EP2601327A1 - Installation de traitement d'un substrat sous vide comprenant un dispositif de refroidissement de secours - Google Patents

Installation de traitement d'un substrat sous vide comprenant un dispositif de refroidissement de secours

Info

Publication number
EP2601327A1
EP2601327A1 EP11757634.8A EP11757634A EP2601327A1 EP 2601327 A1 EP2601327 A1 EP 2601327A1 EP 11757634 A EP11757634 A EP 11757634A EP 2601327 A1 EP2601327 A1 EP 2601327A1
Authority
EP
European Patent Office
Prior art keywords
coolant
cooling device
coolant pump
substrate treatment
pump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11757634.8A
Other languages
German (de)
English (en)
Inventor
Hubertus Von Der Waydbrink
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Von Ardenne GmbH
Original Assignee
Von Ardenne Anlagentechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Von Ardenne Anlagentechnik GmbH filed Critical Von Ardenne Anlagentechnik GmbH
Publication of EP2601327A1 publication Critical patent/EP2601327A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67109Apparatus for thermal treatment mainly by convection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002Cooling arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32458Vessel
    • H01J37/32522Temperature

Definitions

  • Vacuum substrate treatment plant with emergency cooling device
  • the invention relates to an emergency cooling device, in particular for vacuum systems such as substrate coating systems, and a vacuum system with such Notkühl issued.
  • Coating systems, etching systems, etc. are released in the interior of the system chamber due to the high energy conversion during operation, large amounts of heat. This heat must be continually diverted from the plant chamber to the
  • bearings For example, bearings, gaskets, etc., and to
  • the vacuum system usually comprises at least one coolant circuit, which is conducted inside the plant chamber by an active heat source (generated heat) such as a magnetron, a heater and the like and / or by a passive heat source (system component to be protected, which absorbs radiant heat) such as
  • an active heat source generated heat
  • a passive heat source system component to be protected, which absorbs radiant heat
  • This coolant circuit usually has at least one coolant pump outside the installation chamber, which is driven by a drive device, usually an electric motor, is drivable and the
  • Coolant in the coolant circuit between the heat source in the interior of the plant chamber and a heat sink outside the plant chamber, such as a heat exchanger circulate.
  • An object of the invention is to cool the system components to be cooled even in the case
  • Pressure vessels with dry air (CDA) or nitrogen which are usually part of the system anyway and serve to ventilate the plant chamber, could provide pressure for hours and thus drive energy. From this
  • Cooling device for the coolable system component one connected to the coolable system component
  • Coolant circuit with at least a first
  • Coolant pump includes that through a first
  • Cooling device further comprises an emergency cooling device with a running parallel to the first coolant pump branch of the coolant circuit, in which at least one second coolant pump is arranged, which is drivable by a second drive means, and the second
  • Drive device is operated by compressed gas.
  • Notksselssel also connected to another source of pressurized gas, such as a compressor, and yet could be used advantageously for emergency cooling of the vacuum substrate treatment system, without departing from the spirit.
  • a compressor could for example by an internal combustion engine
  • Coolant circuit which at least a first
  • the proposed emergency cooling device at least a second coolant pump with a suction port and a
  • Pressure port which is drivable by a second drive means comprises, and wherein at the suction port and at the pressure port of the second coolant pump
  • Connecting lines are mounted and arranged so that the second coolant pump parallel to the first
  • Coolant pump can be connected to the coolant circuit and wherein the second drive means is operated by compressed gas.
  • Cooling system water cools, fails or can fail for other reasons, a coolant pump while maintaining the coolant circulation. However, the coolant may heat up improperly.
  • the heat capacity of the heat sink must be chosen so that the resulting increase in temperature of the circulating cooling water can not cause damage.
  • Emergency cooling device taken in itself already suitable to safely operate a coolant circuit of a vacuum substrate treatment plant even in case of power failure, For example, by such emergency cooling device to a
  • Vacuum Substrate Treatment System is provided and connected to the coolant circuit in the manner described.
  • the at least one second coolant pump, the at least one second drive device as well as all connecting and connecting lines for the coolant and the compressed gas and optionally further components of the
  • connection lines have connection ends for releasable connection to a coolant circuit, so that the emergency cooling device as a whole movable as an assembly, i. optionally positionable and transportable.
  • the second drive device is connected by a gas supply line with a compressed gas reservoir.
  • the compressed gas reservoir may be an already existing pressure vessel of a vacuum substrate treatment plant.
  • nitrogen is often available in LPG tanks. Depending on the size of the system, it may be necessary to provide very large gas flows over many hours. In nitrogen LPG tanks such large amounts of gas can be stored.
  • the proposed emergency cooling device is also suitable for use with other cooling devices as a redundant cooling system, of course also in other areas than the thin-film technologies.
  • Other compressed gas sources can be used as an energy source, as has also already been explained in connection with the proposed vacuum substrate treatment plant.
  • the second coolant pump is a double diaphragm pump and the second drive device is a pressure change mechanism integrated into the double diaphragm pump.
  • Double diaphragm pumps are known per se and they are available with electric motors, internal combustion engines or the direct
  • the compressed gas is controlled by an automatic
  • Pressure change mechanism in the form of an air control valve, which switches, as soon as a membrane has reached the end position, through one of two directional openings directed to the right or left air chamber of the pump.
  • the pump has two fluid chambers, two air chambers and two diaphragms. In each chamber pair are the liquid chamber and the
  • the diaphragm chamber is alternately closed and opened.
  • These ball valves arranged in the suction ports and pressure ports of the pump open and close, depending on the direction in which the respective diaphragm moves to fill the one fluid chamber (suction side), the other fluid chamber to empty (pressure side) and at the same time the return of coolant to block.
  • the pressure swing mechanism automatically changes the air pressure to the opposite side to reverse the action of the pump.
  • the second coolant pump has a rotating conveying member, as is the case for example in centrifugal pumps, screw pumps and the like, and the second drive means is an air motor, which may be designed for example as a piston engine or screw motor.
  • each Coolant pump Delivery and two or more second coolant pump to be arranged parallel to each other. It can be for each Coolant pump to be provided its own drive means or a common drive means for all parallel coolant pumps can be used.
  • the first coolant pump is arranged to be arranged and so a havariebenntten stoppage of the first coolant pump due to the then missing
  • the invention is based on
  • FIG. 1 shows an embodiment of an emergency cooling device, which is designed as a transportable assembly
  • FIG. 2 in a schematic representation of a
  • Embodiment of a vacuum substrate treatment plant with a coolant circuit and an emergency cooling device according to FIG. 1 Embodiment of a vacuum substrate treatment plant with a coolant circuit and an emergency cooling device according to FIG. 1, and
  • FIG. 3 in a schematic representation a simplified
  • Embodiment of a vacuum substrate treatment plant with a coolant circuit and an emergency cooling device Embodiment of a vacuum substrate treatment plant with a coolant circuit and an emergency cooling device.
  • an emergency cooling device 25 the exemplary embodiment, which is shown in different views in FIG. 1 and whose integration into an existing coolant circuit 24 of a vacuum substrate treatment plant in FIG. 2 is shown schematically, is an emergency cooling device 25, the
  • Components are arranged on a common base frame 6 and the connecting lines manifold 1 and manifold return 4 are formed for releasable connection to the coolant circuit 24 and their
  • Connecting line gas supply line 8 is formed for releasable connection with a compressed gas reservoir 23, so that this Notkühl sensible 25 can be positioned and arbitrarily
  • the emergency cooling device 25 is connected to the manifold flow 1 and the manifold return 4, the purposes of maintenance by shut-off valves 32 are lockable, parallel to
  • Coolant circuit 24 of the main cooling device of the vacuum substrate treatment system connected. This
  • Coolant circuit 24 extends through one or more system components 16 to be cooled in the interior of the system chamber 15.
  • a first coolant pump 17 with a first Drive device 18 and a check valve 26th In the coolant circuit 24, a first coolant pump 17 with a first Drive device 18 and a check valve 26th
  • the heat sink 19 is in the schematic
  • this heat sink may also be a double wall of the installation chamber 15 or a heat exchanger, via which the heat dissipated by the heat source 16 is delivered to a secondary circuit.
  • the emergency cooling device 25 four drivable by compressed gas double diaphragm pumps 2 are hydraulically connected in parallel.
  • the double-diaphragm pumps 2 combine in each case the function of a second coolant pump 20 and a second drive means 21 driving the second coolant pump 20
  • Differential pressure switch 31 generates a signal which can detect the control device of the vacuum substrate treatment system, not shown here, whether the
  • Double diaphragm pumps 2 work or not. With the connections of the headers 1
  • the emergency cooling device 25 is connected to the coolant circuit 24 of the vacuum substrate treatment system, which extends inside the system chamber 15.
  • the four driven by compressed gas double diaphragm pumps 2 are also pneumatically connected in parallel.
  • the inflow of compressed gas for each double diaphragm pump 2 is separately lockable by a respective pressure gas shut-off valve 27.
  • Each connected between two manifolds 1.4 double diaphragm pumps 2 are the input side through the
  • the shut-off valve 9 is designed here as a three-way shut-off valve and therefore allows the optional connection of one of the two compressed gas reservoir 23.
  • a pressure gauge for example, pressure gauge
  • Pressure switch 29 is arranged, which generates a warning signal when the gas pressure is too low.
  • the compressed gas reservoir 23 for nitrogen (N2) also has two
  • Level of the compressed gas reservoir 23 falls below the minimum level or exceeds the maximum level.
  • the mechanical shut-off valve 10 is over the
  • Trigger line 13 controlled independently.
  • the trigger lines 13 are connected to the flow (solid line) and the
  • Coolant circuit 24 acts on a in the interior of the
  • shut-off valve 10 arranged membrane and this keeps the shut-off valve 10 is closed. Is that sinking?
  • Coolant circuit 24 from because the main cooling device has failed, so causes a force acting on the membrane in the interior of the check valve 10 spring, that
  • Double diaphragm pumps 2 are routed and these begin to work.
  • the electropneumatic shut-off valve 11 switched electrically via the trigger line 14. For this purpose, between the flow and return of the coolant circuit 24 a
  • Coolant circuit 24 causes an electrical
  • pneumatic pressure reservoir which is arranged in the interior of the mechanical shut-off valve 10, kept closed.
  • Pressure reservoir empties and the shut-off valve 11 opens, so that the compressed gas is directed to the double diaphragm pumps 2 and these begin to work.
  • shut-off valves 10 and 11 the emergency cooling device can be switched on and off by the parallel to these two shut-off valves 10, 11 arranged manual shut-off valve 12.
  • the emergency cooling device described has made it possible to access energetically usable resources on vacuum substrate treatment systems which can be used for emergency operation of the cooling device, as well as a detector which can operate without current and which recognizes the standstill of the coolant as being critical from the particular risk situation in vacuum substrate treatment systems and the emergency cooling device starts up.
  • Fig. 3 shows a simple embodiment of a
  • a heat source 16 in the form of a system component to be cooled In a plant chamber 15 of a vacuum substrate treatment plant are a heat source 16 in the form of a system component to be cooled and a heat sink 19 in the form of a cooler through which a belonging to a cooling means coolant circuit 24 extends.
  • the cooling device further includes a
  • Coolant circuit 24 arranged first coolant pump 17, which is driven by a first drive means 18 in the form of an electric motor, extending branch, in which a second coolant pump 20, which is driven by a second drive means 21 in the form of an air motor, is arranged.
  • the second coolant pump 20 is replaced by a second Drive device 21 driven, which by a
  • Compressed gas is operable.
  • This pressurized gas is provided by a compressed gas reservoir 23, which is part of the vacuum substrate treatment system and normally for
  • Ventilation of the system chamber 15 is used.
  • Differential pressure switch 22 detects a stoppage of the first coolant pump 17, for example, due to a power failure, and then causes a shut-off valve 9, which is arranged in the gas supply line 8 between compressed gas reservoir 23 and second drive means 21, is opened, so that the second coolant pump 20 with compressed gas is supplied, whereby the coolant is further circulated despite the stoppage of the first coolant pump and thereby the cooling of the heat source 16 is ensured.
  • Heat source e.g., plant component to be cooled
  • Heat sink e.g., heat exchanger, radiator

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

L'invention concerne une installation de traitement d'un substrat sous vide, comprenant une chambre d'installation équipée au moins d'un composant d'installation pouvant être refroidi ainsi que d'un dispositif de refroidissement pour le composant d'installation pouvant être refroidi, lequel dispositif comprend un circuit de réfrigérant qui est relié au composant d'installation pouvant être refroidi et qui comprend au moins une première pompe à réfrigérant pouvant être entraînée par un premier dispositif d'entraînement. Ladite installation est caractérisée en ce que le dispositif de refroidissement comprend en outre un dispositif de refroidissement de secours équipé d'une branche du circuit de réfrigérant. Ladite branche s'étend parallèlement à la première pompe à réfrigérant et comprend au moins une deuxième pompe à réfrigérant, qui peut être entraînée par un deuxième dispositif d'entraînement. Ladite installation est également caractérisée en ce que le deuxième dispositif d'entraînement peut être entraîné par du gaz sous pression.
EP11757634.8A 2011-09-16 2011-09-16 Installation de traitement d'un substrat sous vide comprenant un dispositif de refroidissement de secours Withdrawn EP2601327A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2011/066152 WO2013037423A1 (fr) 2011-09-16 2011-09-16 Installation de traitement d'un substrat sous vide comprenant un dispositif de refroidissement de secours

Publications (1)

Publication Number Publication Date
EP2601327A1 true EP2601327A1 (fr) 2013-06-12

Family

ID=44651825

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11757634.8A Withdrawn EP2601327A1 (fr) 2011-09-16 2011-09-16 Installation de traitement d'un substrat sous vide comprenant un dispositif de refroidissement de secours

Country Status (2)

Country Link
EP (1) EP2601327A1 (fr)
WO (1) WO2013037423A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012112064A1 (de) 2012-12-11 2014-06-12 Von Ardenne Gmbh Dämpfer, Kühlkreislauf und Apparatur für eine schwingungsempfindliche Substratbehandlungsapparatur

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01230986A (ja) * 1988-03-07 1989-09-14 Eagle Ind Co Ltd 真空熱処理炉の非常用冷却装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2500676A1 (fr) * 1981-02-24 1982-08-27 Commissariat Energie Atomique Dispositif de refroidissement de secours d'un reacteur nucleaire refroidi a l'eau
JP2000268756A (ja) * 1999-03-12 2000-09-29 Toshiba Corp 荷電ビーム装置および荷電ビームの制御方法
US7528392B2 (en) * 2006-11-27 2009-05-05 Varian Semiconductor Equipment Associates, Inc. Techniques for low-temperature ion implantation

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01230986A (ja) * 1988-03-07 1989-09-14 Eagle Ind Co Ltd 真空熱処理炉の非常用冷却装置

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
"Air Cooled Water System for Vacuum Furnaces", BULLETIN VAC-1M-9-99, 1 March 2003 (2003-03-01), https://www.google.com/search?q=inurl:http//:drycoolers.com/sites/default/files/vac_series_indd2.pdf&as_qdr=y15, pages 1 - 2, XP055101985, Retrieved from the Internet <URL:http://drycoolers.com/sites/default/files/vac_series_indd2.pdf> [retrieved on 20140213] *
See also references of WO2013037423A1 *

Also Published As

Publication number Publication date
WO2013037423A1 (fr) 2013-03-21

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