EP2487715A3 - Solid-state image pickup device and method for manufacturing solid-state image pickup device - Google Patents

Solid-state image pickup device and method for manufacturing solid-state image pickup device Download PDF

Info

Publication number
EP2487715A3
EP2487715A3 EP12151095A EP12151095A EP2487715A3 EP 2487715 A3 EP2487715 A3 EP 2487715A3 EP 12151095 A EP12151095 A EP 12151095A EP 12151095 A EP12151095 A EP 12151095A EP 2487715 A3 EP2487715 A3 EP 2487715A3
Authority
EP
European Patent Office
Prior art keywords
image pickup
pickup device
state image
solid
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12151095A
Other languages
German (de)
French (fr)
Other versions
EP2487715A2 (en
EP2487715B1 (en
Inventor
Tadashi Sawayama
Hiroshi Ikakura
Takaharu Kondo
Toru Eto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of EP2487715A2 publication Critical patent/EP2487715A2/en
Publication of EP2487715A3 publication Critical patent/EP2487715A3/en
Application granted granted Critical
Publication of EP2487715B1 publication Critical patent/EP2487715B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H01L27/14629—
    • H01L27/146—
    • H01L27/14641—
    • H01L27/14685—
    • H01L27/14621—
    • H01L27/14627—
    • H01L27/14636—
    • H01L27/14643—

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

A method for manufacturing a solid-state image pickup device that includes a substrate (301) including a photoelectric conversion unit (202) and a waveguide arranged on the substrate, the waveguide corresponding to the photoelectric conversion unit and including a core and a cladding (3191), includes a first step and a second step, in which in the first step and the second step, a member (324a) to be formed into the core is formed in an opening in the cladding by high-density plasma-enhanced chemical vapor deposition, and in which after the first step, in the second step, the member to be formed into the core is formed by the high-density plasma-enhanced chemical vapor deposition under conditions in which the ratio of a radio-frequency power on the back face side of the substrate to a radio-frequency power on the front face side of the substrate is higher than that in the first step.
EP12151095.2A 2011-02-09 2012-01-13 Solid-state image pickup device and method for manufacturing solid-state image pickup device Not-in-force EP2487715B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011026346 2011-02-09
JP2011223302A JP5284438B2 (en) 2011-02-09 2011-10-07 Solid-state imaging device and method for manufacturing solid-state imaging device

Publications (3)

Publication Number Publication Date
EP2487715A2 EP2487715A2 (en) 2012-08-15
EP2487715A3 true EP2487715A3 (en) 2013-02-27
EP2487715B1 EP2487715B1 (en) 2015-03-25

Family

ID=45463485

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12151095.2A Not-in-force EP2487715B1 (en) 2011-02-09 2012-01-13 Solid-state image pickup device and method for manufacturing solid-state image pickup device

Country Status (7)

Country Link
US (1) US9224777B2 (en)
EP (1) EP2487715B1 (en)
JP (1) JP5284438B2 (en)
KR (1) KR101476497B1 (en)
CN (1) CN102637703B (en)
BR (1) BR102012002818A2 (en)
RU (1) RU2497233C2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012182426A (en) * 2011-02-09 2012-09-20 Canon Inc Solid state image pickup device, image pickup system using solid state image pickup device and solis state image pickup device manufacturing method
US20120267741A1 (en) * 2011-04-21 2012-10-25 Panasonic Corporation Solid-state imaging device and method for manufacturing the same
US20140186544A1 (en) * 2013-01-02 2014-07-03 Applied Materials, Inc. Metal processing using high density plasma
JP6136663B2 (en) * 2013-07-04 2017-05-31 ソニー株式会社 Solid-state imaging device, manufacturing method thereof, and electronic device
JP6465545B2 (en) * 2013-09-27 2019-02-06 ソニー株式会社 Imaging device, manufacturing method thereof, and electronic apparatus
TWI571626B (en) 2015-07-15 2017-02-21 力晶科技股份有限公司 Integrated bio-sensor with nanocavity and fabrication method thereof
JP2017069553A (en) 2015-09-30 2017-04-06 キヤノン株式会社 Solid-state imaging device, method of manufacturing the same, and camera
US10375338B2 (en) * 2017-02-01 2019-08-06 Omnivision Technologies, Inc. Two stage amplifier readout circuit in pixel level hybrid bond image sensors

Citations (3)

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Publication number Priority date Publication date Assignee Title
US20030110808A1 (en) * 2001-12-14 2003-06-19 Applied Materials Inc., A Delaware Corporation Method of manufacturing an optical core
US20090215281A1 (en) * 2008-02-22 2009-08-27 Applied Materials, Inc. Hdp-cvd sion films for gap-fill
US20100078745A1 (en) * 2008-09-29 2010-04-01 Sony Corporation Solid-state imaging device, method for manufacturing solid-state imaging device, and electronic apparatus

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JPH0745601A (en) * 1993-07-27 1995-02-14 Fuji Electric Co Ltd Method and apparatus for plasma cvd
JPH0992813A (en) * 1995-09-27 1997-04-04 Sony Corp Solid state image pickup device and its manufacture
JP2001176866A (en) * 1999-10-28 2001-06-29 Texas Instr Inc <Ti> Manufacturing method of integrated circuit device
JP4427949B2 (en) 2002-12-13 2010-03-10 ソニー株式会社 Solid-state imaging device and manufacturing method thereof
JP2005251804A (en) * 2004-03-01 2005-09-15 Canon Inc Imaging device
JP2006120845A (en) * 2004-10-21 2006-05-11 Canon Inc Photoelectric converter and its manufacturing method
US7592645B2 (en) * 2004-12-08 2009-09-22 Canon Kabushiki Kaisha Photoelectric conversion device and method for producing photoelectric conversion device
JP2007201162A (en) * 2006-01-26 2007-08-09 Fujifilm Corp Solid-state imaging element, and manufacturing method thereof
US7524690B2 (en) * 2006-08-10 2009-04-28 United Microelectronics Corp. Image sensor with a waveguide tube and a related fabrication method
EP1930950B1 (en) * 2006-12-08 2012-11-07 Sony Corporation Solid-state image pickup device, method for manufacturing solid-state image pickup device, and camera
KR20080111624A (en) * 2007-06-19 2008-12-24 삼성전자주식회사 Plasma etching apparatus and chamber cleaning method using plasma etching apparatus
JP4852016B2 (en) 2007-10-29 2012-01-11 株式会社東芝 Semiconductor device and manufacturing method thereof
KR20100037208A (en) 2008-10-01 2010-04-09 주식회사 동부하이텍 Image sensor and fabricating method thereof
KR101561862B1 (en) * 2008-12-26 2015-10-21 삼성전자 주식회사 Fabricating method of semiconductor integrated circuit devices
JP5644057B2 (en) * 2009-03-12 2014-12-24 ソニー株式会社 Solid-state imaging device, manufacturing method thereof, and imaging device
JP5434252B2 (en) * 2009-05-14 2014-03-05 ソニー株式会社 Solid-state imaging device, manufacturing method thereof, and electronic apparatus
JP2010283145A (en) 2009-06-04 2010-12-16 Sony Corp Solid-state image pickup element and method of manufacturing the same, electronic apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030110808A1 (en) * 2001-12-14 2003-06-19 Applied Materials Inc., A Delaware Corporation Method of manufacturing an optical core
US20090215281A1 (en) * 2008-02-22 2009-08-27 Applied Materials, Inc. Hdp-cvd sion films for gap-fill
US20100078745A1 (en) * 2008-09-29 2010-04-01 Sony Corporation Solid-state imaging device, method for manufacturing solid-state imaging device, and electronic apparatus

Also Published As

Publication number Publication date
RU2497233C2 (en) 2013-10-27
EP2487715A2 (en) 2012-08-15
JP2012182431A (en) 2012-09-20
US20120202310A1 (en) 2012-08-09
EP2487715B1 (en) 2015-03-25
JP5284438B2 (en) 2013-09-11
KR20120092021A (en) 2012-08-20
BR102012002818A2 (en) 2013-07-23
US9224777B2 (en) 2015-12-29
CN102637703B (en) 2016-03-16
RU2012104496A (en) 2013-08-20
CN102637703A (en) 2012-08-15
KR101476497B1 (en) 2014-12-24

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