EP2561553A2 - Verfahren zur herstellung eines photovoltaikmoduls mit rückseitenkontaktierten halbleiterzellen und photovoltaik-modul - Google Patents
Verfahren zur herstellung eines photovoltaikmoduls mit rückseitenkontaktierten halbleiterzellen und photovoltaik-modulInfo
- Publication number
- EP2561553A2 EP2561553A2 EP11714315A EP11714315A EP2561553A2 EP 2561553 A2 EP2561553 A2 EP 2561553A2 EP 11714315 A EP11714315 A EP 11714315A EP 11714315 A EP11714315 A EP 11714315A EP 2561553 A2 EP2561553 A2 EP 2561553A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- carrier
- adhesive layer
- carrier coating
- photovoltaic module
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 57
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 44
- 238000000576 coating method Methods 0.000 claims abstract description 44
- 238000000034 method Methods 0.000 claims abstract description 29
- 239000012790 adhesive layer Substances 0.000 claims description 36
- 230000008569 process Effects 0.000 claims description 14
- 239000002313 adhesive film Substances 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims description 5
- 238000004132 cross linking Methods 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 43
- 239000000853 adhesive Substances 0.000 abstract description 42
- 239000004020 conductor Substances 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 5
- 230000000694 effects Effects 0.000 abstract 1
- 238000005304 joining Methods 0.000 description 8
- 230000009471 action Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 238000010030 laminating Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10018—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10807—Making laminated safety glass or glazing; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
- B32B3/085—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts spaced apart pieces on the surface of a layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
- B32B7/14—Interconnection of layers using interposed adhesives or interposed materials with bonding properties applied in spaced arrangements, e.g. in stripes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
- H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/12—Photovoltaic modules
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the invention relates to a method for producing a photovoltaic module with back-contacted semiconductor cells and a photovoltaic module.
- Prior art photovoltaic modules based on semiconductors consist of a plurality of semiconductor cells. In these, an electric voltage is generated under the action of an external light incidence.
- the semiconductor cells are expediently connected to one another in order to be able to tap as high currents as possible from the photovoltaic module. For a contacting of the semiconductor cells and an appropriate wiring within the photovoltaic module is necessary.
- bands are used for routing. These are usually band-shaped conductor sections made of metal, in particular of copper.
- the contacting between a ribbon and the semiconductor cells interconnected therewith usually takes place by means of a soft solder connection. In this case, the contacts are guided from an upper light-active side of a semiconductor cell to a light-remote rear side of a next adjacent semiconductor cell. At the contact points between the ribbon and the semiconductor cell are located on the semiconductor cells metallized contact areas on which the solder joint is made.
- the method for producing a photovoltaic module with back-contacted semiconductor cells with contact areas provided on each contact side for a photovoltaic module includes the following method steps:
- a non-conductive carrier in the form of the film or of the laminate is provided with an at least one-sided, at least partially, electrically conductive carrier coating. Subsequently, the at least partially carrier coating is covered with an anisotropically conductive adhesive layer. The contact sides of the semiconductor cells are deposited on the coated with the adhesive layer carrier coating. There is a fixing of each semiconductor cell by a pressure and / or heat to generate Leitfaden between the carrier coating and the contact areas within the anisotropic conductive adhesive layer. In this process, the adhesive is cured and also the mechanical connection realized.
- the basic idea of the method is to make use of the anisotropy of such anisotropically conductive adhesives in order to reduce the manufacturing tolerances for the anisotropic conductive adhesives To increase the size of the photovoltaic module.
- This succeeds dad urch by the adhesive layer is electrically conductive only at the Stel len when forming the adhesive bond, where the adhesive layer between the contact areas of Hal bleiterzel len on the one hand and the conductive carrier coating on the other hand is included. At other locations, the adhesive layer remains in an electrically insulating state. Therefore, the adhesive layer can be applied to the carrier in a relatively large amount and without large positional quantity.
- the covering of the carrier coating can take place in different ways.
- the carrier coating with the anisotropically conductive adhesive layer is covered by printing.
- the coating of the carrier coating with the anisotropically conductive adhesive layer is carried out by laminating an adhesive film.
- an image recognition of the carrier coating a is performed when the carrier coating is covered.
- image recognition position determination of coverage sections is performed.
- the aisotropically conductive adhesive layer is applied to the cover sections.
- Particularly advantageous is a pre-crosslinking of the anisotropically conductive adhesive layer after covering the carrier coating in the context of a b-stag ing process.
- the carrier covered with the adhesive layer can be temporarily stored and kept ready for the subsequent production steps.
- a laminating step for encapsulating the semiconductor cells can be carried out.
- the semiconductor cells are firmly connected to the carrier.
- the entirety of the carrier and the laminated semiconductor cells forms an intermediate product which can be kept in stock for subsequent production steps, for example joining with a glass front.
- a photovoltaic module is provided with a plurality of semiconductor cells with a rear-side contact and a carrier, wherein the carrier is formed as a film.
- the carrier has an at least one-sided and at least partially electrically conductive carrier coating and the semiconductor cells are connected point-wise with the carrier coating via an anisotropically conductive adhesive layer and contacted.
- the carrier coating is laminated to the carrier.
- the anisotropically conductive adhesive layer is formed as an adhesive film.
- the semiconductor cells, the carrier, the carrier coating, and the anisotropic conductive adhesive layer form a laminate encapsulated composite.
- FIG. 1 shows a representation of a semiconductor cell with a contact side and contact areas
- Fig. 3 is an anisotropic applied to the carrier of Fig. 2
- Fig. 5 shows a laminated composite of semiconductor cell, carrier and
- Adhesive layer Adhesive layer.
- the semiconductor cell is formed for example of silicon and has the usual for such units, not shown here dopants and transition regions.
- a contact side 2 is provided for contacting the semiconductor cell. This is located on the side facing away from the later incidence of light of the semiconductor cell.
- Contact side are arranged a number of contact areas 3. These are in particular galvanically metallized and are slightly raised compared to their environment.
- Figures 2, 3 and 4 show a Maisier compiler the example of a single semiconductor cell using an anisotropically conductive adhesive.
- the carrier 4 used for this purpose consists of an electrically non-conductive film. This has at least in sections and at least on one side a conductive carrier coating 5.
- the carrier coating consists for example of a metal foil which is laminated to the carrier 4. Alternatively, vapor deposited metallizations, conductive polymer materials, or other compounds, such as indium zinc oxide (ITO) may be used.
- ITO indium zinc oxide
- the carrier coating is also slightly raised relative to the environment.
- anisotropic conductive adhesive ACA is also known for such an adhesive.
- Such contains in addition to the actual adhesive and electrically non-conductive base material embedded therein conductive body 6a, which are formed in particular as metal particles. These are distributed sufficiently thinly in the adhesive, so that the adhesive as such is not conductive even after application.
- the conductive contact is made only when the semiconductor cell is mounted. In this case, the base material of the adhesive is displaced from the contact areas, while the conductive particles are trapped between the contact areas of the semiconductor cells and the conductive carrier coating and establish a conductive connection between the two areas.
- connection thus adjusts itself exclusively to the contact areas.
- the adhesive can thus be applied generously to surface coverage.
- Various types of anisotropic conductive adhesives can be used.
- Such adhesives usually contain spherical silver particles, while the resin is sufficiently resistant to moisture and has stable dielectric material parameters.
- Adhesives cure at a bonding temperature of about 200 to 250 ° C. However, the joining temperature is much lower than the temperature usually required in a conventional soldering.
- thermosetting anisotropic conductive adhesive instead of a thermosetting anisotropic conductive adhesive and an adhesive may be used, the base material under a thermosetting anisotropic conductive adhesive and an adhesive may be used, the base material under a thermosetting anisotropic conductive adhesive and an adhesive may be used, the base material under a thermosetting anisotropic conductive adhesive and an adhesive may be used, the base material under a thermosetting anisotropic conductive adhesive and an adhesive may be used, the base material under a
- so-called b-staging-capable anisotropic conductive adhesives can be used.
- Such adhesives are materials whose base materials enable two-stage or multi-stage crosslinking or curing.
- the adhesive is first deposited on the intended places and then pre-cured or pre-crosslinked without putting the part to be fitted. In this process, which is carried out, for example, under the action of radiation and / or the action of heat, the adhesive is fixed and homogenized on the carrier, but retains its adhesive effect.
- the part to be provided in the present case the semiconductor cell, is set up only at a later time and in a second curing or cross-linking process finally and permanently connected to the carrier conductive.
- Adhesives in the form of an adhesive film or a laminatable adhesive layer are also advantageously usable. These can be rolled onto the carrier and remain there as a layer capable of being tacky for a relatively long time. During the joining process and thereby taking place heat input of the adhesive layer assumes a fluid state, whereby the pressing and Contacting the semiconductor cells is made possible. Subsequently, the adhesive film or the adhesive layer solidifies again, the contacting connection of the semiconductor cell takes place and the adhesive cures in the remaining places final. In the example shown in FIG. 3, the entire surface of the adhesive film or a laminatable adhesive layer are also advantageously usable. These can be rolled onto the carrier and remain there as a layer capable of being tacky for a relatively long time. During the joining process and thereby taking place heat input of the adhesive layer assumes a fluid state, whereby the pressing and Contacting the semiconductor cells is made possible. Subsequently, the adhesive film or the adhesive layer solidifies again, the contacting connection of the semiconductor cell takes place and the adhesive
- Carrier covered Of course, only partially executed adhesive covering is possible.
- an image recognition of the carrier coating can additionally be carried out, in which connection the covering takes place only at clearly identified and locally isolated points of the carrier coating.
- a printing method or a lamination method using an adhesive film For applying the adhesive, as mentioned, recourse can be had to a printing method or a lamination method using an adhesive film.
- the printing process is particularly suitable when the adhesive layer is partially applied.
- screen printing methods with appropriate templates can be used.
- the lamination process is advantageous if the entire support surface is to be covered without distinction.
- the support together with the adhesive layer to be laminated is placed in a rolling apparatus which press-connects both components together.
- the anisotropically conductive adhesive can be applied to the carrier and pretreated as already mentioned in a process referred to as b-staging.
- b-staging is to remove excess solvent from the area of the adhesive and to pre-crosslink and homogenize the adhesive.
- heat treatment processes or treatments with electromagnetic radiation in the UV range can be used. This has the advantage that in the actual production of the photovoltaic module no adhesive for the
- the semiconductor cells 1 are each placed with their contact sides on the area covered with the adhesive and then under pressure and / or heat application with the carrier.
- the conductive particles contained in the adhesive come into electrically conductive contact both with the conductive carrier coating 5 and with the contact regions 3 of the semiconductor cell.
- These include in the joining process, the conductive particles contained in the adhesive 6a into it and thus form at this point selective conductive paths 7, while at the remaining locations, the particles are separated from each other, so that there the adhesive remains electrically non-conductive.
- the heat load of the semiconductor cell is much lower than in an otherwise used soldering process.
- the joining accuracy for the position of the semiconductor cells is in the range of the lateral dimensions of the carrier coating 5. Accordingly, the adhesive itself does not have to be applied with high accuracy.
- the arrangement of semiconductor cell, carrier and adhesive layer can subsequently be covered with a lamination 8.
- the resulting composite can be connected as a whole with a glass carrier, not shown here.
Landscapes
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Sustainable Development (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sustainable Energy (AREA)
- Photovoltaic Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010027953A DE102010027953A1 (de) | 2010-04-20 | 2010-04-20 | Verfahren zur Herstellung eines Photovoltaikmoduls mit rückseitenkontaktierten Halbleiterzellen und Photovoltaik-Modul |
PCT/EP2011/055951 WO2011131567A2 (de) | 2010-04-20 | 2011-04-14 | Verfahren zur herstellung eines photovoltaikmoduls mit rückseitenkontaktierten halbleiterzellen und photovoltaik-modul |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2561553A2 true EP2561553A2 (de) | 2013-02-27 |
Family
ID=44625813
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11714315A Withdrawn EP2561553A2 (de) | 2010-04-20 | 2011-04-14 | Verfahren zur herstellung eines photovoltaikmoduls mit rückseitenkontaktierten halbleiterzellen und photovoltaik-modul |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2561553A2 (de) |
DE (1) | DE102010027953A1 (de) |
WO (1) | WO2011131567A2 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011088476A1 (de) * | 2011-12-14 | 2013-06-20 | Robert Bosch Gmbh | Solarmodul und Verfahren zur Herstellung eines solchen |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5951786A (en) * | 1997-12-19 | 1999-09-14 | Sandia Corporation | Laminated photovoltaic modules using back-contact solar cells |
US6313396B1 (en) * | 2000-05-22 | 2001-11-06 | The Boeing Company | Lightweight solar module and method of fabrication |
DE102006009478A1 (de) * | 2006-02-27 | 2007-08-30 | Infineon Technologies Ag | Verfahren und Substrat zum Flip-Chip-Bonden und Halbleiterbauelement |
EP2388828A1 (de) * | 2009-01-16 | 2011-11-23 | Sharp Kabushiki Kaisha | Solarzellenmodul und verfahren zur herstellung des solarzellenmoduls |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0291360U (de) * | 1988-12-29 | 1990-07-19 | ||
US5123986A (en) * | 1989-08-10 | 1992-06-23 | Casio Computer Co., Ltd. | Conductive connecting method |
JPH11120830A (ja) * | 1997-10-09 | 1999-04-30 | Hitachi Ltd | 平形多芯ケーブル接続構造 |
US5972732A (en) * | 1997-12-19 | 1999-10-26 | Sandia Corporation | Method of monolithic module assembly |
KR100467833B1 (ko) * | 2002-12-24 | 2005-01-25 | 삼성전기주식회사 | 광도파로용 다층 인쇄회로기판을 형성하는 방법 |
EP1542272B1 (de) * | 2003-10-06 | 2016-07-20 | Semiconductor Energy Laboratory Co., Ltd. | Halbleitervorrichtung und deren Herstellungsverfahren |
KR20110008284A (ko) * | 2008-04-29 | 2011-01-26 | 어플라이드 머티어리얼스, 인코포레이티드 | 모놀리식 모듈 어셈블리 기술들을 이용하여 제조된 광전지 모듈들 |
JP5131847B2 (ja) * | 2008-09-09 | 2013-01-30 | シャープ株式会社 | 太陽電池モジュールおよびその製造方法 |
-
2010
- 2010-04-20 DE DE102010027953A patent/DE102010027953A1/de not_active Withdrawn
-
2011
- 2011-04-14 WO PCT/EP2011/055951 patent/WO2011131567A2/de active Application Filing
- 2011-04-14 EP EP11714315A patent/EP2561553A2/de not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5951786A (en) * | 1997-12-19 | 1999-09-14 | Sandia Corporation | Laminated photovoltaic modules using back-contact solar cells |
US6313396B1 (en) * | 2000-05-22 | 2001-11-06 | The Boeing Company | Lightweight solar module and method of fabrication |
DE102006009478A1 (de) * | 2006-02-27 | 2007-08-30 | Infineon Technologies Ag | Verfahren und Substrat zum Flip-Chip-Bonden und Halbleiterbauelement |
EP2388828A1 (de) * | 2009-01-16 | 2011-11-23 | Sharp Kabushiki Kaisha | Solarzellenmodul und verfahren zur herstellung des solarzellenmoduls |
Also Published As
Publication number | Publication date |
---|---|
DE102010027953A1 (de) | 2011-12-01 |
WO2011131567A2 (de) | 2011-10-27 |
WO2011131567A3 (de) | 2012-09-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3081056B1 (de) | Verfahren zum einbetten einer komponente in eine leiterplatte | |
EP2259311B1 (de) | Verfahren zum Einbetten zumindest eines Bauelements in einem Leiterplattenelement | |
DE102009002823A1 (de) | Solarzelle, diese Solarzelle umfassendes Solarmodul sowie Verfahren zu deren Herstellung und zur Herstellung einer Kontaktfolie | |
DE2411259A1 (de) | Integrierter schaltkreis und verfahren zu seiner herstellung | |
DE112011104782T5 (de) | Photovoltaikmodul und Verfahren | |
EP2852970B1 (de) | Verfahren zum herstellen einer elektronischen baugruppe | |
DE102010021764A1 (de) | Verfahren zur Niedertemperatur Drucksinterverbindung zweier Verbindungspartner und hiermit hergestellte Anordnung | |
EP3539160A1 (de) | Einkapselungsfolie für ein photovoltaikmodul in schindelbauweise | |
DE102007052971A1 (de) | Kontaktierung und Modulverschaltung von Dünnschichtsolarzellen auf polymeren Trägern | |
EP2421339A1 (de) | Verfahren zum Einbetten von elektrischen Komponenten | |
DE10261876B4 (de) | Herstellungsverfahren für Solarmodule mittels Leitkleber-Bonding und Solarmodule mit Leitkleberbrücken | |
DE102013204357A1 (de) | Verfahren, Solarzelle und Verdrahtungsfolie zur Herstellung eines Solarmoduls | |
EP2561553A2 (de) | Verfahren zur herstellung eines photovoltaikmoduls mit rückseitenkontaktierten halbleiterzellen und photovoltaik-modul | |
EP2982226B1 (de) | Verfahren zum herstellen eines leiterplattenelements | |
DE102014203306A1 (de) | Herstellen eines Elektronikmoduls | |
DE10341186A1 (de) | Verfahren und Vorrichtung zum Kontaktieren von Halbleiterchips | |
DE102015107712B3 (de) | Verfahren zur Herstellung eines Schaltungsträgers | |
WO2012171680A2 (de) | Solarzellenmodul und verfahren zu dessen herstellung | |
DE102011088476A1 (de) | Solarmodul und Verfahren zur Herstellung eines solchen | |
DE102010054400A1 (de) | Verfahren zur elektrischen Reihenverschaltung von Solarzellen | |
WO2024088803A1 (de) | Solarzellenmodul und verfahren zur herstellung eines solarzellenmoduls | |
DE102013218352A1 (de) | Verfahren und Vorrichtung zum Herstellen eines Fotovoltaikmoduls sowie Fotovoltaikmodul | |
EP2686890A2 (de) | Verfahren zur herstellung einer solarzellenanordnung | |
DE102017216528A1 (de) | Schutzfolie für Solarzelle, Solarmodul mit der Schutzfolie, Verfahren zum Herstellen der Solarfolie und des Solarmoduls | |
DE102007036046A1 (de) | Planares elektronisches Modul |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
17P | Request for examination filed |
Effective date: 20130307 |
|
RBV | Designated contracting states (corrected) |
Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
DAX | Request for extension of the european patent (deleted) | ||
17Q | First examination report despatched |
Effective date: 20150902 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20160113 |