EP2733553A1 - Systèmes et procédés pour composants montés par frittage externe - Google Patents

Systèmes et procédés pour composants montés par frittage externe Download PDF

Info

Publication number
EP2733553A1
EP2733553A1 EP12193298.2A EP12193298A EP2733553A1 EP 2733553 A1 EP2733553 A1 EP 2733553A1 EP 12193298 A EP12193298 A EP 12193298A EP 2733553 A1 EP2733553 A1 EP 2733553A1
Authority
EP
European Patent Office
Prior art keywords
sensor body
frit
component stack
sensor
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12193298.2A
Other languages
German (de)
English (en)
Other versions
EP2733553B1 (fr
Inventor
Christina Marie Schober
Jennifer S. Strabley
Bernard Fritz
James A. Vescera
Kenneth Salit
Delmer L. Smith
Terry Dean Stark
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Priority to EP12193298.2A priority Critical patent/EP2733553B1/fr
Publication of EP2733553A1 publication Critical patent/EP2733553A1/fr
Application granted granted Critical
Publication of EP2733553B1 publication Critical patent/EP2733553B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04F—TIME-INTERVAL MEASURING
    • G04F5/00—Apparatus for producing preselected time intervals for use as timing standards
    • G04F5/14—Apparatus for producing preselected time intervals for use as timing standards using atomic clocks

Definitions

  • Atomic sensors like cold atom clocks and ring laser gyroscopes, use external components to control light and optical signals as they enter the body of the atomic sensor and to sense light and signals as they exit the body of the atomic sensor. Because the external components receive and control light and other signals, the components must be in the correct location relative to the body of the atomic sensor to accurately receive and control the light and other signals. To secure the external components in the correct location, the components are attached to the body of the atomic sensor using adhesives. Alternatively, an external mechanical structure can secure the atomic sensor and external components in the desired locations relative to one another. However, when the external components are secured using either an adhesive or an external mechanical structure, vibrations and shocks cause the components and the atomic sensor to move in relation to one another. This movement in relation to one another affects the operative quality of the sensor. Further, mounting the external components using adhesive or an external mechanical structure requires multiple steps during fabrication of the atomic sensor.
  • the embodiments of the present invention provide systems and methods for external frit mounted components and will be understood by reading and studying the following specification.
  • a method for fabricating a sensor device comprises securing at least one component stack on a sensor body over at least one opening in the sensor body, wherein the at least one component stack comprises a plurality of components and applying a frit to the plurality of components in the at least one component stack and the sensor body.
  • the method further comprises heating the frit, the at least one component stack, and the sensor body such that the frit melts and cooling the frit, the at least one component stack, and the sensor body such that the at least one component stack is secured to the sensor body.
  • Figure 1 is a cross section diagram illustrating externally mounted components attached with frit to a sensor body in one embodiment of the present invention
  • Figure 2 is a block diagram illustrating multiple components in a component stack in one embodiment of the present invention
  • Figure 3 is a block diagram illustrating a fixture for securing a component stack to a sensor body in one embodiment of the present invention
  • Figure 4 is a block diagram illustrating a detailed view of the fixture when securing a component stack to a sensor body in one embodiment of the present invention
  • Figure 5 is a block diagram showing an exemplary implementation of an atomic clock in one embodiment of the present invention.
  • Figure 6 is a flow diagram illustrating a method for attaching externally mounted components to a sensor body using frit in one embodiment of the present invention.
  • Embodiments of the present invention provide systems and methods for externally mounting components on an atomic sensor using frit. This is accomplished by placing the external components in the correct location in relation to the body of the atomic sensor and applying frit around the external components such that when the atomic sensor, the external components and frit are heated, the frit welds the external components to each other and to the body of the atomic sensor.
  • frit By using frit, the external components become rigidly attached to the body of the atomic sensor such that the external components move with the atomic sensor when the system is vibrated or shocked.
  • the external components can be joined to the body of the atomic sensor at the same time that other components are joined to the body of the atomic sensor. Because multiple components can be joined at various locations on the body of the atomic sensor simultaneously using frit, the use of frit uses less fabrication steps to join the body of the atomic sensor to the external components.
  • FIG. 1 is a cross section diagram of sensor 100 where external components are attached with frit 104 to a sensor body 106 of the atomic sensor 100.
  • Sensor 100 is an optical sensor (such as an accelerometer, a gyroscope, an atomic clock, and the like).
  • sensor 100 includes a sensor body 106 that includes a cavity 108 that encompasses a hermetically sealed environment, where the environment type aids sensor 100 in operating correctly.
  • the cavity 108 will contain a desired gas that is hermetically sealed within the sensor body 106.
  • the cavity 108 encompasses a vacuum that is hermetically sealed within the sensor body 106.
  • measurement information obtained by sensor 100 is obtained by observing patterns of optical energy contained within cavity 108. For that reason, sensor 100 provides openings 110 to allow measurement information produced within cavity 108 to be used by an external system connected to sensor 100. Openings 110 are locations on sensor body 106 that allow optical energy to leave or enter the sensor body 106, and allow an external system to analyze the patterns of optical energy within cavity 108.
  • component stack 102 components that interface with sensor body 106 are combined together to form one or more component stacks 102.
  • Sensor 100 can have multiple component stacks 102 that are associated with different openings 110 in sensor body 106.
  • the sensor body 106 can have one or more openings 110 that introduce light into cavity 108 and one or more openings 110 for light to be transmitted out of cavity 108.
  • component stack 102 may include a light source (such as a laser, for example), a lens, a beam splitter (that is, a device that directs portions of light to separate openings), a beam expander, and the like.
  • component stack 102 In an exemplary embodiment of a component stack 102 associated with receiving light from cavity 108, component stack 102 includes a photodetector, a lens, and the like. Further, to preserve a vacuum within the cavity 108, in one embodiment, component stack 102 includes a getter. In one embodiment where sensor 100 is a ring laser gyroscope, the component stack 102 will include a light emitting diode for starting the operation of the ring laser gyroscope. In one embodiment, openings 110 around cavity 108 may include optical elements 112 that may comprise, transparent window elements, reflective mirror elements, or elements that are partially transparent and partially reflective.
  • frit 104 or glass solder is used to join the individual components in component stack 102 to each other.
  • frit 104 is also used to bond the component stack 102 to the sensor body 106.
  • frit 104 is used to bond mirrors and windows 112 to sensor body 106.
  • the component stack 102 is bonded to optical elements 112.
  • an optical element 112 may be bonded to the sensor body 106 using frit 104, such that the frit 104 forms a hermetic seal between the optical element 112 and the sensor body 106.
  • a component stack 102 is directly joined to the sensor body 106 over an openings 110 using frit 104 to form a hermetic seal between the component stack 102 and sensor body 106.
  • FIG. 2 is a block diagram illustrating a sensor 200 with multiple components in multiple component stacks.
  • sensor 200 comprises a sensor 100 such as described above.
  • sensor 200 is an atomic clock.
  • Sensor 200 includes at least three component stacks, 202, 222, and 242.
  • Component stack 202 and 222 function together to introduce light into the cavity 208 within sensor 200.
  • Sensor 200 includes a sensor body 206 that includes a cavity 208 comprising a vacuum chamber cavity that holds alkali metal atoms such as rubidium or cesium (for example, Rb-87) in a passive vacuum.
  • An arrangement of mirrors 210 and windows 212 allow beams of light to be directed into and around the sensor body 206, where the mirrors 210 reflect the beams around the interior of the sensor body 206.
  • the component stacks 202, 222, and 242 are directly bonded to sensor body 206 and not bonded to an interceding window 212. In other embodiments, one or more of component stacks 202, 222, and 242 may be bonded to an interceding window.
  • Component stack 202, 222, and 242 include lenses 203, 223, and 243.
  • Lenses 203, 223, and 243 are each placed at their respective locations such that they abut against sensor body 206, whereupon, lenses 203, 223, and 243 are secured to the sensor body 206 using frit.
  • frit By securing the lenses 203, 223, and 243 as close as possible to the sensor body 206 using frit, the lenses 203, 223, and 243 in conjunction with the frit are able to hermetically seal the interior cavity of sensor body 206 and preserve a vacuum environment within the cavity 208.
  • one or more of lenses 203, 223, and 243 are convex lenses placed against sensor body 206.
  • the convex portion of the lens may be arranged to face the interior cavity 208 of sensor body 206 so that they are able to effectively transmit from component stacks 202 and 222 and focus the light at a particular location within cavity.
  • lens 243 receives light from within sensor body 206 and focuses it onto receiving electronics 244 in component stack 242.
  • component stack 202 includes components that receive a light beam 250 and adjust the light beam 250 before it enters the interior cavity 208 of sensor body 206.
  • component stack 202 includes a collimating lens 217, an optical isolator 213, a series of wave plates 209, a beam splitter 211, and a beam expander 207.
  • Component stack 202 also includes support structures 215 and 205 to set the various components at the appropriate distances from one another to correctly adjust the properties of light beam 250.
  • component stack 202 first receives the light through a collimating lens 217.
  • Collimating lens 217 receives light beam 250 from a light source (like a laser, or other light producing device) and adjusts light beam 250 such that the rays of light that compose light beam 250 are parallel to one another. The light then leaves collimating lens 217 to enter optical isolator 213.
  • the collimating lens 217 is offset from optical isolator 213 a defined distance before the collimated light enters the optical isolator 213.
  • support structure 215 attaches between collimating lens 217 and optical isolator 213.
  • support structure 215 is made from glass and rigidly connects to both collimating lens 217 and optical isolator 213 during the fabrication process.
  • the bonded combination of the collimating lens 217, optical isolator 213, and support structure 215 enclose a hermetically sealed chamber through which light beam 250 travels after collimation.
  • Optical isolator 213 allows light to travel through component stack 202 in only one direction and functions as an optical diode.
  • light beam 250 After the light beam 250 passes through optical isolator 213, light beam 250 enters a beam splitter 211 and a combination of wave plates 209.
  • beam splitter 211 is sandwiched between two wave plates 209.
  • the wave plates 209 alter the polarity of the light beam as it travels through component stack 202 to a desired polarity for entry into the sensor body 206.
  • a first wave plate 209 alters the polarity of light beam 250 before it passes through beam splitter 211.
  • Beam splitter 211 splits light beam 250 into two separate light beams 250a and 250b.
  • Light beam 250b is reflected by beam splitter out of component stack 202 for use in an external application or for use by a different component stack such as component stack 222.
  • light beam 250a passes through further components in component stack 202 before it passes into sensor body 206.
  • light beam 250a passes through a second wave plate 209 to further adjust the polarity of light beam 250a before light beam 250a enters into the sensor body 206.
  • beam expander 207 When the polarity of light beam 250a has been adjusted by wave plates 209, light beam 250a passes through a beam expander 207 and lens 203, where lens 203 is substantially described above and forms a hermetic seal with sensor body 206.
  • Beam expander 207 refracts the collimated and polarized light such that light beam 250a expands before passing through lens 203.
  • beam expander 207 is offset away from lens 203 by a distance that provides substantially enough space between beam expander 207 and lens 203 for light beam 250a to expand to a desired diameter before light beam 250a passes through lens 203.
  • a support structure 205 rigidly bonds to both lens 203 and beam expander 207.
  • support structure 205 is fabricated from glass and bonds to both beam expander 207 and lens 203 using a frit seal.
  • the frit seal bonding support structure 205 to beam expander 207 and lens 203 is a hermetic seal to prevent foreign substances from entering the space within support structure 205 and interfering with light beam 250a.
  • light beam 250a is reflected by a series of mirrors 210 to direct the light at a group of atoms in the middle of the sensor body 206.
  • component stack 222 includes wave plate 229, beam expander 227, and lens 223.
  • the components in component stack 222 are supported by support structure 225.
  • the different components in component stack 222 function similarly to corresponding components in component stack 202.
  • wave plate 229 functions similarly to the second wave plate in wave plates 209
  • beam expander 227 functions similarly to beam expander 207
  • lens 223 functions similarly to lens 203
  • support structure 225 functions similarly to support structure 205.
  • mirrors 210 reflect light beams 250a and 250b in such a way that different reflected light beams within sensor body 206 intersect along three orthogonal axes while illuminating atoms located at the center of cavity 208.
  • sensor 200 includes component stack 242 which includes a photodetector 244 and a lens 243. In some instances, where light is reflected out of the cavity 208 by a mirror 210, that light is reflected to component stack 242.
  • Component stack 242 also includes a support structure 245 to hold photodetector 244 at a prescribed distance from lens 243.
  • Support structure 245 functions similarly to the other support structures 225 and 205 in component stacks 202 and 222.
  • support structure 225 functions to place space between optical components while bonding to the optical components. Support structure 225 can also bond to both photodetector 244 and lens 243 with a frit seal. Further, the frit seal that bonds support structure 225 to photodetector 244 and lens 243 hermetically isolates the space between photodetector 244 and lens 243.
  • component stacks 202, 222, and 242 each include multiple components that are placed at precise locations in relation to sensor body 206 to allow light to correctly propagate in, around, and out of sensor body 206.
  • the components in component stacks 202, 222, and 242 are bonded together and to sensor body 206 using frit to rigidly maintain the precise location of the components in relation to the sensor body 206.
  • frit to bond the components in component stacks 202, 222, and 242 to the sensor body 206 reduces the movement of the components in relation to the sensor body 206 during the operation of the sensor 200.
  • the use of frit to bond the components within component stacks 202, 222, and 242 together and to bond the component stacks 202, 222, and 242 to sensor body 206 also reduces errors in measurements by sensor 200 due to reduced movement of the components in relation to the sensor body 206.
  • FIG. 3 is a block diagram illustrating a fixture 304 for securing a component stack 302 (such as any of sensor stacks 102, 202, 222, or 242) to a sensor body 306 (such as sensors body 106 or 206).
  • a component stack 302 such as any of sensor stacks 102, 202, 222, or 242
  • sensor body 306 such as sensors body 106 or 206.
  • fixture 304 when the sensor body 306 is mounted within the fixture 304, the fixture holds the components at a desired location in relation to the sensor body 306.
  • fixture 304 uses plungers 310 to hold the different components of component stack 302 in place.
  • fixture 304 is composed of multiple parts that are assembled together at the time the sensor body 306 and components are assembled together.
  • fixture 304 has a top portion 308 that is secured to a lower portion 312 of fixture 304 after the sensor body 306 has been placed within fixture 304.
  • Fixture 304 secures all the components to sensor body such that frit can be applied to the multiple components and the sensor body.
  • fixture 304, the components, sensor body 306, and the frit joining the sensor body 306 and the components can be heated at the same time such that the frit simultaneously bonds all the assembled pieces held in place by fixture 304.
  • the frit has bonded the various components to the sensor body 306, the sensor body 306 and adjoining components are removed from fixture 304.
  • Figure 4 is a block diagram illustrating a detailed view of a fixture 404 when securing a component stack 402 (such as component stack 302) to a sensor body 406 (such as body 306).
  • a component stack 402 such as component stack 302
  • sensor body 406 such as body 306
  • the various components in sensor body 406 are first prepped for assembly by cleaning the separate components.
  • sensor body 406 and fixture 404 are rotated such that sensor body 406 is directly below component stack 402.
  • gravity can aid in the stacking of the different components in component stack 402 before the components are secured in place with a plunger 410 connected to fixture 404.
  • a lens 403 is fitted into sensor body 406.
  • the other components in component stack 402 are then subsequently stacked on top of one another as the components move away from sensor body 406.
  • support structure 405 is placed on the lens
  • the beam expander 407 is then placed on the support structure 405
  • the second wave plate 409 is placed on the beam expander 407
  • the beam splitter 411 is placed on the second wave plate 409
  • the first wave plate 409 is placed on the beam splitter 411.
  • optical isolator 413 is placed on the first wave plate 409, a support structure 415 is placed on optical isolator 413, and a collimating lens 417 is placed on support structure 415.
  • a plunger 410 is then placed on collimating lens 417 and support structure 415 to secure component stack 402 to sensor body 406.
  • frit is applied to the component stack 402 to join the different components in component stack 402 together.
  • frit is applied to hermetically seal the space between components.
  • frit is also applied to the different components such that the components are bonded to one another but the space between the different components is not hermetically sealed. The frit is then heated and cooled to bond the different components together.
  • the plunger 410 in fixture 404 is removed and the sensor is removed from fixture 404.
  • the atomic sensor is an atomic clock.
  • the use of frit enables the manufacture of atomic clocks that can be manufactured in fewer steps and are less susceptible to errors caused by vibrations and shocks.
  • the atomic clocks described above can be used to provide a reference frequency signal to frequency dependent applications as part of Global Positioning System satellites, unmanned aerial vehicles, navigation systems, and the like.
  • Figure 5 illustrates the implementation of an atomic clock 502 in a system 500.
  • atomic clock 502 constructed implementing the fritted component stacks as described above, is small enough to be used in micro-electromechanical systems (MEMS).
  • MEMS micro-electromechanical systems
  • atomic clock 502 is mounted as part of a MEMS device 504.
  • Atomic clock 502 produces a reference frequency and provides the reference frequency to a frequency dependent device 506.
  • the reference frequency provided by atomic clock 502 increases the operational stability and accuracy of frequency dependent device 506.
  • frequency dependent device 506 is a component of a Global Positioning System satellite
  • the atomic clock 502 allows the satellite to provide more accurate reference times for the accurate calculation of positions.
  • Figure 6 is a flow diagram illustrating a method 600 for attaching externally mounted components to a sensor body using frit.
  • Method 600 begins at 602 with securing at least one component stack on a sensor body over at least one opening in the sensor body, wherein the at least one component stack comprises a plurality of components.
  • the opening includes an optical element such as a window or mirror over the opening.
  • the component stack is secured over the optical element.
  • a fixture secures a component stack comprising a plurality of different components to a sensor body.
  • the fixture includes a rigid frame that secures the positions of both the component stack and the sensor body at fixed positions in relation to each other.
  • the fixture includes a plunger that applies pressure against the component stack, which pressure secures the component stack to the sensor body.
  • Method 600 proceeds at 604 with applying a frit to the plurality of components in the at least one component stack and the sensor body.
  • frit is applied around the opening in the sensor body and the adjoining component stack. Further, frit is applied around the different components in the component stack. In one embodiment, frit is applied to a window or mirror over and opening in the sensor body and the adjoining component stack.
  • Method 600 proceeds at 606 with heating the frit, the at least one component stack, and the sensor body such that the frit melts.
  • a fixture that secures the component stacks to the sensor body is passed through an oven that gradually heats frit on the sensor body and component stacks to a frit melting temperature.
  • the oven heats the frit to 420° Celsius).
  • the frit will melt and bond to the adjoining surfaces.
  • Method 600 proceeds at 608 with cooling the frit, the at least one component stack, and the sensor body such that the component stack is secured to the sensor body.
  • the sensor body and component stack within the fixture is gradually cooled to prevent the sensor body and components from cracking due to a rapid temperature change. When the frit cools, the component stack will be rigidly bonded to the sensor body. And the sensor body and connected component stack can be removed from the fixture.
  • Example 1 includes a sensor device, the device comprising a sensor body, the sensor body comprising a cavity, wherein the sensor body comprises at least one opening in the body providing access to the cavity; and at least one component stack mounted to the sensor body over the at least one opening using a frit, wherein the component stack comprises a plurality of components that are attached to one another with the frit.
  • Example 2 includes the device of Example 1, wherein the at least one opening further comprises at least one optical element attached to the at least one opening, wherein the at least one optical element is attached to the sensor body with the frit such that the frit hermetically seals the cavity within the sensor body.
  • Example 3 includes the device of Example 2, wherein the component stack is mounted to the at least one optical element by the frit.
  • Example 4 includes the device of any of Examples 1-3, wherein the plurality of components comprises at least one of an optical component, a structural support, a sensor, or an electronics device.
  • Example 5 includes the device of any of Examples 1-4, wherein the component stack is mounted to the sensor body with a frit seal such that the frit seal between the component stack and the sensor body hermetically seals the cavity within the sensor body.
  • Example 6 includes the device of any of Examples 1-5, wherein the sensor device comprises at least one of an atomic clock; and a ring laser gyroscope.
  • Example 7 includes the device of any of Examples 1-6, wherein the plurality of components in the component stack are hermetically sealed to one another.
  • Example 8 includes a method for fabricating a sensor device, the method comprising securing at least one component stack on a sensor body over at least one opening in the sensor body, wherein the at least one component stack comprises a plurality of components; applying a frit to the plurality of components in the at least one component stack and the sensor body; heating the frit, the at least one component stack, and the sensor body such that the frit melts; and cooling the frit, the at least one component stack, and the sensor body such that the at least one component stack is secured to the sensor body.
  • Example 9 includes the method of Example 8, wherein the at least one component stack is secured to the sensor body using a fixture, wherein a fixture comprises a device that securely maintains the at least one component stack and the sensor body at fixed positions in relation to one another.
  • Example 10 includes the method of Example 9, wherein the fixture comprises at least one plunger to secure the at least one component stack to the sensor body.
  • Example 11 includes the method of any of Examples 9-10, further comprising separating the sensor body and the at least one component stack from the fixture.
  • Example 12 includes the method of any of Examples 8-11, wherein securing the at least one component stack on the sensor body further comprises placing at least one optical element over the at least one light reception opening; placing the at least one component stack on the at least one optical element; and securing the at least one component stack and the at least one optical element to the sensor body.
  • Example 13 includes the method of Example 12, wherein the at least one optical element comprises at least one of either a mirror or a window, the method further comprising applying the frit around the at least one optical element such that the frit will form a hermetic seal around the at least one opening when the frit is heated and cooled.
  • Example 14 includes the method of any of Examples 8-13, wherein the frit applied to the plurality of components and the sensor body is applied such that the frit will form a hermetic seal around the at least one opening when the frit is heated and cooled.
  • Example 15 includes the method of any of Examples 8-14, wherein heating the frit, the at least one component stack, and the sensor body comprises gradually heating the frit, the at least one component stack, and the sensor body to a frit melting temperature.
  • Example 16 includes a system for providing a reference frequency, the system comprising: an atomic clock, the atomic clock configured to produce a reference frequency signal, wherein the atomic clock comprises: a clock body comprising a cavity, wherein light is introduced into the cavity through a plurality of openings in the clock body; and a plurality of component stacks mounted to the sensor body over the at least one opening using a glass frit, wherein a component stack comprises a plurality of optical components that are attached to one another with frit, wherein the optical components control light before it enters the cavity and after it leaves the cavity.
  • Example 17 includes the system of Example 16, wherein a first component stack in the plurality of component stacks comprises components that adjust a received light beam before the light beam enters the cavity.
  • Example 18 includes the system of Example 17, wherein a component in the first component stack splits the received light beam into a first part and second part, wherein the second part is reflected into a second component stack in the plurality of component stacks.
  • Example 19 includes the system of Example 18, wherein the first component stack and the second component stack are positioned on the clock body such that the first part and the second part of the light beam are orthogonal to one another when the first part and the second part of the light beam enter the cavity.
  • Example 20 includes the system of any of Examples 16-19, wherein the plurality of optical components in a respective component stack in the plurality of component stacks are hermetically sealed to one another.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Gyroscopes (AREA)
EP12193298.2A 2012-11-19 2012-11-19 Systèmes et procédés pour composants montés par frittage externe Active EP2733553B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP12193298.2A EP2733553B1 (fr) 2012-11-19 2012-11-19 Systèmes et procédés pour composants montés par frittage externe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP12193298.2A EP2733553B1 (fr) 2012-11-19 2012-11-19 Systèmes et procédés pour composants montés par frittage externe

Publications (2)

Publication Number Publication Date
EP2733553A1 true EP2733553A1 (fr) 2014-05-21
EP2733553B1 EP2733553B1 (fr) 2020-07-08

Family

ID=47602801

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12193298.2A Active EP2733553B1 (fr) 2012-11-19 2012-11-19 Systèmes et procédés pour composants montés par frittage externe

Country Status (1)

Country Link
EP (1) EP2733553B1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2952489A1 (fr) * 2014-06-04 2015-12-09 Honeywell International Inc. Capteur et procédés pour la fabrication d'un capteur comprenant un revêtement de protection pour vitrocéramique

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61144613A (ja) * 1984-12-18 1986-07-02 Fujitsu Ltd 光学部品の固着方法
DE3830149A1 (de) * 1988-09-05 1990-03-15 Siemens Ag Optische linse zum hermetischen dichten verschliessen von gehaeusen
US6837075B1 (en) * 2000-10-27 2005-01-04 Bookham Technology, Plc. Glass fiber fixative and fixing process
WO2009025893A2 (fr) * 2007-05-18 2009-02-26 The Regents Of The University Of Colorado, A Body Corporate Systèmes de matière ultra-froide
EP2154585A2 (fr) * 2008-08-11 2010-02-17 Honeywell International Conception d'une uniité physique pour une horloge atomique à atomes refroidis

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9285249B2 (en) * 2012-10-04 2016-03-15 Honeywell International Inc. Atomic sensor physics package with metal frame

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61144613A (ja) * 1984-12-18 1986-07-02 Fujitsu Ltd 光学部品の固着方法
DE3830149A1 (de) * 1988-09-05 1990-03-15 Siemens Ag Optische linse zum hermetischen dichten verschliessen von gehaeusen
US6837075B1 (en) * 2000-10-27 2005-01-04 Bookham Technology, Plc. Glass fiber fixative and fixing process
WO2009025893A2 (fr) * 2007-05-18 2009-02-26 The Regents Of The University Of Colorado, A Body Corporate Systèmes de matière ultra-froide
EP2154585A2 (fr) * 2008-08-11 2010-02-17 Honeywell International Conception d'une uniité physique pour une horloge atomique à atomes refroidis

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2952489A1 (fr) * 2014-06-04 2015-12-09 Honeywell International Inc. Capteur et procédés pour la fabrication d'un capteur comprenant un revêtement de protection pour vitrocéramique

Also Published As

Publication number Publication date
EP2733553B1 (fr) 2020-07-08

Similar Documents

Publication Publication Date Title
US8854146B2 (en) Systems and methods for external frit mounted components
US8526000B1 (en) Atomic sensor physics package with integrated transmissive and reflective portions along light paths
EP3502761B1 (fr) Unité de source de lumière
US9429496B2 (en) Optical time domain reflectometer in a small form factor package
JP3866585B2 (ja) フィルタモジュールの製造方法
EP2733553B1 (fr) Systèmes et procédés pour composants montés par frittage externe
JP2016095224A (ja) 慣性センサーの製造方法および慣性センサー
RU2728847C1 (ru) Телескоп с упрощенным монтажом
US8829423B2 (en) Folded optics for batch fabricated atomic sensor
JP2007193270A (ja) レンズ付きキャップ及びその製造方法
US6965553B2 (en) Light emitting module, optical detecting module, optical pickup apparatus and manufacturing methods thereof
US5016965A (en) Optical package
JP2017152553A (ja) 電子部品収容容器および電子部品収容容器の製造方法
CN208887646U (zh) 光纤陀螺仪用光学集成模块、光学组件和光纤陀螺仪
US20170276871A1 (en) Bonding method, method of producing optical module, and optical module
JP2000275490A (ja) 光軸補正装置および光軸補正装置製造方法
Topart et al. Heterogeneous MEMS device assembly and integration
Gilbert et al. TBIRD, a rapid prototyping approach for design, assembly, and test of a LEO-to-ground lasercom CubeSat
JP2018120977A (ja) 原子セル、量子干渉装置、原子発振器、電子機器および移動体
Gimbert et al. Focal plane assembly demonstrator for two-way laser communication link
JP4300221B2 (ja) フィルタモジュール
CN116171397A (zh) 光学系统、激光雷达传感器和用于制造光学系统的方法
EP3049846B1 (fr) Cellules à liaison anodique dotées d'éléments optiques
JP2003098481A (ja) レンズ付きアイソレータとその製造方法およびこれを用いた光モジュール
JPH07119857B2 (ja) 半導体レーザモジュール及びその位置合わせ方法

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20121119

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: HONEYWELL INTERNATIONAL INC.

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20200316

RIN1 Information on inventor provided before grant (corrected)

Inventor name: SMITH, DELMER L.

Inventor name: STARK, TERRY DEAN

Inventor name: STRABLEY, JENNIFER S.

Inventor name: SCHOBER, CHRISTINA MARIE

Inventor name: SALIT, KENNETH

Inventor name: FRITZ, BERNARD

Inventor name: VESCERA, JAMES A.

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1289113

Country of ref document: AT

Kind code of ref document: T

Effective date: 20200715

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602012071105

Country of ref document: DE

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 1289113

Country of ref document: AT

Kind code of ref document: T

Effective date: 20200708

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20200708

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201009

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201008

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201008

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201109

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201108

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602012071105

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 602012071105

Country of ref document: DE

26N No opposition filed

Effective date: 20210409

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201119

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20201130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201130

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201119

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210601

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200708

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201130

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230525

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20231121

Year of fee payment: 12

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20231123

Year of fee payment: 12