Classifications

• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F24—HEATING; RANGES; VENTILATING
  • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
  • F24H3/00—Air heaters
  • F24H3/02—Air heaters with forced circulation
  • F24H3/06—Air heaters with forced circulation the air being kept separate from the heating medium, e.g. using forced circulation of air over radiators
  • F24H3/062—Air heaters with forced circulation the air being kept separate from the heating medium, e.g. using forced circulation of air over radiators using electric energy supply; the heating medium being the resistive element
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
  • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
  • G06F1/16—Constructional details or arrangements
  • G06F1/20—Cooling means
• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
  • G06F1/16—Constructional details or arrangements
  • G06F1/20—Cooling means
  • G06F1/206—Cooling means comprising thermal management
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
  • H05K7/20263—Heat dissipaters releasing heat from coolant
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
  • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F24—HEATING; RANGES; VENTILATING
  • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
  • F24D2200/00—Heat sources or energy sources
  • F24D2200/16—Waste heat
  • F24D2200/29—Electrical devices, e.g. computers, servers
• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
  • G06F2200/20—Indexing scheme relating to G06F1/20
  • G06F2200/201—Cooling arrangements using cooling fluid

Definitions

• the invention relates to the field of electric heating. More specifically, it relates to an electric heater for heating domestic or professional premises.
• electric heating is known. Of widespread use, electric heating generally uses electric heaters placed in the various rooms to be heated. Each radiator is connected to the power grid to power one or more electrical resistors serving as a hot source. To diffuse the heat in the room, there are several types of radiator.
• the heat produced by the hot source can be directly transmitted to the ambient air, in the case of a convector, or through one or more bodies.
• the heat transfer between each body is achieved by a combination of the effects of conduction, convection and radiation. In the case of convection, it may be natural or forced.
• the hot source can transmit the heat produced to a fluid whose circulation is natural or forced in the radiator body, the latter transferring the heat to the ambient air via its outer surface.
• Computer servers are used. These are computers whose main task is to respond, via a computer network, to requests for computer processing from multiple users, called clients. These servers, once configured, do not require physical interaction with end users. They can be deported to centers remote hosting, called Datacenters, which ensure their operation and accessibility via the network.
• the data processing by a computer server is mainly provided by one or more processors.
• processors There are generic processors called central processing unit (CPU) and specialized processors, especially for graphical processing units (GPU).
• CPU central processing unit
• GPU graphical processing units
• the processor consumes electrical energy and releases heat. Like the electrical resistance, most of the energy consumed by the processor is released as heat. This amount of heat depends on the technical characteristics of the processor and the rate at which it is executed instructions. This rate is generally adjusted according to the capacity available to evacuate the heat produced. Indeed, beyond a certain temperature, the processor sees its performance decrease and can especially stop working.
• a data center must ensure the evacuation of this heat to ensure the operation of the servers it hosts. This evacuation is done by air conditioning accommodation rooms or, more directly, storage cabinets servers. This need for air conditioning is all the more important as server concentration is important in the data center.
• the present invention aims a heating system using the heat produced by computing resources. Another object of the invention is an efficient and simplified transfer of this heat.
• the radiator can be used for its heat generating capacity and / or computing capacity.
• the individual electric radiator comprises an internal heat source and a heating body for effecting the transfer of heat between the hot source of the electric radiator and the ambient air.
• the hot source is constituted by at least one processing circuit on which is disposed at least one calculation processor, the latter being connected to a dissipator block for discharging heat into the heating body.
• This electric radiator further comprises a control interface for regulating the amount of energy dissipated by the hot source, a power supply and a communication interface allowing an external computer system to access the at least one processor as a computing resource. .
• the control interface is user-driven. According to the instruction of the user, this control interface regulates the processors so as to obtain a quantity of energy dissipated satisfying this setpoint. For example, if the user requests more heat, the control interface may control one or more processors to perform predetermined calculations or algorithms, each calculation or algorithm being quantized in terms of dissipated energy. If the user asks for less heat, we use fewer processors or we run fewer calculations. When the processor or processors are used by an external computer system, the control interface takes into account this use to satisfy the user's instructions.
• the control interface may be configured to transmit to the external computer system a signal representing the computing resource available in the radiator according to a user instruction.
• a man-machine interface to control the calorific and computation power delivered by the radiator.
• the coolant can come from a circuit external to the radiator.
• the Q processors are distributed over a number P of printed circuits comparable to single or multi-processor motherboards called modules.
• the set of PCBs constitutes one or more computer processing units.
• the radiator offers a physical interface of heat exchange by means of dissipating blocks for the various electronic components of the processing units, in particular the processors, but also the other components generating heat: chipset, RAM, mass memories , food.
• the geometry of this exchange surface is parameterized according to the heat evacuation needs of the modules and the heat dissipation capacity of the radiator.
• the modules are characterized by a physical architecture adapted to this heat exchange interface.
• control interface is configured so as to transmit to the external computer system a signal representing the computing resource available in the radiator, this availability being a function of a setpoint of a user.
• the stabilized power supply provides power adapted to the consumption of the different modules. In particular, it adapts to the number and power of active modules for calculating and producing heat. The power dissipated in the form of heat by the power supply is also transferred to the radiator by the same type of interface as the modules.
• the radiator may propose other connection interfaces than the simple network interface. It can be video, audio, serial, parallel interfaces allowing the use of the radiator comparable to that of a microcomputer, a multimedia box or a video game console by connecting external peripherals (screen , keyboard, remote control, joysticks, audio speakers).
• the treatment circuit is disposed outside the heating body, a part of the dissipator block being directly in contact with the heating body and its optional heat transfer fluid through a wall of the heating body.
• a heating system comprising:
• each radiator comprising an internal heat source and a heating body for effecting heat transfer between the hot source of the electric radiator and the ambient air
• the hot source is constituted by at least one processing circuit on which at least one calculation processor is arranged, the latter being connected to a dissipator block for evacuating heat in the heating body; and in that it comprises a control interface for regulating the amount of energy dissipated by the hot source, a power supply and a communication interface allowing an external computer system to access said at least one processor as a resource of calculation
• Coordinates They are organized, connected and managed according to needs and constraints by IT agents, centralized or distributed, coordination.
• a computer grid mainly consists of a set of servers interconnected via the Internet or a local network.
• FIG. 2 illustrates a cross-sectional view of a radiator according to the invention.
• FIG. 3 is a detailed schematic representation of the cross section of the lower zone of the radiator according to the invention.
• FIG. 4 is a schematic representation of the arrangement of the electronic components of the modules on the thermal transfer interface.
• FIG. 8 is an illustration of a variant of a radiator according to the invention not using heat transfer fluid.
• FIG. 9 is an illustration of a variant of a radiator according to the invention using a heat transfer fluid and a forced circulation device.
• Figures 10 and 11 are schematic representations of a radiator according to the invention in outer view, respectively in profile and from above.
• Figure 12 describes a system according to the invention comprising a set of radiators according to the invention and its users connected to each other via a computer network.
• FIG. 1 shows, according to the prior art, the schematic operation of an electric radiator, known per se, using the circulation of coolant and an electrical resistance as a hot source.
• This radiator consists mainly of an optionally modular heating body 1 and an electric heating resistor 2 inserted into the heating body and passing through it over substantially its entire length.
• Within the heating body circulates a coolant 3 whose nature is adapted to the thermal function envisaged.
• the positioning of the resistance is a function of the strength of the resistance, the nature of the coolant and the geometry of the heating body.
• the heating body 1 can, for example, be made of cast aluminum and, in order to optimize the heat transfer with the ambient air, is likely to have fins 4 promoting the transfer of heat within the room wherein such a radiator is implanted.
• the heat produced by the hot source is transmitted to the heat transfer fluid which circulates regularly and naturally in the circuit of the heating body by virtue of the temperature gradient between the zone of the hot source of the rising channel 5 and the heat transfer zone towards outside the descending channel 6.
• FIG. 2 illustrates the use of processors 7 as a hot source in replacement of the electrical resistance 2.
• the processors are placed outside the heating body and transmit the heat to the heat transfer fluid through the heating element.
• the dissipator block 8 is a solid block made of copper or aluminum or any other material having heat properties adapted to the need for heat removal.
• the geometry of block 8 is characterized by a flat and smooth surface 9 at the interface with the processors and a surface optimized for thermal transfer with the fluid 3 inside the heating body 1.
• the contact between the heating body 1 and the block 8 is hermetic with respect to the coolant 3.
• FIG. 3 the lower part of the radiator of FIG. 2 is detailed, in particular the interface between a treatment circuit 10 and a dissipator block 8.
• the components requiring a heat evacuation are plated on the outer surface of the block 8 .
• FIG. 4 illustrates an arrangement of the electronic components (processor 7, chipset 18, random access memory 17, mass memory 19) on a processing circuit and contact with a dissipator block 8.
• the heat exchange interface is either mono-block or composed of several blocks. Just as a heatsink block can be in contact with the components of several processing circuits, a processing circuit can be "straddled" on several heatsink blocks.
• the device 20 for attaching a processing circuit 10 to the block 8 by means of fastening screws 21 is presented.
• FIGS. 5, 6 and 7 show the different views of the dissipator block 8.
• FIG. 8 a variant of the invention that does not use heat transfer fluid is illustrated.
• FIG 12 there is described a system according to the invention comprising a set of radiators according to the invention and remote users interconnected via a computer network.
• the computer grid-type software architecture makes it possible to track, organize and use the computing resource made available by the fleet of radiators according to the invention.
• FIG. 13 illustrates the potential use of individual radiators as a microcomputer, multimedia box, video game console or as an extension of such a system by connecting external peripherals (screen, keyboard, remote control, joysticks, speakers, audio).
• Radiators according to the invention then have connection interfaces adapted to the envisaged peripherals (VGA, Serial, Parallel, PS2, Bluetooth, WIFI, HDMI, RCA, ).

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Thermal Sciences (AREA)
• Microelectronics & Electronic Packaging (AREA)
• General Engineering & Computer Science (AREA)
• Theoretical Computer Science (AREA)
• Mechanical Engineering (AREA)
• Human Computer Interaction (AREA)
• General Physics & Mathematics (AREA)
• Combustion & Propulsion (AREA)
• Chemical & Material Sciences (AREA)
• Cooling Or The Like Of Electrical Apparatus (AREA)
• Central Heating Systems (AREA)
• Thermotherapy And Cooling Therapy Devices (AREA)

Applications Claiming Priority (2)

Publications (2)

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ID=42827310

Family Applications (1)

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• 2010
  • 2010-01-06 FR FR1050056A patent/FR2954971B1/fr active Active
  • 2010-12-17 EP EP10807615.9A patent/EP2521884B1/de active Active
  • 2010-12-17 WO PCT/FR2010/052788 patent/WO2011083244A2/fr not_active Ceased
  • 2010-12-17 PL PL10807615.9T patent/PL2521884T3/pl unknown
  • 2010-12-17 JP JP2012547527A patent/JP5767247B2/ja active Active
  • 2010-12-17 DK DK10807615.9T patent/DK2521884T3/en active
  • 2010-12-17 US US13/520,606 patent/US9151515B2/en active Active
  • 2010-12-17 RU RU2012133450/06A patent/RU2556952C2/ru active
  • 2010-12-17 CA CA2785904A patent/CA2785904C/fr active Active
  • 2010-12-17 CN CN201080061135.9A patent/CN102822608B/zh not_active Expired - Fee Related
• 2015
  • 2015-02-16 US US14/623,237 patent/US9746203B2/en active Active

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