EP2530175A4 - Copper alloy with high strength and high electrical conductivity - Google Patents

Copper alloy with high strength and high electrical conductivity Download PDF

Info

Publication number
EP2530175A4
EP2530175A4 EP11736829.0A EP11736829A EP2530175A4 EP 2530175 A4 EP2530175 A4 EP 2530175A4 EP 11736829 A EP11736829 A EP 11736829A EP 2530175 A4 EP2530175 A4 EP 2530175A4
Authority
EP
European Patent Office
Prior art keywords
electrical conductivity
copper alloy
high strength
high electrical
strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11736829.0A
Other languages
German (de)
French (fr)
Other versions
EP2530175A1 (en
Inventor
Kazunari Maki
Yuki Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2010014399A external-priority patent/JP5088385B2/en
Priority claimed from JP2010014398A external-priority patent/JP5088384B2/en
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of EP2530175A1 publication Critical patent/EP2530175A1/en
Publication of EP2530175A4 publication Critical patent/EP2530175A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
EP11736829.0A 2010-01-26 2011-01-06 Copper alloy with high strength and high electrical conductivity Withdrawn EP2530175A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010014399A JP5088385B2 (en) 2010-01-26 2010-01-26 High strength and high conductivity copper alloy
JP2010014398A JP5088384B2 (en) 2010-01-26 2010-01-26 High strength and high conductivity copper alloy
PCT/JP2011/050103 WO2011093114A1 (en) 2010-01-26 2011-01-06 Copper alloy with high strength and high electrical conductivity

Publications (2)

Publication Number Publication Date
EP2530175A1 EP2530175A1 (en) 2012-12-05
EP2530175A4 true EP2530175A4 (en) 2017-03-29

Family

ID=44319105

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11736829.0A Withdrawn EP2530175A4 (en) 2010-01-26 2011-01-06 Copper alloy with high strength and high electrical conductivity

Country Status (6)

Country Link
US (2) US20120294754A1 (en)
EP (1) EP2530175A4 (en)
KR (2) KR101641842B1 (en)
CN (1) CN102666888B (en)
TW (1) TWI547569B (en)
WO (1) WO2011093114A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103667786A (en) * 2013-12-03 2014-03-26 江苏帕齐尼铜业有限公司 Shock-resistant copper-nickel alloy and preparation method thereof
EP2960350B1 (en) * 2014-06-27 2017-11-29 Gebr. Kemper GmbH + Co. KG Metallwerke Copper casting alloy
CN104269201B (en) * 2014-09-30 2016-09-14 国网河南省电力公司周口供电公司 A kind of high-performance aluminium alloy wire and preparation method thereof
CN104513912A (en) * 2014-11-13 2015-04-15 无锡信大气象传感网科技有限公司 Corrosion resistant copper alloy material for sensor chip
CN104451242A (en) * 2014-11-20 2015-03-25 无锡贺邦金属制品有限公司 Necklace soft alloy material with anti-allergic function
CN104928526A (en) * 2015-07-06 2015-09-23 苏州科茂电子材料科技有限公司 Copper alloy material for cable and preparation method thereof
CN104928527A (en) * 2015-07-13 2015-09-23 苏州科茂电子材料科技有限公司 Conductive copper material for cable and preparing method thereof
TWI717382B (en) * 2015-09-09 2021-02-01 日商三菱綜合材料股份有限公司 Copper alloy for electronic and electric device, plastically-worked copper alloy material for electronic and electric device, electronic and electric device, terminal and bus bar
CN105463239A (en) * 2015-12-28 2016-04-06 苏州众禹环境科技有限公司 Industrial rotational flow separator
JP6151813B1 (en) * 2016-03-23 2017-06-21 株式会社神戸製鋼所 Vapor chamber manufacturing method
KR102402191B1 (en) * 2016-07-05 2022-05-25 엘에스전선 주식회사 Heating cable with excellent elasticity and flexibility
CN107858551B (en) * 2017-11-06 2020-03-31 江苏科技大学 High-strength high-conductivity wear-resistant nontoxic copper alloy for resistance welding electrode and preparation method thereof
CN108598058B (en) * 2017-12-21 2020-05-19 汕头市骏码凯撒有限公司 Copper alloy bonding wire and manufacturing method thereof
CN110343901A (en) * 2019-08-27 2019-10-18 天长市华海电子科技有限公司 A kind of high tenacity low stress forge piece and its production technology
JP7136157B2 (en) * 2020-06-30 2022-09-13 三菱マテリアル株式会社 Copper alloys, copper alloy plastic working materials, parts for electronic and electrical equipment, terminals
CN113088751A (en) * 2021-03-31 2021-07-09 江西铭德电器有限公司 High-toughness copper strip and production method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10219372A (en) * 1997-02-05 1998-08-18 Kobe Steel Ltd Copper alloy for electrical and electronic parts, and is production
JPH1180863A (en) * 1997-09-10 1999-03-26 Kobe Steel Ltd Copper alloy excellent in stress relaxation resistance and spring property

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2195435A (en) * 1938-08-19 1940-04-02 American Brass Co Copper alloy
JPS5344136B2 (en) * 1974-12-23 1978-11-27
JPS6267144A (en) * 1985-09-18 1987-03-26 Nippon Mining Co Ltd Copper alloy for lead frame
JPS644445A (en) * 1987-06-26 1989-01-09 Mitsubishi Electric Corp Copper alloy for terminal-connector
US5017250A (en) * 1989-07-26 1991-05-21 Olin Corporation Copper alloys having improved softening resistance and a method of manufacture thereof
JP2743342B2 (en) * 1992-05-21 1998-04-22 同和鉱業株式会社 Copper base alloy for connector and method of manufacturing the same
JP2804966B2 (en) * 1993-02-24 1998-09-30 矢崎総業株式会社 High strength copper alloy for conductive
JPH0995747A (en) * 1995-10-02 1997-04-08 Yazaki Corp High tensile conductive copper alloy excellent in drawability and bendability and its production
JPH09296237A (en) * 1996-04-28 1997-11-18 Nikko Kinzoku Kk Metallic substrate material for semiconductor packaging
US6074499A (en) * 1998-01-09 2000-06-13 South Dakoga School Of Mines And Technology Boron-copper-magnesium-tin alloy and method for making same
JP3383615B2 (en) * 1999-08-05 2003-03-04 日鉱金属株式会社 Copper alloy for electronic materials and manufacturing method thereof
JP3731600B2 (en) * 2003-09-19 2006-01-05 住友金属工業株式会社 Copper alloy and manufacturing method thereof
EP1759026B1 (en) * 2004-06-23 2009-05-13 Wieland-Werke Ag Corrosion-resistant copper alloy and use thereof
JP5156316B2 (en) * 2007-09-26 2013-03-06 Ｄｏｗａメタルテック株式会社 Cu-Sn-P copper alloy sheet, method for producing the same, and connector
JP2009242814A (en) * 2008-03-28 2009-10-22 Furukawa Electric Co Ltd:The Copper alloy material and producing method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10219372A (en) * 1997-02-05 1998-08-18 Kobe Steel Ltd Copper alloy for electrical and electronic parts, and is production
JPH1180863A (en) * 1997-09-10 1999-03-26 Kobe Steel Ltd Copper alloy excellent in stress relaxation resistance and spring property

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2011093114A1 *

Also Published As

Publication number Publication date
CN102666888A (en) 2012-09-12
TW201142047A (en) 2011-12-01
KR101641842B1 (en) 2016-07-21
WO2011093114A1 (en) 2011-08-04
EP2530175A1 (en) 2012-12-05
KR20150013944A (en) 2015-02-05
CN102666888B (en) 2014-06-18
TWI547569B (en) 2016-09-01
US20140227128A1 (en) 2014-08-14
KR20120066671A (en) 2012-06-22
US20120294754A1 (en) 2012-11-22

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