EP2500978B1 - Transition de guide d'onde - Google Patents

Transition de guide d'onde Download PDF

Info

Publication number
EP2500978B1
EP2500978B1 EP20110158700 EP11158700A EP2500978B1 EP 2500978 B1 EP2500978 B1 EP 2500978B1 EP 20110158700 EP20110158700 EP 20110158700 EP 11158700 A EP11158700 A EP 11158700A EP 2500978 B1 EP2500978 B1 EP 2500978B1
Authority
EP
European Patent Office
Prior art keywords
waveguide
transition
substrate
circuit board
siw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP20110158700
Other languages
German (de)
English (en)
Other versions
EP2500978A1 (fr
Inventor
Christer Stoij
Sten Gunnarsson
Staffan Bruce
Ronny Christoffersson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sivers IMA AB
Original Assignee
Sivers IMA AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sivers IMA AB filed Critical Sivers IMA AB
Priority to EP20110158700 priority Critical patent/EP2500978B1/fr
Priority to PCT/EP2012/054421 priority patent/WO2012123473A1/fr
Publication of EP2500978A1 publication Critical patent/EP2500978A1/fr
Application granted granted Critical
Publication of EP2500978B1 publication Critical patent/EP2500978B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • H01P5/107—Hollow-waveguide/strip-line transitions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/082—Transitions between hollow waveguides of different shape, e.g. between a rectangular and a circular waveguide

Definitions

  • the present invention relates to the field of radio frequency communication, and more particularly to a transition between a microstrip and a waveguide.
  • Wireless transmission of a radio frequency signal generally requires delivering the signal carrying considerable power to the transmission antenna, which is best obtained by means of a conventional rectangular waveguide, i.e. a rectangular tube, connected with the antenna.
  • a conventional rectangular waveguide i.e. a rectangular tube
  • the term "waveguide” used alone means such a conventional rectangular waveguide.
  • a circuit board environment is preferred, employing inter alia microstrips.
  • the transition is sensitive as regards the mutual position of the ridge and the microstrip. For instance, only a minor lateral displacement causes a large attenuation of the signal due to mismatch of the characteristic impedances of the ridge and the microstrip, respectively, at the transition.
  • the relative reflected power, or return loss, at a lateral displacement of about 0.5% of the wavelength, i.e. about 0.025 mm is about 20 dB, which is a limit of acceptance.
  • a transition between a microstrip and a waveguide comprising a rectangular waveguide having a floor, side walls, a ceiling, and a transition end; a microstrip; and a substrate integrated waveguide.
  • the rectangular waveguide is coupled to the substrate integrated waveguide at a first end of the substrate integrated waveguide.
  • the microstrip is coupled to the substrate integrated waveguide at a second end thereof.
  • the rectangular waveguide comprises a ridge attached to the ceiling, extending along a portion of the rectangular waveguide, and having a first end portion which is engaged with a portion of a top layer of the substrate integrated waveguide at its first end.
  • the substrate integrated waveguide (SIW) as an intermediate portion of the transition between the microstrip and the waveguide. Measurements as well as simulations have revealed that the transition between the SIW and the waveguide is substantially less sensitive to position displacements, lateral as well as longitudinal, between the ridge of the waveguide and the SIW.
  • the displacement causing the same relative reflected power i.e. 20 dB
  • the displacement causing the same relative reflected power is 5% of the wavelength, which is 10 times as high tolerance as in the prior art transition between the mircrostrip and the waveguide. More particularly, 5% at 60 GHz corresponds to about 0.25 mm, which is a low accuracy in the present field of technology.
  • the frequency range for application of the invention is by no means limited to a narrow range, it is useful for the whole range of radio frequency communication, which is currently regarded to be from about 30 kHz to about 300 GHz.
  • the characteristic impedance of the waveguide and the characteristic impedance of the substrate integrated waveguide are matched to each other, which provides for a maximum transfer of power from one to the other.
  • At least an area of the substrate integrated waveguide extending between the transition end of the waveguide and the microstrip is covered by a solid metallic enclosure.
  • the floor and a portion of each side wall close to the floor end at the edge of the first end of the circuit board, the floor being coplanar with a bottom surface thereof, while the rest of the waveguide extends along a portion of a top surface of the circuit board.
  • the substrate integrated waveguide is included in a circuit board at a first end thereof.
  • the circuit board comprises a substrate, wherein an end portion of the circuit board, at the first end thereof, comprises an uncovered portion of the substrate, and wherein a portion of the ridge adjacent to its end portion extends along the uncovered portion of the substrate.
  • the circuit board has a narrowed end portion at its first end, which narrowed end portion extends into the waveguide. This is another advantageous way of aligning the floor of the waveguide with the ground plane of the SIW in order to facilitate for the propagation of the electric field through the SIW to continue into the waveguide.
  • the transition comprises a solid metal housing having two halves, wherein a bottom part of the waveguide is formed in a first half of the housing and a top part of the waveguide, including the ridge, is formed in a second half of the housing, and wherein at least the first half of the housing comprises a first seat in which a circuit board including the substrate integrated waveguide and the microstrip is arranged.
  • the first half of the housing comprises a wall section, which is arranged at the transition end of the rectangular waveguide, and which is in engagement with the substrate integrated waveguide and extends transverse thereof.
  • the waveguide is separated from the SIW and mictrostrip and it is possible to form a tight enclosure enclosing the SIW and mictrostrip.
  • the transition 100 comprises a rectangular waveguide 102 having a floor 104, side walls 106, and a ceiling 108, a microstrip 110, and a substrate integrated waveguide 112.
  • the waveguide 102 is arranged in engagement with the substrate integrated waveguide, or SIW, 112, at a transition end 114 of the waveguide 102.
  • the waveguide 102 extends over a portion of the SIW 112 including a first end 116 thereof.
  • the microstrip 110 is coupled to the SIW 112 at a second end thereof, wherein there is a continuous transition from the top layer of the microstrip 110 to the top layer of the SIW 112.
  • the rectangular waveguide 102 comprises a ridge 118 attached to the ceiling 108, extending along a portion of the rectangular waveguide 102, and having a first end portion 120 which is engaged with a portion of the top layer 122 of the SIW at its first end 116.
  • the waveguide 102 is partly cut away at the transition end 114, in order to show the structure of the very transition between the SIW 112 and the waveguide 102.
  • the actual extension of the side walls 106 of the waveguide 102 is indicated by a broken line on the top layer 122 of the SIW 112. Additionally referring to e.g. Fig.
  • the SIW 310 is a kind of a waveguide having a layered structure of a ground plane 312, of a conductive material such as a metal, at the bottom of the structure, a substrate 314, of a dielectric material, in the middle, a top layer 316, of a conductive material such as a metal, and one or more rows of vias 318, which are through holes comprising a conductive material, typically an inside metal plating, connecting the top layer 316 with the ground plane 312.
  • the vias 318 simulate the walls of a rectangular waveguide.
  • a microstrip as understood by the skilled person, is a layer structure of a ground plane 304, a substrate 306, and a top layer 308, which parts have the similar characteristics as the corresponding parts of the SIW 310.
  • the SIW 112, and the microstrip 110 are arranged on a circuit board 124, only a portion of which is shown in Fig. 1 , and which may comprise other circuits as well.
  • the microstrip 110 includes different signal processing portions, for instance filters, amplifiers, mixers, switches and other active and passive circuits.
  • the SIW 112 comprises double rows of vias at its opposite longitudinal edges 126, 128. However, single or multiple rows of vias can be used.
  • the top layer of the SIW 112 is removed at an end portion 130 of the SIW 112 at the first end 116 thereof, which is also a first end of the circuit board 124.
  • the end portion 130 of the SIW 112 is still regarded as a part of the SIW although it is missing the top layer 122, since the rest of the SIW structure remain with via edges 126, 128, 318, ground plane 312 and substrate 314, and since, due to the ridge 118, the signal propagation is kept within the structure.
  • the SIW 112 is broadened at the end portion 130, such that the walls 106 of the waveguide 102 extend just inside of the edges 126, 128 of the SIW 112, while at the adjacent portion of the SIW 112 where the ridge 118 engages the top layer 122 of the SIW 112 the side walls 106 of the waveguide 102 extends just outside of the edges 126, 128 of the SIW 112.
  • This embodiment of the SIW 112 is more clearly shown in Figs. 5a and 5b , where the same reference numbers as above have been used for denoting the different parts and portions of the SIW 112.
  • Fig. 5a shows a cut off portion of the circuit board 124, at a first end thereof, which includes the SIW 112. The position of the ridge 118 has been indicated with broken lines.
  • the SIW 600 is not broadened at an end portion but it has straight via edges 602.
  • an end portion 604 of the circuit board 606 has been narrowed at a first end 607 thereof, to the width of the SIW 600.
  • the end portion 604 extends into the waveguide 608 at the transition end thereof, where the ridge 610 is engaged with the top layer 612 of the SIW 600.
  • a groove 614 has been formed in the floor 616 of the waveguide 608, and the ground plane 618 of the SIW 600 has been received in the groove 614.
  • the transition comprises a housing, which consists of two solid metal halves 200, 202, as shown in Figs. 2a and 2b .
  • a bottom part 204 of the waveguide is formed as a bottom groove in a first half 200 of the housing, and a top part 206 of the waveguide, including the ridge 118, is formed in a second half 202 of the housing.
  • the top part 206 of the waveguide includes a top groove 208 formed in the second half 202, the top groove 208 being defined by the ceiling 108, and by a major part of the side walls 106 mentioned above.
  • the bottom part, or bottom groove, 204 of the waveguide is defined by the floor 104 and by minor parts of the side walls 106.
  • the ridge 118 is formed as a ridge of material left in the middle of the top groove 208, and it has its full height at a transition portion 210 at the first end 212 thereof.
  • the transition portion 210 includes the end portion and the portion adjacent thereto mentioned above, and it extends a distance towards a second opposite end 214 of the ridge 118.
  • the height of the ridge 118 decreases, stepwise in this embodiment, to zero along a transformation portion 216 extending from the transition portion 210 to the second end 214.
  • the decrease can be continuous, such as having a curved periphery, or any other kind of gradual transformation.
  • the first half 200 of the housing comprises a first seat 218 in which the circuit board 124 including the SIW 112 and the microstrip 110 has been received.
  • the bottom groove 204 extends to the seat 218, and the first end 116 of the circuit board 124 is positioned adjacent to the end of the bottom groove 204.
  • the top groove 208 ends a bit ahead of the first end 212 of the ridge 118. That end of the top groove 208 constitutes the transition end 114 of the waveguide.
  • a wall section 220 is arranged at the transition end 114, and it is followed by a large recess 222. When the two halves 200, 202 have been mounted together, the wall section 220 is in engagement with the SIW 112 and extends transverse thereof. Further, the recess 222 forms a space above the rest of the circuit board 124.
  • Figs. 3a to 3f, and Fig. 4 the signal propagation through the transition will be explained.
  • the signal is propagated from the microstrip to the waveguide.
  • the microstrip 302 comprising a ground plane 304, a substrate 306, and a top layer 308, and being enclosed by the walls defining the recess 222, the major part of the signal energy propagates through the substrate 306, as shown in Fig. 3a .
  • the cross-section of Fig. 3a is taken along line A-A in Fig. 4 .
  • Fig. 3b shows the SIW 310, which is also enclosed in the recess 222, and which comprises a ground plane 312, which is another portion of the same layer as used for the microstrip 302, a substrate 314, a top layer 316, and plated vias 318 connecting the top layer 316 with the ground plane 312.
  • the signal energy is kept within the substrate 314.
  • Fig. 3c is a cross-section taken along line B-B in Fig. 4 .
  • the top layer 316 of the SIW 310 has been removed, uncovering the substrate 314.
  • the ridge 118 takes the role of the top layer, and the signal can continue to propagate through the substrate 314. See Fig. 3e , which is a cross-section along line C-C in Fig. 4 .
  • the ground plane 310 is aligned with the floor 104 of the waveguide 102, and it is possible for the signal to continue from the end of the SIW 310, 112 and the circuit board 124 into the gap between the ridge 118 and the floor 104, as shown in Fig. 3f .
  • the transition is completed.
  • the ground plane of the SIW 700 is not integrated in the circuit board. Instead, the ground plane 702 is integrated in the first half of the housing. More particularly, the circuit board part of the SIW 700 comprises a substrate 704, a top layer 706, and vias 708, while the ground plane 702 is provided by the housing, i.e. the metal of the housing located beneath the substrate 704 constitutes the ground plane 702.
  • the substrate 704 is arranged in engagement with the ground plane 702, and it is preferably rigidly attached to the ground plane 702 by means of soldering, adhesive bonding, or the like.
  • the SIW 700 can be received in a recess of the housing as in the above embodiments. The housing still provides the ground plane.

Landscapes

  • Waveguides (AREA)
  • Optical Integrated Circuits (AREA)

Claims (10)

  1. Transition entre un microruban et un guide d'onde, comprenant :
    - un guide d'onde rectangulaire (102) ayant un plancher (104), des parois latérales (106), un plafond (108) et une extrémité de transition ;
    - un microruban (110) ; et
    - un guide d'onde intégré au substrat (112) ;
    dans laquelle le guide d'onde rectangulaire (102), à l'extrémité de transition de celui-ci, est couplé au guide d'onde intégré au substrat (112) à une première extrémité du guide d'onde intégré au substrat (112), dans laquelle le microruban (110) est couplé au guide d'onde intégré au substrat (112) à une deuxième extrémité de celui-ci, et dans laquelle le guide d'onde rectangulaire (102) comprend une arête (118) attachée au plafond (108), s'étendant le long d'une portion du guide d'onde rectangulaire (102), et ayant une première portion d'extrémité qui est mise en prise avec une portion d'une surface supérieure du guide d'onde intégré au substrat (112) à sa première extrémité.
  2. Transition selon la revendication 1, dans laquelle l'impédance caractéristique du guide d'onde et l'impédance caractéristique du guide d'onde intégré au substrat correspondent l'une à l'autre.
  3. Transition selon la revendication 1 ou 2, dans laquelle au moins une zone du guide d'onde intégré au substrat s'étendant entre l'extrémité de transition du guide d'onde et le microruban est recouverte d'une enceinte métallique solide.
  4. Transition selon l'une quelconque des revendications précédentes, dans laquelle le guide d'onde intégré au substrat est inclus dans une carte de circuit à une première extrémité de celui-ci.
  5. Transition selon la revendication 4, dans laquelle, à l'extrémité de transition du guide d'onde, le plancher et une portion de chaque paroi latérale proche du plancher se terminent au bord de la première extrémité de la carte de circuit, le plancher étant coplanaire avec une surface inférieure de celui-ci, alors que le reste du guide d'onde s'étend le long d'une portion d'une surface supérieure de la carte de circuit.
  6. Transition selon la revendication 4 ou 5, dans laquelle la carte de circuit comprend un substrat, dans laquelle une portion d'extrémité de la carte de circuit, à la première extrémité de celle-ci, comprend une portion découverte du substrat, et dans laquelle une portion de l'arête adjacente à sa portion d'extrémité s'étend le long de la portion découverte du substrat.
  7. Transition selon la revendication 4, dans laquelle la carte de circuit comprend une portion d'extrémité rétrécie à sa première extrémité, laquelle portion d'extrémité rétrécie s'étend dans le guide d'onde.
  8. Transition selon l'une quelconque des revendications précédentes, comprenant un boîtier métallique solide comportant deux moitiés, dans laquelle une partie inférieure du guide d'onde est constituée dans une première moitié du boîtier et une partie supérieure du guide d'onde, comprenant l'arête, est constituée dans une deuxième moitié du boîtier, et dans laquelle au moins la première moitié du boîtier comprend un premier siège dans lequel une carte de circuit comprenant le guide d'onde intégré au substrat et le microruban est agencée.
  9. Transition selon la revendication 8, dans laquelle la deuxième moitié du boîtier comprend une section de paroi, qui est agencée à l'extrémité de transition du guide d'onde rectangulaire, et qui est en prise avec le guide d'onde intégré au substrat et s'étend transversalement à celui-ci.
  10. Transition selon l'une quelconque des revendications 8 et 9, dans laquelle la carte de circuit comprend un substrat et une couche supérieure du guide d'onde intégré au substrat, et le boîtier comprend un plan de masse du guide d'onde intégré au substrat, et dans laquelle le substrat est en prise avec le plan de masse.
EP20110158700 2011-03-17 2011-03-17 Transition de guide d'onde Active EP2500978B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP20110158700 EP2500978B1 (fr) 2011-03-17 2011-03-17 Transition de guide d'onde
PCT/EP2012/054421 WO2012123473A1 (fr) 2011-03-17 2012-03-14 Transition entre guides d'ondes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP20110158700 EP2500978B1 (fr) 2011-03-17 2011-03-17 Transition de guide d'onde

Publications (2)

Publication Number Publication Date
EP2500978A1 EP2500978A1 (fr) 2012-09-19
EP2500978B1 true EP2500978B1 (fr) 2013-07-10

Family

ID=44370639

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20110158700 Active EP2500978B1 (fr) 2011-03-17 2011-03-17 Transition de guide d'onde

Country Status (2)

Country Link
EP (1) EP2500978B1 (fr)
WO (1) WO2012123473A1 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9444135B2 (en) 2014-09-19 2016-09-13 Freescale Semiconductor, Inc. Integrated circuit package
US9620841B2 (en) 2014-06-13 2017-04-11 Nxp Usa, Inc. Radio frequency coupling structure
US9887449B2 (en) 2014-08-29 2018-02-06 Nxp Usa, Inc. Radio frequency coupling structure and a method of manufacturing thereof
US9917372B2 (en) 2014-06-13 2018-03-13 Nxp Usa, Inc. Integrated circuit package with radio frequency coupling arrangement
CN108604722A (zh) * 2016-02-12 2018-09-28 瑞典爱立信有限公司 包括siw与波导或天线之间的非接触过渡或连接的过渡装置
US10103447B2 (en) 2014-06-13 2018-10-16 Nxp Usa, Inc. Integrated circuit package with radio frequency coupling structure
US10225925B2 (en) 2014-08-29 2019-03-05 Nxp Usa, Inc. Radio frequency coupling and transition structure
WO2021123111A1 (fr) 2019-12-20 2021-06-24 2Pi-Labs Gmbh Agencement de guide d'ondes creux
US11728576B2 (en) 2020-10-02 2023-08-15 Aptiv Technologies Limited Plastic air-waveguide antenna with conductive particles

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104078733B (zh) * 2014-06-12 2017-04-12 电子科技大学 一种siw环行器
CN104466325B (zh) * 2014-12-10 2017-04-05 电子科技大学 一种用于Ka波段矩形波导转基片集成波导的装置
WO2017167916A1 (fr) 2016-03-31 2017-10-05 Huber+Suhner Ag Plaque d'adaptateur et ensemble antenne
US10468736B2 (en) 2017-02-08 2019-11-05 Aptiv Technologies Limited Radar assembly with ultra wide band waveguide to substrate integrated waveguide transition
US10985448B2 (en) 2017-03-20 2021-04-20 Viasat, Inc. Radio-frequency seal at interface of waveguide blocks
US11527808B2 (en) 2019-04-29 2022-12-13 Aptiv Technologies Limited Waveguide launcher
US11757166B2 (en) 2020-11-10 2023-09-12 Aptiv Technologies Limited Surface-mount waveguide for vertical transitions of a printed circuit board
US11626668B2 (en) 2020-12-18 2023-04-11 Aptiv Technologies Limited Waveguide end array antenna to reduce grating lobes and cross-polarization
US11901601B2 (en) 2020-12-18 2024-02-13 Aptiv Technologies Limited Waveguide with a zigzag for suppressing grating lobes
US11502420B2 (en) 2020-12-18 2022-11-15 Aptiv Technologies Limited Twin line fed dipole array antenna
US11749883B2 (en) 2020-12-18 2023-09-05 Aptiv Technologies Limited Waveguide with radiation slots and parasitic elements for asymmetrical coverage
US11681015B2 (en) 2020-12-18 2023-06-20 Aptiv Technologies Limited Waveguide with squint alteration
US11444364B2 (en) 2020-12-22 2022-09-13 Aptiv Technologies Limited Folded waveguide for antenna
US11668787B2 (en) 2021-01-29 2023-06-06 Aptiv Technologies Limited Waveguide with lobe suppression
US11721905B2 (en) 2021-03-16 2023-08-08 Aptiv Technologies Limited Waveguide with a beam-forming feature with radiation slots
US11616306B2 (en) 2021-03-22 2023-03-28 Aptiv Technologies Limited Apparatus, method and system comprising an air waveguide antenna having a single layer material with air channels therein which is interfaced with a circuit board
US11973268B2 (en) 2021-05-03 2024-04-30 Aptiv Technologies AG Multi-layered air waveguide antenna with layer-to-layer connections
US11962085B2 (en) 2021-05-13 2024-04-16 Aptiv Technologies AG Two-part folded waveguide having a sinusoidal shape channel including horn shape radiating slots formed therein which are spaced apart by one-half wavelength
US11616282B2 (en) 2021-08-03 2023-03-28 Aptiv Technologies Limited Transition between a single-ended port and differential ports having stubs that match with input impedances of the single-ended and differential ports
CN117374552B (zh) * 2023-12-05 2024-02-02 成都华兴大地科技有限公司 一种低剖面密封型微带至波导的过渡结构及应用

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5846702A (ja) * 1981-09-11 1983-03-18 Nec Corp 直流阻止形リツジ導波管・マイクロストリツプライン変換器
ATE199995T1 (de) 1996-09-13 2001-04-15 Siemens Ag Verfahren zum inertisieren eines generators in einem kraftwerk
US7064633B2 (en) * 2002-07-13 2006-06-20 The Chinese University Of Hong Kong Waveguide to laminated waveguide transition and methodology
US7068121B2 (en) * 2003-06-30 2006-06-27 Tyco Technology Resources Apparatus for signal transitioning from a device to a waveguide
JP5179570B2 (ja) * 2008-03-31 2013-04-10 京セラ株式会社 高周波モジュールおよびその製造方法ならびに該高周波モジュールを備えた送信器、受信器、送受信器およびレーダ装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9620841B2 (en) 2014-06-13 2017-04-11 Nxp Usa, Inc. Radio frequency coupling structure
US9917372B2 (en) 2014-06-13 2018-03-13 Nxp Usa, Inc. Integrated circuit package with radio frequency coupling arrangement
US10103447B2 (en) 2014-06-13 2018-10-16 Nxp Usa, Inc. Integrated circuit package with radio frequency coupling structure
US9887449B2 (en) 2014-08-29 2018-02-06 Nxp Usa, Inc. Radio frequency coupling structure and a method of manufacturing thereof
US10225925B2 (en) 2014-08-29 2019-03-05 Nxp Usa, Inc. Radio frequency coupling and transition structure
US9444135B2 (en) 2014-09-19 2016-09-13 Freescale Semiconductor, Inc. Integrated circuit package
CN108604722A (zh) * 2016-02-12 2018-09-28 瑞典爱立信有限公司 包括siw与波导或天线之间的非接触过渡或连接的过渡装置
CN108604722B (zh) * 2016-02-12 2021-04-16 瑞典爱立信有限公司 包括siw与波导或天线之间的非接触过渡或连接的过渡装置
WO2021123111A1 (fr) 2019-12-20 2021-06-24 2Pi-Labs Gmbh Agencement de guide d'ondes creux
US11728576B2 (en) 2020-10-02 2023-08-15 Aptiv Technologies Limited Plastic air-waveguide antenna with conductive particles

Also Published As

Publication number Publication date
EP2500978A1 (fr) 2012-09-19
WO2012123473A1 (fr) 2012-09-20

Similar Documents

Publication Publication Date Title
EP2500978B1 (fr) Transition de guide d'onde
US8674885B2 (en) Systems for interfacing waveguide antenna feeds with printed circuit boards
KR101750813B1 (ko) 마이크로스트립 라인과 직사각형 도파관 사이의 마이크로파 전환 디바이스
US20200168974A1 (en) Transition arrangement, a transition structure, and an integrated packaged structure
US7884682B2 (en) Waveguide to microstrip transducer having a ridge waveguide and an impedance matching box
US7154356B2 (en) Radio frequency (RF) circuit board topology
US8674892B2 (en) Accurate millimeter-wave antennas and related structures
US20120256707A1 (en) Systems and methods for millimeter-wave laminate structures
US8253029B2 (en) Filter circuit element and electronic circuit device
JP5566169B2 (ja) アンテナ装置
CN112397863B (zh) 用于毫米波的转接结构以及多层转接结构
US20110140799A1 (en) Low-Loss Millimeter-Wave Interface Comprising a Bare-Die
US20110140810A1 (en) Waveguide-backshort comprising a printed conducting layer
IL270826B (en) Broadband waveguide launch designs on a single layer printed circuit board
US20110140979A1 (en) Waveguide comprising laminate structure
JP6151794B2 (ja) 回路基板、電子部品収納用パッケージおよび電子装置
EP1798806A1 (fr) Dispositif de conversion d'une structure de transmission
US20110122041A1 (en) Planar antenna
ITTO20080619A1 (it) Dispositivo a struttura multistrato a transizione verticale tra una microstriscia ed una stripline
US20110140811A1 (en) Millimeter-Wave Chip Packaging and Interface
KR101577370B1 (ko) 마이크로웨이브 필터
JP5225188B2 (ja) 方向性結合器
JP3678194B2 (ja) 伝送線路および送受信装置
KR20100005616A (ko) 손실 개선을 위한 ｒｆ 전송 선로
JP2011172173A (ja) ミリ波回路モジュール及びそれを用いたミリ波送受信機

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

17P Request for examination filed

Effective date: 20121220

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

Ref country code: AT

Ref legal event code: REF

Ref document number: 621419

Country of ref document: AT

Kind code of ref document: T

Effective date: 20130715

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602011002241

Country of ref document: DE

Effective date: 20130905

REG Reference to a national code

Ref country code: SE

Ref legal event code: TRGR

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 621419

Country of ref document: AT

Kind code of ref document: T

Effective date: 20130710

REG Reference to a national code

Ref country code: NL

Ref legal event code: VDEP

Effective date: 20130710

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131110

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131010

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130911

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131111

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131021

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131011

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

26N No opposition filed

Effective date: 20140411

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602011002241

Country of ref document: DE

Effective date: 20140411

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140317

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20140331

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20140331

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 6

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20110317

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 7

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 8

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

REG Reference to a national code

Ref country code: DE

Ref legal event code: R081

Ref document number: 602011002241

Country of ref document: DE

Owner name: SIVERS WIRELESS AB, SE

Free format text: FORMER OWNER: SIVERS IMA AB, KISTA, SE

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20230228

Year of fee payment: 13

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: SE

Payment date: 20230228

Year of fee payment: 13

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230504

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IE

Payment date: 20240219

Year of fee payment: 14

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20240216

Year of fee payment: 14

Ref country code: GB

Payment date: 20240215

Year of fee payment: 14