EP2683520A4 - Procédé et appareil permettant de marquer au laser des articles de manière fiable - Google Patents

Procédé et appareil permettant de marquer au laser des articles de manière fiable

Info

Publication number
EP2683520A4
EP2683520A4 EP11860649.0A EP11860649A EP2683520A4 EP 2683520 A4 EP2683520 A4 EP 2683520A4 EP 11860649 A EP11860649 A EP 11860649A EP 2683520 A4 EP2683520 A4 EP 2683520A4
Authority
EP
European Patent Office
Prior art keywords
laser marking
marking articles
reliably laser
reliably
articles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11860649.0A
Other languages
German (de)
English (en)
Other versions
EP2683520A1 (fr
Inventor
Haibin Zhang
Glenn Simenson
Robert Hainsey
David Barsic
Jeffrey Howerton
Wayne Crowther
Patrick Leonard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of EP2683520A1 publication Critical patent/EP2683520A1/fr
Publication of EP2683520A4 publication Critical patent/EP2683520A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046Automatically focusing the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • B23K26/364Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/34Coated articles, e.g. plated or painted; Surface treated articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/34Coated articles, e.g. plated or painted; Surface treated articles
    • B23K2101/35Surface treated articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • B23K2103/10Aluminium or alloys thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/16Composite materials, e.g. fibre reinforced

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)
EP11860649.0A 2011-03-10 2011-03-10 Procédé et appareil permettant de marquer au laser des articles de manière fiable Withdrawn EP2683520A4 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2011/027943 WO2012121733A1 (fr) 2011-03-10 2011-03-10 Procédé et appareil permettant de marquer au laser des articles de manière fiable

Publications (2)

Publication Number Publication Date
EP2683520A1 EP2683520A1 (fr) 2014-01-15
EP2683520A4 true EP2683520A4 (fr) 2016-05-11

Family

ID=46798495

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11860649.0A Withdrawn EP2683520A4 (fr) 2011-03-10 2011-03-10 Procédé et appareil permettant de marquer au laser des articles de manière fiable

Country Status (5)

Country Link
EP (1) EP2683520A4 (fr)
JP (1) JP2014509946A (fr)
KR (1) KR101881621B1 (fr)
CN (1) CN103228399B (fr)
WO (1) WO2012121733A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9290008B1 (en) 2011-09-20 2016-03-22 Nlight Photonics Corporation Laser marking method and system
RU2615381C1 (ru) * 2015-09-21 2017-04-04 Владимир Ефимович Рогалин Способ лазерной маркировки поверхности изделия из алюминия или его сплава с оксидным внешним слоем
US9837784B2 (en) 2015-12-28 2017-12-05 Nlight, Inc. Fully controllable burst shaping individual pulses from picosecond fiber lasers
CN106529620A (zh) * 2016-11-02 2017-03-22 努比亚技术有限公司 一种样机及其安全管控方法和安全管控系统
CN106335289A (zh) * 2016-11-18 2017-01-18 深圳英诺激光科技有限公司 一种在透明材料上进行白色或彩色打标的设备及方法
DE102017202269A1 (de) * 2017-02-13 2018-08-16 Sauer Gmbh Verfahren zur bearbeitung einer werkstückoberfläche mittels eines lasers
CN107685197A (zh) * 2017-09-22 2018-02-13 南京理工大学 利用线型激光源对铸造砂型进行刻槽的加工装置及方法
CN109365995A (zh) * 2018-12-06 2019-02-22 哈尔滨工业大学 一种高度均一的微锥阵列结构的制备方法
CN109986212A (zh) * 2019-05-13 2019-07-09 大族激光科技产业集团股份有限公司 一种激光彩色打标系统及其方法
CN111230320B (zh) * 2020-03-16 2022-05-17 深圳泰德激光技术股份有限公司 一种阳极氧化铝表面的激光打标方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5215864A (en) * 1990-09-28 1993-06-01 Laser Color Marking, Incorporated Method and apparatus for multi-color laser engraving
US6777098B2 (en) * 1999-11-11 2004-08-17 Koninklijke Philips Electronics N.V. Marking of an anodized layer of an aluminium object
US7126746B2 (en) * 2003-08-19 2006-10-24 Electro Scientific Industries, Inc. Generating sets of tailored laser pulses
WO2008091898A1 (fr) * 2007-01-23 2008-07-31 Imra America, Inc. Impression de microtexture par laser ultra-bref
WO2011047325A1 (fr) * 2009-10-16 2011-04-21 Apple Inc. Marquage de sous-surface de boîtiers de produit
WO2012121732A1 (fr) * 2011-03-10 2012-09-13 Electro Scientific Industries, Inc. Procédé et appareil permettant de marquer au laser des articles de manière fiable

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4547649A (en) * 1983-03-04 1985-10-15 The Babcock & Wilcox Company Method for superficial marking of zirconium and certain other metals
JPH0761198A (ja) * 1993-08-26 1995-03-07 Yoshioka Fujio レーザによる金属のカラーマーキング方法
JPH07204871A (ja) * 1994-01-20 1995-08-08 Fuji Electric Co Ltd マーキング方法
CN2477555Y (zh) * 2001-02-26 2002-02-20 宏全国际股份有限公司 具有镭射标记的包装容器
GB0127410D0 (en) * 2001-11-15 2002-01-09 Renishaw Plc Laser substrate treatment
GB0201101D0 (en) * 2002-01-18 2002-03-06 Renishaw Plc Laser marking
US6710287B2 (en) * 2002-08-22 2004-03-23 Fu Sheng Industrial Co., Ltd. Laser engraving and coloring method for a golf club head
US20060000814A1 (en) * 2004-06-30 2006-01-05 Bo Gu Laser-based method and system for processing targeted surface material and article produced thereby
GB0507465D0 (en) * 2005-04-13 2005-05-18 Renishaw Plc Method of scale manufacture
JP2007229778A (ja) * 2006-03-02 2007-09-13 Toppan Printing Co Ltd マーキング方法及び装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5215864A (en) * 1990-09-28 1993-06-01 Laser Color Marking, Incorporated Method and apparatus for multi-color laser engraving
US6777098B2 (en) * 1999-11-11 2004-08-17 Koninklijke Philips Electronics N.V. Marking of an anodized layer of an aluminium object
US7126746B2 (en) * 2003-08-19 2006-10-24 Electro Scientific Industries, Inc. Generating sets of tailored laser pulses
WO2008091898A1 (fr) * 2007-01-23 2008-07-31 Imra America, Inc. Impression de microtexture par laser ultra-bref
WO2011047325A1 (fr) * 2009-10-16 2011-04-21 Apple Inc. Marquage de sous-surface de boîtiers de produit
WO2012121732A1 (fr) * 2011-03-10 2012-09-13 Electro Scientific Industries, Inc. Procédé et appareil permettant de marquer au laser des articles de manière fiable

Also Published As

Publication number Publication date
CN103228399B (zh) 2016-04-13
WO2012121733A1 (fr) 2012-09-13
KR20140008522A (ko) 2014-01-21
KR101881621B1 (ko) 2018-07-24
CN103228399A (zh) 2013-07-31
JP2014509946A (ja) 2014-04-24
EP2683520A1 (fr) 2014-01-15

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