CN115729329A - 两相冷板 - Google Patents
两相冷板 Download PDFInfo
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- CN115729329A CN115729329A CN202210634833.8A CN202210634833A CN115729329A CN 115729329 A CN115729329 A CN 115729329A CN 202210634833 A CN202210634833 A CN 202210634833A CN 115729329 A CN115729329 A CN 115729329A
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- 239000012530 fluid Substances 0.000 claims abstract description 94
- 230000017525 heat dissipation Effects 0.000 claims abstract description 51
- 239000007788 liquid Substances 0.000 claims description 10
- 238000012886 linear function Methods 0.000 claims description 3
- 230000009977 dual effect Effects 0.000 claims 3
- 238000009428 plumbing Methods 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 239000007921 spray Substances 0.000 abstract description 5
- 238000001816 cooling Methods 0.000 description 16
- 238000009835 boiling Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D1/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D13/00—Pumping installations or systems
- F04D13/02—Units comprising pumps and their driving means
- F04D13/06—Units comprising pumps and their driving means the pump being electrically driven
- F04D13/0646—Units comprising pumps and their driving means the pump being electrically driven the hollow pump or motor shaft being the conduit for the working fluid
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/04—Shafts or bearings, or assemblies thereof
- F04D29/043—Shafts
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/18—Rotors
- F04D29/22—Rotors specially for centrifugal pumps
- F04D29/2261—Rotors specially for centrifugal pumps with special measures
- F04D29/2277—Rotors specially for centrifugal pumps with special measures for increasing NPSH or dealing with liquids near boiling-point
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/40—Casings; Connections of working fluid
- F04D29/42—Casings; Connections of working fluid for radial or helico-centrifugal pumps
- F04D29/426—Casings; Connections of working fluid for radial or helico-centrifugal pumps especially adapted for liquid pumps
- F04D29/4293—Details of fluid inlet or outlet
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/58—Cooling; Heating; Diminishing heat transfer
- F04D29/5806—Cooling the drive system
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/58—Cooling; Heating; Diminishing heat transfer
- F04D29/586—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
- F04D17/02—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps having non-centrifugal stages, e.g. centripetal
- F04D17/025—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps having non-centrifugal stages, e.g. centripetal comprising axial flow and radial flow stages
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
- F04D25/02—Units comprising pumps and their driving means
- F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/40—Casings; Connections of working fluid
- F04D29/42—Casings; Connections of working fluid for radial or helico-centrifugal pumps
- F04D29/426—Casings; Connections of working fluid for radial or helico-centrifugal pumps especially adapted for liquid pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/58—Cooling; Heating; Diminishing heat transfer
- F04D29/586—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps
- F04D29/588—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps cooling or heating the machine
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
- Sampling And Sample Adjustment (AREA)
- Magnetic Heads (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
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Abstract
一种两相冷板包含有一底座、一上盖板、一热交换腔以及一散热鳍片模块。上盖板安装于底座之上,热交换腔形成于底座与上盖板之间,而散热鳍片模块,安装于热交换腔之中。上盖板包含有至少一喷嘴模块以及多个两相流体通道。两相流体通道分别位于喷嘴模块的两侧,而喷嘴模块将一散热流体喷向散热鳍片模块,且散热流体沿着散热鳍片模块流向两侧的两相流体通道,以冷却散热鳍片模块。
Description
技术领域
本发明涉及一种冷板。特别涉及一种两相冷板。
背景技术
随着科技的进步,电子产品日渐普及,并逐渐地改变了许多人的生活或是工作的模式。当电脑运算能力的日益增强,中央处理器等电子元件工作时的温度控制越来越重要。
中央处理器等电子元件在运行时会产生热量,需要适当冷却才能达到最佳性能。为了让中央处理器等电子元件能保持在理想温度下运行,目前通常采用液体冷却或空气冷却的方式进行。
以现行水冷散热方式,工作流体经由管路流入水冷头,而水冷头接触中央处理器等电子元件的表面,以将中央处理器等电子元件工作所产生的热量带走,进而降低中央处理器等电子元件的工作温度,进而提升工作效率。
然而,如何能进一步改善水冷头的性能,将有助于提升电子产品的性能与效率,为所属技术领域相关人员所殷殷企盼。
发明内容
发明内容旨在提供本揭示内容的简化摘要,以使阅读者对本揭示内容具备基本的理解。此发明内容并非本揭示内容的完整概述,且其用意并非在指出本发明实施例的重要/关键元件或界定本发明的范围。
本发明内容的一目的是在提供一种两相冷板,以有效地提升散热效率,进而降低电子设备的工作温度。
为达上述目的,本发明内容的一技术实施方式涉及一种两相冷板包含有一底座、一上盖板、一热交换腔以及一散热鳍片模块。上盖板安装于底座之上,热交换腔形成于底座与上盖板之间,而散热鳍片模块,安装于热交换腔之中。此外,上盖板包含有至少一喷嘴模块以及多个两相流体通道。两相流体通道位于喷嘴模块的两侧,而喷嘴模块将一散热流体喷向散热鳍片模块,且散热流体沿着散热鳍片模块流向两侧的两相流体通道,以冷却散热鳍片模块。
在一些实施例中,喷嘴模块包含有一第一喷嘴模块以及多个第二喷嘴模块,位于第一喷嘴模块的两侧。
在一些实施例中,散热鳍片模块还包含有一中间导引槽,中间导引槽对准第一喷嘴模块。
在一些实施例中,第一喷嘴模块的入口小于第二喷嘴模块的入口。
在一些实施例中,第一喷嘴模块或第二喷嘴模块包含有多个前喷嘴、至少一长条喷嘴以及多个后喷嘴,而前喷嘴,至少一长条喷嘴以及后喷嘴,依序排列。
在一些实施例中,前喷嘴与后喷嘴为圆形喷嘴。
在一些实施例中,两相流体通道包含有一两相流体导引面以及一出口,且两相流体导引面,由一入口的方向,向出口的方向,高度逐渐增加。
在一些实施例中,入口的截面积小于出口的截面积。
在一些实施例中,两相流体导引面包含有一第一导引面以及一第二导引面,且第二导引面的斜率大于第一导引面的斜率。
在一些实施例中,第一导引面是由一次线性函数所形成的平面,而第二导引面是由二次以上函数所形成的曲面。
在一些实施例中,第一导引面与第二导引面的接合处,位于两相流体导引面的末端。
在一些实施例中,两相冷板还包含有二管路连接模块,分别连接于上盖板的前后两端。
在一些实施例中,管路连接模块包含有一管路连接器以及一流体导引器。管路连接器用以连接一散热流体管路,而流体导引器连接于上盖板与管路连接器之间。
在一些实施例中,流体导引器包含有一液体出入口以及二导引面,分别位于液体出入口的两侧,以导引散热流体进入或流出热交换腔。
因此,前述的两相冷板,具有两相流体导引面能够导引具有相变化的散热流体进行热交换,通过斜面结构以及出口面积大于入口面积的设计,且由于两相流体导引面形成了容积向出口方向变大的流体流动空间,在流体产生相变化时,可减少膨胀所导致的内部压力增加,而使散热流体的沸点产生波动变化的情形,例如是,沸点提高的情形,以有效地导引汽化后的流体,达到较佳的散热效率与散热能力。
附图说明
为让本公开的上述和其他目的、特征、优点与实施例能更明显易懂,说明书附图的说明如下:
图1为依照本发明一实施例所示出的一种两相冷板的立体示意图。
图2为图1所示的两相冷板的爆炸示意图。
图3为图1所示的两相冷板的上盖板的仰视立体示意图。
图4为图1所示的两相冷板的上盖板的另一角度的仰视立体示意图。
图5为图1所示的两相冷板的部分剖面示意图,其位于图3的剖面线5-5相应的位置。
图6为图1所示的两相冷板的部分剖面示意图,其位于图3的剖面线6-6相应的位置。
附图标记说明:
100:两相冷板
101:热源
110:上盖板
120:底座
130:管路连接模块
132:管路连接器
134:流体导引器
140:管路连接模块
142:管路连接器
144:流体导引器
210:散热鳍片模块
211:鳍片
212:鳍片
218:中间导引槽
220:热交换腔
232:液体出入口
234:导引面
236:接合面
310:第一喷嘴模块
311:入口
312:导引通道
314:前喷嘴
316:长条喷嘴
318:后喷嘴
320:第二喷嘴模块
321:入口
322:导引通道
324:前喷嘴
326:长条喷嘴
328:后喷嘴
330:两相流体通道
332:两相流体导引面
334:出口
501:凹槽
510:端面
610:第一导引面
620:第二导引面
630:接合处
650:流体流动空间
具体实施方式
下文举实施例配合说明书附图进行详细说明,但所提供的实施例并非用以限制本公开所涵盖的范围,而结构运行的描述非用以限制其执行的顺序,任何由元件重新组合的结构,所产生具有均等技术效果的装置,都为本公开所涵盖的范围。另外,附图仅以说明为目的,并未依照原尺寸作图。为使便于理解,下述说明中相同元件或相似元件将以相同的符号标示来说明。
另外,在全篇说明书与权利要求所使用的用词(terms),除有特别注明外,通常具有每个用词使用在此领域中、在此公开的内容中与特殊内容中的平常意义。某些用以描述本公开的用词将于下或在此说明书的别处讨论,以提供本领域技术人员在有关本公开的描述上额外的引导。
于实施方式与权利要求中,除非内文中对于冠词有所特别限定,否则“一”与“所述”可泛指单一个或多个。而步骤中所使用的编号仅用来标示步骤以便于说明,而非用来限制前后顺序及实施方式。
其次,在本文中所使用的用词“包含”、“包括”、“具有”、“含有”等等,均为开放性的用语,即意指包含但不限于。
图1为本发明所公开的一种两相冷板的立体示意图,图2为其爆炸示意图,图3为两相冷板的上盖板的仰视立体示意图,图4为另一角度的仰视立体示意图,图5为沿着剖面线5-5的两相冷板的部分剖面示意图,而图6为沿着剖面线6-6的两相冷板的部分剖面示意图。
首先参阅图1与图2,两相冷板100包含有一底座120、一上盖板110、一热交换腔220以及一散热鳍片模块210。上盖板110安装于底座120之上,热交换腔220形成于底座120与上盖板110之间,而散热鳍片模块210安装于热交换腔220之中。此外,同时参阅图3,上盖板110包含有至少一喷嘴模块,例如是第一喷嘴模块310及/或第二喷嘴模块320,以及多个两相流体通道330。两相流体通道330位于第一喷嘴模块310及第二喷嘴模块320的两侧。第一喷嘴模块310及第二喷嘴模块320将散热流体喷向散热鳍片模块210。此时,散热流体沿着散热鳍片模块210的鳍片211以及鳍片212流向两侧,并进入两相流体通道330,用以冷却散热鳍片模块210,进而冷却安装于两相冷板100下方的热源101,例如是中央处理器、绘图芯片或其他发热的电子元件。
在一些实施例中,散热鳍片模块210包含有铲齿散热片(skived fin)。
在一些实施例中,第二喷嘴模块320位于第一喷嘴模块310的两侧,且散热鳍片模块210的鳍片211以及鳍片212之间形成有一中间导引槽218,而第一喷嘴模块310对准散热鳍片模块210的中间导引槽218。
在一些实施例中,同时参阅图5,第一喷嘴模块310包含有一入口311、一导引通道312、一多个前喷嘴314、至少一长条喷嘴316以及多个后喷嘴318。其中,入口311连接于导引通道312,而导引通道312连通于依序排列的前喷嘴314、长条喷嘴316以及后喷嘴318,以导引散热流体进入并喷向散热鳍片模块210。
在一些实施例中,前喷嘴314与后喷嘴318,例如是圆形喷嘴,以增加散热流体喷射的速度,进而深入散热鳍片模块210的鳍片212之间的凹槽501,以提升散热效率与散热能力,而长条喷嘴316,例如是一长圆孔形的喷嘴,以增加散热流体喷射的流量,进一步提升散热效率与散热能力。鳍片212之间的凹槽501则导引散热流体,向第一喷嘴模块310的两侧流动,然后进入第一喷嘴模块310相邻的两相流体通道330之中。此外,导引通道312相对于入口311的另一端,则具有端面510,以封闭导引通道312,进而强制散热流体进入相邻的两相流体通道330之中。
在一些实施例中,相似于第一喷嘴模块310,第二喷嘴模块320亦包含有一入口321、一导引通道322、一多个前喷嘴324、至少一长条喷嘴326以及多个后喷嘴328。其中,入口321连接于导引通道322,而导引通道322连通于依序排列的前喷嘴324、长条喷嘴326以及后喷嘴328,以导引散热流体进入并喷向散热鳍片模块210。相同地,前喷嘴324与后喷嘴328,例如是圆形喷嘴,以增加散热流体喷射的速度,进而深入散热鳍片模块210,以提升散热效率与散热能力,而长条喷嘴326例如是一长圆孔形的喷嘴,以增加散热流体喷射的流量,进一步提升散热效率与散热能力。相同地,鳍片212或鳍片211之间的凹槽亦可导引散热流体,朝向第二喷嘴模块320的两侧流动,然后进入第二喷嘴模块320相邻的两相流体通道330之中。此外,导引通道322相对于入口321的另一端,亦封闭导引通道322,进而强制散热流体进入相邻的两相流体通道330之中。
在一些实施例中,第一喷嘴模块310以及第二喷嘴模块320邻接于散热鳍片模块210的上表面,换言之,第一喷嘴模块310以及第二喷嘴模块320的喷嘴可贴合于散热鳍片模块210的上表面。
此外,值得注意的是,在一些实施例中,第一喷嘴模块310的入口311小于第二喷嘴模块320的入口321。
在一些实施例中,两相冷板100还包含有一管路连接模块130以及一管路连接模块140,分别连接于上盖板110的前后两端。管路连接模块130包含有一管路连接器132以及一流体导引器134。管路连接器132用以连接一散热流体管路,而流体导引器134则连接于上盖板110与管路连接器132之间。相同地,管路连接模块140亦包含有一管路连接器142以及一流体导引器144。管路连接器142用以连接一散热流体管路,而流体导引器144则连接于上盖板110与管路连接器142之间。
在一些实施例中,以管路连接模块130为例,流体导引器134包含有一液体出入口232以及二导引面234,导引面234分别位于液体出入口232的两侧,以导引散热流体进入或流出热交换腔220。值得注意的是,当管路连接模块130安装于上盖板110时,流体导引器134的接合面236接合于上盖板110,而液体出入口232对准第一喷嘴模块310的入口311。此外,导引面234则将散热流体导引至第二喷嘴模块320的入口321。
在一些实施例中,两相流体通道330包含有一两相流体导引面332以及一出口334,且两相流体导引面332,由两相冷板100的入口311方向,向出口334方向逐渐变高,进而增加一流体流动空间650的高度与容积。
在一些实施例中,两相流体导引面332包含有一第一导引面610以及一第二导引面620,且第二导引面620的斜率大于第一导引面610的斜率。其中第一导引面610与第二导引面620的接合处630,约对应于后喷嘴318的区域,亦即邻近两相流体导引面332的末端,一般而言,接合处630位于两相流体导引面332后半部的位置,例如是邻近两相流体通道330的出口334的位置,优选地距离出口334约小于两相流体导引面332的1/4长度。
在一些实施例中,第一导引面610是由一次线性函数所形成的平面,而第二导引面620是由二次以上函数所形成的曲面,然本发明并不限定于此。
在一些实施例中,出口334的截面积大于入口311的截面积。
有鉴于此,本发明的两相冷板的两相流体导引面能够导引具有相变化的散热流体进行热交换,通过斜面结构以及出口面积大于入口面积的设计,可导引汽化后的流体,达到较佳的散热效率与散热能力。此外,通过两相流体导引面,对汽化后的散热流体导引至出口方向,更能避免产生堆积的现象。此外,由于两相流体导引面形成了容积向出口方向变大的流体流动空间,在流体产生相变化时,可减少膨胀所导致的内部压力增加,而使散热流体的沸点产生波动变化的情形,例如是,沸点提高的情形,进而进一步地提升两相冷板的散热效率与散热能力,更提升两相冷板的稳定性。
而以上所述者,仅为本发明的优选实施例而已,当不能以此限定本发明实施的范围,即大凡依本发明权利要求及发明说明内容所作的简单的等效变化与修饰,都仍属本发明专利涵盖的范围内。另外,本发明的任一实施例或权利要求不须达成本发明所公开的全部目的或优点或特点。此外,摘要部分和标题仅是用来辅助专利文件搜索之用,并非用来限制本发明的权利要求。此外,本说明书或权利要求中提及的“第一”、“第二”等用语仅用以命名元件(element)的名称或区别不同实施例或范围,而并非用来限制元件数量上的上限或下限。
虽然本公开已以实施方式公开如上,然其并非用以限定本公开,任何本领域技术人员,在不脱离本公开的构思和范围内,当可作各种的变动与润饰,因此本公开的保护范围当视权利要求所界定者为准。
Claims (14)
1.一种两相冷板,其特征在于,包含:
一底座;
一上盖板,安装于所述底座之上,
一热交换腔,形成于所述底座与所述上盖板之间;以及
一散热鳍片模块,安装于所述热交换腔之中,其中所述上盖板,包含:
至少一喷嘴模块;以及
多个两相流体通道,位于所述至少一喷嘴模块的两侧,其中所述喷嘴模块,用以将一散热流体喷向所述散热鳍片模块,所述散热流体沿着所述散热鳍片模块流向两侧的所述多个两相流体通道,以冷却所述散热鳍片模块。
2.如权利要求1所述的两相冷板,其中所述至少一喷嘴模块,包含:
一第一喷嘴模块;以及
多个第二喷嘴模块,分别位于所述第一喷嘴模块的两侧。
3.如权利要求2所述的两相冷板,其中所述散热鳍片模块,还包含一中间导引槽,所述中间导引槽对准所述第一喷嘴模块。
4.如权利要求2所述的两相冷板,其中所述第一喷嘴模块的入口小于所述多个第二喷嘴模块的入口。
5.如权利要求4所述的两相冷板,其中所述第一喷嘴模块以及所述多个第二喷嘴模块的其中之一,包含:
多个前喷嘴;
至少一长条喷嘴;以及
多个后喷嘴,所述多个前喷嘴,所述至少一长条喷嘴以及所述多个后喷嘴,依序排列。
6.如权利要求5所述的两相冷板,其中所述多个前喷嘴与所述多个后喷嘴均为圆形喷嘴。
7.如权利要求1所述的两相冷板,其中每一所述多个两相流体通道,包含:
一两相流体导引面,以及
一出口,其中所述两相流体导引面,由一入口的方向朝所述出口的方向,高度逐渐增加。
8.如权利要求7所述的两相冷板,其中所述入口的截面积小于所述出口的截面积。
9.如权利要求7所述的两相冷板,其中所述两相流体导引面,包含:
一第一导引面;以及
一第二导引面,且所述第二导引面的斜率大于所述第一导引面的斜率。
10.如权利要求9所述的两相冷板,其中所述第一导引面是由一次线性函数所形成的平面,而所述第二导引面是由二次以上函数所形成的曲面。
11.如权利要求9所述的两相冷板,其中所述第一导引面与所述第二导引面的接合处,位于所述两相流体导引面的末端。
12.如权利要求1所述的两相冷板,还包含二管路连接模块,分别连接于所述上盖板的前后两端。
13.如权利要求12所述的两相冷板,其中每一个所述多个管路连接模块,包含:
一管路连接器,用以连接一散热流体管路;以及
一流体导引器,连接于所述上盖板与所述管路连接器之间。
14.如权利要求13所述的两相冷板,其中所述流体导引器,包含:
一液体出入口;以及
二导引面,分别位于所述液体出入口的两侧,以导引所述散热流体进入或流出所述热交换腔。
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TWI845004B (zh) * | 2022-10-31 | 2024-06-11 | 技鋼科技股份有限公司 | 散熱器及電子裝置 |
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Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6366462B1 (en) * | 2000-07-18 | 2002-04-02 | International Business Machines Corporation | Electronic module with integral refrigerant evaporator assembly and control system therefore |
US20040011509A1 (en) * | 2002-05-15 | 2004-01-22 | Wing Ming Siu | Vapor augmented heatsink with multi-wick structure |
US6994151B2 (en) * | 2002-10-22 | 2006-02-07 | Cooligy, Inc. | Vapor escape microchannel heat exchanger |
US6917522B1 (en) * | 2003-12-29 | 2005-07-12 | Intel Corporation | Apparatus and method for cooling integrated circuit devices |
US20060039111A1 (en) * | 2004-08-17 | 2006-02-23 | Shine Ying Co., Ltd. | [high-performance two-phase flow evaporator for heat dissipation] |
US20060171801A1 (en) * | 2004-12-27 | 2006-08-03 | Matsushita Electric Industrial Co., Ltd. | Heatsink apparatus |
US7213636B2 (en) * | 2005-03-15 | 2007-05-08 | Delphi Technologies, Inc. | Cooling assembly with impingement cooled heat sink |
CN100456461C (zh) * | 2005-06-04 | 2009-01-28 | 富准精密工业(深圳)有限公司 | 热管散热装置 |
US7450386B2 (en) * | 2005-07-30 | 2008-11-11 | Articchoke Enterprises Llc | Phase-separated evaporator, blade-thru condenser and heat dissipation system thereof |
US7298620B2 (en) * | 2005-12-08 | 2007-11-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US7597135B2 (en) * | 2006-05-23 | 2009-10-06 | Coolit Systems Inc. | Impingement cooled heat sink with low pressure drop |
JP4714638B2 (ja) * | 2006-05-25 | 2011-06-29 | 富士通株式会社 | ヒートシンク |
US7762314B2 (en) * | 2007-04-24 | 2010-07-27 | International Business Machines Corporation | Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways |
US20090159244A1 (en) * | 2007-12-19 | 2009-06-25 | Stephen Mounioloux | Water-cooled cold plate with integrated pump |
CN201282616Y (zh) * | 2008-09-22 | 2009-07-29 | 富准精密工业(深圳)有限公司 | 散热装置 |
EP2713132A1 (en) * | 2012-09-26 | 2014-04-02 | Alcatel Lucent | A vapor-based heat transfer apparatus |
US9477275B2 (en) * | 2013-01-18 | 2016-10-25 | Intel Corporation | Thermal management solution for circuit products |
TWM454565U (zh) * | 2013-01-30 | 2013-06-01 | Bor-Bin Tsai | 水冷模組 |
US9772143B2 (en) * | 2013-04-25 | 2017-09-26 | Asia Vital Components Co., Ltd. | Thermal module |
JP2016075184A (ja) * | 2014-10-03 | 2016-05-12 | 三菱重工業株式会社 | 遠心圧縮機 |
CN106151054B (zh) * | 2015-03-26 | 2019-12-13 | 浙江三花汽车零部件有限公司 | 电驱动泵 |
TWI592623B (zh) * | 2015-09-23 | 2017-07-21 | 邁萪科技股份有限公司 | 均溫板及其製作方法 |
US10001133B2 (en) * | 2015-10-02 | 2018-06-19 | Sundyne, Llc | Low-cavitation impeller and pump |
US20190003775A1 (en) * | 2017-06-29 | 2019-01-03 | Taiwan Microloops Corp. | Anti-bending heat dissipation module |
TWI682144B (zh) * | 2019-03-22 | 2020-01-11 | 邁萪科技股份有限公司 | 一體式均溫板及其製作方法 |
TWM585836U (zh) * | 2019-07-01 | 2019-11-01 | 大陸商深圳興奇宏科技有限公司 | 泵浦結構 |
TWM609697U (zh) * | 2020-08-13 | 2021-04-01 | 大陸商深圳市研派科技有限公司 | 一體式水冷散熱裝置 |
US11483947B2 (en) * | 2020-09-16 | 2022-10-25 | Motivair Corporation | Cooling apparatus with expanding fluid jets |
US11849569B2 (en) * | 2020-10-30 | 2023-12-19 | Toyota Motor Engineering & Manufacturing North America, Inc. | Ultra-compact configurable double-sided manifold micro-channel cold plate |
CN217360731U (zh) * | 2021-08-26 | 2022-09-02 | 春鸿电子科技(重庆)有限公司 | 两相冷板 |
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