EP2761654A4 - Spannmechanismus und verfahren zur anwendung von nennkraft auf eine leistungsumwandlungsvorrichtung - Google Patents

Spannmechanismus und verfahren zur anwendung von nennkraft auf eine leistungsumwandlungsvorrichtung

Info

Publication number
EP2761654A4
EP2761654A4 EP11873228.8A EP11873228A EP2761654A4 EP 2761654 A4 EP2761654 A4 EP 2761654A4 EP 11873228 A EP11873228 A EP 11873228A EP 2761654 A4 EP2761654 A4 EP 2761654A4
Authority
EP
European Patent Office
Prior art keywords
power conversion
clamping mechanism
conversion apparatus
rated force
applying rated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11873228.8A
Other languages
English (en)
French (fr)
Other versions
EP2761654A1 (de
Inventor
Junfeng Sheng
Richard S Zhang
Fan Zhang
Mark Edward Dame
Brian Eric Lindholm
Patrick Jose Lazatin
Xiaodan Zhang
John Wilbur Cannon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of EP2761654A1 publication Critical patent/EP2761654A1/de
Publication of EP2761654A4 publication Critical patent/EP2761654A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H01L2924/13023—IGCT - Integrated Gate Commutated Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Inverter Devices (AREA)
EP11873228.8A 2011-09-28 2011-09-28 Spannmechanismus und verfahren zur anwendung von nennkraft auf eine leistungsumwandlungsvorrichtung Withdrawn EP2761654A4 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2011/001634 WO2013044409A1 (en) 2011-09-28 2011-09-28 Clamping mechanism and method for applying rated force to power conversion apparatus

Publications (2)

Publication Number Publication Date
EP2761654A1 EP2761654A1 (de) 2014-08-06
EP2761654A4 true EP2761654A4 (de) 2015-05-20

Family

ID=47994090

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11873228.8A Withdrawn EP2761654A4 (de) 2011-09-28 2011-09-28 Spannmechanismus und verfahren zur anwendung von nennkraft auf eine leistungsumwandlungsvorrichtung

Country Status (4)

Country Link
EP (1) EP2761654A4 (de)
BR (1) BR112014005674A2 (de)
CA (1) CA2848802A1 (de)
WO (1) WO2013044409A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103489856B (zh) * 2013-09-18 2016-08-24 许继电气股份有限公司 用于柔性直流输电的晶闸管压接组件
CN103745975B (zh) * 2013-10-18 2016-09-14 中国西电电气股份有限公司 一种模块化多电平换流器功率模块内的晶闸管压装结构
KR101921585B1 (ko) 2014-07-01 2018-11-26 지멘스 악티엔게젤샤프트 가압 요소를 갖는 클램핑 조립체
CN206758432U (zh) * 2014-07-03 2017-12-15 西门子公司 具有弹簧装置的夹紧组件
EP3018709B1 (de) * 2014-11-04 2018-07-18 SEMIKRON Elektronik GmbH & Co. KG Stromrichtereinrichtung
WO2018133942A1 (de) * 2017-01-20 2018-07-26 Siemens Aktiengesellschaft Kühlplatte
JP2020150747A (ja) * 2019-03-15 2020-09-17 東芝三菱電機産業システム株式会社 電力装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004028748A2 (en) * 2000-10-27 2004-04-08 Varian Medical Systems, Inc. Clamping assembly for high-voltage solid state devices

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2550887B1 (fr) * 1983-08-19 1986-11-07 Jeumont Schneider Element pretare pour le maintien en place et le serrage de semi-conducteurs et de radiateurs disposes en colonne par alternance
JP3462709B2 (ja) * 1997-05-06 2003-11-05 株式会社日立製作所 電力変換器用平形半導体スタック
JP3808680B2 (ja) * 2000-01-11 2006-08-16 東芝三菱電機産業システム株式会社 平型半導体素子用スタック
JP2003168778A (ja) * 2001-12-03 2003-06-13 Toshiba Corp 平型半導体素子用スタック
CN2779619Y (zh) * 2005-03-10 2006-05-10 冶金自动化研究设计院 一种平板型电力电子半导体器件组件

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004028748A2 (en) * 2000-10-27 2004-04-08 Varian Medical Systems, Inc. Clamping assembly for high-voltage solid state devices

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013044409A1 *

Also Published As

Publication number Publication date
EP2761654A1 (de) 2014-08-06
BR112014005674A2 (pt) 2017-03-28
CA2848802A1 (en) 2013-04-04
WO2013044409A1 (en) 2013-04-04

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