added substantially equal to or less than 2 wt% in the twelfth embodiment.
  • the mixture material that is used in the twelfth embodiment has higher viscosity as compared with the mixture material in the eleventh embodiment and has a lower fluidity so that a lump of the mixture material does not flow and spread like a liquid when being placed on a plane surface. Therefore, the putty state mixture material is filled in the mold by pressurizing with a higher pressure than the pressure used in the eleventh embodiment.
  • the mixture material that is filled in the mold 101 is dried by evaporating the solvent from the mixture material.
  • a predetermined drying condition a temperature condition and a time condition in a drying process
  • the mixture material is solidified (less fluidity). Further, when the mixture material is formed without containing the solvent, the drying process can be omitted.
  • the number of holes made by the bubbles that are formed in the top surface of the mixture material decrease compared with the holes in the eleventh embodiment because the mixture material used in the twelfth embodiment has less amount of the solvent. Further, when the mixture material is formed without containing the solvent, the bubbles are not generated.
  • the mixture material is cured by heat in the mold.
  • the magnetic exterior bodies 3 and 4 are formed.
  • the electronic component is taken out from the mold 101.
  • the surfaces of the magnetic exterior bodies 3 and 4 are polished as desired. Further, when the putty state mixture material is used, the surfaces of the magnetic exterior bodies 3 and 4 become in a good (smooth) state. As a result, the polishing may be omitted depending on surface smoothness states.
  • the electronic components explained in the first through tenth embodiments above can be manufactured.
  • a method for manufacturing an electronic component according to a thirteenth embodiment of the present invention is accomplished in order to manufacture the electronic components according to the first through tenth embodiments explained above.
  • the winding 2 and the magnetic core 1 after the forming process are placed in a mold (for a press mold method). After that, a mixture material that contains a magnetic material and a resin is filled in the mold for the press mold.
  • the mixture material that is used in the thirteenth embodiment does not contain a solvent.
  • the mixture material is in a granulated powder state in which an outer surface of each of metal magnetic powder is coated with a resin layer.
  • the magnetic exterior bodies 3 and 4 are formed.
  • the winding 2, the magnetic core 1 and the magnetic exterior bodies 3, 4 are taken out from the mold after the compression molding method is performed. After that, they are cured by heat under a predetermined cure condition (a temperature condition and a time condition in a curing process).
  • a predetermined cure condition a temperature condition and a time condition in a curing process.
  • the electronic components explained in the first through tenth embodiments above can be manufactured.
  • the electronic component according to each of the embodiments explained above corresponds to an inductor.
  • electronic components can also be formed as one package in which an element that has a magnetic core, a winding and a magnetic exterior body or an element that has a magnetic core and a winding together with another element.
  • the core part 12 of the magnetic core 1 projects above an uppermost surface of the winding section 21 of the winding 2.
  • a top surface of the core part 12 of the magnetic core 1 can be lower than the uppermost surface of the winding section 21 of the winding 2.
  • the height of the core part 12 of the magnetic core 1 can be set according to a required inductance value for an electronic component.
  • a rust preventive treatment for the magnetic core 1 of the electronic component in each of the embodiments explained above can also be performed in advance as desired.
  • an insulating coating layer which is made of, for example, a resin, can also be formed on the sides 11a, 11b, 11c and the bottom surface 11d and/or the outer surface of the core part 12 (that is, surfaces other than a surface through which a magnetic flux formed by the winding 2 crosses at substantially right angle) of the flat base part 11 of the magnetic core 1 of the electronic component discussed in each of the embodiments explained above.
  • the insulating coating layer is formed on the top surface 11e of the flat base part 11 of the magnetic core 1 and on the top surface of the core part 12, a magnetic gap is generated by the insulating coating layer. Therefore, the insulating coating layer is not formed on the top surface 11e of the flat base part 11 of the magnetic core 1 and on the top surface of the core part 12.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)

Claims (14)

  1. Elektronisches Bauteil, umfassend:
    ein magnetisches Kernelement (1), das aus einem magnetischen Material hergestellt ist und das eine flache Basis (11) und einen Kern (12) aufweist, wobei die flache Basis eine obere Oberfläche (11e), eine untere Oberfläche (11d), eine erste seitliche Oberfläche und eine zweite seitliche Oberfläche aufweist, die der ersten seitlichen Oberfläche gegenüberliegt, wobei sich der Kern auf der oberen Oberfläche der flachen Basis befindet,
    eine Wicklung (2), die eine Hochkant-Spule aufweist, in welcher ein flacher Draht gewickelt ist und in welche der Kern eingesetzt ist, wobei die Wicklung zwei nicht gewickelte flache Drähte aufweist, die sich von der Hochkant-Spule aus erstrecken, und
    einen magnetischen äußeren Körper (3), der mindestens den Kern und die Hochkant-Spule bedeckt, wobei
    die zwei nicht gewickelten flachen Drähte (22, 23) nicht gewickelte Abschnitte der Wicklung (2) sind, die in die Hochkant-Spule integriert sind, und sich ununterbrochen entlang der oberen Oberfläche, der ersten seitlichen Oberfläche, der unteren Oberfläche und der zweiten seitlichen Oberfläche der flachen Basis in dieser Reihenfolge erstrecken,
    die zwei nicht gewickelten flachen Drähte, die sich auf der unteren Oberfläche befinden, als Elektroden (22c, 23c) dienen, dadurch gekennzeichnet, dass die Enden der nicht gewickelten flachen Drähte an der zweiten seitlichen Oberfläche durch den magnetischen äußeren Körper bedeckt sind.
  2. Elektronisches Bauteil nach Anspruch 1, wobei
    die zwei Enden durch ein Harz bedeckt sind.
  3. Elektronisches Bauteil nach Anspruch 1, wobei
    die zwei nicht gewickelten Drähte (22, 23) mit der unteren Oberfläche der flachen Basis (11) mit einem Klebstoff verbunden sind.
  4. Elektronisches Bauteil nach Anspruch 1, wobei
    die untere Oberfläche der flachen Basis zwei Elektrodennuten (51, 52) aufweist, und
    sich die zwei nicht gewickelten Drähte jeweils in den zwei Elektrodennuten befinden.
  5. Elektronisches Bauteil nach Anspruch 1, wobei
    die erste und die zweite seitliche Oberfläche der flachen Basis jeweils eine erste beziehungsweise eine zweite Führungsnut (61, 62) aufweisen, und
    sich die zwei nicht gewickelten Drähte jeweils in der ersten und der zweiten Führungsnut befinden.
  6. Elektronisches Bauteil nach Anspruch 1, wobei
    die zwei Enden der zwei nicht gewickelten Drähte in Richtung der ersten seitlichen Oberfläche der flachen Basis gebogen sind.
  7. Elektronisches Bauteil nach Anspruch 6, wobei
    die zwei Enden der zwei nicht gewickelten Drähte mit der oberen Oberfläche der flachen Basis in Kontakt kommen.
  8. Elektronisches Bauteil nach Anspruch 1, wobei
    sich die zwei seitlichen Oberflächen der flachen Basis, die sich jeweils zwischen der ersten und der zweiten seitlichen Oberfläche (11c) befinden, nach unten neigen.
  9. Elektronisches Bauteil nach Anspruch 1, wobei
    ein Harzklebstoff auf zwei seitlichen Oberflächen der flachen Basis, die sich jeweils zwischen der ersten und der zweiten seitlichen Oberfläche befinden, vorgesehen ist.
  10. Elektronisches Bauteil nach Anspruch 1, wobei
    sich die zweite seitliche Oberfläche (11b) nach oben neigt.
  11. Verfahren zum Herstellen eines elektronischen Bauteils, umfassend:
    Bilden eines magnetischen Kernelements aus einem magnetischen Material und mit einer flachen Basis und einem Kern, wobei die flache Basis eine obere Oberfläche, eine untere Oberfläche, eine erste seitliche Oberfläche und eine zweite seitliche Oberfläche aufweist, die der ersten seitlichen Oberfläche gegenüberliegt, wobei sich der Kern auf der oberen Oberfläche der flachen Basis befindet,
    Bilden einer Wicklung, die eine Hochkant-Spule aufweist, in welcher ein flacher Draht gewickelt ist und in welche der Kern eingesetzt ist, wobei die Wicklung zwei nicht gewickelte flache Drähte aufweist, die sich von der Hochkant-Spule aus erstrecken, wobei die zwei nicht gewickelten flachen Drähte (22, 23) nicht gewickelte Abschnitte der Wicklung (2) sind, die in die Hochkant-Spule integriert sind, und sich ununterbrochen entlang der oberen Oberfläche, der ersten seitlichen Oberfläche, der unteren Oberfläche und der zweiten seitlichen Oberfläche der flachen Basis in dieser Reihenfolge erstrecken,
    Platzieren der Wicklung und des magnetischen Kerns in einer Form,
    Füllen der Form mit einer Mischung aus einem magnetischen Material und einem Harz, und
    Durchführen einer Behandlung an der Mischung, um einen magnetischen äußeren Körper zu bilden, der mindestens den Kern und die Hochkant-Spule und die Enden der nicht gewickelten flachen Drähte an zweiten seitlichen Oberflächen der Basis bedeckt.
  12. Verfahren zum Herstellen eines elektronischen Bauteils nach Anspruch 11, wobei
    die Mischung in einem Aufschlämmungszustand vorliegt, und die Behandlung ein Erwärmen ist, sodass die Mischung durch Wärme gehärtet wird.
  13. Verfahren zum Herstellen eines elektronischen Bauteils nach Anspruch 11, wobei
    die Mischung in einem Spachtelzustand vorliegt, und
    die Behandlung ein Erwärmen ist, sodass die Mischung durch Wärme gehärtet wird.
  14. Verfahren zum Herstellen eines elektronischen Bauteils nach Anspruch 11, wobei
    die Behandlung ein Formpressen der Mischung ist,
    der gepresste magnetische äußere Körper aus der Form herausgenommen wird, und
    der gepresste magnetische äußere Körper durch Wärme ausgehärtet wird.
EP14160000.7A 2013-03-14 2014-03-14 Elektronische Komponente und Verfahren zur Herstellung einer elektronischen Komponente Active EP2779182B1 (de)

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EP21170000.0A EP3879544B1 (de) 2013-03-14 2014-03-14 Elektronische komponente und verfahren zur herstellung einer elektronischen komponente
EP24161633.3A EP4358104A3 (de) 2013-03-14 2014-03-14 Elektronisches bauteil und verfahren zur herstellung des elektronischen bauteils

Applications Claiming Priority (3)

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US13/804,857 US9087634B2 (en) 2013-03-14 2013-03-14 Method for manufacturing electronic component with coil
CN201310109345 2013-03-29
CN201410050474.7A CN104051129A (zh) 2013-03-14 2014-02-13 电子元件以及电子元件的制造方法

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EP21170000.0A Division-Into EP3879544B1 (de) 2013-03-14 2014-03-14 Elektronische komponente und verfahren zur herstellung einer elektronischen komponente
EP24161633.3A Division EP4358104A3 (de) 2013-03-14 2014-03-14 Elektronisches bauteil und verfahren zur herstellung des elektronischen bauteils

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CN103915236A (zh) * 2014-04-01 2014-07-09 黄伟嫦 一种新型电感及其制造方法
CN110085411B (zh) * 2014-09-11 2022-05-31 胜美达集团株式会社 线圈元件的制造方法以及线圈元件
JP2016157751A (ja) * 2015-02-23 2016-09-01 スミダコーポレーション株式会社 電子部品
CN106710786B (zh) * 2015-07-29 2019-09-10 胜美达集团株式会社 小型电子器件、电子线路板及小型电子器件的制造方法
CN106469607B (zh) 2015-08-19 2020-10-27 胜美达集团株式会社 一种线圈元器件的制造方法及用于制造此线圈元器件的模具设备
CN115206644A (zh) * 2022-08-08 2022-10-18 中磁电科有限公司 一种电子元件以及电子元件的制造方法

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JP2001060523A (ja) * 1999-08-20 2001-03-06 Concorde Denshi Kogyo:Kk 表面実装型インダクタ。
JP2002289442A (ja) * 2001-03-23 2002-10-04 Mosutetsuku:Kk ダミー端子付き電子部品、及びダミー端子付き接着シート
JP2003243228A (ja) * 2002-02-18 2003-08-29 Tdk Corp コモンモードフィルタ
JP2003347129A (ja) * 2002-05-24 2003-12-05 Minebea Co Ltd 表面実装型コイル
JP4777100B2 (ja) * 2006-02-08 2011-09-21 太陽誘電株式会社 巻線型コイル部品
JP4783183B2 (ja) * 2006-03-16 2011-09-28 スミダコーポレーション株式会社 インダクタ
US20080036566A1 (en) * 2006-08-09 2008-02-14 Andrzej Klesyk Electronic Component And Methods Relating To Same

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EP3879544B1 (de) 2024-05-01
EP2779182A2 (de) 2014-09-17
EP2779182A3 (de) 2017-11-29
EP4358104A3 (de) 2024-06-19
EP4358104A2 (de) 2024-04-24

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