EP2516321A2

EP2516321A2 - Sensor comprising a preferably multilayered ceramic substrate and method for producing it

Info

Publication number: EP2516321A2
Application number: EP11817213A
Authority: EP
Inventors: Sabine Schmideder; Torsten Thelemann; Josef Nagl; Heinrich Aschenbrenner; Reinhold Hoenicka
Original assignee: Micro Epsilon Messtechnik GmbH and Co KG
Current assignee: Micro Epsilon Messtechnik GmbH and Co KG
Priority date: 2010-12-02
Filing date: 2011-10-10
Publication date: 2012-10-31
Anticipated expiration: 2031-10-10
Also published as: WO2012072070A2; EP2516321B1; CN103221330B; WO2012072070A3; CN103221330A; DE102010053760A1; US20130223031A1; US9144155B2

Abstract

A sensor comprises a preferably multilayered ceramic substrate (2) and at least one sensor element (1) arranged in, at or on the ceramic substrate (2). Contact can be made with the sensor element (1) via a metallic contact (6), wherein the metallic contact (6) is produced by means of a soldering connection that electrically connects the contact (6) to the sensor element (1) and in the process produces a fixed mechanical connection of the contact (6) relative to the ceramic substrate (2). A method for producing the sensor according to the invention is furthermore claimed.

Description

SENSOR WITH A PREFERRED MULTILAYER CERAMIC SUBSTRATE AND METHOD THEREOF

MANUFACTURING

The invention generally relates to a sensor which comprises a preferably multilayer ceramic substrate, wherein at least one sensor element is arranged or formed in, on or on the ceramic substrate. Furthermore, the invention relates to a method for producing such a sensor.

While electronic assemblies have been manufactured on conventional printed circuit boards, they are increasingly being produced today on or in ceramic substrates. The use of ceramic has several advantages. Of particular importance is the high temperature resistance of the ceramic. In addition, the expansion of the ceramic over conventional circuit boards in the temperature curve is much lower. It is also possible to produce multilayer ceramics with integrated interconnect structures in or between the layers. Between the layers even electrical / electronic components can be realized. This leads to an extremely compact design. The contacting of such electronic assemblies is usually carried out by means of so-called solder pads, which are printed on the substrate. On the solder pads, the contact is soldered in the form of a strand, a metal tab or the like in the conventional soldering. The soft soldering has the disadvantage that the solder used melts at temperatures of 200 ° C to 300 ° C. This eliminates the enormous advantage of a high temperature resistance of the ceramic, which can not be used when soldering conventional soldering solder.

Conventional soldering is also disadvantageous in that the connection to the solder pad is an exclusively electrical connection. Mechanically, such a connection is extremely unstable. Accordingly, the solder joint must hardly be mechanically stressed. In case of shock, vibration or other mechanical stress, such solder joints break or break frequently. Consequently, a separate mechanical fixation, for example by gluing, joining, etc. is required. An alternative to conventional soft soldering is the brazing process, where the brazing temperature is above 450 ° C. A special form of brazing is active soldering. Commercially available active solders have a melting point of approx. 850 ° C. In addition, it is advantageous that by means of active soldering metal can be soldered directly on the ceramic. A customary in conventional soldering or brazing metallization of the ceramic is not required in active soldering, since the solder enters into a direct connection with the ceramic surface due to its chemical composition. Through the addition of specific alloying elements such as titanium, active soldering produces a reaction at the interface, namely between the metal or the metal alloy of the solder and the ceramic surface, so that the materials bond directly to one another without the use of an adhesion promoter. The particular advantage of active soldering is therefore the high mechanical strength and high temperature resistance of the compound. Consequently, by active soldering, a high temperature suitable metal-ceramic compound can be produced.

Sensors of the generic type are known from practice. Such sensors are already available in multilayer ceramics. For example, reference is made to DE 10 2008 016 829 A1 and DE 103 14 875 A1.

The connection between metal and ceramic is also a particular problem in the case of the sensors in question. Since the actual sensor element is usually arranged on, on or in the ceramic or the ceramic substrate and, for example, at least one measuring electrode or at least one measuring coil are electrically contacted must, there is the fundamental problem of how to produce such an electrical connection with simultaneous generation of a sufficiently good mechanical connection error-free and sustainable.

Usually metallic contacts are applied to the ceramic even with sensors, for example by soldering. Such metal-ceramic solder joints are - in itself - also already known. Reference is made to DE 10 2004 024 920 B4. Specifically, from DE 10 2004 024 920 B4 a pressure sensor is known, in which a ceramic substrate is connected by means of active or brazing with a fixedly connected to the terminal housing of the pressure sensor support structure made of metal. There is a disadvantage that the ceramic substrate itself only as Holding device for the actual pressure measuring cell is used. This pressure cell is again made of metal and bonded to the ceramic substrate by active soldering on one side. On the other side of the ceramic substrate pins are provided.

However, the measures known in sensors for electrical contacting are problematic in practice so far, on the one hand cause a considerable effort in the handling / production and on the other hand, only conditionally external - mechanical - withstand conditions. Such contacts produced by soldering are extremely "sensitive" and therefore prone to failure.

The present invention is therefore based on the object to provide a sensor or sensor structure in which the sensor element is arranged on or on a preferably multi-layer ceramic substrate or generated accordingly and in which a secure contacting of the sensor element is realized with the simplest technology. In addition, the sensor should be simple and therefore inexpensive to produce.

The above object is achieved with respect to a sensor according to the invention by the features of claim 1. Thereafter, the generic sensor includes the actual sensor element in, on or on a ceramic substrate and an electrical contact in the form of a metallic contact generated by soldering, wherein the solder joint is designed such that it electrically contacts the metallic contact on the one hand with the sensor element and on the other hand a secure forms mechanical connection between the metallic contact and the ceramic substrate. Consequently, in the inventive manner by a surprisingly simple construction, a secure both in electrical and mechanical terms, solid solder joint created. With regard to a method according to the invention, the present invention is achieved by the features of the independent claim 9, which relates to the manufacture of the sensor according to the invention.

In the case of an inductive distance or position sensor, the sensor element may comprise one or more coils. For capacitive distance measurement, one or more electrode surfaces as integral components would be conceivable. In force or Pressure sensors could contain the sensor element expansion elements of any design. For temperature sensors, the sensor element consists of resistance layers. In magnetoresistive sensors, the sensor element could be contained as a silicon component in the substrate. Other other sensor elements are conceivable. In that regard, it should be noted that this is the basic sensor structure, but not the realization of a specific sensor element.

Particularly advantageous is the use of active soldering in the sensor. Sensors must often be used in particularly adverse environmental conditions, for example at high temperature or under shock and vibration. A weak point of the sensors is their connection, d. H. the cable. The connection between the metal wire of the cable and the electronics assembly of the sensor can be easily damaged by shock or vibration. Here, the use of active soldering is particularly suitable for simultaneously producing sensors with high temperature resistance and high resistance to mechanical stress.

The ceramic substrate is in the simplest case of a single layer of a ceramic. In this case, the sensor element is mounted on the surface of the substrate. The contacting of the sensor element takes place in the usual way by conductor tracks, which are applied for example in a known printing technique on the substrate. Particularly advantageous is the use of multi-layer ceramic substrates, which are firmly connected by sintering. In the individual layers of the substrate, the sensor elements may be applied, for example, the coil of a distance sensor by printing a conductor track layer. After the stacking of the individual layers and the sintering, a solid ceramic block is formed, which contains the sensor elements in its interior. These are protected against environmental influences and mechanically stable.

The contacting of the sensor element on the ceramic substrate is produced in such a way that a simultaneously electrically conductive and mechanically stable connection is formed by actively soldering a suitable metal connection piece onto the ceramic substrate. This happens because the contact surface of the contact on the ceramic substrate at the same time on the one hand, the electrical contact surface, such as the conductor track or the solder pad, covered and on the other hand, the uncovered Ceramic surface covered. During the soldering process, both the electrical connection between the contact surface and the metallic contact and the mechanical connection with the ceramic surface and the contact are then simultaneously produced by the active solder.

The metallic contact may be further advantageously directly bonded to / in the ceramic substrate by active soldering. The metallic contact can be embodied in the form of a pin inserted into the ceramic substrate, so that a certain positional stability, possibly also due to the realization of a certain fit, is achieved even by the insertion of the contact.

The metallic contact may advantageously be dimensioned such that it can be operated with at least slight play, i. without implementation of a press fit, is inserted into the ceramic substrate. The resulting gap between the contact and the ceramic substrate can be designed such that the active solder or the solder paste is evenly and sufficiently distributed in the gap, with an exact dosage of the solder paste in the gap, preferably before the insertion of the metallic contact, is beneficial.

In a further advantageous manner, the measuring electrode or measuring coil to be contacted by the metallic contact is provided in the interior or on the side of the ceramic substrate opposite the insertion side. Between the measuring electrode or measuring coil and the metallic contact, a material favoring the electrical contact, preferably a contact paste, is provided in a further advantageous manner. This is preferably applied before the sintering of the ceramic substrate on the measuring electrode or measuring coil to be contacted, so that in the subsequent active soldering, at a temperature of about 850 ° C, an excellent electrical and mechanical connection with respect to the metallic contact can be produced.

In light of the above, not only a perfect electrical contact between the metallic contact and a contact surface of the sensor element, such as a measuring electrode or measuring coil of the sensor element, realized, but also a perfect mechanical Anchoring or attachment of the metallic contact in or on the ceramic substrate.

The inventive method is used to produce the previously discussed sensor and is essentially based on that the ceramic substrate is prepared by sintering technology and the electrical contact for contacting metallic contact introduced after sintering of the ceramic substrate in this and there for both electrical contacting as well as mechanical anchoring means Active solder is soldered. A material favoring the electrical contact, for example in the form of a contact paste, can already be introduced into the ceramic substrate prior to sintering.

There are now various possibilities for designing and developing the teaching of the present invention in an advantageous manner. For this purpose, on the one hand to the claims subordinate to claim 1 and on the other hand to refer to the following explanation of preferred embodiments of the invention with reference to the drawings. In conjunction with the explanation of the preferred embodiments of the invention with reference to the drawings, also generally preferred embodiments and developments of the teaching are explained. In the drawing show

1 is a schematic view, partially in section, of the basic structure of a sensor according to the invention,

Fig. 2 in a schematic view, cut and partially a further embodiment of a sensor according to the invention in the field of contacting and

Fig. 3 in a schematic view, cut and section of a sensor according to the invention in the contact area.

1 shows a first exemplary embodiment of a sensor according to the invention, in which the metal connecting piece is designed as a pin 6 with an attachment for attachment. Position surface is executed. The bearing surface forms the contact point to the ceramic substrate 2 by these are connected to each other by means of an active solder 8. The bearing surface of the contact is designed such that it simultaneously covers, on the one hand, the electrical contact surface, for example the conductor track or the solder pad, on the ceramic substrate 2 and, on the other hand, the uncovered ceramic surface. During the soldering process, both the electrical connection between the contact surface and the metallic contact and the mechanical connection with the ceramic surface and the contact are then simultaneously produced by the active solder.

During manufacture, the ceramic substrate 2 is covered with the active solder 8. Thereafter, the pin 6 is fixed on the ceramic substrate 2 by means of a suitable device. When heated, the active solder 8 combines by means of chemical reactions with the metal on the one hand and with the ceramic on the other hand, whereby a firm structural connection between metal and ceramic is produced. Since the active solder 8 is simultaneously electrically conductive, it establishes an electrical connection between the pin 6 and the conductor tracks on the ceramic substrate. At the pin 6 can then be mounted in a conventional manner, a cable 9, a wire or other electrical connections. This can in turn be done by means of soldering, or at particularly high temperature requirements, by welding or crimping.

FIG. 2 shows a further embodiment of a sensor according to the invention, in which the metal connection element is introduced in the form of a metal pin 6 into a recess 7 of the ceramic substrate 2. Still in the pressed, but unsintered state (the so-called green state), the ceramic layers are processed accordingly, so provided with openings, resulting in what are called cavities. Such processes are also used in so-called vias (plated-through holes) in multilayer ceramic substrates. In order to make through contacts between the ceramic layers, small holes are punched into the initially soft substrate. These holes are filled with a conductive contact paste 5. After stacking and sintering of the layers, the conductive paste 5 connects the top of the layer to the bottom, thereby establishing a via between the interconnect on the upper side of a layer and the interconnect on the underside. This via can also extend over several layers. It must be at Just make sure that the layers are aligned exactly one above the other. If breakthroughs extend over several layers to the surface of the sensor substrate, a depression (cavity) in the form of a blind hole is formed on the surface. Conventional ceramic layers have a thickness of, for example, about 200 μιη after sintering. If the via extends over three layers, a blind hole with a depth of approx. 600μιη is created.

In this blind hole, the metal pin 6 can be inserted and connected by means of active soldering 8 with the ceramic substrate 2. By soldering the metal pin 6 within the ceramic substrate 2 and the conductive layer in the via creates a conductive connection, which is mechanically very stable at the same time. The mechanical stability is thus produced not only by the interface of the active solder 8, but additionally by the immersion of the pin 6 in the ceramic substrate 2. As a result, the contact area between the pin 6 and the ceramic is increased without on the surface of the ceramic large contact surfaces required are. This is particularly advantageous when the ceramic substrate 2 itself has a small area. In addition, the immersion increases the mechanical stability against lateral loads. As a result, the pin 6, for example, when pulling in the lateral direction on the cable welded thereto not break.

Particularly favorable for the use of metal fittings, for example in the form of a metal pin 6 is titanium, kovar or zirconium. The ceramic substrates 2 after sintering have a thermal expansion coefficient of 5-7 ppm / K. The coefficient of expansion of titanium is 9 ppm / K, of Kovar 5.3 ppm / and of zirconium 5.9 ppm / K. The use of metals with similar or even the same coefficients of expansion as the ceramic is therefore advantageous, so that at high temperatures no or only slight stresses occur at the active soldering point. High temperatures initially occur during the soldering process itself, which takes place at 850 ° C, for example. If, after soldering, the material cools, due to greatly different coefficients of expansion at the juncture between the metal fitting and the ceramic, strong internal mechanical stresses can result which, in the worst case, cause the breakage of the solder joint. Furthermore, high temperatures can occur in the environmental conditions of the sensors, since such sensors are just for such high temperature applications are particularly suitable. The use of co-ordinated materials with similar coefficients of expansion is therefore particularly important for the stability of the metal-ceramic bond.

3 shows, in a schematic side view, cut, the multilayer ceramic substrate 2 comprising the sensor element 1, the sensor or the sensor element 1 being made of multilayer ceramic. A housing, not shown here, may be made of metal or at least include a metallic rim, frame or the like.

In FIG. 3 it is indicated that the lowest layer 3 there, which comprises the measuring electrode 4 or measuring coil, is covered with a contact paste 5, which is introduced into the ceramic substrate 2 before the sintering. The metallic contact, in the form of a metal pin 6, is inserted into a bore / recess 7 in the ceramic substrate 2, wherein a perfect electrical contacting by action of the contact paste 5 against the measuring electrode 4 and measuring coil takes place.

Fig. 3 shows that the metal pin 6 penetrates directly into the multilayer ceramic substrate 2, i. is soldered by active soldering, so that by the active soldering both an electrical contact with the cooperation of the contact paste 5 and a mechanical connection with respect to the ceramic substrate 2 is realized. The active solder 8 causes the electrical as well as solid mechanical connection.

Particular advantages of the sensors according to the invention are as follows:

- At the same time electrically conductive and mechanically stable connection

- Active soldering suitable for high temperatures

- Sensor elements encapsulated in the ceramic substrate

- Compact design due to low space requirement of contacting

- no mechanical stresses due to choice of material

- Sensor element robust against environmental influences (temperature, dirt, water, chemical influences, etc.).

- Manufacture of a metal-ceramic compound without the use of lead and tin, which may not be used in certain applications due to toxicity. With regard to further advantageous embodiments of the device according to the invention and the method according to the invention, reference is made to avoid repetition to the general part of the specification and to the appended claims.

Finally, it should be expressly understood that the above-described embodiments of the device according to the invention is only for the purpose of discussion of the claimed teaching, but not limit these to the embodiments.

LIST OF REFERENCE NUMBERS

1 sensor element

2 ceramic substrate

3 lowest layer

4 measuring electrode, electrode surface

5 contact paste

6 contact, pin, metal pin

7 bore / recess

8 active solder

9 cables, wire

10 trace within 2

Claims

1 . Sensor having a preferably multilayer ceramic substrate (2) and at least one in or on the ceramic substrate (2) arranged sensor element (1), which is contactable via a metallic contact (6), wherein the metallic contact (6) produced via a solder connection which electrically connects the contact (6) to the sensor element (1) and thereby produces a firm mechanical connection of the contact (6) with respect to the ceramic substrate (2).

2. Sensor according to claim 1, characterized in that the sensor element (1) for inductive or capacitive displacement / distance / position measurement, wherein the contact with one or more coils or against one or more electrode surfaces (4) is formed.

3. Sensor according to claim 1, characterized in that the sensor element

(1) is designed as a force or pressure sensor or as a temperature sensor or as a magnetoresistive sensor, wherein the contacting with respect to one or more expansion elements, resistance layers, silicon components, etc. is formed.

4. Sensor according to one of claims 1 to 3, characterized in that the metallic contact (6) by active soldering directly on / in the ceramic substrate

(2) is connected to this.

5. Sensor according to one of claims 1 to 4, characterized in that the metallic contact (6) in the form of a ceramic substrate in the (2) inserted pins, pin or the like is executed.

6. Sensor according to one of claims 1 to 5, characterized in that the metallic contact (6) is dimensioned such that it can be introduced with little play into the ceramic substrate (2) up to the sensor element (1) to be contacted, wherein active solder (8) sufficiently fill any space between the ceramic substrate (2) and the contact (6) while filling as evenly as possible.

7. Sensor according to one of claims 1 to 6, characterized in that the by the metallic contact (6) to be contacted sensor element (1) in the interior or on the metallic contact (6) opposite side of the ceramic substrate (2) is arranged, wherein between the sensor element (1) and the metallic contact (6) a the electrical contacting favoring material, preferably a contact paste (5), is arranged.

8. Sensor according to one of claims 1 to 7, characterized in that the ceramic substrate (2) is produced by sintering technology, wherein the electrical contacting favoring material, preferably the contact paste (5), before the actual sintering on the surface to be contacted of the sensor element (1) is applied or in the ceramic substrate (2) can be introduced.

9. A method for producing a sensor according to one of claims 1 to 8, wherein at least one sensor element (1) on, on or in a ceramic substrate (2) is generated and wherein both for electrical contacting and for the mechanical connection of a metallic contact (6 ) is introduced by active soldering in the ceramic substrate (2) and firmly connected to the ceramic substrate (2).

10. The method according to claim 9, characterized in that the contacting of the sensor element (1) is favored by the fact that prior to sintering of the ceramic substrate (2) an electrical contact favoring material, preferably in the form of a contact paste (5), in the interior of the ceramic substrate (2) is introduced.