EP2483593B1 - Lamp with variable substrate as base for the lightsource - Google Patents

Lamp with variable substrate as base for the lightsource Download PDF

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Publication number
EP2483593B1
EP2483593B1 EP10779685.6A EP10779685A EP2483593B1 EP 2483593 B1 EP2483593 B1 EP 2483593B1 EP 10779685 A EP10779685 A EP 10779685A EP 2483593 B1 EP2483593 B1 EP 2483593B1
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EP
European Patent Office
Prior art keywords
mounting substrate
lamp
led
lamp according
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
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EP10779685.6A
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German (de)
French (fr)
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EP2483593A1 (en
Inventor
Alexander Dohn
Karl Degelmann
Christian Schnagl
Armin Veitl
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Ceramtec GmbH
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Ceramtec GmbH
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Priority to PL10779685T priority Critical patent/PL2483593T3/en
Priority to SI201030629T priority patent/SI2483593T1/en
Publication of EP2483593A1 publication Critical patent/EP2483593A1/en
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Publication of EP2483593B1 publication Critical patent/EP2483593B1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86—Ceramics or glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a lamp according to the preamble of claim 1.
  • Ceramic lamps are optimally designed according to the current state for a specific light source (LED, fluorescent tube, filament). As a result, the required heat dissipation is firmly designed. Disadvantage is that for each variant of the actual light source, a redesign of the lamp necessary and the production becomes inflexible. Hardly any components of the different lamps can be interchanged.
  • US 2008/0149945 A1 describes a substrate made of aluminum nitride.
  • FIG. 2 shows such a lamp according to the prior art.
  • the lamp for receiving an LED as a lighting means consists of a lower part 1 as a lamp base and support member for the LED and for supplying the electrical connection wires to the LED.
  • the mounting device for the LED is integrated in the lower part 1 or in the lamp base and consists of a tungsten-nickel receiving region 14, to which the LED is soldered.
  • a lampshade 3 surrounds the LED.
  • the disadvantage of this lamp is that only by a redesign the lamp can be adapted to different light sources with different heat development.
  • the lamp base is made of a single ceramic, so that when changing the material due to better heat conduction or design reasons always the entire lamp base the color of the new Ceramic and so no individual adjustments to the various color designs of the lampshade is possible.
  • the color of the lamp cap is hardly to be varied as a technically preferred material and, for example, adapted to a brightly colored lampshade.
  • the invention has for its object to improve a lamp according to the preamble of claim 1 so that the lower part and the lamp base can be adapted to a variety of materials or design requirements, without the technical needs are neglected.
  • the production should be flexible and components of different lamps interchangeable.
  • the mounting device is a separate mounting substrate with a breaking strength between 100 and 1000 MPa
  • the material of the mounting substrate has a thermal conductivity between 10 and 250 W / m ° K and the mounting substrate is arranged on the lower part
  • the technical requirements are met or can be fulfilled and at the same time the lower part or the lamp base can be adapted to the most diverse materials or design requirements.
  • the production is flexible and components of the various lamps can be exchanged with each other.
  • At least one metallization region for soldering the LED is preferably applied to the mounting substrate.
  • This Metallization region consists in one embodiment of tungsten-nickel, wherein the metallization regions are made of tungsten and are chemically nickel-plated.
  • the material of the mounting substrate has a thermal conductivity between 20 and 200 W / m ° K.
  • the mounting substrate consists of a ceramic. Ceramics can have excellent thermal conductivity and high resistance to breakage. They are therefore ideal for a mounting substrate. According to the invention, the surface of the ceramic substrate contains sintered metallization regions for soldering the LED (s).
  • feedthroughs for the electrical connection wires are arranged in the mounting substrate. These connecting wires are electrically conductively connected to the metallization regions.
  • the mounting substrate is a disc-shaped mounting plate. Slices are easy to produce and are also easy to arrange on the base. LEDs can be easily soldered to mounting washers, as the surfaces are flat.
  • the lamp is modularly composed of three ceramic parts, namely the lower part, the mounting substrate and the lampshade.
  • the lampshade has on its outer surface longitudinally extending ribs which increase the surface area for cooling. Ceramics can be produced in a wide variety of colors, so that the lampshade can be adapted to individual design specifications. This also applies to the lower part as a lamp base.
  • the mounting substrate is not visible from the outside, so that its ceramic can be adapted exclusively to the technical requirements.
  • the color of the mounting substrate is not important because it is not visible from the outside.
  • the lower part is cylindrical with an inner cavity and two end faces, wherein the first end face is closed and having passages or connecting elements for the connecting wires and the second end face is closed by the mounting substrate.
  • the mounting substrate forms in this embodiment, the closure of the lower part, whereby material is saved and at the same time an optimal fit of the mounting substrate is given.
  • the outer upper end of the lower part facing the mounting substrate preferably has a radially projecting shoulder on which the lampshade is seated and surrounds the outer upper end of the lower part.
  • Base and lampshade form a unit and can be easily attached to each other.
  • the mounting substrate has on its outer circumference on a radial indentation, on which a shoulder of the lampshade is seated and engages around the mounting substrate.
  • the mounting substrate is thereby firmly anchored.
  • the mounting substrate can also be connected to the other parts of the lamp by means of a screw connection, adhesive bonding or a bayonet closure.
  • the mounting substrate can also be mechanically and / or chemically bonded (gluing, active soldering, glass soldering, metallizing or soldering) to the other parts of the lamp.
  • the lampshade completely surrounds the mounting substrate, so that it is not visible from the outside. Only this hiding inside the lamp makes it possible to select the ceramics exclusively according to the technical requirements and not according to design wishes.
  • the mounting substrate consists of highly heat-conductive aluminum nitride AlN. With aluminum nitride, the technical requirements of breaking strength and thermal conductivity are best fulfilled.
  • the lampshade in a preferred embodiment is ruby-colored alumina with chromium oxide doping.
  • all or some of the ceramic parts of the lamp made of alumina, glassy or pure, with or without additives, such as Cr203 as an additive, having a thermal conductivity of 20 to 40 W / m ° K, or aluminum nitride with a thermal conductivity of 160 to 200 W. / m ° K.
  • all or some of the ceramic parts of the lamp are made of a transparent, transparent, translucent or translucent ceramic.
  • the connecting wires are guided through the cavity in the lower part to the mounting substrate and are there electrically connected to the mounting substrate or directly to the LED.
  • the lamp is preferably a base GU10 lamp.
  • a lamp with replaceable mounting substrate for the light source is presented.
  • This mounting substrate can be varied in material (different thermal conductivity) and strength and adapted to the dissipated amount of heat of the light source. With the help of a screw connection, bonding, bayonet closure or the like, the mounting substrate with the remaining parts of the lamp body mechanically and / or chemically (bonding, active soldering, glass soldering, metallizing and soldering) connected.
  • This mounting substrate can also consist of other material (other ceramic, metal, etc.) than the other (visible) lamp parts and also be different in color, because, for example, alumina can be strongly colored by doping, because of his good thermal conductivity as a mounting substrate attractive but not gray aluminum nitride. Inside the lamp, however, it is not visible and only has to fulfill its technical purpose.
  • the substrate itself can be produced by the known methods of molding such as dry pressing, injection molding in the case of ceramics, by melting glass to metal in the case of enameled metal, injection molding in the case of plastic, etc.
  • FIG. 1 a lamp according to the invention described.
  • FIG. 3 shows a ceramic substrate 4 according to the invention.
  • a socket GU10 lamp according to the invention consists of a lower part 1 with power supply 2, lampshade 3 and adhesive mounting substrate. 4
  • the mounting substrate 4 is in this example a mounting plate for the LED and consists of unattractive gray highly heat-conductive AIN, the lampshade 3 of ruby-colored aluminum oxide with Chromoxiddot mich.
  • the mounting substrate 4 is not visible.
  • the lamp body or lampshade 3 is closed with a glass pane (not shown) at the upper end of the lampshade 3.
  • metallization regions 15 for soldering the LED (s) are arranged on the surface of the ceramic substrate 4.
  • bushings 16 or plug elements for the electrical connecting wires are arranged in the mounting substrate. These connecting wires are electrically conductively connected to the metallization regions 15.
  • any number of metallization regions 15 may be arranged on the mounting substrate 4 any number of metallization regions 15 may be arranged.
  • the mounting substrate 4 has a radial indentation 13 on the circumferential surface facing the metallization region 15 for better fixation.
  • the lamp is modularly formed from three ceramic parts, namely a lower part 1 with a power supply 2, a mounting substrate 4 Through the power supply 2, for example, electrical connection wires (not shown in the figure) are guided in the lower part 1 and within the lower part 1 to the mounting substrate 4.
  • the mounting substrate 4 consists of a ceramic, preferably a high heat dissipation.
  • a light source or a plurality of light sources are attached on the mounting substrate 4.
  • LEDs are preferably used.
  • the lampshade 3 is also preferably made of a ceramic with cooling fins 5 on its outer surface. The cooling fins 5 extend in the longitudinal direction of the lampshade third
  • mounting substrate is the more general term, since the mounting substrate is only a mounting plate.
  • the mounting substrate may also not be disc-shaped. Otherwise both terms describe the same item.
  • the lampshade 3 For better attachment of the lampshade 3 on the lower part 1, this has on its inner surface a paragraph 8, with which the lampshade 3 is seated on a corresponding paragraph or indentation 13 on the mounting substrate 4.
  • the lower end of the lampshade 3 surrounds the mounting substrate 4 and the upper end 12 of the lower part 1.
  • the mounting substrate 4 is arranged between the lampshade 3 and the lower part 1, that it is not visible from the outside.
  • the upper, the mounting plate 4 facing away from the end of the lampshade 3 has an inner shoulder 6 for receiving a glass.
  • the lower part 1 is formed cylindrically with an inner cavity 7. This saves material.
  • the lamp according to the invention thus consists of a lower part 1, a mounting plate 4 and a lampshade 3, which surrounds the light source, an LED. On the mounting substrate 4, the light source is attached.
  • the lampshade 3 which surrounds the LED (light source), has three functions. It protects the LED from damage and its color design influences the color of the emitted light. In the main, however, it serves as a heat sink, ie for heat dissipation of the heat generated by the LED to the ambient air.
  • To increase the surface of the lampshade distributed on its circumference structures may have, such as cooling fins 5, whose cross sections may have any shape.
  • the shape of the lampshade 3 can be arbitrary. It can be round, for example polygonal, oval or elliptical.
  • the lampshade 3 may be glued to the lower part 1 or otherwise firmly connected.
  • the material of the lamp must be heat resistant.
  • a particularly suitable material for the lamp is a ceramic material with a good thermal conductivity, for example alumina, glass-containing or pure, with or without additives, for example Cr 2 O 3, with a thermal conductivity of 20 to 40 W / m ° K, or aluminum nitride with a thermal conductivity of 160 to 200 W / m ° K.
  • the material may be transparent or translucent translucent.
  • the breaking strength of the ceramic materials is preferably between 100 and 1000 MPa.
  • the lower part 1 can also be equipped as a plug for the production of plug-in connections with appropriate sockets or with threads for screwing in brackets or, in occupied with terminal poles sockets, in lamp holders.
  • the lampshade 3 has on its circumference evenly distributed cooling fins 5, so that the outline of the lampshade 3 looks at its opening like a gear.
  • the cooling fins 5 are, in particular in high-power LEDs, an advantage to dissipate the heat generated to the ambient air. Its cross section can take any other possible form such as semicircular or semi-elliptical. For LEDs with low heat loss, the screen can also be smooth. The screen may also have different shapes, such as oval or polygonal.

Description

Die Erfindung betrifft eine Lampe nach dem Oberbegriff des Anspruchs 1.The invention relates to a lamp according to the preamble of claim 1.

Stand der Technik :State of the art :

Keramische Lampen sind nach heutigem Stand meist für eine bestimmte Lichtquelle (LED, Fluoreszenzröhre, Glühfaden) optimal konstruiert. Dadurch wird die benötigte Wärmeabfuhr fest einkonstruiert. Nachteil ist, dass für jede Variante der eigentlichen Lichtquelle eine Neukonstruktion der Lampe notwendig und die Herstellung unflexibel wird. Es können kaum Bauteile der verschiedenen Lampen untereinander getauscht werden.Ceramic lamps are optimally designed according to the current state for a specific light source (LED, fluorescent tube, filament). As a result, the required heat dissipation is firmly designed. Disadvantage is that for each variant of the actual light source, a redesign of the lamp necessary and the production becomes inflexible. Hardly any components of the different lamps can be interchanged.

US 2007/0230188 A1 beschreibt eine Lampe nach dem Oberbegriff des Anspruchs 1. US 2007/0230188 A1 describes a lamp according to the preamble of claim 1.

US 2008/0149945 A1 beschreibt ein Substrat aus Aluminiumnitrid. US 2008/0149945 A1 describes a substrate made of aluminum nitride.

Figur 2 zeigt eine derartige Lampe nach dem Stand der Technik. FIG. 2 shows such a lamp according to the prior art.

Die Lampe zur Aufnahme einer LED als Leuchtmittel besteht aus einem Unterteil 1 als Lampensockel und Trageelement für die LED und zur Zuführung der elektrischen Anschlussdrähte zur LED. Die Montagevorrichtung für die LED ist in das Unterteil 1 bzw. in den Lampensockel integriert und besteht aus einem Wolfram-Nickel-Aufnahmebereich 14, auf den die LED aufgelötet wird. Ein Lampenschirm 3 umgibt die LED. Der Nachteil dieser Lampe besteht darin, dass nur durch eine Neukonstruktion die Lampe an verschiedene Lichtquellen mit unterschiedlicher Wärmeentwicklung angepasst werden kann. Der Lampensockel besteht aus einer einzigen Keramik, so dass bei einem Materialwechsel wegen besserer Wärmeleitung oder aus Design-Gründen immer der gesamte Lampensockel die Farbe der neuen Keramik annimmt und so keine individuelle Anpassungen an die verschiedensten Farbgestaltungen des Lampenschrirms möglich ist. Die Farbe des Lampensockels ist im Falle von AIN als technisch bevorzugten Werkstoff kaum zu variieren und zum Beispiel an einen kräftig gefärbten Lampenschirm anzupassen.The lamp for receiving an LED as a lighting means consists of a lower part 1 as a lamp base and support member for the LED and for supplying the electrical connection wires to the LED. The mounting device for the LED is integrated in the lower part 1 or in the lamp base and consists of a tungsten-nickel receiving region 14, to which the LED is soldered. A lampshade 3 surrounds the LED. The disadvantage of this lamp is that only by a redesign the lamp can be adapted to different light sources with different heat development. The lamp base is made of a single ceramic, so that when changing the material due to better heat conduction or design reasons always the entire lamp base the color of the new Ceramic and so no individual adjustments to the various color designs of the lampshade is possible. In the case of AIN, the color of the lamp cap is hardly to be varied as a technically preferred material and, for example, adapted to a brightly colored lampshade.

In folgenden Schriften werden Sockellampen auch mit GU10 beschrieben.In the following publications pedestal lamps are also described with GU10.

DE 10233073 B3 , DE 19539808 C2 , DE 19539809 A1 , DE 20102325 U1 , DE 20310313 U1 , DE 29620098 U1 , DE 69130738 T2 , DE 69223391 T2 , DE 69229592 T2 , DE 102004004651 B3 , DE 102006022133 A1 , DE 202006014239 U1 , DE 202008007159 U1 , DE 202008011023 U1 , EP 1855052 A2 , US 20070159420 A1 . DE 10233073 B3 . DE 19539808 C2 . DE 19539809 A1 . DE 20102325 U1 . DE 20310313 U1 . DE 29620098 U1 . DE 69130738 T2 . DE 69223391 T2 . DE 69229592 T2 . DE 102004004651 B3 . DE 102006022133 A1 . DE 202006014239 U1 . DE 202008007159 U1 . DE 202008011023 U1 . EP 1855052 A2 . US 20070159420 A1 ,

Der Erfindung liegt die Aufgabe zugrunde, eine Lampe nach dem Oberbegriff des Anspruchs 1 so zu verbessern, dass das Unterteil bzw. der Lampensockel an die verschiedensten Materialien oder Design-Anforderungen angepasst werden kann, ohne dass die technischen Notwendigkeiten vernachlässigt werden. Außerdem soll die Herstellung flexibel und Bauteile der verschiedenen Lampen untereinander tauschbar sein.The invention has for its object to improve a lamp according to the preamble of claim 1 so that the lower part and the lamp base can be adapted to a variety of materials or design requirements, without the technical needs are neglected. In addition, the production should be flexible and components of different lamps interchangeable.

Erfindungsgemäß wird diese Aufgabe durch die Merkmale des Anspruchs 1 gelöst.According to the invention, this object is solved by the features of claim 1.

Dadurch, dass die Montagevorrichtung ein separates Montagesubstrat mit einer Bruchfestigkeit zwischen 100 und 1.000 MPa ist, der Werkstoff des Montagesubstrats eine Wärmeleitfähigkeit zwischen 10 und 250 W/m°K hat und das Montagesubstrat auf dem Unterteil angeordnet ist, sind die technischen Notwendigkeiten erfüllt bzw. erfüllbar und gleichzeitig ist das Unterteil bzw. der Lampensockel an die verschiedensten Materialien oder Design-Anforderungen anpassbar. Hierdurch ist die Herstellung flexibel und Bauteile der verschiedenen Lampen lassen sich untereinander tauschen. Auf dem Montagesubstrat ist bevorzugt zumindest ein Metallisierungsbereich zum Anlöten der LED aufgebracht. Dieser Metallisierungsbereich besteht in einer Ausgestaltung aus Wolfram-Nickel, wobei die Metallisierungsbereiche aus Wolfram bestehen und chemisch vernickelt sind.Because the mounting device is a separate mounting substrate with a breaking strength between 100 and 1000 MPa, the material of the mounting substrate has a thermal conductivity between 10 and 250 W / m ° K and the mounting substrate is arranged on the lower part, the technical requirements are met or can be fulfilled and at the same time the lower part or the lamp base can be adapted to the most diverse materials or design requirements. As a result, the production is flexible and components of the various lamps can be exchanged with each other. At least one metallization region for soldering the LED is preferably applied to the mounting substrate. This Metallization region consists in one embodiment of tungsten-nickel, wherein the metallization regions are made of tungsten and are chemically nickel-plated.

In einer vorteilhaften Ausgestaltung der Erfindung hat der Werkstoff des Montagesubstrats eine Wärmeleitfähigkeit zwischen 20 und 200 W/m°K.In an advantageous embodiment of the invention, the material of the mounting substrate has a thermal conductivity between 20 and 200 W / m ° K.

Erfindungsgemäß besteht das Montagesubstrat aus einer Keramik. Keramiken könnenn eine herausragende Wärmeleitfähigkeit und eine hohe Bruchfestigkeit haben. Sie eignen sich daher vorzüglich für ein Montagesubstrat. Die Oberfläche des Keramiksubstrats enthält erfindungsgemäß versinterte Metallisierungsbereiche zum Anlöten der oder die LED/LED's.According to the invention, the mounting substrate consists of a ceramic. Ceramics can have excellent thermal conductivity and high resistance to breakage. They are therefore ideal for a mounting substrate. According to the invention, the surface of the ceramic substrate contains sintered metallization regions for soldering the LED (s).

Bevorzugt sind im Montagesubstrat Durchführungen für die elektrischen Anschlussdrähte angeordnet. Diese Anschlussdrähte sind mit den Metallisierungsbereichen elektrisch leitend verbunden.Preferably, feedthroughs for the electrical connection wires are arranged in the mounting substrate. These connecting wires are electrically conductively connected to the metallization regions.

In einer erfinderischen Ausgestaltung ist das Montagesubstrat eine scheibenförmige Montagescheibe. Scheiben lassen sich leicht herstellen und sind auch einfach auf dem Unterteil anzuordnen. LED lassen sich auf Montagescheiben leicht anlöten, da die Oberflächen eben sind.In an inventive embodiment, the mounting substrate is a disc-shaped mounting plate. Slices are easy to produce and are also easy to arrange on the base. LEDs can be easily soldered to mounting washers, as the surfaces are flat.

Erfindungsgemäß besteht die Lampe modulartig aus drei keramischen Teilen, nämlich aus dem Unterteil, dem Montagesubstrat und dem Lampenschirm. Der Lampenschirm weist auf seiner Außenfläche sich in Längsrichtung erstreckende Rippen auf, die zur Kühlung die Oberfläche vergrößern. Keramiken lassen sich in den verschiedensten Farben herstellen, so dass der Lampenschirm an individuelle Design-Vorgaben anpassbar ist. Dies trifft ebenso auf das Unterteil als Lampensockel zu. Das Montagesubstrat ist von Außen nicht sichtbar, so dass dessen Keramik ausschließlich an die technischen Erfordernisse angepasst werden kann. Die Farbe des Montagesubstrats ist nicht von Bedeutung, da es von Außen nicht sichtbar ist.According to the invention, the lamp is modularly composed of three ceramic parts, namely the lower part, the mounting substrate and the lampshade. The lampshade has on its outer surface longitudinally extending ribs which increase the surface area for cooling. Ceramics can be produced in a wide variety of colors, so that the lampshade can be adapted to individual design specifications. This also applies to the lower part as a lamp base. The mounting substrate is not visible from the outside, so that its ceramic can be adapted exclusively to the technical requirements. The color of the mounting substrate is not important because it is not visible from the outside.

Zur Materialeinsparung und leichteren Herstellung ist das Unterteil zylinderförmig mit einem inneren Hohlraum und zwei Stirnflächen ausgebildet, wobei die erste Stirnfläche verschlossen ist und Durchgänge oder Anschlusselemente für die Anschlussdrähte aufweist und die zweite Stirnfläche vom Montagesubstrat verschlossen ist. Das Montagesubstrat bildet in dieser Ausführungsform den Verschluss des Unterteils, wodurch Material eingespart wird und gleichzeitig ein optimaler Sitz des Montagesubstrats gegeben ist.To save material and easier production, the lower part is cylindrical with an inner cavity and two end faces, wherein the first end face is closed and having passages or connecting elements for the connecting wires and the second end face is closed by the mounting substrate. The mounting substrate forms in this embodiment, the closure of the lower part, whereby material is saved and at the same time an optimal fit of the mounting substrate is given.

Zur optimalen Verbindung weist bevorzugt das zum Montagesubstrat gewandte äußere obere Ende des Unterteils einen radial auskragenden Absatz auf, auf dem der Lampenschirm aufsitzt und das äußere obere Ende des Unterteils umgreift. Unterteil und Lampenschirm bilden so eine Einheit und lassen sich leicht aneinander befestigen.For optimum connection, the outer upper end of the lower part facing the mounting substrate preferably has a radially projecting shoulder on which the lampshade is seated and surrounds the outer upper end of the lower part. Base and lampshade form a unit and can be easily attached to each other.

Bevorzugt weist das Montagesubstrat an seinem Außenumfang einen radialen Einzug auf, auf dem ein Absatz des Lampenschirms aufsitzt und das Montagesubstrat umgreift. Das Montagesubstrat ist hierdurch fest verankert.Preferably, the mounting substrate has on its outer circumference on a radial indentation, on which a shoulder of the lampshade is seated and engages around the mounting substrate. The mounting substrate is thereby firmly anchored.

Das Montagesubstrat kann auch mittels einer Verschraubung, Verklebung oder einem Bajonettverschluss mit den anderen Teilen der Lampe verbunden sein.The mounting substrate can also be connected to the other parts of the lamp by means of a screw connection, adhesive bonding or a bayonet closure.

Das Montagesubstrat kann auch mechanisch und/oder chemisch (Verkleben, Aktivlöten, Glaslöten, Metallisieren oder Löten) mit den anderen Teilen der Lampe verbunden sein.The mounting substrate can also be mechanically and / or chemically bonded (gluing, active soldering, glass soldering, metallizing or soldering) to the other parts of the lamp.

Bevorzugt umgreift der Lampenschirm das Montagesubstrat vollständig, so dass es von Außen nicht sichtbar ist. Erst dieses Verstecken im Inneren der Lampe macht es möglich, die Keramik ausschließlich nach den technischen Anforderungen auszuwählen und nicht nach Designwünschen.Preferably, the lampshade completely surrounds the mounting substrate, so that it is not visible from the outside. Only this hiding inside the lamp makes it possible to select the ceramics exclusively according to the technical requirements and not according to design wishes.

In einer bevorzugten Ausgestaltung der Erfindung besteht das Montagesubstrat aus hochwärmeleitfähigem Aluminiumnitrid AlN. Mit Aluminiumnitrid sind die technischen Anforderungen der Bruchfestigkeit und Wärmeleitfähigkeit bestens zu erfüllen.In a preferred embodiment of the invention, the mounting substrate consists of highly heat-conductive aluminum nitride AlN. With aluminum nitride, the technical requirements of breaking strength and thermal conductivity are best fulfilled.

Der Lampenschirm besteht in einer bevorzugten Ausführungsform aus rubinfarbenem Aluminiumoxid miteiner Chromoxiddotierung.The lampshade in a preferred embodiment is ruby-colored alumina with chromium oxide doping.

Bevorzugt bestehen alle oder einige der keramischen Teile der Lampe aus Aluminiumoxid, glashaltig oder rein, ohne oder mit Additiven, beispielsweise Cr203 als Additiv, mit einer Wärmeleitfähigkeit von 20 bis 40 W/m°K, oder Aluminiumnitrid mit einer Wärmeleitfähigkeit von 160 bis 200 W/m°K.Preferably, all or some of the ceramic parts of the lamp made of alumina, glassy or pure, with or without additives, such as Cr203 as an additive, having a thermal conductivity of 20 to 40 W / m ° K, or aluminum nitride with a thermal conductivity of 160 to 200 W. / m ° K.

In einer anderen Ausführungsform bestehen alle oder einige der keramischen Teile der Lampe aus einer durchsichtigen, transparenten, durchscheinenden oder transluzenten Keramik. Hierdurch ist das Design modebewusst anzupassen.In another embodiment, all or some of the ceramic parts of the lamp are made of a transparent, transparent, translucent or translucent ceramic. As a result, the design is fashion-conscious adapt.

Bevorzugt sind die Anschlussdrähte durch den Hohlraum im Unterteil bis zum Montagesubstrat geführt und sind dort elektrisch mit dem Montagesubstrat oder direkt der LED verbunden.Preferably, the connecting wires are guided through the cavity in the lower part to the mounting substrate and are there electrically connected to the mounting substrate or directly to the LED.

Die Lampe ist bevorzugt eine Sockel-GU10 Lampe.The lamp is preferably a base GU10 lamp.

Eine Lampe mit auswechselbarem Montagesubstrat für die Lichtquelle wird vorgestellt. Dieses Montagesubstrat kann in Material (unterschiedliche Wärmeleitfähigkeit) und Stärke variiert und an die abzuführende Wärmemenge der Lichtquelle angepasst werden. Mit Hilfe einer Verschraubung, Verklebung, Bajonettverschlusses oder ähnliches wird das Montagesubstrat mit den Teilen des restlichen Lampenkörpers mechanisch und/oder chemisch (Verkleben, Aktivlöten, Glaslöten, Metallisieren und Löten) verbunden. Dieses Montagesubstrat kann auch aus anderem Material (andere Keramik, Metall etc.) als die anderen (sichtbaren) Lampenteile bestehen und auch andersfarbig sein, weil beispielsweise Aluminiumoxid durch Dotierungen stark gefärbt werden kann, das wegen seiner guten Wärmeleitfähigkeit als Montagesubstrat attraktive aber graue Aluminiumnitrid hingegen nicht. Im Inneren der Lampe ist es aber nicht sichtbar und muss nur seinen technischen Zweck erfüllen.A lamp with replaceable mounting substrate for the light source is presented. This mounting substrate can be varied in material (different thermal conductivity) and strength and adapted to the dissipated amount of heat of the light source. With the help of a screw connection, bonding, bayonet closure or the like, the mounting substrate with the remaining parts of the lamp body mechanically and / or chemically (bonding, active soldering, glass soldering, metallizing and soldering) connected. This mounting substrate can also consist of other material (other ceramic, metal, etc.) than the other (visible) lamp parts and also be different in color, because, for example, alumina can be strongly colored by doping, because of his good thermal conductivity as a mounting substrate attractive but not gray aluminum nitride. Inside the lamp, however, it is not visible and only has to fulfill its technical purpose.

Das Substrat selber kann hergestellt werden durch die bekannten Verfahren der Formgebung wie Trockenpressen, Spritzgießen im Falle von Keramik, durch Aufschmelzen von Glas auf Metall im Falle eines emaillierten Metalls, Spritzgiessen im Falle von Kunststoff usw.The substrate itself can be produced by the known methods of molding such as dry pressing, injection molding in the case of ceramics, by melting glass to metal in the case of enameled metal, injection molding in the case of plastic, etc.

Nachfolgend wird anhand Figur 1 eine erfindungsgemäße Lampe beschrieben. Figur 3 zeigt ein erfindungsgemäßes Keramiksubstrat 4.The following is based on FIG. 1 a lamp according to the invention described. FIG. 3 shows a ceramic substrate 4 according to the invention.

Eine erfindungsgemäße Sockel-GU10 Lampe besteht aus einem Unterteil 1 mit Stromzuführung 2, Lampenschirm 3 und aufklebbarem Montagesubstrat 4.A socket GU10 lamp according to the invention consists of a lower part 1 with power supply 2, lampshade 3 and adhesive mounting substrate. 4

Das Montagesubstrat 4 ist in diesem Beispiel eine Montagescheibe für die LED und besteht aus unattraktivem grauem hochwärmeleitfähigem AIN, der Lampenschirm 3 aus rubinfarbenem Aluminiumoxid mit Chromoxiddotierung. Das Montagesubstrat 4 ist nicht sichtbar. Der Lampenkörper bzw. Lampenschirm 3 wird mit einer Glasscheibe (nicht gezeigt) am oberen Ende des Lampenschirms 3 abgeschlossen.The mounting substrate 4 is in this example a mounting plate for the LED and consists of unattractive gray highly heat-conductive AIN, the lampshade 3 of ruby-colored aluminum oxide with Chromoxiddotierung. The mounting substrate 4 is not visible. The lamp body or lampshade 3 is closed with a glass pane (not shown) at the upper end of the lampshade 3.

Auf der Oberfläche des Keramiksubstrats 4 sind versinterte Metallisierungsbereiche 15 zum Anlöten der oder die LED/LED's angeordnet. Bevorzugt sind im Montagesubstrat Durchführungen 16 oder Steckerelemente für die elektrischen Anschlussdrähte angeordnet. Diese Anschlussdrähte werden mit den Metallisierungsbereichen 15 elektrisch leitend verbunden. Auf dem Montagesubstrat 4 können beliebig viele Metallisierungsbereiche 15 angeordnet sein.On the surface of the ceramic substrate 4, sintered metallization regions 15 for soldering the LED (s) are arranged. Preferably, bushings 16 or plug elements for the electrical connecting wires are arranged in the mounting substrate. These connecting wires are electrically conductively connected to the metallization regions 15. On the mounting substrate 4 any number of metallization regions 15 may be arranged.

Das Montagesubstrat 4 weist einen radialen Einzug 13 an der zum Metallisierungsbereich 15 gewandten Umfangsfläche zur besseren Fixierung auf.The mounting substrate 4 has a radial indentation 13 on the circumferential surface facing the metallization region 15 for better fixation.

Erfindungsgemäß ist die Lampe modulartig aus drei keramischen Teilen gebildet, nämlich aus einem Unterteil 1 mit einer Stromzuführung 2, einem Montagesubstrat 4 bzw. Montagescheibe und einem Lampenschirm 3. Durch die Stromzuführung 2 werden zum Beispiel elektrische Anschlussdrähte (nicht gezeigt in der Figur) in das Unterteil 1 geführt und innerhalb des Unterteils 1 bis zum Montagesubstrat 4. Das Montagesubstrat 4 besteht aus einer Keramik mit bevorzugt einer hohen Wärmeableitung. Auf dem Montagesubstrat 4 werden eine Lichtquelle oder auch mehrere Lichtquellen befestigt. Als Lichtquellen werden bevorzugt LED verwendet. Der Lampenschirm 3 besteht ebenfalls bevorzugt aus einer Keramik mit Kühlrippen 5 auf seiner Außenfläche. Die Kühlrippen 5 erstrecken sich in Längsrichtung des Lampenschirms 3.According to the invention, the lamp is modularly formed from three ceramic parts, namely a lower part 1 with a power supply 2, a mounting substrate 4 Through the power supply 2, for example, electrical connection wires (not shown in the figure) are guided in the lower part 1 and within the lower part 1 to the mounting substrate 4. The mounting substrate 4 consists of a ceramic, preferably a high heat dissipation. On the mounting substrate 4, a light source or a plurality of light sources are attached. As light sources, LEDs are preferably used. The lampshade 3 is also preferably made of a ceramic with cooling fins 5 on its outer surface. The cooling fins 5 extend in the longitudinal direction of the lampshade third

In dieser Beschreibung ist für das Montagesubstrat 4 eine Montagescheibe gezeigt. Montagesubstrat ist der allgemeinere Begriff, da das Montagesubstrat nur bevorzugt eine Montagescheibe ist. Das Montagesubstrat kann auch nicht scheibenförmig ausgebildet sein. Ansonsten beschreiben beide Begriffe den gleichen Gegenstand.In this description, a mounting disk is shown for the mounting substrate 4. Mounting substrate is the more general term, since the mounting substrate is only a mounting plate. The mounting substrate may also not be disc-shaped. Otherwise both terms describe the same item.

Zur besseren Befestigung des Lampenschirms 3 auf dem Unterteil 1 weist dieser auf seiner Innenfläche einen Absatz 8 auf, mit welchem der Lampenschirm 3 auf einem entsprechenden Absatz oder Einzug 13 auf dem Montagesubstrat 4 aufsitzt. Das untere Ende des Lampenschirms 3 umgreift dabei das Montagesubstrat 4 und das obere Ende 12 des Unterteils 1. Das Montagesubstrat 4 ist so zwischen dem Lampenschirm 3 und dem Unterteil 1 angeordnet, dass es von außen nicht sichtbar ist. Das obere, der Montagescheibe 4 abgewandte Ende des Lampenschirms 3 weist einen inneren Absatz 6 zur Aufnahme einer Glasscheibe auf. Bevorzugt ist das Unterteil 1 zylinderförmig mit einem inneren Hohlraum 7 ausgebildet. Hierdurch wird Material eingespart.For better attachment of the lampshade 3 on the lower part 1, this has on its inner surface a paragraph 8, with which the lampshade 3 is seated on a corresponding paragraph or indentation 13 on the mounting substrate 4. The lower end of the lampshade 3 surrounds the mounting substrate 4 and the upper end 12 of the lower part 1. The mounting substrate 4 is arranged between the lampshade 3 and the lower part 1, that it is not visible from the outside. The upper, the mounting plate 4 facing away from the end of the lampshade 3 has an inner shoulder 6 for receiving a glass. Preferably, the lower part 1 is formed cylindrically with an inner cavity 7. This saves material.

Die erfindungsgemäße Lampe besteht somit aus einem Unterteil 1, einer Montagescheibe 4 und einem Lampenschirm 3, der die Lichtquelle, eine LED, umgibt. Auf dem Montagesubstrat 4 wird die Lichtquelle befestigt.The lamp according to the invention thus consists of a lower part 1, a mounting plate 4 and a lampshade 3, which surrounds the light source, an LED. On the mounting substrate 4, the light source is attached.

Der Lampenschirm 3, der die LED (Lichtquelle) umgibt, hat drei Funktionen. Er schützt die LED vor Beschädigungen und durch seine Farbgestaltung nimmt er Einfluss auf die Farbe des abgestrahlten Lichts. In der Hauptsache dient er aber als heat sink, also zur Wärmeableitung der durch die LED erzeugten Wärme an die Umgebungsluft. Zur Vergrößerung der Oberfläche kann der Lampenschirm auf seinem Umfang verteilt Gebilde aufweisen wie beispielsweise Kühlrippen 5, deren Querschnitte beliebige Formen haben können. Auch die Form des Lampenschirms 3 kann beliebig sein. Sie kann außer rund beispielsweise vieleckig, oval oder elliptisch sein.The lampshade 3, which surrounds the LED (light source), has three functions. It protects the LED from damage and its color design influences the color of the emitted light. In the main, however, it serves as a heat sink, ie for heat dissipation of the heat generated by the LED to the ambient air. To increase the surface of the lampshade distributed on its circumference structures may have, such as cooling fins 5, whose cross sections may have any shape. The shape of the lampshade 3 can be arbitrary. It can be round, for example polygonal, oval or elliptical.

Der Lampenschirm 3 kann mit dem Unterteil 1 verklebt oder anderweitig fest verbunden sein.The lampshade 3 may be glued to the lower part 1 or otherwise firmly connected.

Der Werkstoff der Lampe muss wärmebeständig sein. Ein besonders geeigneter Werkstoff für die Lampe ist ein keramischer Werkstoff mit einer guten Wärmeleitfähigkeit, beispielsweise Aluminiumoxid, glashaltig oder rein, ohne oder mit Additiven, beispielsweise Cr203, mit einer Wärmeleitfähigkeit von 20 bis 40 W/m°K, oder Aluminiumnitrid mit einer Wärmeleitfähigkeit von 160 bis 200 W/m°K. Je nach vorgesehenem Beleuchtungseffekt kann der Werkstoff durchsichtig oder transparent durchscheinend, transluzent, sein. Die Bruchfestigkeit der keramischen Werkstoffe liegt bevorzugt zwischen 100 und 1000 MPa.The material of the lamp must be heat resistant. A particularly suitable material for the lamp is a ceramic material with a good thermal conductivity, for example alumina, glass-containing or pure, with or without additives, for example Cr 2 O 3, with a thermal conductivity of 20 to 40 W / m ° K, or aluminum nitride with a thermal conductivity of 160 to 200 W / m ° K. Depending on the intended lighting effect, the material may be transparent or translucent translucent. The breaking strength of the ceramic materials is preferably between 100 and 1000 MPa.

Die Grundfarbe des keramischen Werkstoffs ist weiß oder glasartig klar. Durch entsprechende, aus dem Stand der Technik bekannte Additive zum Keramikwerkstoff kann der keramische Werkstoff auch farbig sein. Durch Kombinationen von LEDs, die weißes oder farbiges Licht emittieren, mit entsprechendem keramischen Werkstoff können unterschiedliche Farbeffekte erzielt werden. Weiterhin kann der Schirm eine lichtdurchlässige Abdeckung der LED aufweisen, die klar oder farbig sein kann. Es sind folgende Farbzusammenstellungen möglich:

  • Das Licht der LED hat die Grundfarbe Weiß, der keramische Werkstoff ist weiß oder glasartig.
  • Das Licht der LED hat die Grundfarbe Weiß, der keramische Werkstoff ist farbig.
  • Das Licht der LED ist farbig, der keramische Werkstoff ist weiß oder glasartig.
  • Das Licht der LED ist farbig, der keramische Werkstoff ist farbig.
  • Das Licht der LED hat die Grundfarbe Weiß, der keramische Werkstoff ist weiß oder glasartig und die Abdeckung über der LED ist farblos.
  • Das Licht der LED hat die Grundfarbe Weiß, der keramische Werkstoff ist weiß oder glasartig und die Abdeckung über der LED ist farbig.
  • Das Licht der LED hat die Grundfarbe Weiß, der keramische Werkstoff ist farbig und die Abdeckung über der LED ist farblos.
  • Das Licht der LED ist farbig, der keramische Werkstoff ist weiß oder glasartig und die Abdeckung über der LED ist farblos.
  • Das Licht der LED ist farbig, der keramische Werkstoff ist farbig und die Abdeckung über der LED ist farblos.
  • Das Licht der LED ist farbig, der keramische Werkstoff ist farbig und die Abdeckung über der LED ist farbig.
The basic color of the ceramic material is white or glassy clear. By appropriate, known from the prior art additives for ceramic material of the ceramic material may also be colored. Combinations of LEDs, which emit white or colored light, with the corresponding ceramic material can achieve different color effects. Furthermore, the screen may have a translucent cover of the LED, which may be clear or colored. The following color combinations are possible:
  • The light of the LED has the basic color white, the ceramic material is white or glassy.
  • The light of the LED has the basic color white, the ceramic material is colored.
  • The light of the LED is colored, the ceramic material is white or glassy.
  • The light of the LED is colored, the ceramic material is colored.
  • The light of the LED has the basic color white, the ceramic material is white or glassy and the cover over the LED is colorless.
  • The light of the LED has the basic color white, the ceramic material is white or glassy and the cover over the LED is colored.
  • The light of the LED has the basic color white, the ceramic material is colored and the cover over the LED is colorless.
  • The light of the LED is colored, the ceramic material is white or glassy and the cover over the LED is colorless.
  • The light of the LED is colored, the ceramic material is colored and the cover over the LED is colorless.
  • The light of the LED is colored, the ceramic material is colored and the cover over the LED is colored.

Das Unterteil 1 kann auch als Stecker zur Herstellung von Steckverbindungen mit entsprechenden Steckdosen oder mit Gewinden zum Einschrauben in Halterungen oder, bei mit Anschlusspolen belegten Sockeln, in Lampenfassungen ausgestattet sein.The lower part 1 can also be equipped as a plug for the production of plug-in connections with appropriate sockets or with threads for screwing in brackets or, in occupied with terminal poles sockets, in lamp holders.

Der Lampenschirm 3 hat auf seinem Umfang gleichmäßig verteilt Kühlrippen 5, so dass der Umriss des Lampenschirms 3 an seiner Öffnung aussieht wie ein Zahnrad. Die Kühlrippen 5 sind, insbesondere bei Hochleistungs-LEDs, von Vorteil, um die entstehende Wärme an die Umgebungsluft abzuführen. Ihr Querschnitt kann auch jede andere mögliche Form annehmen wie beispielsweise halbrund oder halbelliptisch. Bei LEDs mit niedrigen Wärmeverlusten kann der Schirm auch glatt sein. Der Schirm kann ebenfalls unterschiedliche Formen aufweisen, beispielsweise oval oder vieleckig.The lampshade 3 has on its circumference evenly distributed cooling fins 5, so that the outline of the lampshade 3 looks at its opening like a gear. The cooling fins 5 are, in particular in high-power LEDs, an advantage to dissipate the heat generated to the ambient air. Its cross section can take any other possible form such as semicircular or semi-elliptical. For LEDs with low heat loss, the screen can also be smooth. The screen may also have different shapes, such as oval or polygonal.

Claims (12)

  1. A lamp for receiving at least one LED as illuminating means, having a bottom part (1) as carrier element and for feeding the electrical connecting wires to a mounting device carrying the at least one LED, and having a lamp shade (3), wherein the mounting device is a separate mounting substrate (4) having a breaking strength of from 100 to 1000 MPa, the material of the mounting substrate (4) has a thermal conductivity of from 10 to 250 W/m°K, and the mounting substrate (4) is arranged on the bottom part (1), characterised in that the mounting substrate (4) consists of a ceramic; sintered metallised regions (15) for soldering of the LED/LEDs are arranged on the ceramic substrate (4); and the lamp consists, in a modular manner, of three ceramic parts, namely the bottom part (1), the mounting substrate (4) and the lamp shade (3).
  2. A lamp according to claim 1, characterised in that the bottom part (1) is cylindrical with an inner cavity (7) and two end faces (9, 10), the first end face (9) being closed and having ducts (11) or connecting elements for the connecting wires, and the second end face (10) being closed off by the mounting substrate (4).
  3. A lamp according to claim 1 or 2, characterised in that the outer upper end of the bottom part (1) facing the mounting substrate (4) has a radially projecting shoulder (8) on which the lamp shade (3) rests and encloses the outer upper end (12) of the bottom part (1).
  4. A lamp according to one of claims 1 to 3, characterised in that the mounting substrate (4) has on its outer periphery a radial indented portion (13) on which a shoulder of the lamp shade (3) rests and encloses the mounting substrate (4).
  5. A lamp according to one of claims 1 to 4, characterised in that the mounting substrate (4) is connected to the other parts of the lamp by means of screwing, adhesive bonding or a bayonet fixing.
  6. A lamp according to one of claims 1 to 5, characterised in that the mounting substrate (4) is connected to the other parts of the lamp mechanically and/or chemically (adhesive bonding, active soldering, glass soldering, metallisation or soldering).
  7. A lamp according to one of claims 1 to 6, characterised in that the lamp shade (3) encloses the mounting substrate (4) completely so that it is not visible from the outside.
  8. A lamp according to one of claims 1 to 7, characterised in that the mounting substrate (4) consists of highly thermally conductive aluminium nitride AlN.
  9. A lamp according to one of claims 1 to 8, characterised in that the lamp shade (3) consists of ruby-coloured aluminium oxide doped with chromium oxide.
  10. A lamp according to one of claims 1 to 9, characterised in that all or some of the ceramic parts of the lamp consist of aluminium oxide, glass-containing or pure, without or with additives, for example Cr2O3 as additive, having a thermal conductivity of from 20 to 40 W/m°K, or aluminium nitride having a thermal conductivity of from 160 to 200 W/m°K.
  11. A lamp according to one of claims 1 to 10, characterised in that all or some of the ceramic parts of the lamp consist of a clear, transparent, see-through or translucent ceramic.
  12. A lamp according to one of claims 1 to 11, characterised in that the connecting wires are guided through the cavity (7) in the bottom part (1) to the mounting substrate (4), where they are connected electrically to the mounting substrate (4) or directly to the LED.
EP10779685.6A 2009-09-30 2010-09-30 Lamp with variable substrate as base for the lightsource Not-in-force EP2483593B1 (en)

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PL10779685T PL2483593T3 (en) 2009-09-30 2010-09-30 Lamp with variable substrate as base for the lightsource
SI201030629T SI2483593T1 (en) 2009-09-30 2010-09-30 Lamp with variable substrate as base for the lightsource

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PCT/EP2010/005957 WO2011038909A1 (en) 2009-09-30 2010-09-30 Lamp having a variable substrate as a base for a light source

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JP (1) JP2013506940A (en)
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SI2483593T1 (en) 2014-10-30
HK1174088A1 (en) 2013-05-31
WO2011038909A1 (en) 2011-04-07
BR112012007235A2 (en) 2016-04-05
PL2483593T3 (en) 2014-11-28
ES2469095T3 (en) 2014-06-17
CN102695907A (en) 2012-09-26
US20120262059A1 (en) 2012-10-18
JP2013506940A (en) 2013-02-28
RU2012117415A (en) 2013-11-10
DK2483593T3 (en) 2014-05-19
EP2483593A1 (en) 2012-08-08
KR20120092616A (en) 2012-08-21
DE102010047030A1 (en) 2011-05-12
US8410692B2 (en) 2013-04-02
PT2483593E (en) 2014-05-12
TW201116753A (en) 2011-05-16

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