EP2713132A1 - Appareil de transfert de chaleur par évaporation - Google Patents

Appareil de transfert de chaleur par évaporation Download PDF

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Publication number
EP2713132A1
EP2713132A1 EP12306167.3A EP12306167A EP2713132A1 EP 2713132 A1 EP2713132 A1 EP 2713132A1 EP 12306167 A EP12306167 A EP 12306167A EP 2713132 A1 EP2713132 A1 EP 2713132A1
Authority
EP
European Patent Office
Prior art keywords
vapor chamber
heat
vapor
heat sink
thermally conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12306167.3A
Other languages
German (de)
English (en)
Inventor
Roger Scott Kempers
Simon Kerslake
Lucius Chidi Akalanne
Todd Richard Salamon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent SAS
Original Assignee
Alcatel Lucent SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Lucent SAS filed Critical Alcatel Lucent SAS
Priority to EP12306167.3A priority Critical patent/EP2713132A1/fr
Priority to US13/742,582 priority patent/US20140083653A1/en
Publication of EP2713132A1 publication Critical patent/EP2713132A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/04—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by preventing the formation of continuous films of condensate on heat-exchange surfaces, e.g. by promoting droplet formation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • F28F21/065—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material the heat-exchange apparatus employing plate-like or laminated conduits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/06—Hollow fins; fins with internal circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2225/00—Reinforcing means
    • F28F2225/04—Reinforcing means for conduits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2245/00—Coatings; Surface treatments
    • F28F2245/02—Coatings; Surface treatments hydrophilic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2245/00—Coatings; Surface treatments
    • F28F2245/04—Coatings; Surface treatments hydrophobic

Definitions

  • Vapor chambers and heat sinks are used in structures employed for cooling electronically operated devices.
  • a vapor chamber is a closed structure having an empty space inside within which a liquid is provided.
  • Vapor chambers are typically passive, two-phase (liquid-vapor) heat transport loops that are used to spread heat from relatively small, high heat-flux sources to a region of larger area where the heat can be transferred elsewhere at a significantly lower heat-flux.
  • Heat sinks are widely known in the related art. In a typical heat sink in operation, heat is conducted from the base of the heat sink to an array of extended surfaces (so-called fins) where it is ultimately transferred to the surrounding air.
  • heat is conducted from a heat source to a heat sink through an evacuated chamber containing a working fluid such that the internal pressure of the chamber is at the saturated vapor pressure of the working fluid.
  • the working fluid evaporates or boils as a consequence of receiving heat from the heat source and then re-condenses on the colder (typically upper) regions of the chamber at a nearly identical temperature (i.e . the corresponding saturation temperature).
  • the condensate liquid is caused to flow back, often assisted by gravity, in proximity of the heat source inside the chamber.
  • a wicking structure is incorporated into the evaporator (vapor-generating) side of the vapor chamber which may serve to enhance the liquid flow back to the heat source for re-evaporation.
  • the net effect is efficient heat transport from the evaporator section of the vapor chamber to the condenser section of the vapor chamber; this is due to the convective transport of the vapor, and results in a very large effective vapor chamber thermal conductivity, often 10 to 100 times that of copper.
  • the low heat flux side of vapor chambers are coupled to a heat sink in order to more effectively reject the heat to a surrounding fluid medium (usually air) via convection (either natural or forced).
  • vapor chambers and heat sink effectiveness may be increased is by making the devices larger in size which may have the effect of both lowering the heat sink thermal resistance and serve to increase the surface area for conduction or convection at the free surfaces. However this may result in larger and heavier devices causing a significant drawback.
  • Another approach may be to use a higher conductivity metal (e.g. copper, gold or silver), however typically, higher-conductivity materials correspond to both higher density (increased weight) and greater cost.
  • the vapor-based heat transfer apparatus may be a vapor chamber or a vapor chamber heat sink, or a heat pipe.
  • Some embodiments of the present disclosure relate to a vapor-based heat transfer apparatus using a thermally conductive polymer as the solid enclosure thereof.
  • the inventors have realized that the heat spreading and corresponding high thermal effectiveness of these devices are primarily due to the vaporization and condensation of the working fluid occurring internally. Therefore, the thermal conductivity of the outer enclosure may play a relatively minor role on the overall system performance. Furthermore, by using a relatively thin and thermally conductive polymer, good thermal performance can still be achieved while minimizing weight ( e.g. as opposed to using metals).
  • thermally conductive polymer is to be understood as a polymer matrix loaded with conductive particle filler materials in order to improve the overall bulk thermal conductivity of the base polymer.
  • thermally conductive polymers include but are not limited to polymers such as liquid crystaline polymers (LCP), polyamides, polycarbonate, polypropolene, polyphthalamide, polyphenylene Sulfides or thermoplastic elastomers.
  • Filler particles may include, but are not limited to, a range of metal or ceramic particles such as aluminium oxide, boron nitride, silver or variations of carbon-based graphite or graphene particles.
  • a vapor-based heat transfer apparatus comprising a hollow structure and a working liquid within the hollow structure, wherein the structure is made of a thermally conductive polymer.
  • the apparatus comprises a vapor chamber.
  • the apparatus comprises a vapor chamber and a heat sink such that the at least a portion of the heat sink comprises a conductive polymer material.
  • FIG. 1a exemplary schematic representations of a vapor chamber according to some embodiments of the disclosure are provided where the vapor chamber is shown assembled together with a heat sink.
  • the assembly 100 of figure 1a comprises a vapor chamber 110 and a heat sink 120.
  • the vapor chamber 110 comprises a structure comprising walls 111, 112, 113 and 114 (111-114).
  • the walls 111-114 define an enclosed space 115 which is hollow. Inside the hollow space 115 a working liquid 116 is provided.
  • the working liquid may be for example water, acetone, methanol, ammonia or any number of refrigerants or liquid salts or liquid metals, depending on desired operating characteristics.
  • the vapor chamber 110 is made of thermally conductive polymer.
  • the heat sink 120 comprises an array of extending bodies, or fins, 121 which serve for transporting heat away from the vapor chamber and dissipating the heat in the surrounding ambient, which may be air.
  • FIG. 1b illustrates in further detail, a portion - represented by reference R - of the assembly of figure 1a in heat transferring operation.
  • FIG 1b like elements have been given like reference numerals as those of figure 1a .
  • the heat source 130 is shown in thermal contact with the vapor chamber 110. In operation, heat is transferred from the heat source 130 to the vapor chamber 110 through the wall 111 of the vapor chamber as schematically shown by arrows A.
  • the heat received by the vapor chamber 110 causes the liquid 116 inside the vapor chamber to evaporate and the vapor may then move toward another (e.g. upper) wall 113 of the vapor chamber 110 as schematically shown by arrows B.
  • the vapor condenses on the surface 117 of the wall 113 and is converted back to liquid. Heat is thereby transferred from the wall 113 of the vapor chamber to the heat sink120 as shown by arrows C which in turn is dissipated to the ambient using fins 121.
  • the liquid returns back to the side adjacent to the heat source 130 in order to undergo another evaporation-condensation cycle as described above.
  • the material of the vapor chamber is made of a thermally conductive polymer, heat is effectively and satisfactorily transferred from the heat source to the vapor chamber and also from the vapor chamber to the heat sink. In this manner, the thermal effectiveness of the devices is ensured by the vaporization and condensation of the working fluid occurring inside the vapor chamber while the weight of the device is maintained low as compared to known solutions where metal is typically used.
  • the contribution of the solid phase thermal conductivity has little effect on the thermal performance of the vapor chamber or the vapor chamber and heat sink as a whole due to the highly effective heat transport of the vapor chamber region.
  • the level of heat transfer may vary from low heat flux regions (e.g., the condenser section) to high heat flux regions (e.g., near the heat source), it may be possible to select design parameters and materials such that the overall heat transfer response of the device meets the specific requirements of a particular application.
  • a reasonably thermally conductive polymer material may be suitable for heat transfer, as the thermal resistance across such a material would not generate too large of a temperature drop due to the low heat flux.
  • the use of some metal may be appropriate to contribute to improving the heat transfer.
  • thermally conductive polymer that presents a thermal conductivity of 1/20 of that of a metal (e.g. copper) would have a similar temperature drop across both the evaporator and condenser walls.
  • Figures 2a and 2b are exemplary schematic representations of a vapor chamber heat sink according to some embodiments of the disclosure.
  • like elements have been given like reference numeral as those of figures 1a and 1b .
  • figure 2b shows in further detail a portion R of the assembly of figure 2a .
  • the structure and the mode of operation of the assembly shown in figures 2a and 2b are in many aspects similar to those of the example of figures 1a and 1b , with a difference that in the example of figures 2a and 2b , the vapor chamber 110 is integrated into the base 120a of the heat sink 120.
  • the fins 121 of the heat sink 120 are hollow thereby providing additional internal space 115a for the vapor and therefore additional surface for liquid condensation thereby improving heat transfer.
  • This option therefore has the advantage of allowing for an enhanced spreading of the heat, which may include the body of the vapor chamber 110 (similar to the example of figures 1a and 1b ) as well as the entire domain of extended surfaces of the fins 121 of the heat sink 120.
  • the working fluid 116 is allowed to re-condense the full (or any available) length and height of each fin (or pin or any other extended surface used for heat dissipation). Furthermore, this approach allows for effectively removing or at least reducing the contribution of fin thermal resistance (which can be considerable) to the total resistance of the heat sink and making the entire heat sink a contiguous vapor chamber.
  • this vapor chamber or vapor chamber heat sink may be made thin, for example less than about 1 mm, to limit their possible contribution to the thermal resistance of the device and to allow adequate internal space for the condensate to flow.
  • this embodiment may also allow for the construction of the vapor chamber and the vapor chamber and heat sink using an injection molded high-conductivity plastic and thus encompasses similar advantages.
  • the embodiment of figures 2a and 2b also allows for a number of unique construction options and embodiments which are described in the following.
  • injection molding may allow for at least certain parts of the complex extended vapor chamber side of the heat sink to be created as one piece thereby decreasing the otherwise more intensive construction process of conventional vapor chamber heat sinks.
  • the extended fins and the top portion of the vapor chamber may be made in one piece.
  • the base of the vapor chamber adjacent to the heat source may be another piece and the two pieces may then be easily bonded together.
  • small amounts of working fluid may be absorbed into the polymer material.
  • Figure 3 is in many aspects of structure and operation similar to figure 2b in both of which only a portion R of the assembly of the vapor chamber, heat sink and the heat source is shown.
  • like elements have been given like reference numerals as those of figure 2b .
  • figure 3 further illustrates the presence of a layer 140 which is intended to block the absorption of the fluid as well as the out-gassing of the gasses as described above.
  • the overall polymer enclosure or at least a part thereof, including the inner walls of the vapor chamber 110 and those of the fins 121 is lined with a thin hermetic layer 140 adapted to act as an impermeable barrier to mass transport to or from the polymer enclosure. This layer may be applied through electroplating or chemical vapor deposition or other known techniques.
  • the fins of the heat sink also act as condensation walls (e.g. figures 2a, 2b )
  • vapor may condense on the fins' inner walls.
  • liquid droplets may be formed on said inner walls that could potentially bridge the gap between the inner walls in this region and could result in an accumulation of liquid in this space.
  • FIG 4a a portion of a fin 121 is shown where the fin 121 has a hollow inner space 115a in accordance with the embodiments described with reference to figures 2a-2b and 3 .
  • the fin 121 has walls 122 and 123.
  • liquid bridges 124 are formed between the inner surfaces of the walls 122 and 123.
  • Such accumulation of droplets may be undesirable as it may block the passage of vapor to other regions of the fins or the return of the liquid back to the liquid base adjacent to the heat source (not shown) or it may increase thermal resistance within the fins 121.
  • use may be made of known surface treatments which provide a certain level of hydrophobicity to the regions concerned thereby promoting the flow of liquid droplets from the surface and minimizing the thermal resistance associated with a condensation film on the inner surface of the walls 122, 123. By using such surface treatment, the droplets would not accumulate on the inner surfaces of the walls and may leave such surfaces before an accumulation is produced as shown in figure 4b .
  • a hydrophilic surface may be used thereby causing the droplets to adhere along a relatively extended inner surface of the walls 122 and 123, thereby limiting their propensity to form liquid bridges on the opposite wall as illustrated in figure 4c .
  • An example of a hydrophobic material is teflon and one for a hydrophilic material is glass.
  • Hydrophobicity or Hydrophilicity typically depends on the solid/liquid combination and the surface structure of the solid (i.e. the presence of microstructures to encourage hydrophobicity).
  • Hydrophilic surfaces more specifically, have the property that water has an affinity for the surface, thus water will readily wet and spread onto a hydrophilic surface.
  • Hydrophobic surfaces in contrast, are such that water does not have a significant affinity for the surface, and will instead minimize its surface contact area with the surface by forming droplets. Hydrophilicity and hydrophobicity are controlled by the inherent surface energies associated with the interaction of the solid, liquid and vapor phases.
  • FIG. 5a shows an exemplary schematic representation of an assembly of a vapor chamber 110, a heat sink 120 and a heat source 130.
  • the embodiment shown in figure 5a is in many structural and operational aspects similar to that of figures 2a-2b or figure 3 and like elements therein have been given like reference numerals as figures 2a-2b and 3 .
  • figure 5a further illustrates the use of support elements 150 inside the vapor chamber 110 and/or the fins 121 to enhance rigidity as discussed above.
  • additional structural elements may be provided inside the fins 121 designed to direct or enhance the liquid condensate flow returning back to the liquid base in the vapor chamber ( e.g. to the wick structure and/or heat source).
  • additional elements may be the same as the support elements as described above. Therefore, in some embodiments, the support elements 150 may be used for both purposes described above, namely that of providing structural rigidity to the overall structure and that of directing the condensed liquid back to the vapor chamber.
  • Figure 5b shows a fin 121 in a cross-sectional view along the cross-section represented by broken line A-A in figure 5a .
  • support elements 150 may be positioned inside the fins 121 to direct the liquid drops 160.
  • the support elements may be provided in a shape and/or position to assist the flow of the drops 160 back to the vapor chamber 110.
  • the support elements are provided with a certain slope that, when fin is positioned vertically, direct the liquid drops 160 downward as shown by arrows in figure 5b .
  • the thermally conductive polymer used in the vapor chamber or the vapor chamber heat sink may include metal inserts incorporated or over-molded into the polymer structure at the location where the heat source is brought into thermal contact with the vapor chamber. This option may help to improve heat transfer from the heat sink into the vapor chamber and the wick structure (if a wick structure is used). Furthermore, such metal insert may allow for more robust heat source attachment options such as the use of threaded holes or studs or the direct soldering or welding of such devices directly to the vapor chamber or heat sink. In addition, a metal wick structure may optionally be soldered directly to such metal inserts to improve heat transfer into the wick inside of the vapor chamber.
  • wick structure may be one of several existing technologies depending on the design requirements and liquid transport needs of the vapor chamber or vapor chamber heat sink.
  • Some non-limiting examples of wick structure include porous sintered metal wicks, layers of woven metal wire screen mesh or a grooved wick.
  • grooved wicks may be an attractive option and may be incorporated directly into the heated base of the vapor chamber during the process of molding the plastic.
  • a hybrid wick structure may be used.
  • Figure 6 shows an exemplary schematic representation of a portion of a vapor chamber R within which a hybrid wick structure is used.
  • the hybrid wick structure 119 comprises a first portion made of porous structure 119a which may be made of a sintered metal or a screen mesh wick.
  • the hybrid wick structure further comprises a second portion with grooves 119b such that the groove are embedded in the body of the vapor chamber wall 111 or in the base of the heat sink (not shown).
  • the wick structure itself may be made of sintered plastic material. This option is made possible due to the use of a thermally conductive polymer as material for the vapor chamber as discussed above.
  • Figures 7a and 7b show a schematic representation of a portion of a vapor chamber R within which sintered plastic is used to form the wick structure.
  • like elements have been given like reference numerals as those of figures 1a and 1b .
  • particles 170a of the thermally conductive polymer are provided inside the vapor chamber 110. The particles 170a are then heated to a temperature below their melting point or glass transition temperature. Atomic diffusion bonds the particles together forming a continuous (sintered) solid porous structure as shown in figure 7b by reference numeral 170b which represents the particles of figure 7a but in porous structure form.
  • the initial particle size may be determined based on the required porosity and capillary requirements of the overall vapor chamber or vapor chamber heat sink.
  • the sintered polymer wick 170b may be manufactured in-situ of the vapor chamber heat sink and may further be sintered directly to the inner wall 111 of the vapor chamber (or the vapor chamber and heat sink) to improve heat transfer from the outer heat source 130 into the wick 170b.
  • the overall assembly of the vapor chamber or the vapor chamber and heat sink may be made using known processes. For example, in order to create an enclosed chamber of a given design (be it a simple flat vapor chamber design or a more complex extended vapor chamber heat sink) the injection molded conductive polymer may be assembled from a minimum of two separately molded pieces. In order to provide an effective seal between these components, mechanical assembly using fasteners and a gasket material (such as an O-ring or a wet installed sealant or adhesive) may be used. Another alternative approach afforded by the use of a polymeric enclosure may be to use a compatible epoxy or adhesive to chemically bond the components together. Finally, a variety of plastic welding options may also be amenable to joining these components.
  • a gasket material such as an O-ring or a wet installed sealant or adhesive
  • the solution proposed herein provide significant increase in vapor chamber and vapor chamber heat sink effectiveness (performance) and decrease in weight as compared to known designs resulting in increased reliability and functionality for the hardware employing such solution.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
EP12306167.3A 2012-09-26 2012-09-26 Appareil de transfert de chaleur par évaporation Withdrawn EP2713132A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP12306167.3A EP2713132A1 (fr) 2012-09-26 2012-09-26 Appareil de transfert de chaleur par évaporation
US13/742,582 US20140083653A1 (en) 2012-09-26 2013-01-16 Vapor-Based Heat Transfer Apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP12306167.3A EP2713132A1 (fr) 2012-09-26 2012-09-26 Appareil de transfert de chaleur par évaporation

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EP2713132A1 true EP2713132A1 (fr) 2014-04-02

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US11353269B2 (en) 2009-03-06 2022-06-07 Kelvin Thermal Technologies, Inc. Thermal ground plane
US11598594B2 (en) 2014-09-17 2023-03-07 The Regents Of The University Of Colorado Micropillar-enabled thermal ground plane
US11930621B2 (en) 2020-06-19 2024-03-12 Kelvin Thermal Technologies, Inc. Folding thermal ground plane
US11988453B2 (en) 2014-09-17 2024-05-21 Kelvin Thermal Technologies, Inc. Thermal management planes
US12104856B2 (en) 2016-10-19 2024-10-01 Kelvin Thermal Technologies, Inc. Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems

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US10674631B1 (en) * 2019-07-08 2020-06-02 Forcecon Technology Co., Ltd. Thin vapor chamber with circuit unit
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