Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
  • H10K59/80—Constructional details
  • H10K59/87—Passivation; Containers; Encapsulations
  • H10K59/871—Self-supporting sealing arrangements
  • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
  • H10K59/80—Constructional details
  • H10K59/805—Electrodes
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K50/00—Organic light-emitting devices
  • H10K50/80—Constructional details
  • H10K50/805—Electrodes
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K50/00—Organic light-emitting devices
  • H10K50/80—Constructional details
  • H10K50/84—Passivation; Containers; Encapsulations
  • H10K50/841—Self-supporting sealing arrangements
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K50/00—Organic light-emitting devices
  • H10K50/80—Constructional details
  • H10K50/84—Passivation; Containers; Encapsulations
  • H10K50/842—Containers
  • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/484—Connecting portions
  • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
  • H01L2224/732—Location after the connecting process
  • H01L2224/73251—Location after the connecting process on different surfaces
  • H01L2224/73265—Layer and wire connectors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/10—Details of semiconductor or other solid state devices to be connected
  • H01L2924/11—Device type
  • H01L2924/12—Passive devices, e.g. 2 terminal devices
  • H01L2924/1204—Optical Diode
  • H01L2924/12044—OLED

Definitions

• the technical field of the invention is that of organic light-emitting diodes, DELOs.
• the invention will find its application particularly in the field of lighting using OLEs large sizes.
• the charge carriers pair in an emission layer comprising organic emitters, also called organic layer, to form excitons. Radiative recombination allows the emission of light.
• the organic layer allows such light emission, it nevertheless has poor resistance to contact with water or oxygen.
• Contact of the organic layer with water or oxygen produces a oxidation and results in loss of chemical properties and electroluminescent properties.
• the life of an OLED is thus directly related to the quality of an encapsulation needed to protect it from contact with water and oxygen.
• the maximum water permeation rate, or oxygen permissible, in an OLED is 10 -6 g / (m 2 ⁇ day-atmosphere), respectively 10 -4 cc / (m 2 ⁇ day-day atmosphere).
• US 2005/0242721 discloses a OLED provided with a cover and a connector passage through the cover. However, this construction does not optimize the formation of a seal
• a means of accessing the electrodes of a DEO is sought while providing encapsulation effectively protecting the organic layer against contact with water and / or oxygen.
• An object of the present invention is an organic light-emitting diode, OLED, comprising a stack comprising successively and in order a substrate, a first electrode, such as an anode, an organic layer, a second electrode, such as a cathode, a layer of adhesive and a cover fixed on said stack by means of said adhesive layer, wherein the cover comprises at least one through opening allowing electrical access to an electrode through said opening.
• the nature of the hood material and the dimensions of the opening are selected so as to produce a surprising effect by which the adhesive layer does not spread, at least not completely, to the right of the opening.
• the latter thus always offers access optimized for electrical connection of at least one electrode. Such a result is excluded in the prior art.
• the cover is made of glass or metal.
• the hood is flat.
• the cover is transparent. According to another characteristic of the invention, the cover comprises at least a first opening allowing electrical access to an electrode and at least a second opening allowing electrical access to a second electrode.
• the first electrode comprises an overflowing portion projecting laterally from the organic layer.
• At least one opening is made to the right of the protruding portion of the first electrode.
• At least one opening is made to the right of a border of the first electrode.
• the second electrode comprises an overflowing portion protruding laterally from the organic layer.
• At least one opening is made to the right of the protruding portion of the second electrode.
• At least one second opening is made in line with a border of the second electrode.
• the smallest dimension of an opening (in section in a direction transverse to the thickness of the stack of layers) is at least 0.4 mm, more precisely, an opening has a width of at least 0.4mm.
• At least one opening comprises at least partially glue, preferably only partially.
• an opening is at least 4 mm distant from another opening.
• the width of an opening is at least 1000 times greater than the thickness of the stack comprising the first electrode, the organic layer, the second electrode, and the adhesive layer.
• an opening is at least 2 mm apart from the organic layer.
• the first electrode and the second electrode respectively comprise electrical contact means intended to allow an electrical connection.
• the at least one opening is made to the right of the electrical contact means.
• the adhesive layer is continuous over the entire surface of the OLED with the exception of the openings.
• the adhesive layer is interrupted at the right of each of the openings.
• the cover covers the entire surface of the OLED.
• the OLED comprises a polyurethane coating arranged over the hood
• the smallest dimension of the OLED is at least one centimeter preferentially greater than 5 centimeters.
• the invention also relates to a method for manufacturing an organic light-emitting diode, OLED, comprising a stack comprising successively and in order a substrate, a first electrode, such as an anode, an organic layer, a second electrode, such as a cathode , an adhesive layer and a cover fixed on said stack by means of said adhesive layer, the cover comprises at least one through opening allowing electrical access to an electrode through said opening, comprising the following steps: minus a through opening in the cover, allowing electrical access to an electrode through said opening, making a layer of adhesive on the cover, placing the cover over the second electrode of said stack, pressing the cover on said stack configured so that movement of the adhesive between the cover and the second electrode at least partially preserves access to at least one electrode through the opening.
• the production of an adhesive layer is carried out by depositing on an internal face of the cover.
• At least one opening is made to the right of the electrical contact means with an electrode.
• the pressing step is carried out by applying a minimum pressure of 100 mm to the assembly, so as to obtain a neck of less than 20 mm. micrometers.
• the method comprises a step of depositing a polymer coating on the hood
• the invention also relates to a lighting device comprising at least one OLED as described above.
• the invention also relates to a lamp comprising at least one OLED as described above.
• Figure 1 shows a partial sectional view in the thickness of an OLED at an opening 8a.
• Figure 2 shows a partial sectional view in the thickness of an OLED at an opening 8d.
• FIG. 3 shows a top view of a DELOs plate
• FIG. 4 shows a view from above of a hood according to the invention adapted to the DELOs of FIG. 3,
• FIG. 5 shows a view from above of the assembly of said cover on said OLED plate
• FIG. 6 presents a flowchart of a method for manufacturing an OLED
• FIG. 7 illustrates an embodiment of an electrical connection.
• the OLED according to the invention is intended to be used in the field of domestic, industrial or urban lighting for example in lamps.
• the OLED has dimensions greater than one centimeter, preferably of the order of a few tens of centimeters.
• FIG. 1 illustrates an organic light-emitting diode, OLED, in partial view in section along the thickness at an opening 8a.
• a DELO 1 comprises an ordered succession of layers forming a stack. Said stack comprises successively and in order, from bottom to top in FIG. 1: a substrate 2, a first electrode 3, an organic layer 4, a second electrode 5.
• the first electrode 3 is an anode 3, as the second electrode 5 is a cathode 5.
• a layer of glue 6 and a cover 7 fixed to stack it by means of this layer of neck 6.
• the first electrode 3 extends beyond the stack.
• the electrode 3 protrudes from the organic layer 4 laterally.
• the second electrode 5 at least partially covers the organic layer 4 preferentially, the electrode 5 covers the totality of the surface of the organic layer 4 without being in contact with the electrode 3 because it creates a short circuit.
• the second electrode 5 extends beyond the organic layer 4 as illustrated in FIG.
• the second electrode 5 protrudes laterally from the stack. The protruding portion of the second electrode 5 and the projecting portion of the first electrode 3 are not superimposed and are not in contact at the risk of forming a short circuit.
• the substrate 2 is typically a flat plate made of transparent material, for example glass.
• the two electrodes 3, 5, anode 3 and cathode 5, are electrically conductive layers typically made of metallic materials.
• the anode 3 this can be made of indium tin oxide (ITO).
• ITO indium tin oxide
• This material has electrical conductivity properties and optical transparency of interest for the manufacture of OLED.
• the organic layer 4 comprises one or more sublayers contributing to a pairing of the charge carriers within an emission sub-layer in order to achieve a radiative recombination which allows light emission, object of the OLED.
• Said OLED is encapsulated on one side by the substrate 2 which forms a continuous plate forming a closed protection. On the other side, the encapsulation is obtained by a cover 7 and an adhesive layer 6 which allows the attachment of said cover 7 on the stack.
• the cover 7 is an example of glass, plastic or metal.
• the cover 7 is transparent or opaque.
• the cover 7 is preferably flat.
• the cover 7 advantageously has at least the same dimensions as the OLED to encapsulate.
• the OLED is preferably rigid.
• the anode 3 and the cathode 5 must be electrically connected to a power supply in order to provide said charge carriers.
• This electrical contact is typically made by an electrical conductor, such as a wire, coming from outside the cover 7 and connected to the electrode 3, 5.
• an electrical conductor such as a wire
• the cover 7 comprises at least one through opening 8.
• This opening 8 traversing the entire thickness of the cover 7, allows electrical access to an electrode 3, 5.
• the electrical conductor can pass through the cover 7 through said opening 8.
• the OLED according to the invention is particularly surprising because the formation of a rigid cover, glass or metal having openings 8 would not have been considered by the skilled person for whom this assembly would have been too fragile. However, it has been found that the OLED according to the invention was particularly resistant to breakage.
• the thickness of the cover 7 is 700 microns minimum and therefore remains rigid after assembly with the adhesive layer.
• the substrate 2 also has a thickness of 700 microns minium so as to have a rigidity and a satisfactory resistance to breakage.
• the openings 8 can take various forms, for example a circle or a parallelepiped.
• the electrodes 3,5 com take means of electrical contact 3a, 3b, 5a.
• These electrical contact means 3a, 3b, 5a are formed at the electrode 3, 5 and allow the electrical connection.
• the contact means 3a, 3b are preferably formed at the protruding portion of the electrode 3 and the contact means 5a are preferably formed at the protruding portion of the electrode 5.
• the opening 8 is made to the right of the electrical contact means 3a, 3b, 5a of an electrode 3, 5. This allows, however, a significant latitude for locating the openings 8.
• An opening 8 is made by any means of manufacture.
• a laser machining is used to form the openings 8 in the cover 7.
• the cover can be formed with the openings 8 prior to the OLED assembly line.
• At least one opening 8 allows access to the anode 3, and at least one opening 8 allows access to the cathode 5.
• access to the two electrodes 3 and 8 is made on the same side of the OLED and advantageously through the cover 7. This arrangement facilitates the manufacture of OLED.
• the at least one aperture 8a is arranged so as to be at the right side of the screen. rod 5, preferably to the right of the projecting portion of the second electrode 5. More precisely, the opening is at the right of a border of said electrode 5. This arrangement facilitates the encapsulation by glue and the evacuation excess glue in the opening 8a without obstructing it.
• the opening 8d is arranged to be at the right of the electrode 3, preferably the overflowing portion of the said electrode 3. More precisely, the opening is at the right of a border of said electrode 3.
• FIG. 3 illustrates, in plan view, a plate comprising a substrate
• the contact means 3a, 3b of the anode 3 and 5a of the cathode 5 are advantageously large areas.
• the contact means 3a, 3b, 5a are preferably made by a metal layer deposition by thermal evaporation of 1 micron maximum.
• FIG. 4 illustrates, in plan view, a cover 7 adapted to the plate of
• Said cover 7 comprises openings 8, divided into two openings 8c, 8d which allow access to two anode contact means 3a, 3b and two openings 8a, 8b which provide access to cathode contact means 5, in two separate places.
• FIG. 5 illustrates the cover 7 of FIG. 3 superimposed in the assembly position with the OLED plate of FIG. 2. This superposition shows that the openings 8a-8d are superimposed with the contacts 3a, 3b, 5a.
• the cover 7 is plane. This greatly simplifies the production of both the hood 7 and OLED 1.
• the adhesive layer 6 advantageously makes it possible to absorb any differences in the level of the layers on which the cover 7 is bonded. This makes it possible to obtain good encapsulation at the best cost.
• the cover 7 is transparent. This transparency characteristic advantageously allows the light produced within the organic layer to be extracted outwards, in accordance with the function of the OLED.
• the cover 7 covers the entire surface of OLED 1.
• the cover 7 reinforces, in collaboration with the substrate 2, the structure of the plate, and confer, in addition to encapsulation, a good mechanical resistance to the OLED plate.
• the cover 7 / glue 6 / substrate 2 assembly is mechanically strong and uniform facilitating secure cutting limiting the risk of breakage.
• an opening 8 is preferably formed at a distance of at least 4 mm from any other opening 8 adjacent. This distance is measured in the plane of the hood 7 of OLED 1.
• An opening 8 is preferably disposed on the cover 7 at a distance from the organic layer 4 sufficient to prevent, or at least strongly reduce, any penetration of water and / or oxygen from the opening 8 to the organic layer 4.
• a distance of at least 2 mm is sufficient. This distance is measured in the plane of the hood 7 of OLED 1. The greater the distance between the outside and the organic layer 4, the greater the diffusion of the water and oxygen molecules to the organic layer 4 is long.
• an opening 8 is configured to allow the only passage of an electrical conductor while ensuring a seal of the OLED. Said dimension is advantageously reduced, in order to limit the risk of creating an entry door for water and / or oxygen.
• the openings can be significant because the adhesive 6 forms a satisfactory barrier to the introduction of water and oxygen.
• an opening 8 has a minimum dimension of 0.4 mm, more precisely a width of at least 0.4 mm, for example for a circle with a diameter of 0.4 mm.
• the smallest extent of the opening 8 is at least 0.4 mm.
• an opening 8a, 8d has a length of 15 mm and a width of 3 mm.
• the electrical contact means 3a, 3b, 5a with an electrode is large in front of the size of an opening 8 necessary to ensure the passage of an electrical conductor. This feature advantageously allows a large latitude of position réelle openings 8, according to the needs and constraints of integration of OLEs.
• the invention further relates to a method of manufacturing an OLED.
• Such a method comprises the following sequence of following steps. Such a method is illustrated by the scheme of FIG. 6.
• a first step consists in producing a stack comprising successively and in order: a substrate 2, a first electrode 3, such as an anode, an organic layer 4, a second electrode 5, such as a cathode.
• a first electrode 3 such as an anode
• an organic layer 4 such as an organic layer 4
• a second electrode 5 such as a cathode.
• one or more desired openings 8 are formed, during a forming step 1 1 in a cover 7 adapted to said stack. Each opening 8 is arranged to allow electrical access to an electrode 3, 5.
• openings 8 are made in a cover 7 after its bonding, or openings 8 according to the invention are made in the cover 7, before its bonding.
• the adhesive layer 6 can be made 12. Said layer is obtained by spreading glue on the surface and can be carried out by any known means. Thus, the deposition of the adhesive can be carried out for example by spraying, rolling, spin coating, brushing, etc.
• the adhesive is typically an epoxy or acrylate glue and has a viscosity of between 10 mPa.s and 10,000 mPa.s.
• the glue deposit 12 can be made optionally on the stack or on the inner face, facing the stack, of the cap 7.
• the deposition of the glue layer is preferably carried out on the already drilled cap 7, plus precisely on a face intended to be facing the stack, more precisely facing the second electrode 5, referred to as the inner face of the cap 7.
• the face or above the second electrode is meant that the adhesive layer and / or the bonnet are arranged on the free side of the stack opposite the substrate 2.
• the adhesive layer covers in particular the second electrode 5 but also the first electrode 3 in the embodiment with an overflowing portion.
• the glue has such a fluidity in view of the large size of the openings 8 that the deposited or sprayed glue flows through the openings 8. There is no glue on the cover 7 to the right openings 8 during assembly.
• the adhesive layer 6 is thus automatically interrupted to the right of each of the openings 8. This is obtained without recourse to any savings, only because the openings 8 are made before the deposition of the glue.
• the invention advantageously allows any form of OLED since the openings 8 are not limiting.
• a better production yield is achieved because the voltage drops are limited, the thermal distribution is optimized, the luminous homogeneity is improved.
• the adhesive is chosen from adhesives for full plate encapsulation, for example epoxy or acrylate adhesives.
• the adhesive 6 is advantageously chosen to withstand OLED operating temperatures which may be of the order of 90 ° C. That is, the glue does not lose these sealing properties.
• the quantity of adhesive required is determined as a function of the viscosity of the adhesive and as a function of the desired thickness of the adhesive layer 6, after the pressing step 14.
• the cover 7 can be put in place 13, on the stack, preferably on the second electrode 5.
• the glue 6 is crushed. It follows advantageously that the glue 6 thus crushed follows the edges of the openings 8.
• the openings 8 are of sufficient size relative to the dimensions of the contact means 3a, 3b, 5a and properties of the glue for that during pressing the excess glue is evacuated at least partially through the openings 8 without obstructing them.
• the adhesive 6 represents a maximum of 20% of the area of the opening 8, more preferably less than 10%.
• the smallest dimension of u is open 8, more precisely its width is at least 100 times greater than the thickness of the stack comprising only the first electrode 3, the organic layer 4, the second electrode 5. More preferably, the aspect ratio is at least 1000.
• such a stack has a thickness of the order of 300 to 400 nm whereas an opening 8 has a minimum width of 0, 4mm.
• the glue 6 does not spread over the electrical contact means 3a, 3b, 5a with the electrodes 3, 5. The encapsulation obtained is thus perfectly achieved, at the same time that the electrical contact means are spared and do not receive not or only partially glue.
• the pressing step 1 4 is performed by applying a minimum pressure of 100 mbar on the assembly. This combined with a suitable thickness of glue between 1 0 ⁇ and 500 ⁇ , perm and o bte n i r u n e co u ch e of 6 d co nd e s pa e s preferably less than 20 micrometers.
• a UV treatment is realisé after the pressing step to crosslink the glue 6.
• An opening 8 made according to the invention allows electrically access to the contact means 3a, 3b, 5a, an electrode 3, 5.
• electrically conductive glue 15 allows to fix a pellet 16, for example copper.
• a conductor wire 18 may be soldered by means of, for example, tin 17.
• the electrical contact does not advantageously clog the opening 8.
• the opening 8 is then only partially obstructed by the electrical contact.
• the openings 8 for access to the electrodes 3-5 remain open after placement of the electrical contact.
• the DELO 1 comprises a polymer coating, preferably polyurethane disposed over the cover 7 and preferably once the electrical contacts made.
• This polymer coating is advantageously flexible. According to a preferred possibility, this coating is deposited on the hood by spraying, rolling, spin coating, brushing, etc.
• the coating improves the strength of the hood 7 to breakage.
• the coating is advantageously configured to flatten the surface of the DELO 1 above the cover 7.
• the coating thus forms a flat layer above the cover 7 including above the openings 8.
• the coating fills the openings 8 to smooth OLED.
• the coating is configured not to penetrate the openings 8; the coating remains on the surface of the openings 8 substantially at the plane of the cover 7.
• the thickness of the coating is such that it allows to encase the electrical contacts more particularly the conductive wire 18 so as to flatten the surface of the OLED.
• the coating layer may be transparent or opaque. In the case of a transparent coating, the light emission may be through this coating layer.

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• Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Electroluminescent Light Sources (AREA)

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• 2011
  • 2011-06-17 FR FR1155353A patent/FR2976730B1/fr active Active
• 2012
  • 2012-06-15 EP EP12730857.5A patent/EP2721659A1/de not_active Withdrawn
  • 2012-06-15 US US14/127,005 patent/US9515293B2/en not_active Expired - Fee Related
  • 2012-06-15 WO PCT/EP2012/061460 patent/WO2012172059A1/fr active Application Filing
  • 2012-06-15 CN CN201280029790.5A patent/CN103797603B/zh not_active Expired - Fee Related
  • 2012-06-15 KR KR1020147001390A patent/KR20140048208A/ko not_active Application Discontinuation

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