EP2551384A4 - Copper alloy for electronic material and method of manufacture for same - Google Patents

Copper alloy for electronic material and method of manufacture for same Download PDF

Info

Publication number
EP2551384A4
EP2551384A4 EP11759455.6A EP11759455A EP2551384A4 EP 2551384 A4 EP2551384 A4 EP 2551384A4 EP 11759455 A EP11759455 A EP 11759455A EP 2551384 A4 EP2551384 A4 EP 2551384A4
Authority
EP
European Patent Office
Prior art keywords
manufacture
same
copper alloy
electronic material
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11759455.6A
Other languages
German (de)
French (fr)
Other versions
EP2551384A1 (en
Inventor
Hiroshi Kuwagaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of EP2551384A1 publication Critical patent/EP2551384A1/en
Publication of EP2551384A4 publication Critical patent/EP2551384A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
EP11759455.6A 2010-03-23 2011-03-23 Copper alloy for electronic material and method of manufacture for same Withdrawn EP2551384A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010066397A JP4629154B1 (en) 2010-03-23 2010-03-23 Copper alloy for electronic materials and manufacturing method thereof
PCT/JP2011/057026 WO2011118650A1 (en) 2010-03-23 2011-03-23 Copper alloy for electronic material and method of manufacture for same

Publications (2)

Publication Number Publication Date
EP2551384A1 EP2551384A1 (en) 2013-01-30
EP2551384A4 true EP2551384A4 (en) 2017-07-19

Family

ID=43638543

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11759455.6A Withdrawn EP2551384A4 (en) 2010-03-23 2011-03-23 Copper alloy for electronic material and method of manufacture for same

Country Status (7)

Country Link
EP (1) EP2551384A4 (en)
JP (1) JP4629154B1 (en)
KR (1) KR101335201B1 (en)
CN (1) CN102803574B (en)
MX (1) MX2012010887A (en)
TW (1) TWI429763B (en)
WO (1) WO2011118650A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4831552B1 (en) * 2011-03-28 2011-12-07 Ｊｘ日鉱日石金属株式会社 Co-Si copper alloy sheet
JP5961371B2 (en) * 2011-12-06 2016-08-02 Ｊｘ金属株式会社 Ni-Co-Si copper alloy sheet
JP6141708B2 (en) * 2013-07-09 2017-06-07 三菱伸銅株式会社 Plated copper alloy plate with excellent gloss
JP6085536B2 (en) * 2013-08-05 2017-02-22 株式会社Ｓｈカッパープロダクツ Copper strip, plated copper strip, lead frame and LED module
WO2015022916A1 (en) 2013-08-14 2015-02-19 三菱レイヨン株式会社 Method for producing mold for nanoimprinting and anti-reflective article
JP6320759B2 (en) * 2014-01-06 2018-05-09 三菱伸銅株式会社 Method for producing Cu-Fe-P copper alloy sheet
JP6228941B2 (en) 2015-01-09 2017-11-08 Ｊｘ金属株式会社 Titanium copper with plating layer
KR102503365B1 (en) * 2015-09-01 2023-02-24 후루카와 덴키 고교 가부시키가이샤 Plating material with excellent heat resistance and its manufacturing method
JP6271626B2 (en) * 2016-03-31 2018-01-31 Ｊｘ金属株式会社 Titanium copper foil with plating layer
JP6662685B2 (en) * 2016-03-31 2020-03-11 Ｊｘ金属株式会社 Titanium copper foil with plating layer
JP2016211078A (en) * 2016-07-26 2016-12-15 Ｊｘ金属株式会社 Cu-Ni-Si-BASED ALLOY AND MANUFACTURING METHOD THEREFOR
JP6793005B2 (en) * 2016-10-27 2020-12-02 Ｄｏｗａメタルテック株式会社 Copper alloy plate material and its manufacturing method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995014121A1 (en) * 1993-11-16 1995-05-26 Ontario Hydro Metal tube having a section with an internal electroplated structural layer
JP2006002233A (en) * 2004-06-18 2006-01-05 Furukawa Electric Co Ltd:The Object to be plated having excellent forming workability
US20070015001A1 (en) * 2005-07-05 2007-01-18 The Furukawa Electric Co., Ltd. Copper alloy for electronic machinery and tools and method of producing the same
CN101215698A (en) * 2007-12-28 2008-07-09 天津大学 Method for preparing film surface of nanometer-stage thickness on red copper surface
WO2009099198A1 (en) * 2008-02-08 2009-08-13 The Furukawa Electric Co., Ltd. Copper alloy material for electric and electronic components

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3550482B2 (en) 1997-07-09 2004-08-04 三島光産株式会社 Plating method of mold pieces used for continuous casting
FR2781922B1 (en) * 1998-07-31 2001-11-23 Clariant France Sa METHOD FOR THE MECHANICAL CHEMICAL POLISHING OF A LAYER OF A COPPER-BASED MATERIAL
JP4001491B2 (en) * 2001-02-20 2007-10-31 日鉱金属株式会社 High-strength titanium-copper alloy, manufacturing method thereof, and terminal / connector using the same
JP2007039804A (en) * 2005-07-05 2007-02-15 Furukawa Electric Co Ltd:The Copper alloy for electronic apparatus and method of producing the same
JP5128152B2 (en) * 2007-03-14 2013-01-23 古河電気工業株式会社 Copper alloy for lead frame excellent in bare bonding property and manufacturing method thereof
CN101509850A (en) * 2009-03-20 2009-08-19 北京科技大学 Method for preparing electroforming copper metallographical example and display texture

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995014121A1 (en) * 1993-11-16 1995-05-26 Ontario Hydro Metal tube having a section with an internal electroplated structural layer
JP2006002233A (en) * 2004-06-18 2006-01-05 Furukawa Electric Co Ltd:The Object to be plated having excellent forming workability
US20070015001A1 (en) * 2005-07-05 2007-01-18 The Furukawa Electric Co., Ltd. Copper alloy for electronic machinery and tools and method of producing the same
CN101215698A (en) * 2007-12-28 2008-07-09 天津大学 Method for preparing film surface of nanometer-stage thickness on red copper surface
WO2009099198A1 (en) * 2008-02-08 2009-08-13 The Furukawa Electric Co., Ltd. Copper alloy material for electric and electronic components
EP2243847A1 (en) * 2008-02-08 2010-10-27 The Furukawa Electric Co., Ltd. Copper alloy material for electric and electronic components

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2011118650A1 *

Also Published As

Publication number Publication date
KR101335201B1 (en) 2013-11-29
TWI429763B (en) 2014-03-11
JP2011195927A (en) 2011-10-06
MX2012010887A (en) 2012-12-17
WO2011118650A1 (en) 2011-09-29
TW201139703A (en) 2011-11-16
EP2551384A1 (en) 2013-01-30
JP4629154B1 (en) 2011-02-09
CN102803574A (en) 2012-11-28
KR20120114341A (en) 2012-10-16
CN102803574B (en) 2015-09-02

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Ipc: C22C 9/02 20060101ALI20170424BHEP

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