EP2683519A4 - Procédé et appareil permettant de marquer au laser des articles de manière fiable - Google Patents

Procédé et appareil permettant de marquer au laser des articles de manière fiable

Info

Publication number
EP2683519A4
EP2683519A4 EP11860642.5A EP11860642A EP2683519A4 EP 2683519 A4 EP2683519 A4 EP 2683519A4 EP 11860642 A EP11860642 A EP 11860642A EP 2683519 A4 EP2683519 A4 EP 2683519A4
Authority
EP
European Patent Office
Prior art keywords
laser marking
marking articles
reliably laser
reliably
articles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11860642.5A
Other languages
German (de)
English (en)
Other versions
EP2683519A1 (fr
Inventor
Haibin Zhang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of EP2683519A1 publication Critical patent/EP2683519A1/fr
Publication of EP2683519A4 publication Critical patent/EP2683519A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/009—Working by laser beam, e.g. welding, cutting or boring using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/262—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used recording or marking of inorganic surfaces or materials, e.g. glass, metal, or ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B23K2101/35—Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)
EP11860642.5A 2011-03-10 2011-03-10 Procédé et appareil permettant de marquer au laser des articles de manière fiable Withdrawn EP2683519A4 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2011/027937 WO2012121732A1 (fr) 2011-03-10 2011-03-10 Procédé et appareil permettant de marquer au laser des articles de manière fiable

Publications (2)

Publication Number Publication Date
EP2683519A1 EP2683519A1 (fr) 2014-01-15
EP2683519A4 true EP2683519A4 (fr) 2015-11-11

Family

ID=46798494

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11860642.5A Withdrawn EP2683519A4 (fr) 2011-03-10 2011-03-10 Procédé et appareil permettant de marquer au laser des articles de manière fiable

Country Status (5)

Country Link
EP (1) EP2683519A4 (fr)
JP (1) JP2014509945A (fr)
KR (3) KR20190095553A (fr)
CN (1) CN103415370B (fr)
WO (1) WO2012121732A1 (fr)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101881621B1 (ko) * 2011-03-10 2018-07-24 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 물품을 신뢰성 높게 레이저 마킹하기 위한 방법 및 장치
US9290008B1 (en) * 2011-09-20 2016-03-22 Nlight Photonics Corporation Laser marking method and system
US20130083500A1 (en) * 2011-09-30 2013-04-04 Christopher D. Prest Interferometric color marking
EP2922657B1 (fr) * 2012-11-24 2020-03-04 SPI Lasers UK Limited Procédé de marquage laser de surface métallique ayant une couleur désirée
CN105522282B (zh) * 2013-03-27 2021-04-27 丁雪强 一种激光打标方法
AU2014278451B2 (en) 2013-06-09 2017-05-18 Apple Inc. Laser-formed features
EP3033198A4 (fr) * 2013-08-16 2017-06-28 Electro Scientific Industries, Inc. Systèmes et procédés au laser destinés au marquage interne de couches minces, et articles produits de la sorte
GB2520945A (en) * 2013-12-03 2015-06-10 Spi Lasers Uk Ltd Method for laser marking an anodized metal surface with a desired colour
CN106921107B (zh) 2015-12-28 2019-04-19 恩耐公司 来自皮秒光纤激光器的完全可控突发成形的个体脉冲
CN108349296B (zh) * 2016-09-06 2019-11-05 苹果公司 阳极化表面的激光漂白标记
US10787753B2 (en) 2016-09-14 2020-09-29 Apple Inc. Anodized substrates with dark laser markings
CN108262564A (zh) * 2017-01-04 2018-07-10 大族激光科技产业集团股份有限公司 一种激光打标装置及方法
US11200386B2 (en) 2018-09-27 2021-12-14 Apple Inc. Electronic card having an electronic interface
KR102186568B1 (ko) * 2018-11-08 2020-12-03 한국생산기술연구원 금속 표면 색상 구현 방법 및 표면 색상이 구현된 금속 판재
WO2020104972A1 (fr) * 2018-11-21 2020-05-28 Huf Technologies Gmbh Procédé de marquage par impulsion d'une surface métallique
US11571766B2 (en) 2018-12-10 2023-02-07 Apple Inc. Laser marking of an electronic device through a cover
US11299421B2 (en) 2019-05-13 2022-04-12 Apple Inc. Electronic device enclosure with a glass member having an internal encoded marking
TN2021000224A1 (en) * 2019-07-01 2023-07-04 Tamer Akcay Ve Ortaklari Bilisim Sistemleri Kollektif Sirketi A machine processing textile with laser and its method
WO2021000966A1 (fr) * 2019-07-02 2021-01-07 Master Dynamic Limited Procédé de marquage d'un matériau à l'état solide, marques formées à partir de tels procédés et matériaux à l'état solide marqués selon un tel procédé

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040000490A1 (en) * 2002-06-28 2004-01-01 Suli Chang Method of forming mark on anodized surface of aluminum object
WO2011047325A1 (fr) * 2009-10-16 2011-04-21 Apple Inc. Marquage de sous-surface de boîtiers de produit

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4335295A (en) * 1979-05-09 1982-06-15 Fowler Gary J Method of marking a metal device
US4547649A (en) * 1983-03-04 1985-10-15 The Babcock & Wilcox Company Method for superficial marking of zirconium and certain other metals
JPH0761198A (ja) * 1993-08-26 1995-03-07 Yoshioka Fujio レーザによる金属のカラーマーキング方法
JPH07204871A (ja) * 1994-01-20 1995-08-08 Fuji Electric Co Ltd マーキング方法
US6590183B1 (en) * 1999-11-11 2003-07-08 Koninklijke Philips Electronics N.V. Marking of an anodized layer of an aluminum object
CN1981291B (zh) * 2004-06-30 2011-06-15 通明国际科技有限公司 基于激光的用于处理目标表面材料的方法
CN101851350B (zh) * 2009-03-31 2013-11-06 上海金发科技发展有限公司 一种塑料用激光标记助剂及其制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040000490A1 (en) * 2002-06-28 2004-01-01 Suli Chang Method of forming mark on anodized surface of aluminum object
WO2011047325A1 (fr) * 2009-10-16 2011-04-21 Apple Inc. Marquage de sous-surface de boîtiers de produit

Also Published As

Publication number Publication date
EP2683519A1 (fr) 2014-01-15
KR20180071396A (ko) 2018-06-27
JP2014509945A (ja) 2014-04-24
KR20140008521A (ko) 2014-01-21
KR101869435B1 (ko) 2018-06-21
KR20190095553A (ko) 2019-08-14
CN103415370B (zh) 2016-08-24
WO2012121732A1 (fr) 2012-09-13
CN103415370A (zh) 2013-11-27

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