EP2653574A4 - COPPER ALLOY AND METHOD OF MANUFACTURING THE SAME - Google Patents

COPPER ALLOY AND METHOD OF MANUFACTURING THE SAME

Info

Publication number
EP2653574A4
EP2653574A4 EP11848127.4A EP11848127A EP2653574A4 EP 2653574 A4 EP2653574 A4 EP 2653574A4 EP 11848127 A EP11848127 A EP 11848127A EP 2653574 A4 EP2653574 A4 EP 2653574A4
Authority
EP
European Patent Office
Prior art keywords
manufacturing
same
copper alloy
alloy
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP11848127.4A
Other languages
German (de)
French (fr)
Other versions
EP2653574A1 (en
EP2653574B1 (en
Inventor
Kiyohito Ishida
Ryosuke Kainuma
Ikuo Ohnuma
Toshihiro Omori
Takashi Miyamoto
Hiroki Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Seisen Co Ltd
Tohoku Techno Arch Co Ltd
Original Assignee
Nippon Seisen Co Ltd
Tohoku Techno Arch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Seisen Co Ltd, Tohoku Techno Arch Co Ltd filed Critical Nippon Seisen Co Ltd
Publication of EP2653574A1 publication Critical patent/EP2653574A1/en
Publication of EP2653574A4 publication Critical patent/EP2653574A4/en
Application granted granted Critical
Publication of EP2653574B1 publication Critical patent/EP2653574B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
EP11848127.4A 2010-12-13 2011-12-13 Copper alloy and method for producing copper alloy Active EP2653574B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010276607 2010-12-13
PCT/JP2011/078786 WO2012081573A1 (en) 2010-12-13 2011-12-13 Copper alloy and method for producing copper alloy

Publications (3)

Publication Number Publication Date
EP2653574A1 EP2653574A1 (en) 2013-10-23
EP2653574A4 true EP2653574A4 (en) 2014-09-10
EP2653574B1 EP2653574B1 (en) 2017-05-31

Family

ID=46244672

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11848127.4A Active EP2653574B1 (en) 2010-12-13 2011-12-13 Copper alloy and method for producing copper alloy

Country Status (6)

Country Link
US (1) US20130333812A1 (en)
EP (1) EP2653574B1 (en)
JP (1) JP5743165B2 (en)
KR (1) KR101576715B1 (en)
CN (1) CN103328665B (en)
WO (1) WO2012081573A1 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2653575B1 (en) * 2010-12-13 2016-07-27 Nippon Seisen Co., Ltd. Copper alloy wire and copper alloy spring
KR102370860B1 (en) * 2014-03-25 2022-03-07 후루카와 덴키 고교 가부시키가이샤 Copper alloy sheet material, connector, and method for manufacturing copper alloy sheet material
CN104532055A (en) * 2014-11-21 2015-04-22 华南理工大学 High nickel-content deformable aluminum white copper alloy material, and preparation method thereof
CN104711451B (en) * 2015-01-30 2017-04-12 湖南科技大学 High temperature oxidation and heat resistant copper-nickel-based alloy
JP5925936B1 (en) * 2015-04-22 2016-05-25 日本碍子株式会社 Copper alloy
EP3085799B1 (en) * 2015-04-22 2018-01-17 NGK Insulators, Ltd. Copper alloy and method for manufacturing the same
CN105088009A (en) * 2015-07-26 2015-11-25 邢桂生 Copper alloy frame strip and making method thereof
CN105088008A (en) * 2015-07-26 2015-11-25 邢桂生 Microalloyed copper alloy frame strip and manufacturing method thereof
CN105316523A (en) * 2015-12-02 2016-02-10 苏州龙腾万里化工科技有限公司 Durable resistance alloy for milling machine regulator
DE102016006824B4 (en) * 2016-06-03 2025-04-10 Wieland-Werke Ag Copper alloy and its uses
KR102119552B1 (en) * 2016-12-02 2020-06-05 후루카와 덴키 고교 가부시키가이샤 Copper alloy wire and method for manufacturing copper alloy wire
KR102648370B1 (en) * 2017-02-04 2024-03-15 마테리온 코포레이션 Copper-nickel-tin alloy
JP6869119B2 (en) * 2017-06-14 2021-05-12 Ｄｏｗａメタルテック株式会社 Cu-Ni-Al-based copper alloy plate material, manufacturing method, and conductive spring member
JP7145070B2 (en) * 2017-06-22 2022-09-30 日本精線株式会社 COPPER ALLOY EXTRA FINE WIRE FOR SPRINGS AND METHOD FOR MANUFACTURING SAME
CN107653384A (en) * 2017-08-31 2018-02-02 宋宏婷 A kind of preparation method of in-situ preparation nickel aluminide enhancing Cu-base composites
JP7202121B2 (en) * 2018-09-27 2023-01-11 Ｄｏｗａメタルテック株式会社 Cu-Ni-Al-based copper alloy plate material, manufacturing method thereof, and conductive spring member
JP7181768B2 (en) * 2018-11-13 2022-12-01 Ｄｏｗａメタルテック株式会社 High Young's Modulus Cu--Ni--Al Copper Alloy Plate Material, Manufacturing Method Thereof, and Conductive Spring Member
CN110551917B (en) * 2019-09-29 2021-07-09 广东和润新材料股份有限公司 A kind of high-conductivity and corrosion-resistant copper strip and preparation method thereof
JP7534883B2 (en) * 2020-07-29 2024-08-15 Ｄｏｗａメタルテック株式会社 Cu-Ni-Al copper alloy sheet material, its manufacturing method and conductive spring member
CN115735017B (en) * 2020-07-29 2025-08-26 同和金属技术有限公司 Cu-Ni-Al copper alloy plate, manufacturing method thereof and conductive spring component
CN115094266B (en) * 2022-07-05 2023-06-27 中南大学 High-strength conductive elastic copper alloy and preparation method thereof
CN116815009A (en) * 2023-05-08 2023-09-29 大连理工大学 A multi-component complex coherent precipitation strengthened Cu-Ni-Al-Cr-Ti high temperature resistant copper alloy and its preparation method
JP7610667B1 (en) 2023-09-11 2025-01-08 日本精線株式会社 Copper alloy
CN117568656B (en) * 2023-10-25 2026-01-20 宁波金田铜业(集团)股份有限公司 Copper alloy strip and preparation method and application thereof
CN117535553B (en) * 2023-11-14 2025-09-26 安徽工程大学 A high-strength Cu alloy resistant to high-temperature oxidation and softening and its preparation method

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2051127A (en) * 1979-04-30 1981-01-14 Delta Enfield Metals Precipitation hardening copper alloys
JPH02179839A (en) * 1988-12-29 1990-07-12 Kobe Steel Ltd High strength copper alloy having excellent impact resistance
JPH03126829A (en) * 1989-10-06 1991-05-30 Sumitomo Metal Mining Co Ltd Non-pyrophoric copper alloy for tool
JPH03173730A (en) * 1989-12-01 1991-07-29 Sumitomo Metal Mining Co Ltd Non-incendive copper alloy for tools
JPH0499140A (en) * 1990-08-03 1992-03-31 Hitachi Ltd Mold materials for plastic molding
DE4226692A1 (en) * 1991-08-13 1993-03-04 Mitsubishi Materials Corp Age-hardenable copper@ alloy - contains aluminium@, nickel@, silicon@, titanium@ and/or zirconium@, giving improved high-temp. tensile strength and electroconductivity
JPH07268512A (en) * 1994-03-30 1995-10-17 Mitsubishi Materials Corp Heat-resistant copper alloy excellent in thermal conductivity, high-temperature hardness and oxidation resistance, and a baking mold made of this heat-resistant copper alloy
JP2010007174A (en) * 2008-05-29 2010-01-14 Nippon Mining & Metals Co Ltd Cu-Ni-Si-BASED ALLOY PLATE OR BAR FOR ELECTRONIC MATERIAL

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US2851353A (en) * 1953-07-15 1958-09-09 Ibm Copper-base alloys
US4378332A (en) * 1981-06-15 1983-03-29 Ford Motor Company Aluminum hardened copper alloy
US4692192A (en) * 1984-10-30 1987-09-08 Ngk Insulators, Ltd. Electroconductive spring material
JPH0238653B2 (en) * 1986-01-27 1990-08-31 Kobe Steel Ltd PURASUCHITSUKUKANAGATAYODOGOKINOYOBISONOSEIZOHOHO
JPS63210247A (en) * 1987-02-27 1988-08-31 Sumitomo Metal Mining Co Ltd High strength copper alloy
JPS63266033A (en) * 1987-04-23 1988-11-02 Mitsubishi Electric Corp Copper alloy
JP3383615B2 (en) * 1999-08-05 2003-03-04 日鉱金属株式会社 Copper alloy for electronic materials and manufacturing method thereof
JP3465108B2 (en) 2000-05-25 2003-11-10 株式会社神戸製鋼所 Copper alloy for electric and electronic parts
JP4728704B2 (en) 2005-06-01 2011-07-20 古河電気工業株式会社 Copper alloy for electrical and electronic equipment
WO2006093140A1 (en) * 2005-02-28 2006-09-08 The Furukawa Electric Co., Ltd. Copper alloy
JP4501818B2 (en) 2005-09-02 2010-07-14 日立電線株式会社 Copper alloy material and method for producing the same
JP4408275B2 (en) * 2005-09-29 2010-02-03 日鉱金属株式会社 Cu-Ni-Si alloy with excellent strength and bending workability
JP2007126739A (en) 2005-11-07 2007-05-24 Nikko Kinzoku Kk Copper alloy for electronic material
JP2008266787A (en) 2007-03-28 2008-11-06 Furukawa Electric Co Ltd:The Copper alloy material and method for producing the same
JP4440313B2 (en) 2008-03-31 2010-03-24 日鉱金属株式会社 Cu-Ni-Si-Co-Cr alloy for electronic materials
JP5261122B2 (en) 2008-10-03 2013-08-14 Ｄｏｗａメタルテック株式会社 Copper alloy sheet and manufacturing method thereof
EP2653575B1 (en) * 2010-12-13 2016-07-27 Nippon Seisen Co., Ltd. Copper alloy wire and copper alloy spring

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2051127A (en) * 1979-04-30 1981-01-14 Delta Enfield Metals Precipitation hardening copper alloys
JPH02179839A (en) * 1988-12-29 1990-07-12 Kobe Steel Ltd High strength copper alloy having excellent impact resistance
JPH03126829A (en) * 1989-10-06 1991-05-30 Sumitomo Metal Mining Co Ltd Non-pyrophoric copper alloy for tool
JPH03173730A (en) * 1989-12-01 1991-07-29 Sumitomo Metal Mining Co Ltd Non-incendive copper alloy for tools
JPH0499140A (en) * 1990-08-03 1992-03-31 Hitachi Ltd Mold materials for plastic molding
DE4226692A1 (en) * 1991-08-13 1993-03-04 Mitsubishi Materials Corp Age-hardenable copper@ alloy - contains aluminium@, nickel@, silicon@, titanium@ and/or zirconium@, giving improved high-temp. tensile strength and electroconductivity
JPH07268512A (en) * 1994-03-30 1995-10-17 Mitsubishi Materials Corp Heat-resistant copper alloy excellent in thermal conductivity, high-temperature hardness and oxidation resistance, and a baking mold made of this heat-resistant copper alloy
JP2010007174A (en) * 2008-05-29 2010-01-14 Nippon Mining & Metals Co Ltd Cu-Ni-Si-BASED ALLOY PLATE OR BAR FOR ELECTRONIC MATERIAL

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
"Mechanical Properties of Intermetallic Compounds Formed Between Tin (Solder) and Copper or Nickel - Hardness as a function of temperature for Cu6Sn5, Cu3Sn, and Ni3Sn4", 23 July 2014 (2014-07-23), pages 1 - 2, XP002727695, Retrieved from the Internet <URL:http://www.msed.nist.gov/mechanical_properties/solder_mechanicalprop.html> [retrieved on 20140723] *
GRYZIECKI JANUSZ ET AL: "The role of microadditions in the kinetic change of precipitation during the aging process of nickel-aluminium bronze", ARCHIVES OF METALLURGY,, vol. 48, no. 3, 31 December 2003 (2003-12-31), pages 245 - 259, XP009179304 *
See also references of WO2012081573A1 *
ZHU ZHI-YUAN ET AL: "Solid solution and aging of Cu-Ni-Al-Si alloy", JINSHU RECHULI - HEAT TREATMENT OF METALS, ZHONGGUO JIXIE GONGCHENG XUEHUI, RECHULI XUEHUI, BEIJING, CN, vol. 32, no. 4, 31 December 2007 (2007-12-31), pages 83 - 85, XP009179303, ISSN: 0254-6051 *

Also Published As

Publication number Publication date
CN103328665A (en) 2013-09-25
EP2653574A1 (en) 2013-10-23
KR20130089661A (en) 2013-08-12
WO2012081573A1 (en) 2012-06-21
EP2653574B1 (en) 2017-05-31
KR101576715B1 (en) 2015-12-10
CN103328665B (en) 2016-04-13
US20130333812A1 (en) 2013-12-19
JP5743165B2 (en) 2015-07-01
JPWO2012081573A1 (en) 2014-05-22

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