EP2749156A1 - Sensor with a single electrical carrier means - Google Patents
Sensor with a single electrical carrier meansInfo
- Publication number
- EP2749156A1 EP2749156A1 EP12761920.3A EP12761920A EP2749156A1 EP 2749156 A1 EP2749156 A1 EP 2749156A1 EP 12761920 A EP12761920 A EP 12761920A EP 2749156 A1 EP2749156 A1 EP 2749156A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- sensor
- housing
- carrier means
- sensor according
- designed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000012545 processing Methods 0.000 claims abstract description 13
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000012546 transfer Methods 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 238000004382 potting Methods 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000000742 single-metal deposition Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 101150049168 Nisch gene Proteins 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
- B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/13147—Copper [Cu] as principal constituent
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
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- H01L2224/49175—Parallel arrangements
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10924—Leads formed from a punched metal foil
Definitions
- the invention relates to a sensor according to the preamble of claim 1 and the use of the sensor in Kraftfahrzeu ⁇ gen.
- micromechanical sensor elements or MEMS sensor elements and application specific integrated circuits or ASICs which are initially formed as unpackaged half ⁇ conductor devices, as so-called “bare die” already by the manufacturer equipped to produce inertial sensors, which as a solderable component or devisdommon ⁇ tierter component or as so-called
- SMD Surface Mounted Device
- Such SMDs can be soldered directly to a printed circuit board or "PCB" in a control unit (ECU, ACU) or in a separate housing of a satellite sensor.
- PCB printed circuit board
- the invention is based on the object to propose a excellentgüns ⁇ term and / or compact sensor.
- the sensor preferably has a single carrier means.
- the carrier means is preferably designed as a leadframe. Alternatively, preferably the carrier means is formed as a printed ⁇ te or "PCB".
- a plug Under an electrical interface, is preferably understood a plug and, preferably, a cable connection or cable outlet.
- the at least one sensor element and the signal processing element are each arranged as unpackaged ⁇ half-conductor components on the carrier.
- Un ⁇ ter an unpackaged semiconductor device is understood to be ⁇ vorzugt a component whose functional structure is formed of a semiconductor material and having no own Ge ⁇ housing. Unpacked, for example
- the senor has a transfer gold housing, which encloses the at least one sensor element and the signal processing element and the carrier completely or at least partially.
- a transfer gold housing which encloses the at least one sensor element and the signal processing element and the carrier completely or at least partially.
- the transfer gold housing is completely or at least partially enclosed by an overmold housing.
- the at least one sensor element is designed as an inertial sensor element.
- the sensor is also approved as a motor vehicle sensor.
- a transfermold housing is preferably understood to mean a transfer molding housing or a premold housing.
- An overmold housing is preferably understood to mean an injection-molded housing or an overmold housing or a housing made of epoxy.
- the lead frame or lead frame preferably has at least one mounting island on which at least the sensor ⁇ element and the signal processing element are arranged.
- the at least one sensor element is preferably designed as mik ⁇ romechanisches sensor element, in particular as a micromechanical Inertialsensorelement.
- the sensor is preferably designed such that the
- Overmold housing has two parts, a prefabricated housing part, in which the support means and the components connected thereto are introduced and a second part with which this prefabricated housing part is closed by means of Obermoldens or an overmold housing.
- These two housing parts are particularly preferably made of injection molding or overmold or epoxy.
- the unpackaged semiconductor components are preferably fastened or arranged on the carrier means by means of an adhesive.
- the at least one sensor element as well as the signal processing element and / or optionally tere electrical components, by bonding or
- Wire bonds are at least electrically connected to the carrier and / or under ⁇ each other.
- the fixing and electrical contacting of the at least one sensor element and the signal processing element and / or optionally further elekt ⁇ -driven components in particular "bare dies” as removablebil ⁇ det formed by flip-chip.
- This bare dies, or called non ⁇ grabbed semiconductor devices are then ⁇ example as flipped on the lead frame or circuit board placed and soldered by reflow or hot steam.
- the sensor preferably has one or more additional electrical components, such as at least one resistor and / or at least one capacitor and / or at least one inductance and / or at least one further integrated circuit and / or at least one varistor.
- the housing of the sensor in particular the outer casing or Overmoldgetude one or two or meh ⁇ eral fastening means on which is particularly preferably designed so / are that the sensor is fastened by means of a screw connection.
- the electric vehicle is preferably electrically kontak ⁇ advantage with one or more press-fit pins "press fit pins". In this case, the range in which this contacting is carried out recessed from the Overmoldgephase
- the carrier means is electrically contacted by at least one welded-on pins, in particular ⁇ sondere with the electrical interface.
- the fixation of the PCB in the satellite sensor is preferably carried out by constructive elements directly in the housing and cover (support domes, ribs, snap hooks, etc.). Alternatively, gluing or screwing the PCB is possible.
- the invention also relates to the use of the sensor in motor vehicles.
- the invention also relates to a manufacturing method of a sensor that is favorable and / or flexible.
- the electrical and mechanical connecting ⁇ nisch carrier is initially loaded with unpackaged semiconductor elements and optionally further electronic components.
- the unwrapped semiconductor elements and the optional further electronic components are preferably directly encapsulated so that they are in one
- Transfer gold housing are arranged.
- the unpackaged semiconductor elements and the optiona ⁇ len other electronic components prior to coating with the Transfermoldgeratiuse yet with a Vergussmass or "globe top” are covered, which then also in the
- Transfermold housing is injected.
- a sensor as a solderable component or surface mounted component or as so-called
- SMD Surface Mounted Device
- FIGS. 3 and 4 show exemplary production methods.
- FIG. 1 shows a Ron sensor from two perspectives, which has a leadframe as carrier means 4.
- the sensor comprises two glued-on sensor elements 1 and a signal processing element 2, which are electrically contacted by means of bonding wires 10.
- Sensor elements 1 and a Sig ⁇ nal kauselement 2 are surrounded by a Transfermoldgephaseuse 5 or injected accordingly.
- the lead frame 4 includes two further encapsulation as Transfermoldgephaseuse 5.
- FIG. 2 shows an exemplary sensor as a surface-mounted component or so-called
- SMD Surface Mounted Device
- a sensor element 1 and a signal processing element 2, which are arranged on the support means 4, for example as a conductor ⁇ plate or "PCB.”
- PCB conductor ⁇ plate
- Printed circuit board 4 is contacted by Einpresspins 11 electrically, wherein the contact region of the housing of the sensor, a
- Overmold housing 7 are recessed.
- the housing has a recess / recess in this contacting region, in FIG. 2 b) arranged next to the housing 7 in this contacting region.
- FIG. 1 An exemplary manufacturing method is illustrated with reference to FIG. Instead of conventionally two packaging ⁇ step for the construction of a satellite sensor, only one step is needed - the "bare dies" are arranged / equipped on the circuit board as a support means and there ⁇ after the contacting and training of the housing takes place SMDs omitted that would be too ⁇ additionally connected to the carrier and then would take up space.
- the construction and connection technology of the bare die and the flip chip process is identical. It can be used the same front-end equipment to Her ⁇ position.
- the printed circuit board can be completely or partially encapsulated by Transfermold.
- the modular production method illustrated in FIG. 4 preferably allows or comprises two main variants, as illustrated schematically by way of example:
- the populated leadframe having the contacted Bare This is preferred by a glob top or potting and after ⁇ following transfer mold or a total / Nachumspritzungsvorgang, for example by means of epoxy, ge ⁇ protects. It creates an SMD, so one
- the populated leadframe with the contacted bare die is preferably ge ⁇ protected by a glob top or casting and a subsequent transfer mold or a complete / Nachumspritzungsvorgang, for example by means of epoxy.
- the contact pins are previously welded to the leadframe or, alternatively, a cable can be attached by so-called crimping.
- the fixing members can be inserted in the mold and introduced with or subsequently injection-molded, ⁇ example, by heat embedding and / or ultrasonic welding. After that 3 subvariants are possible:
- the populated leadframe is partially encapsulated with an open housing and sealed with a potting and / or lid.
- the lid may be made of a metallic or non-metallic material.
- passive elements can be equipped to who, as exemplified schematically illustrates ⁇ ⁇ based Figure 1 additionally with or without protection (glob top and Transfer Mold).
- any modular extensions of the leadframe are possible, which carry additional additional circuits, as illustrated schematically by way of example with reference to FIG. 1.
- These may be other bare dies (MEMS, ASIC) or other components (R, C, IC, diodes, vanisters, LEDs, etc.).
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pressure Sensors (AREA)
- Gyroscopes (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011081505 | 2011-08-24 | ||
DE102011081512 | 2011-08-24 | ||
PCT/EP2012/066503 WO2013026923A1 (en) | 2011-08-24 | 2012-08-24 | Sensor with a single electrical carrier means |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2749156A1 true EP2749156A1 (en) | 2014-07-02 |
Family
ID=46888388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP12761920.3A Ceased EP2749156A1 (en) | 2011-08-24 | 2012-08-24 | Sensor with a single electrical carrier means |
Country Status (6)
Country | Link |
---|---|
US (1) | US9645163B2 (en) |
EP (1) | EP2749156A1 (en) |
KR (1) | KR102182947B1 (en) |
CN (2) | CN103748976B (en) |
DE (1) | DE102012215091A1 (en) |
WO (1) | WO2013026923A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3147258A1 (en) * | 2015-09-22 | 2017-03-29 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Connection panel for electronic components |
DE102015223775A1 (en) * | 2015-11-30 | 2017-06-01 | Continental Teves Ag & Co. Ohg | Method for producing a connecting element, connecting element and sensor arrangement |
DE102015223850A1 (en) | 2015-12-01 | 2017-06-01 | Robert Bosch Gmbh | Method for producing a device for detecting at least one property of a fluid medium in a measuring space |
JP2018166083A (en) * | 2017-03-28 | 2018-10-25 | アイシン精機株式会社 | Electronic component module and manufacturing method of the same |
DE102019210375A1 (en) * | 2019-07-12 | 2021-01-14 | Continental Teves Ag & Co. Ohg | Method of manufacturing a robust sensor |
USD984397S1 (en) * | 2021-03-16 | 2023-04-25 | Yidong Cai | Circuit board |
Citations (3)
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DE19804170A1 (en) * | 1998-02-03 | 1999-08-05 | Siemens Ag | Electrical unit e.g. for electrical connection of ignition (triggering) conductors to airbag ignition pellet |
EP2133539A2 (en) * | 2008-06-11 | 2009-12-16 | Helga Apel | Throttle valve support with throttle valve |
DE102010042438A1 (en) * | 2010-01-27 | 2011-07-28 | Robert Bosch GmbH, 70469 | sensor arrangement |
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TW314650B (en) | 1995-06-21 | 1997-09-01 | Oki Electric Ind Co Ltd | |
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JP3566928B2 (en) * | 1998-12-04 | 2004-09-15 | フォームファクター,インコーポレイテッド | Method and apparatus for transport and tracking of electronic components |
US6428357B1 (en) * | 2001-06-19 | 2002-08-06 | Amphenol Corporation | Electrical connector with overmold housing |
EP1274039B1 (en) * | 2001-07-03 | 2008-01-02 | Symbol Technologies, Inc. | Compact scan module with magnetically centered scan mirror |
JP4174979B2 (en) * | 2001-07-13 | 2008-11-05 | 松下電工株式会社 | Acceleration sensor |
US7304362B2 (en) * | 2002-05-20 | 2007-12-04 | Stmicroelectronics, Inc. | Molded integrated circuit package with exposed active area |
KR20030091549A (en) * | 2002-05-28 | 2003-12-03 | 삼성전기주식회사 | Image sensor module and method thereof |
US6924496B2 (en) * | 2002-05-31 | 2005-08-02 | Fujitsu Limited | Fingerprint sensor and interconnect |
JP3906767B2 (en) * | 2002-09-03 | 2007-04-18 | 株式会社日立製作所 | Electronic control unit for automobile |
DE102004019428A1 (en) | 2004-04-19 | 2005-08-04 | Infineon Technologies Ag | Semiconductor component with hollow space housing as for sensor chips has plastic housing and carrier for wiring plate |
US7235431B2 (en) * | 2004-09-02 | 2007-06-26 | Micron Technology, Inc. | Methods for packaging a plurality of semiconductor dice using a flowable dielectric material |
DE102006030133A1 (en) | 2005-06-29 | 2007-02-08 | Ab Elektronik Gmbh | Sensor with electrical module has conductive wire grid connected to chip of sensor IC and plastic base with conductive wires and plug connection |
DE102005053682A1 (en) | 2005-11-10 | 2007-05-16 | Bosch Gmbh Robert | Sensor, sensor component and method for producing a sensor |
DE102006046984A1 (en) * | 2006-10-04 | 2008-04-10 | Siemens Ag | Method for producing a carrier element with an angle sensor |
DE102007032142A1 (en) | 2007-06-30 | 2009-01-02 | Robert Bosch Gmbh | Electronic module and method for producing an electronic module |
CN101599444B (en) * | 2008-06-04 | 2011-11-02 | 同欣电子工业股份有限公司 | Image-sensing device and encapsulation method thereof |
JP2010006929A (en) * | 2008-06-26 | 2010-01-14 | Shin-Etsu Chemical Co Ltd | Adhesive composition, adhesive sheet, and dicing die attach film |
DE102009000427A1 (en) * | 2009-01-27 | 2010-07-29 | Robert Bosch Gmbh | Method for producing a sensor module |
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2012
- 2012-08-24 CN CN201280041181.1A patent/CN103748976B/en active Active
- 2012-08-24 KR KR1020147007598A patent/KR102182947B1/en active IP Right Grant
- 2012-08-24 US US14/240,503 patent/US9645163B2/en active Active
- 2012-08-24 DE DE102012215091A patent/DE102012215091A1/en active Pending
- 2012-08-24 EP EP12761920.3A patent/EP2749156A1/en not_active Ceased
- 2012-08-24 WO PCT/EP2012/066503 patent/WO2013026923A1/en active Application Filing
- 2012-08-24 CN CN201711223466.8A patent/CN107954393B/en active Active
Patent Citations (3)
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DE19804170A1 (en) * | 1998-02-03 | 1999-08-05 | Siemens Ag | Electrical unit e.g. for electrical connection of ignition (triggering) conductors to airbag ignition pellet |
EP2133539A2 (en) * | 2008-06-11 | 2009-12-16 | Helga Apel | Throttle valve support with throttle valve |
DE102010042438A1 (en) * | 2010-01-27 | 2011-07-28 | Robert Bosch GmbH, 70469 | sensor arrangement |
Non-Patent Citations (1)
Title |
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See also references of WO2013026923A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN103748976B (en) | 2018-01-02 |
KR102182947B1 (en) | 2020-11-25 |
DE102012215091A1 (en) | 2013-02-28 |
US20140202246A1 (en) | 2014-07-24 |
CN107954393B (en) | 2021-06-22 |
CN107954393A (en) | 2018-04-24 |
KR20140054333A (en) | 2014-05-08 |
US9645163B2 (en) | 2017-05-09 |
WO2013026923A1 (en) | 2013-02-28 |
CN103748976A (en) | 2014-04-23 |
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