EP2610970B1 - Broche de contact brasable pour cartes de circuit imprimé et procédé de fabrication d'un dispositif électronique - Google Patents

Broche de contact brasable pour cartes de circuit imprimé et procédé de fabrication d'un dispositif électronique Download PDF

Info

Publication number
EP2610970B1
EP2610970B1 EP12199794.4A EP12199794A EP2610970B1 EP 2610970 B1 EP2610970 B1 EP 2610970B1 EP 12199794 A EP12199794 A EP 12199794A EP 2610970 B1 EP2610970 B1 EP 2610970B1
Authority
EP
European Patent Office
Prior art keywords
coupling portion
mechanical coupling
elastic elements
printed circuit
outer edges
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP12199794.4A
Other languages
German (de)
English (en)
Other versions
EP2610970A1 (fr
Inventor
Marco Boano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
VIMERCATI SpA
Original Assignee
Vimercati SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vimercati SpA filed Critical Vimercati SpA
Priority to PL12199794T priority Critical patent/PL2610970T3/pl
Publication of EP2610970A1 publication Critical patent/EP2610970A1/fr
Application granted granted Critical
Publication of EP2610970B1 publication Critical patent/EP2610970B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/55Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board

Definitions

  • the present invention relates to an electronic device comprising a printed circuit board and a solderable contact pin, and a process for manufacturing an electronic device.
  • printed circuit devices comprise printed circuit boards on which various types of components are mounted.
  • Printed circuit boards have metal tracks and contact pads on one or both surfaces and through-holes, usually internally coated with a metallization layer, for mounting and electrically connecting components and, if necessary, for electrical connection between the opposite faces of the boards.
  • contact pins which normally serve as terminals for the electrical connection of external devices.
  • Known contact pins are made for being mounted by press fitting or soldering in the holes of printed circuit boards.
  • Pins of the first type are provided with rather complex connection mechanisms, which must ensure sufficient force to retain the contact pins in their respective seats for the life of the devices.
  • the forces must not be excessive.
  • ensuring this balance between the mounting force and that for pin retention is expensive and critical, as it is necessary to use materials with high mechanical performance and more precise production tools and controls.
  • the electrical properties of the contacts made in this way are sub-optimal.
  • the resistance of the contact can be quite high, as the connection area between hole and pin is limited to the edges in contact and is subject to possible oxidation because it is not protected.
  • press-fit pins examples are disclosed e.g. in DE 41 32 996 A1 , DE 43 21 065 A1 , US 3 428 934 A , GB 2 121 620 A and US 2004/154907 A1 .
  • the press-fit pin of DE 41 32 996 A1 has a mechanical coupling portions in the form of a fork that extends through and projects from a seat in a printed circuit board.
  • Solderable pins are simpler to make and guarantee contacts with optimal electrical properties, due to both the larger extension of the contact area and because the level of conduction is not significantly altered by possible oxidation (which at most is limited to just the surface of the solder joint).
  • the positioning of the contact pins is critical and requires special machines being introduced on the soldering lines. In fact, until soldering is completed, the pins are unsteady and the transfer from a machine outside the soldering line would be highly likely to cause them to come out or, in and case, to move.
  • soldering lines of this type are not very flexible and can only be used for a limited range of printed circuit devices. Their high cost is only justified if the few types of printed circuit devices are produced in sufficient volumes to saturate the production capacity, as the lines cannot be shared with other devices.
  • the object of the present invention is therefore to provide an electronic device comprising a printed circuit board and a solderable contact pin, and a process for manufacturing an electronic device that enables the described limitations to be overcome.
  • an electronic device comprising a printed circuit board and a solderable contact pin, and a process for manufacturing an electronic device are provided as defined in claims 1 and 9, respectively.
  • solderable contact pin for printed circuit boards is indicated as a whole by reference numeral 1.
  • the pin 1 is obtained by shearing from a lamina of metal and comprises a terminal 2 and a mechanical coupling portion 3, which extend along an axis A, on opposite sides of a base 5.
  • the base 5 comprises two facing arms, transversal to axis A and defining a seat for mounting the pin 1 on a printed circuit board (not shown in Figures 1-3 ).
  • the mechanical coupling portion 3 comprises two elastic elements 6 and 7 on opposite sides with respect to axis A and has a length L that is less than the thickness of a printed circuit board on which the pin 1 is intended to be mounted (the length L of the coupling portion is understood as defined between the side of the base 5 from which the mechanical coupling portion 3 projects and a longitudinal extremity, along axis A, of the mechanical coupling portion 3).
  • the elastic elements 6 and 7 form a fork along axis A and are shaped so that, following the insertion of the mechanical coupling portion 3 in an opening (such as a hole of a printed circuit board) with a width less than a maximum distance D between respective outer edges 6a and 7a of the elastic elements 6 and 7, respective free ends 6b and 7b of the elastic elements 6 are rotated towards each other (as shown in Figures 4 and 5 , and which shall be described hereinafter).
  • the elastic elements 6 and 7 have respective contact sections 6c and 7c and respective guide sections 6d and 7d.
  • the contact sections 6c and 7c of the mechanical coupling portion 3 project in the opposite direction with respect to terminal 2 and are connected to the base 5 by a connecting portion 8, which forms a narrowing between the base 5 and the mechanical coupling portion 3.
  • the outer edges 6a and 7a of the elastic elements 6 and 7 are substantially straight and parallel to axis A.
  • the contact sections 6c and 7c of the elastic elements 6 and 7 also form respective hooking elements 9 and 10 with a connecting portion.
  • the hooking elements 9 and 10 are defined by sharp edges at the connection between the respective outer edges 6a and 7a of the elastic elements 6 and 7 and respective edges 11 and 12 of the connecting portion 8.
  • angles ⁇ formed by the outer edges 6a and 7a and the respective edges 11 and 12 of the connecting portion are less than 135°, preferably between 45° and 90°.
  • the sharp edges that define the hooking elements 9 and 10 extend in a perpendicular direction to the outer edges 6a and 7a.
  • the guide sections 6d and 7d are shaped so as to facilitate the rotation of the elastic elements 6 and 7 towards each other following the introduction of the mechanical coupling portion in an opening having a width less than the distance between the outer edges.
  • the outer edges 6a and 7a of the elastic elements 6 and 7 are curvilinear and converge towards each other at the respective free ends 6b and 7b, which are spaced from each other in absence of stress.
  • the elastic elements 6 and 7 are shaped so that the hooking elements 9 and 10 are turned outwards to prevent the extraction of the mechanical coupling portion 3 from an opening in which it has been inserted, thus ensuring temporary locking of the pin 1.
  • Figure 4 shows a step of press fitting the pin 1 into a printed circuit board 15 to manufacture an electronic device 16, part of which is visible in Figure 5 .
  • the operation is performed by a specially provided press-fitting machine 30, of a type in itself known ( Figure 6 ).
  • the printed circuit board 15 has a thickness T that is greater than the length L of the mechanical coupling portion 3 of the pin 1 and has two opposite faces 17 and 18 parallel to each other, on which the conductive tracks 19 are arranged, these being produced, for example, by lamination of a copper layer with subsequent definition via a spark erosion process.
  • the printed circuit board 15 also has through-holes 20 (only one is visible in Figure 4 and to which reference will be made).
  • the through-hole 20 is internally coated with a metallization layer 21, for example, electroplated copper.
  • the metallization layer 21 is connected to a contact pad 23 on face 17 and to one of the tracks 19 on face 18.
  • the clear width W of the through-hole 20 is less than the distance D between the outer edges 6a and 7a of the elastic elements 6 and 7.
  • the shape of the guide sections 6d and 7d causes the rotation of the free ends 6b and 7b of the elastic elements 6 and 7 towards each other and towards axis A (arrows 26 and 27).
  • the contact sections 6c and 7c exert an elastic reaction against the walls of the through-hole 20.
  • the hooking elements 9 and 10 which are turned outwards due to the rotation of the elastic elements 6 and 7, cut into the metallization layer 21 and remain embedded, obstructing the extraction of the mechanical coupling portion 3 from the through-hole 20.
  • the mechanical coupling portion 3 ensures that the pin 1 is temporarily centred and locked to the printed circuit board 15 before further processing steps are performed.
  • the mechanical coupling portion 3 is completely contained between the faces 17 and 18 of the printed circuit board 15 and does not protrude from face 18.
  • the grip offered by the mechanical coupling portion 3 is not sufficient to ensure correct functionality in use, because the contact with the walls of the through-hole 20 is only partially exploited. Nevertheless, the coupling is stable enough to enable transport of the printed circuit board 15 without significant risks of the pins coming out before final soldering.
  • the printed circuit board 15, with the pin 1 pressed in and temporarily retained in the through-hole 20, is then moved from the press-fitting machine 30 to an SMT soldering line 31, which comprises a depositing station 32 and an oven 33 ( Figure 6 ).
  • SMT soldering line 31 which comprises a depositing station 32 and an oven 33 ( Figure 6 ).
  • particles of solder material are deposited on the printed circuit board 15 around the through-hole on the side of the pad 19 and where it is required for manufacturing the electronic device 16.
  • SMT soldering is possible because the length L of the mechanical coupling portion 3 is such that no part of the pin 1 protrudes from face 18.
  • the depositing step normally also provides for the removal of excess solder material by means of a doctor blade, which could not be used with normal protruding press-fit pins.
  • the printed circuit board 15 is then transferred to the oven 33 for fusion.
  • the molten solder material penetrates into the through-hole 20 by capillarity, filling it and forming a solder meniscus on both the side with pad 19 and the side with pad 23.
  • the soldering line is of the wave type.
  • the solder material is thus transferred to the printed circuit board 15 by contact with a crest of a wave in the liquid state that laps the pad 19 and penetrates the metallized hole 20, filling it and creating the solder menisci on both sides of the printed circuit board 15.
  • the electronic device 16 can be used both as a simple connector and as a true processing board, if equipped with further analogue and/or digital components.
  • the invention therefore enables making high-quality soldered contacts (it should be noted that the entire mechanical coupling portion also accomplishes the function of electrical connection to the printed circuit board through the solder material), but without the costs of soldering lines with dedicated press-fitting machines.
  • the mechanical coupling portion of the contact pins may be made in a very simple manner, using ordinary and not special materials, and does not require complex mechanisms with critical details like press-fit pins.
  • the open fork shaped enables exerting sufficient force for temporarily retaining the pins seated in the soldering position.
  • the constructional simplicity results in a low number of production rejects and consequently in high output.
  • a solderable contact pin 100 for printed circuit boards comprises a terminal 102 with an output along an axis C at 90° with respect to the press-fitting axes A and B, a mechanical coupling portion 103 and a base 105.
  • the base 105 which in the described embodiment has a substantially quadrangular frame shape, defines a contact position for mounting the pin 100 on a printed circuit board ( Figure 8 ) .
  • the mechanical coupling portion 103 extends from the base 105 along axis A and comprises two elastic elements 106 and 107, which form a fork and are provided with respective hooking elements 109 and 110, substantially as already described with reference to Figures 1-5 .
  • the mechanical coupling portion 103 has a length L' that is less than the thickness of a printed circuit board on which the pin 1 is destined to be mounted ( Figure 8 ).
  • a centering pin 104 protrudes from the base 105 along axis B, which is parallel to axis A of the mechanical coupling portion 103.
  • the terminal 102 extends from the base 105 transversally to axis A of the mechanical coupling portion 103, in particular along axis C, which is perpendicular to axis A.
  • the pin 100 is mounted on a printed circuit board 115 to manufacture an electronic device 116.
  • the printed circuit board 115 which has a thickness T' greater than the length L' of the mechanical coupling portion 3 of pin 1, has a through-hole 120, provided with a metallization layer 121 and connected to a track 119 and a pad 123, and an auxiliary hole 120' that, in one embodiment, is devoid of metallization to avoid an excessive increase in the press-fit force.
  • the pin 100 is mounted with the mechanical coupling portion 103 inserted and soldered in the through-hole 120, with axis A perpendicular to the faces 117 and 118 of the printed circuit board 120, while the centering pin 104 is inserted in the auxiliary hole 120' without soldering.
  • the centering pin 104 can also be soldered.
  • the soldering can be of the SMT or wave type in this case as well.
  • the terminal 102 is therefore substantially parallel to the faces of the printed circuit board 115.

Claims (10)

  1. Dispositif électronique comprenant une carte de circuit imprimé (15 ; 115), présentant au moins un trou (20 ; 120), et une broche de contact (1 ; 100) dans le trou (20 ; 120), la broche de contact (1; 100) comprenant une borne (2 ; 102) et une portion de couplage mécanique (3 ; 103) s'étendant le long d'un axe (A) ; dans lequel la portion de couplage mécanique (3 ; 103) comprend deux éléments élastiques (6, 7 ; 106, 107) formant une fourche le long de l'axe (A) ; caractérisé en ce que la portion de couplage mécanique (3; 103) présente une longueur (L ; L') inférieure à une épaisseur (T ; T') de la carte de circuit imprimé (15), la broche de contact (1; 100) est une lame métallique et les éléments élastiques (6, 7 ; 106, 107) sont dotés respectivement d'éléments d'accrochage (9, 10; 109, 110); dans lequel les éléments élastiques (6, 7 ; 106, 107) sont formés de sorte que, suivant l'insertion de la portion de couplage mécanique (3 ; 103) dans une ouverture définie par le trou (20 ; 120) présentant une largeur (W) inférieure à une distance maximum (D) entre des arêtes extérieures (6a, 7a) respectives des éléments élastiques (6, 7 ; 106, 107), des extrémités libres (6b, 7b) respectives des éléments élastiques (6, 7 ; 106, 107) sont tournées l'une vers l'autre et les éléments d'accrochage (9, 10 ; 109, 110) sont tournés vers l'extérieur pour empêcher l'extraction de la portion de couplage mécanique (3 ; 103) depuis l'ouverture ; dans lequel les éléments élastiques (6, 7 ; 106, 107) présentent des sections de contact respectives (6c, 7c) et des sections de guidage respectives (6d, 7d), et dans lequel les sections de guidage (6d, 7d) sont formées de sorte à faciliter la rotation des éléments élastiques (6, 7 ; 106, 107) l'un vers l'autre suivant l'introduction de la portion de couplage mécanique (3 ; 103) dans une ouverture présentant une largeur (W) inférieure à la distance (D) entre les arêtes extérieures (6a, 7a) ; et dans lequel les éléments d'accrochage (9, 10; 109, 110) sont définis par des arêtes vives transversales aux arêtes extérieures (6a, 7a) des éléments élastiques (6, 7 ; 106, 107) dans les sections de contact (6c, 7c), sur les extrémités des arêtes extérieures (6a, 7a) opposées aux extrémités libres (6b, 7b).
  2. Dispositif selon la revendication 1, dans lequel la portion de couplage mécanique (3 ; 103) est raccordée à la borne (2 ; 102) par une portion de connexion (8) et les éléments d'accrochage (9, 10 ; 109, 110) sont définis par des arêtes extérieures respectives (6a, 7a) et par des arêtes respectives de la portion de connexion (8).
  3. Dispositif selon la revendication 2, dans lequel les arêtes extérieures (6a, 7a) de la portion de couplage mécanique (3 ; 103) et les arêtes respectives de la portion de connexion (8) forment des angles (α) inférieurs à 135°.
  4. Dispositif selon l'une quelconque des revendications précédentes, dans lequel les extrémités libres (6b, 7b) des éléments élastiques (6, 7 ; 106, 107) sont espacées l'une de l'autre en l'absence de contrainte.
  5. Dispositif selon l'une quelconque des revendications précédentes, présentant la portion de couplage mécanique (3 ; 103) brasée dans le trou (20 ; 120).
  6. Dispositif selon la revendication 5, dans lequel la portion de couplage mécanique (3 ; 103) est complètement contenue entre les faces opposées (17, 18 ; 117, 118) de la carte de circuit imprimé (15 ; 115).
  7. Dispositif selon la revendication 6, dans lequel le trou (20 ; 120) est revêtu en interne d'une couche de métallisation (21 ; 121).
  8. Dispositif selon la revendication 7, dans lequel la couche de métallisation (21 ; 121) est découpée par les éléments d'accrochage (9, 10 ; 109, 110) de la portion de couplage mécanique (3 ; 103).
  9. Procédé de fabrication d'un dispositif électronique, comprenant les étapes de :
    obtenir une broche de contact (1 ; 100) présentant une borne (2 ; 102) et une portion de couplage mécanique (3 ; 103), s'étendant le long d'un axe (A) ; dans lequel la portion de couplage mécanique (3 ; 103) comprend deux éléments élastiques (6, 7 ; 106, 107), formant une fourche le long de l'axe (A) ;
    caractérisé par :
    l'obtention d'une carte de circuit imprimé (15 ; 115), présentant au moins un trou (20 ; 120) avec une largeur (W) inférieure à la distance maximum (D) entre les arêtes extérieures respectives (6a, 7a) des éléments élastiques (6, 7 ; 106, 107), la longueur (L ; L') de la portion de couplage mécanique (3 ; 103) étant inférieure à l'épaisseur (T ; T') de la carte de circuit imprimé (5 ; 105) ;
    l'ajustement par pressage de la portion de couplage mécanique (3 ; 103) de la broche de contact (1 ; 100) dans le trou (20 ; 120) ; et
    le brasage de la portion de couplage mécanique (3 ; 103) de la broche de contact (1 ; 100) dans le trou (20 ; 120) ;
    dans lequel la broche de contact (1 ; 100) est une lame métallique et les éléments élastiques (6, 7 ; 106, 107) sont dotés respectivement d'éléments d'accrochage (9, 10 ; 109, 110) ; dans lequel les éléments élastiques (6, 7 ; 106, 107) sont formés de sorte que, suivant l'insertion de la portion de couplage mécanique (3 ; 103) dans une ouverture définie par le trou (20; 120) présentant une largeur (W) inférieure à une distance maximum (D) entre des arêtes extérieures (6a, 7a) respectives des éléments élastiques (6, 7 ; 106, 107), des extrémités libres (6b, 7b) respectives des éléments élastiques (6, 7 ; 106, 107) soient tournées l'une vers l'autre et les éléments d'accrochage (9, 10 ; 109, 110) soient tournés vers l'extérieur pour empêcher l'extraction de la portion de couplage mécanique (3 ; 103) depuis l'ouverture ; dans lequel les éléments élastiques (6, 7 ; 106, 107) présentent des sections de contact respectives (6c, 7c) et des sections de guidage respectives (6d, 7d), et dans lequel les sections de guidage (6d, 7d) sont formées de sorte à faciliter la rotation des éléments élastiques (6, 7 ; 106, 107) l'un vers l'autre suivant l'introduction de la portion de couplage mécanique (3 ; 103) dans une ouverture présentant une largeur (W) inférieure à la distance (D) entre les arêtes extérieures (6a, 7a) ; et dans lequel les éléments d'accrochage (9, 10 ; 109, 110) sont définis par des arêtes vives transversales aux arêtes extérieures (6a, 7a) des éléments élastiques (6, 7 ; 106, 107) dans les sections de contact (6c, 7c), sur les extrémités des arêtes extérieures (6a, 7a) opposées aux extrémités libres (6b, 7b).
  10. Procédé selon la revendication 9, comprenant le dépôt d'un matériau de brasage (28) après l'étape d'ajustement par pressage et avant l'étape de brasage.
EP12199794.4A 2011-12-30 2012-12-31 Broche de contact brasable pour cartes de circuit imprimé et procédé de fabrication d'un dispositif électronique Not-in-force EP2610970B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL12199794T PL2610970T3 (pl) 2011-12-30 2012-12-31 Wtyk kontaktowy nadający się do lutowania miękkiego dla płytek z obwodami drukowanymi oraz proces wytwarzania urządzenia elektronicznego

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT001245A ITTO20111245A1 (it) 2011-12-30 2011-12-30 Piedino di contatto a saldare per schede a circuiti stampati e procedimento per realizzare un dispositivo elettronico

Publications (2)

Publication Number Publication Date
EP2610970A1 EP2610970A1 (fr) 2013-07-03
EP2610970B1 true EP2610970B1 (fr) 2018-07-25

Family

ID=45614977

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12199794.4A Not-in-force EP2610970B1 (fr) 2011-12-30 2012-12-31 Broche de contact brasable pour cartes de circuit imprimé et procédé de fabrication d'un dispositif électronique

Country Status (5)

Country Link
EP (1) EP2610970B1 (fr)
ES (1) ES2682245T3 (fr)
IT (1) ITTO20111245A1 (fr)
PL (1) PL2610970T3 (fr)
PT (1) PT2610970T (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016164825A (ja) * 2015-03-06 2016-09-08 富士電機株式会社 接続端子

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5497546A (en) * 1992-09-21 1996-03-12 Matsushita Electric Works, Ltd. Method for mounting lead terminals to circuit board

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3428934A (en) * 1967-02-28 1969-02-18 Amp Inc Electrical connector for printed circuit board
GB2121620A (en) * 1982-06-08 1983-12-21 Oxley Dev Co Ltd Connectors pins for printed circuit boards
DE4132996C2 (de) * 1991-05-16 2003-03-20 Eads Deutschland Gmbh Kontaktstift für Leiterplatten
DE4321065A1 (de) * 1993-06-24 1995-01-19 Phoenix Contact Gmbh & Co Anschlußleiste
US7030325B2 (en) * 2002-12-16 2006-04-18 Trw Automotive U.S. Llc Electrical switch assembly

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5497546A (en) * 1992-09-21 1996-03-12 Matsushita Electric Works, Ltd. Method for mounting lead terminals to circuit board

Also Published As

Publication number Publication date
PL2610970T3 (pl) 2018-12-31
ES2682245T3 (es) 2018-09-19
EP2610970A1 (fr) 2013-07-03
ITTO20111245A1 (it) 2013-07-01
PT2610970T (pt) 2018-10-10

Similar Documents

Publication Publication Date Title
CN207834619U (zh) 电连接器
JP5224067B2 (ja) 基板用端子およびこれを備えた基板用コネクタ
US20060216970A1 (en) Electrical connector terminal and method of producing same
US20070093143A1 (en) Structure of connecting press-fit terminal to board
JP5589409B2 (ja) 実装部品、電子機器および実装方法
EP2259381B1 (fr) Element de retenue, structure de montage comportant l'element de retenue monte dans une carte a circuit electrique, et equipement electronique comportant cet element de retenue
KR101683386B1 (ko) 이중 두께 이중-단부형 수형 블레이드 단자
TWI543450B (zh) Electrical connector
WO1998006149A1 (fr) Connecteur electrique ayant des contacts minces a bords montes en saillie
US7025640B2 (en) Circuit board inter-connection system and method
EP2610970B1 (fr) Broche de contact brasable pour cartes de circuit imprimé et procédé de fabrication d'un dispositif électronique
US20090239396A1 (en) Compression Connector
CA2240967C (fr) Connecteur male pour carte enfichable
US20170085015A1 (en) Printed substrate and printed substrate with terminal using same
JP4043030B2 (ja) 回路基板用電気コネクタ及びこれに伝送基板が接続されたコネクタ組立体
US20050064745A1 (en) Terminal for electrical connector
JP5649969B2 (ja) プラグ装置、プラグコネクタおよび該プラグ装置製造方法
EP2239818A1 (fr) Élément de retenue, structure de montage comportant l'élément de retenue monté dans une carte à circuit électrique, et équipement électronique comportant cet élément de retenue
JP4384193B2 (ja) コネクタ
CN110875530B (zh) 焊接部件
JP2017157718A (ja) 電気回路用部品
JP2000251986A (ja) 電気コネクタ
JP6376168B2 (ja) コネクタ端子用線材およびこれを用いたコネクタ
CN109417235B (zh) 连接器
JP3886397B2 (ja) フレキシブル基板の接続方法

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

17P Request for examination filed

Effective date: 20131227

RBV Designated contracting states (corrected)

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: VIMERCATI S.P.A.

17Q First examination report despatched

Effective date: 20160201

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20180214

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

RIN1 Information on inventor provided before grant (corrected)

Inventor name: BOANO, MARCO

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1022763

Country of ref document: AT

Kind code of ref document: T

Effective date: 20180815

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602012048816

Country of ref document: DE

REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2682245

Country of ref document: ES

Kind code of ref document: T3

Effective date: 20180919

REG Reference to a national code

Ref country code: CH

Ref legal event code: NV

Representative=s name: BOVARD AG PATENT- UND MARKENANWAELTE, CH

REG Reference to a national code

Ref country code: PT

Ref legal event code: SC4A

Ref document number: 2610970

Country of ref document: PT

Date of ref document: 20181010

Kind code of ref document: T

Free format text: AVAILABILITY OF NATIONAL TRANSLATION

Effective date: 20180824

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20180725

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180725

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181025

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181026

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181025

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180725

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20181125

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180725

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180725

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180725

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180725

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180725

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180725

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602012048816

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180725

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180725

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180725

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180725

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180725

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180725

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20190426

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IE

Payment date: 20190408

Year of fee payment: 7

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180725

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20181231

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180725

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20181231

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20181231

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20181231

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: PT

Payment date: 20191211

Year of fee payment: 8

Ref country code: CZ

Payment date: 20191223

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: PL

Payment date: 20191204

Year of fee payment: 8

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180725

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: AT

Payment date: 20191220

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20191226

Year of fee payment: 8

Ref country code: ES

Payment date: 20200123

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: CH

Payment date: 20200113

Year of fee payment: 8

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180725

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20121231

Ref country code: MK

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20180725

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20191231

REG Reference to a national code

Ref country code: AT

Ref legal event code: UEP

Ref document number: 1022763

Country of ref document: AT

Kind code of ref document: T

Effective date: 20180725

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CZ

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201231

Ref country code: PT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210630

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

REG Reference to a national code

Ref country code: AT

Ref legal event code: MM01

Ref document number: 1022763

Country of ref document: AT

Kind code of ref document: T

Effective date: 20201231

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20201231

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201231

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201231

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201231

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201231

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20211227

Year of fee payment: 10

REG Reference to a national code

Ref country code: ES

Ref legal event code: FD2A

Effective date: 20220422

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20211228

Year of fee payment: 10

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210101

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201231

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 602012048816

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20230701

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20221231