EP2694875B1 - Procédé de fixation et de mise en contact d'une lampe et/ou d'un module de luminaire ainsi que luminaire - Google Patents

Procédé de fixation et de mise en contact d'une lampe et/ou d'un module de luminaire ainsi que luminaire Download PDF

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Publication number
EP2694875B1
EP2694875B1 EP12721692.7A EP12721692A EP2694875B1 EP 2694875 B1 EP2694875 B1 EP 2694875B1 EP 12721692 A EP12721692 A EP 12721692A EP 2694875 B1 EP2694875 B1 EP 2694875B1
Authority
EP
European Patent Office
Prior art keywords
spring means
led module
socket housing
module
lighting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP12721692.7A
Other languages
German (de)
English (en)
Other versions
EP2694875A2 (fr
Inventor
Peter Moser
Thomas Riedler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tridonic GmbH and Co KG
Original Assignee
Tridonic GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from ATGM204/2011U external-priority patent/AT12818U1/de
Application filed by Tridonic GmbH and Co KG filed Critical Tridonic GmbH and Co KG
Publication of EP2694875A2 publication Critical patent/EP2694875A2/fr
Application granted granted Critical
Publication of EP2694875B1 publication Critical patent/EP2694875B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00Protecting lighting devices from damage
    • F21V15/01Housings, e.g. material or assembling of housing parts
    • F21V15/012Housings with variable shape or dimensions, e.g. by means of elastically deformable materials or by movement of parts forming telescopic extensions of the housing body
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/0005Fastening of light sources or lamp holders of sources having contact pins, wires or blades, e.g. pinch sealed lamp
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/04Fastening of light sources or lamp holders with provision for changing light source, e.g. turret
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the invention relates to a device for attaching and contacting a lamp and / or a lighting module, in particular an LED module according to the preambles of independent claim 1, and a lamp, in particular as a downlight, with such a device.
  • Such devices are used to attach at least one light source and / or a light module, in particular LED module, and to contact with a power supply. They are also connected to a light.
  • the device has a socket housing with at least one outer ring and an inner ring which is mounted in the outer ring with a plurality of separate compression springs, screws and washers distributed in the vicinity. Due to the resilient mounting of the inner ring, the back of the LED module is pressed on a heat sink.
  • the inner ring should be made of high-temperature resistant plastic due to the heat generation of the LED module. This is disadvantageous for cost reasons.
  • the object of the invention is to design and further develop a device for fastening and contacting a luminous means and / or light module, in particular an LED module, so that it eliminates the disadvantages mentioned, wherein the design of the device is to be simplified and cost-saving.
  • the required contact pressure of the lamp and / or light module, in particular LED module continue to be ensured on the heat sink.
  • the device for fastening and contacting a luminous means and / or a lighting module, in particular an LED module has at least one socket housing, wherein the lighting means and / or light module, in particular LED module, is arranged in the socket housing and on one with the device connected cooling body is pressed, this pressing takes place at least via spring means of the device.
  • the required contact pressure depends i.a. from the structure of the lamp and / or light module, in particular LED module, and also from its electrical contacts. The less contact pressure is required, the easier it will be to design the spring means.
  • fastening means or locking means for the lighting means and / or lighting module, in particular LED module are present in the device. It is preferred to offer a tool-free installation.
  • the fastening means or locking means may be mechanical fastening means or mechanical locking means which are designed for retaining means of the luminous means and / or luminous module, in particular LED module.
  • the attachment of the light source and / or light module, in particular LED module in the device can be done by known per se principles. If the device or the socket housing are formed as a ring, the principle of a bayonet closure can be applied.
  • the mechanical fastening between the luminous means and / or luminous module, in particular LED module, and the device can be distributed over several points.
  • nubs may be arranged as holding means on the lighting means and / or lighting module, in particular LED module.
  • corresponding recesses be present in the socket housing of the device so that the light source and / or light module, in particular LED module, can be inserted into the socket housing.
  • the socket housing of the device guide elements preferably provided as a locking link, be present, which serve for the guidance of the holding means of the illuminant and / or light module, in particular LED module.
  • a possible locking or locking of the light source and / or light module, in particular LED module, in the socket housing can be realized by a locking stop. It could also be realized by means of a notch in the socket housing.
  • the LED module fastened in the device can be pressed against a heat sink, which can be arranged on or behind the device.
  • the rear side of the luminous means and / or lighting module in particular LED module, consists of a heat-dissipating material.
  • the heat sink is preferably made of aluminum. If the contact force over the entire contact surface between the heat sink and the rear side of the light source and / or light module, in particular LED module, is distributed almost uniformly, improved heat dissipation from the light source and / or light module, in particular LED module, can be achieved. The larger this contact area, the better the heat dissipation can take place.
  • the socket housing may be formed partially resilient, this effect can be achieved by the leg position of spring means, which are integrated in the socket housing.
  • the spring means are integrally formed with the socket housing. By minimizing the number of individual components required, there is a significant reduction in assembly costs.
  • the socket housing is preferably made of plastic.
  • the spring means may be according to the invention of the same material as the socket housing.
  • the spring means need not necessarily be too strong, so that they can be integrally formed with the socket housing.
  • the spring means may be formed in particular in a direction perpendicular to the contact surface of the heat sink with the light source and / or light module, in particular LED module, resilient. It corresponds to the direction of the necessary pressing force or pressing force.
  • the spring means may preferably act between the socket housing and the lighting means and / or lighting module, in particular LED module, or between the socket housing and the heat sink. It is important that sufficient contact between the light source and / or light module, in particular LED module, and heat sink takes place in order to derive the heat of the LEDs from the light source and / or light module, in particular LED module.
  • the spring means may be formed as spring elements.
  • the device has locking means for the mechanical fastening of the luminous means and / or luminous module, in particular LED module. These locking means are arranged in the socket housing.
  • the spring means are present in the Verrieglungsstoffn.
  • the locking means may be resilient and integrally formed with the socket housing.
  • the locking means may comprise at least one locking link, which is resilient.
  • the locking linkage forms the spring means.
  • the holding means of the luminous means and / or light module, in particular LED module can be held by the locking elements.
  • a contact pressure on the holding means i. practiced on the light source and / or light module, in particular LED module, so that the light source and / or light module, in particular LED module, is pressed on the heat sink.
  • the spring means may for example be integrally formed with the lighting means and / or lighting module, in particular LED module, wherein the holding means for Attachment may be resiliently formed with the socket housing and the locking means of the socket housing can be rigid.
  • the device has fastening means for mechanically fastening the device to the heat sink.
  • the spring means can be arranged on these fastening means.
  • a respective spring means between the fastening means of the device to the heat sink and the socket housing can be provided.
  • these respective spring means can be formed as a tab.
  • the invention is also that additional spring means may be present to the one-piece spring means in or on the socket housing.
  • the one-piece plastic spring means are designed like the socket housing, it may happen that they can apply less force over time and / or that the design of the one-piece spring means is insufficient for the required spring force. This can also be achieved at higher temperatures, which may occur due to the LED heating or the ambient temperature come, wherein the plastic of the socket housing and the one-piece spring means would diminish.
  • the additional spring means should act to assist the spring means, i. that the additional spring means should be stronger than the one-piece spring means. A higher contact pressure can be achieved. Depending on the properties of the one-piece spring means and the additional spring means up to about ten times the contact pressure can be achieved.
  • the required contact pressure can be achieved.
  • the additional spring means may also be formed integrally with the socket housing or as an additional element. They can be made of the same material as the one-piece spring means. But you can also preferably made of a material with a higher spring force, in particular spring steel. As a result, higher temperatures are better tolerated and the contact pressure of the LED module on the heat sink remains more evenly distributed.
  • the additional spring means be arranged directly to the one-piece spring means. They can for example be provided almost or substantially parallel to the one-piece spring means.
  • the additional spring means may preferably be attached or locked at least on one side with the socket housing.
  • the other side of the additional spring means may be arranged for example mounted in the socket housing.
  • the one-piece spring means consist of a different material than that of the socket housing.
  • the socket housing may be made of plastic and the one-piece spring means made of spring steel, wherein in the manufacture of the device, these spring means are integrally connected to the socket housing, for example by encapsulation.
  • spring means between the socket housing of the device and the lamp and / or light module, in particular LED module, act, or that spring means between the socket housing of the device and the heat sink act, the spring means as additional elements are present to the socket housing of the device.
  • Such spring means can be connected at least at one end to the socket housing of the device or stored in or on the socket housing of the device. It is conceivable that in these embodiments, the one-piece spring means can be omitted.
  • the spring means can be selected as additional elements so that the necessary contact pressure of the lamp and / or light module, in particular LED module, is achieved on the heat sink. Material and geometry of the spring means can be selected accordingly, with spring steel can be preferred as a material. Further advantages from the other described embodiments may also be considered for such embodiments. It is also not excluded to combine features of the other described embodiments with such embodiments.
  • a further aspect of the invention is that the electrical contact between the device and the lighting means and / or light module, in particular LED module, via further means than for the mechanical attachment between the device and the lamp and / or light module, in particular LED Module, is provided.
  • a device for fixing and contacting a light source and / or a light module, in particular an LED module is provided, wherein the device has at least one socket housing, wherein the lighting means and / or light module, in particular LED module, in the socket housing of the device is arranged and pressed on a heat sink connected to the device, and wherein the device has a ground.
  • the grounding of the socket housing is contacted directly on the heat sink.
  • the grounding can be springy. It can also be provided as a wire hanger.
  • the device for attaching and contacting a light source and / or a light module, in particular an LED module is connected directly or indirectly to a luminaire.
  • a light for example, a downlight can be provided.
  • the invention also relates to a lamp or light module, in particular LED module, as well as a lamp with the device according to the invention.
  • Fig. 1a is a device 1 according to the invention shown, and an LED module 2 and a heat sink 4. Only LED modules 2 are described here, but it is not excluded that other bulbs or lighting modules can be used.
  • the device 1 with the LED module 2 and the heat sink 4 are usually part of a lamp. It could be a downlight. Nevertheless, other types of luminaires should not be excluded from this invention.
  • Heat sinks are preferably made of aluminum and are necessary when using LEDs or LED modules in order to be able to dissipate the heat generated by the LEDs.
  • a first variant of the device 1 according to the invention is shown.
  • the device 1 has a socket housing 3.
  • This socket housing 3 can be mounted on the heat sink 4.
  • the connection can be made, for example, by fastening means 15 and 16, here as screw holes for fixing screws, not shown here.
  • the fastening means 15 are preferably distributed regularly on the socket housing 3 and the fastening means 16 are distributed on the heat sink 4, correspondingly suitable for the fastening means 15 of the socket housing 3.
  • the device 1 is thereby fixed or rigidly connected to the heat sink 4.
  • the assembly of the LED module 2 in the device 1 can take place. It has the advantage that only the light source and / or the light module, in particular LED module 2, should be replaced, if necessary.
  • the device 1 can remain in its assembled state. It simplifies assembly and disassembly for the specialist personnel, especially if the light source and / or the light module is intended as a downlight.
  • the mechanical connection of the LED module 2 with the device 1 or with the socket housing 3 may preferably take place via a bayonet principle.
  • the LED module 2 is locked in the device 1 and in the socket housing 3 in this way.
  • the LED module 2 has nubs 10. These nubs are preferably distributed around the LED module 2.
  • the knobs 10 When mounting the LED module 2 in the device 1, the knobs 10 are inserted into the recesses 7 of the socket housing 3 and then the LED module 2 is rotated in the direction of rotation according to a bayonet principle. The knobs 10 are guided and locked via the locking means 6. As a result, the LED module 2 is mechanically fixed in the device 1. The knobs 10 slide along the locking link 8 of the locking means 6 to the stop 9 of the locking means. 6
  • Each locking means 6 is connected in one piece with its two ends 11 and 12 with the socket housing 3.
  • the locking means 6, especially the locking latches 8, are resilient and will push the knobs 10 of the LED module 2 in the direction of the pressing force, so that the LED module 2 can be kept pressed to the heat sink 4.
  • the locking means 6 simultaneously form the spring means 5, which are to enable the pressing of the LED module 2 on the heat sink 4.
  • the socket housing 3 is preferably made of plastic.
  • the locking means 6 are made of the same material.
  • Fig. 4a to 8b a second variant of the device according to the invention is shown.
  • the mechanical locking of the LED module 2 with the device 1 can be done in a manner known per se.
  • the knobs 10 of the LED module 2 can be inserted into the respective recesses 7 of the socket housing 3.
  • the LED module 2 can be rotated according to a bayonet principle, wherein the studs 10 of the LED module 2 each slide along a rigid locking link 29 and can be guided and each can be locked by a locking stop 30.
  • the device 1 can in turn be connected for this embodiment via fastening elements 15 with the fastening elements 16 of the heat sink 4 by means of fastening screws, not shown here.
  • the spring means 5 are formed by tabs 17 between the fastening elements 15 of the device 1 and the socket housing 3.
  • the tabs 17 are resilient.
  • the tabs 17 are formed integrally with the socket housing 3 and preferably also integrally with the respective fastening elements 15. One end 18 of a tab 17 may be connected in the upper part of a fastener 15 and the other end 19 of this tab 17 may be connected to the socket housing 3.
  • recesses 28 may be present from the socket housing 3 around the fasteners 15.
  • the socket housing 3 Before the LED module 2 is screwed into the socket housing 3, i. as long as the LED module 2 is inserted only in the socket housing 3, the socket housing 3 is located on the contact surface 13 of the heat sink 4 at.
  • the socket housing 3 lifts from the contact surface 13 of the heat sink 4 from a distance X and by the suspension of the tab 17 is preferably made of heat-dissipating material back 14 of the LED module 2 is pressed onto the contact surface 13 of the heat sink 4.
  • the electrical contact between the LED module 2 and the device 1 can be done in a conventional manner.
  • the LED module 2 on pins 20 which are positioned all around the LED module 2 and are arranged in a direction perpendicular to the rear side 14 of the LED module 2.
  • the contact pins 20 are inserted into the slots 21 of the socket housing 3 and by the rotational movement for the mechanical locking they are contacted with the electrically conductive contacting elements 22.
  • the contact pins 20 are clamped in the respective contact clips 23.
  • These contact clips 23 are each electrically connected to a wiring contact 24, wherein a further electrical wiring is possible.
  • pins 20 There are five pins 20 here. The number of pins may be dependent on the desired terminals.
  • the required contact pressure or pressing force depends above all on the light management of the LED module 2, ie it depends on how much heat comes out of the LED module. As an indication, a pressing force of approximately 10N to 20N may be sufficient to sufficiently dissipate the heat from the LED module 2.
  • a good light management or little heat from the LED module 2 allows a simplified design of the spring means 5. They can be integrally formed with the socket housing 3 and need not be designed as an additional component to the socket housing 3. The assembly of the device is thereby simplified and a more favorable production of the device results.
  • Fig. 9a and 9b is a possible embodiment of a ground 25 for this unit (LED module 2 with device 1 and heat sink 4) shown.
  • a ground 25 may be required for LED modules, depending on the regulations.
  • the grounding 25 may preferably be a wire bow. It is preferably resilient. The ground 25 can be contacted directly on the heat sink 4. Due to their resilient properties, a good grounding contact of the LED module 2 with the heat sink 4 is provided.
  • holding elements 26 and / or 27, which are arranged on the socket housing and / or on the fastening element 15 of the device 1.
  • the earthing 25 as a wire bow can be guided by these holding elements 26 and 27.
  • the additional spring means 31 may be formed of spring steel.
  • a first end 32 of the spring means 31 is attached indirectly and / or directly to the fastening means 15 of the device 1.
  • the end 32 the spring means 31 is bent and is positioned in a slot 34 in the region of the fastening means 15 and at the first end 18 of the one-piece spring means 5, 17.
  • the socket housing 3 has bearing means, here shown as nubs 35, which are arranged in the region of the second end 19 of the spring means 5, 17.
  • the second end 33 of the spring means 31 can be arranged or stored in the region of the bearing means, here as nubs 35. It is not mandatory that this end 33 of the spring means 31 is fixed.
  • the free end 33 of the spring means 31 may be present, for example, between nub 35 and second end 19 of the spring means 5, 17.
  • the spring means 5, 17 and 31 may be arranged substantially parallel to each other when the LED module 2 is not yet mounted in the socket housing 3.
  • the spring force direction of the spring means 5, 17 and 31 is substantially identical.
  • the socket housing 3 is detached from the heat sink 4 by a distance X, and the spring means 5 and the spring means 31 may deform differently, as in FIG Fig. 12a and 12b shown.
  • the spring means 5, 17 have a greater deformation than the spring means 31, since they can allow less contact force of the LED module 2 on the heat sink 4.
  • the spring means 5, 17 and 31 are no longer parallel to each other in the mounted state of the LED module 2 due to different deformations.
  • the spring means 31 support the spring means 5, 17 and improve or increase the pressure of the LED module 2 on the heat sink 4th
  • the second end 33 of the spring means 31 rests on the end 19 of the spring means 5, 17 in the region of the socket housing. The spring means 31 are clamped down.
  • the thickness of the spring means 31 as spring steel influences u.a. the pressing force of the LED module 2 on the heat sink 4. It would be conceivable to use different spring means 31 with e.g. to have different thicknesses and to use the appropriate spring means 31 to the requirements for the light in the device.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Device Packages (AREA)

Claims (12)

  1. Appareil destiné à fixer et à mettre en contact un moyen d'éclairage et/ou un module d'éclairage, en particulier un module DEL (2), dans lequel l'appareil (1) possède un logement de support (3), dans lequel le moyen d'éclairage et/ou le module d'éclairage, en particulier le module DEL (2), est disposé dans le logement de support (3) de l'appareil (1) et pressé sur un élément réfrigérant (4) relié à l'appareil (1), dans lequel cette pression au moins s'effectue par le biais de moyens à ressort (5) de l'appareil (1), dans lequel les moyens à ressort (5) sont intégralement formés avec le logement de support (3) ; caractérisé en ce que l'appareil (1) possède des moyens de verrouillage (6) pour fixer mécaniquement le moyen d'éclairage et/ou le module d'éclairage, en particulier le module DEL (2), dans le logement de support (3), dans lequel les moyens à ressort (5) sont présents dans les moyens de verrouillage (6).
  2. Appareil selon la revendication 1, caractérisé en ce que les moyens à ressort (5) sont élastiquement formés dans une direction verticale à la zone de contact (13) de l'élément réfrigérant (4) avec le moyen d'éclairage et/ou le module d'éclairage, en particulier le module DEL (2).
  3. Appareil selon les revendications 1 ou 2, caractérisé en ce que les moyens à ressort (5) agissent entre le logement de support (3) et le moyen d'éclairage et/ou le module d'éclairage, en particulier le module DEL (2), ou entre le logement de support (3) et l'élément réfrigérant (4).
  4. Appareil selon l'une des revendications de 1 à 3, caractérisé en ce que le moyen de verrouillage (6) possède au moins un organe de raccordement de verrouillage (8) étant formé élastiquement.
  5. Appareil selon l'une des revendications de 1 à 3, caractérisé en ce que l'appareil (1) possède des moyens de fixation (15) pour mécaniquement fixer l'appareil (1) sur l'élément réfrigérant (4), dans lequel les moyens à ressort (5) sont disposés sur les moyens de fixation (15).
  6. Appareil selon la revendication 5, caractérisé en ce que les moyens à ressort (5) forment une languette (17) entre les moyens de fixation (15) et le logement de support (3).
  7. Appareil selon l'une des revendications précédentes, caractérisé en ce que des moyens à ressort supplémentaires (31) sont associés aux moyens à ressort (5) dans ou sur le logement de support (3).
  8. Appareil selon la revendication 7, caractérisé en ce que les moyens à ressort supplémentaires (31) agissent pour les moyens à ressort (5) d'une façon complémentaire.
  9. Appareil selon les revendications 7 ou 8, caractérisé en ce que les moyens à ressort supplémentaires (31) sont disposés directement vers les moyens à ressort (5).
  10. Appareil selon l'une des revendications précédentes, caractérisé en ce que le contact électrique entre l'appareil (1) et le moyen d'éclairage et/ou le module d'éclairage, en particulier le module DEL (2), est prévu par l'intermédiaire d'autres moyens (20, 22) que ceux prévus pour la fixation mécanique entre l'appareil (1) et le moyen d'éclairage et/ou le module d'éclairage, en particulier le module DEL (2).
  11. Appareil selon l'une des revendications précédentes, caractérisé en ce que l'appareil (1) possède une mise à la terre (25), dans lequel la mise à la terre (25) est mise directement en contact du logement de support (3) à l'élément réfrigérant (4).
  12. Lampe dotée d'un appareil (1), selon l'une des revendications précédentes.
EP12721692.7A 2011-04-08 2012-04-03 Procédé de fixation et de mise en contact d'une lampe et/ou d'un module de luminaire ainsi que luminaire Active EP2694875B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ATGM204/2011U AT12818U1 (de) 2011-04-08 2011-04-08 Vorrichtung zum befestigen und kontaktieren eines leuchtmittels und/oder eines leuchtmoduls, sowie leuchte
ATGM434/2011U AT12910U1 (de) 2011-04-08 2011-08-01 Vorrichtung zum befestigen und kontaktieren eines leuchtmittels und/oder eines leuchtmoduls, sowie leuchte
PCT/AT2012/000087 WO2012135877A2 (fr) 2011-04-08 2012-04-03 Procédé de fixation et de mise en contact d'une lampe et/ou d'un module de luminaire ainsi que luminaire

Publications (2)

Publication Number Publication Date
EP2694875A2 EP2694875A2 (fr) 2014-02-12
EP2694875B1 true EP2694875B1 (fr) 2016-03-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP12721692.7A Active EP2694875B1 (fr) 2011-04-08 2012-04-03 Procédé de fixation et de mise en contact d'une lampe et/ou d'un module de luminaire ainsi que luminaire

Country Status (6)

Country Link
US (1) US9146021B2 (fr)
EP (1) EP2694875B1 (fr)
CN (1) CN103597281B (fr)
AT (1) AT12910U1 (fr)
DE (1) DE112012001614A5 (fr)
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Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9927103B2 (en) 2014-05-22 2018-03-27 Feit Electric Company, Inc. Flush mount lighting fixture
US9835300B2 (en) 2014-05-22 2017-12-05 Feit Electric Company, Inc. Multi-configurable light emitting diode (LED) flat panel lighting fixture
US10168031B2 (en) 2014-12-03 2019-01-01 CP IP Holdings Limited Lighting arrangement
US9921364B2 (en) 2015-01-03 2018-03-20 CP IP Holdings Limited Lighting arrangement
US10039161B2 (en) 2014-12-03 2018-07-31 CP IP Holdings Limited Lighting arrangement with battery backup
US10119685B2 (en) 2014-12-03 2018-11-06 CP IP Holdings Limited Lighting arrangement
US10174887B2 (en) 2014-12-03 2019-01-08 CP IP Holdings Limited Lighting arrangement with battery backup
EP3141810B1 (fr) * 2015-08-27 2019-01-09 CP IP Holdings Limited Dispositif d'éclairage
JP6775165B2 (ja) * 2016-04-08 2020-10-28 パナソニックIpマネジメント株式会社 照明器具
US10047937B2 (en) 2016-06-29 2018-08-14 Feit Electric Company, Inc. Lighting fixture mounting systems
US10634320B2 (en) 2016-06-29 2020-04-28 Feit Electric Company, Inc. Lighting fixture mounting systems
CN114815456A (zh) * 2022-06-28 2022-07-29 深圳市爱图仕影像器材有限公司 照明装置、光效附件及照明设备

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7510400B2 (en) * 2007-03-14 2009-03-31 Visteon Global Technologies, Inc. LED interconnect spring clip assembly
DE102007050893B4 (de) * 2007-10-24 2011-06-01 Continental Automotive Gmbh Verfahren zum Positionieren und Montieren einer LED-Baueinheit sowie Positionierkörper hierfür
US7866850B2 (en) * 2008-02-26 2011-01-11 Journée Lighting, Inc. Light fixture assembly and LED assembly
US8152336B2 (en) 2008-11-21 2012-04-10 Journée Lighting, Inc. Removable LED light module for use in a light fixture assembly
KR20120031296A (ko) * 2009-06-17 2012-04-02 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 내부 전원 및 외부 전원에 조명 디바이스를 접속시키기 위한 인터페이스를 포함하는 조명 디바이스
EP2284440A1 (fr) * 2009-08-14 2011-02-16 Koninklijke Philips Electronics N.V. Connecteur pour la connexion d'un composant à un dissipateur de chaleur
DE102009036122B4 (de) 2009-08-05 2011-07-21 BJB GmbH & Co. KG, 59755 Lampensockel und Lampenfassung
US8414178B2 (en) * 2009-08-12 2013-04-09 Journée Lighting, Inc. LED light module for use in a lighting assembly
EP2706292A1 (fr) 2010-04-26 2014-03-12 Xicato, Inc. Fixation de module d'éclairage à DEL à un luminaire

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US9146021B2 (en) 2015-09-29
WO2012135877A3 (fr) 2012-12-13
DE112012001614A5 (de) 2014-01-09
CN103597281B (zh) 2016-12-28
WO2012135877A2 (fr) 2012-10-11
EP2694875A2 (fr) 2014-02-12
AT12910U1 (de) 2013-01-15
US20140092608A1 (en) 2014-04-03
CN103597281A (zh) 2014-02-19

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