EP2472581A3 - Mobilkommunikationgerät mit einer Kamera mit gekrümmtem Sensor und sein Herstellungsverfahren - Google Patents

Mobilkommunikationgerät mit einer Kamera mit gekrümmtem Sensor und sein Herstellungsverfahren Download PDF

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Publication number
EP2472581A3
EP2472581A3 EP11007020A EP11007020A EP2472581A3 EP 2472581 A3 EP2472581 A3 EP 2472581A3 EP 11007020 A EP11007020 A EP 11007020A EP 11007020 A EP11007020 A EP 11007020A EP 2472581 A3 EP2472581 A3 EP 2472581A3
Authority
EP
European Patent Office
Prior art keywords
mobile communication
curved sensor
communication device
sensor
curved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11007020A
Other languages
English (en)
French (fr)
Other versions
EP2472581A2 (de
Inventor
Gary Edwin Sutton
Douglas Gene Lockie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP2472581A2 publication Critical patent/EP2472581A2/de
Publication of EP2472581A3 publication Critical patent/EP2472581A3/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H01L27/14605—Structural or functional details relating to the position of the pixel elements, e.g. smaller pixel elements in the center of the imager compared to pixel elements at the periphery
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/61—Noise processing, e.g. detecting, correcting, reducing or removing noise the noise originating only from the lens unit, e.g. flare, shading, vignetting or "cos4"
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/61—Noise processing, e.g. detecting, correcting, reducing or removing noise the noise originating only from the lens unit, e.g. flare, shading, vignetting or "cos4"
    • H04N25/611—Correction of chromatic aberration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14623—Optical shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/703—SSIS architectures incorporating pixels for producing signals other than image signals
    • H04N25/708—Pixels for edge detection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
EP11007020A 2010-12-28 2011-08-29 Mobilkommunikationgerät mit einer Kamera mit gekrümmtem Sensor und sein Herstellungsverfahren Withdrawn EP2472581A3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/930,165 US8654215B2 (en) 2009-02-23 2010-12-28 Mobile communicator with curved sensor camera

Publications (2)

Publication Number Publication Date
EP2472581A2 EP2472581A2 (de) 2012-07-04
EP2472581A3 true EP2472581A3 (de) 2012-08-01

Family

ID=44763732

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11007020A Withdrawn EP2472581A3 (de) 2010-12-28 2011-08-29 Mobilkommunikationgerät mit einer Kamera mit gekrümmtem Sensor und sein Herstellungsverfahren

Country Status (3)

Country Link
US (2) US8654215B2 (de)
EP (1) EP2472581A3 (de)
CA (1) CA2762725C (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2313860B1 (es) * 2008-08-08 2010-03-16 Nilo Garcia Manchado Camara digital y procedimiento asociado.
US8957992B2 (en) * 2010-01-06 2015-02-17 Gary Edwin Sutton Curved sensor camera with moving optical train
US9974466B2 (en) 2011-10-17 2018-05-22 Atlas5D, Inc. Method and apparatus for detecting change in health status
US9817017B2 (en) * 2011-10-17 2017-11-14 Atlas5D, Inc. Method and apparatus for monitoring individuals while protecting their privacy
WO2013058978A1 (en) 2011-10-17 2013-04-25 Kimmel Zebadiah M Method and apparatus for sizing and fitting an individual for apparel, accessories, or prosthetics
US10334181B2 (en) 2012-08-20 2019-06-25 Microsoft Technology Licensing, Llc Dynamically curved sensor for optical zoom lens
US9086558B2 (en) 2013-03-05 2015-07-21 Apple Inc. Small form factor high-resolution camera
EP3022898B1 (de) * 2013-07-19 2020-04-15 Google Technology Holdings LLC Asymmetrisches bildsensorarray
US10591969B2 (en) 2013-10-25 2020-03-17 Google Technology Holdings LLC Sensor-based near-field communication authentication
US9600993B2 (en) 2014-01-27 2017-03-21 Atlas5D, Inc. Method and system for behavior detection
US9551856B2 (en) * 2014-05-19 2017-01-24 Google Inc. MEMS-released curved image sensor
CN104301605B (zh) * 2014-09-03 2018-11-23 北京智谷技术服务有限公司 数码变焦图像的成像控制方法和装置、成像设备
US10373995B2 (en) 2014-09-19 2019-08-06 Microsoft Technology Licensing, Llc Image sensor bending using tension
US10013756B2 (en) 2015-03-13 2018-07-03 Atlas5D, Inc. Methods and systems for measuring use of an assistive device for ambulation
US10304900B2 (en) 2015-04-02 2019-05-28 Microsoft Technology Licensing, Llc Bending semiconductor chip in molds having radially varying curvature
US10062727B2 (en) * 2016-09-09 2018-08-28 Microsoft Technology Licensing, Llc Strain relieving die for curved image sensors
CN107977124B (zh) * 2017-11-28 2020-11-03 友达光电（苏州）有限公司 立体触控面板
JP2022539553A (ja) 2019-06-24 2022-09-12 サークル オプティクス，インコーポレイテッド 低視差パノラマカメラシステムのためのレンズ設計
WO2021133843A1 (en) * 2019-12-23 2021-07-01 Circle Optics, Inc. Mounting systems for multi-camera imagers

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010094929A1 (en) * 2009-02-23 2010-08-26 Powell, Stephen, David Sensor systems and digital cameras

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3106636A1 (de) 1980-08-04 1982-03-18 Roger C. 8000 München Field Kamera, insbesondere film- oder videokamera
US5576627A (en) * 1994-09-06 1996-11-19 The Regents Of The University Of California Narrow field electromagnetic sensor system and method
EP0786815A1 (de) 1996-01-26 1997-07-30 Hewlett-Packard Company Photodetektor-Matrix mit Kompensation von Abbildungsfehlern und ungleichmässiger Beleuchtung
US5880777A (en) 1996-04-15 1999-03-09 Massachusetts Institute Of Technology Low-light-level imaging and image processing
JP3610234B2 (ja) 1998-07-17 2005-01-12 株式会社メディア・テクノロジー アイリス情報取得装置およびアイリス識別装置
US6455831B1 (en) 1998-09-11 2002-09-24 The Research Foundation Of Suny At Buffalo CMOS foveal image sensor chip
JP3527117B2 (ja) * 1998-12-24 2004-05-17 富士電機デバイステクノロジー株式会社 半導体力学量センサの製造方法およびその製造装置
US6592383B2 (en) * 1999-12-27 2003-07-15 M. Tahir Akram Extendable and retractable type 2 PC card and method of operation thereof
DE10004891C2 (de) 2000-02-04 2002-10-31 Astrium Gmbh Fokalfläche und Detektor für optoelektronische Bildaufnahmesysteme, Herstellungsverfahren und optoelektronisches Bildaufnahmesystem
US20010022094A1 (en) * 2000-03-15 2001-09-20 Shinji Makikawa Silicon surface oxidation device and method of fabricating optical waveguide substrate by the device
JP3607160B2 (ja) 2000-04-07 2005-01-05 三菱電機株式会社 撮像装置
US6787052B1 (en) * 2000-06-19 2004-09-07 Vladimir Vaganov Method for fabricating microstructures with deep anisotropic etching of thick silicon wafers
JP4698874B2 (ja) 2001-04-24 2011-06-08 ローム株式会社 イメージセンサモジュール、およびイメージセンサモジュールの製造方法
FR2830128A1 (fr) 2001-09-26 2003-03-28 Egg Solution Sa Capteur photoelectrique avec des elements de capture de pixels disposes en cercles concentriques et dispositif d'acquisition d'images panoramiques comprenant ce capteur
US20030141433A1 (en) 2002-01-31 2003-07-31 Gordon Gary B. Solid state image sensor array for correcting curvilinear distortion of a camera lens system and method for fabricating the image sensor array
US7196391B2 (en) 2002-02-05 2007-03-27 E-Phocus, Inc. MOS or CMOS sensor with micro-lens array
AU2003218298A1 (en) 2002-03-20 2003-10-08 Concord Camera Corp. Opto-digital zoom for an image capture device
US7408572B2 (en) 2002-07-06 2008-08-05 Nova Research, Inc. Method and apparatus for an on-chip variable acuity imager array incorporating roll, pitch and yaw angle rates measurement
JP2005278133A (ja) 2003-07-03 2005-10-06 Fuji Photo Film Co Ltd 固体撮像装置および光学機器
US20050268521A1 (en) 2004-06-07 2005-12-08 Raytheon Company Electronic sight for firearm, and method of operating same
JP2006148710A (ja) 2004-11-22 2006-06-08 Sharp Corp 撮像モジュール及び撮像モジュールの製造方法
KR100693927B1 (ko) * 2005-02-03 2007-03-12 삼성전자주식회사 마이크로 렌즈 제조방법, 마이크로 렌즈 어레이 제조방법및 이미지 센서 제조방법
US7190039B2 (en) * 2005-02-18 2007-03-13 Micron Technology, Inc. Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers
US7162806B1 (en) 2005-03-21 2007-01-16 Travis Swiggart Video sighting system
JP4233536B2 (ja) 2005-03-31 2009-03-04 シャープ株式会社 光学装置用モジュール
US20060245640A1 (en) 2005-04-28 2006-11-02 Szczuka Steven J Methods and apparatus of image processing using drizzle filtering
US7493030B2 (en) 2005-06-24 2009-02-17 Nokia Corporation Adaptive optical plane formation with rolling shutter
US9041851B2 (en) 2005-11-15 2015-05-26 The Trustees Of Princeton University Organic electronic detectors and methods of fabrication
JP4828221B2 (ja) 2005-12-14 2011-11-30 富士フイルム株式会社 デジタルカメラ
US7726890B2 (en) 2006-01-19 2010-06-01 Fujifilm Corporation Camera
JP2007221386A (ja) 2006-02-15 2007-08-30 Eastman Kodak Co 撮像装置
US7702226B1 (en) * 2006-07-20 2010-04-20 Siimpel Corporation Board mounted hermetically sealed optical device enclosure and manufacturing methods therefor
JP2008092532A (ja) 2006-10-05 2008-04-17 Matsushita Electric Ind Co Ltd 撮像装置とその製造方法および携帯電話装置
CA2570955A1 (en) 2006-12-12 2008-06-12 The University Of Western Ontario Flexible bioelectronic photodetector and imaging arrays based on bacteriorhodopsin (br) thin films
US7742090B2 (en) 2006-12-22 2010-06-22 Palo Alto Research Center Incorporated Flexible segmented image sensor
US7277242B1 (en) 2007-03-16 2007-10-02 Advanced Connection Technology Inc. Lens module
US8502898B2 (en) 2007-04-23 2013-08-06 Micron Technology, Inc. Method, apparatus, and system providing a rectilinear pixel grid with radially scaled pixels
WO2009011224A1 (ja) 2007-07-18 2009-01-22 Konica Minolta Holdings, Inc. 金属酸化物半導体の製造方法、それにより得られた薄膜トランジスタ
WO2009022178A1 (en) 2007-08-16 2009-02-19 Bae Systems Plc Imaging device
KR101378418B1 (ko) * 2007-11-01 2014-03-27 삼성전자주식회사 이미지센서 모듈 및 그 제조방법
JP5517423B2 (ja) * 2008-08-26 2014-06-11 キヤノン株式会社 インプリント装置及びインプリント方法
US8492876B2 (en) * 2008-10-17 2013-07-23 Palo Alto Research Center Incorporated Geometry and design for conformal electronics
US8232617B2 (en) * 2009-06-04 2012-07-31 Wisconsin Alumni Research Foundation Flexible lateral pin diodes and three-dimensional arrays and imaging devices made therefrom
JP2011081185A (ja) * 2009-10-07 2011-04-21 Olympus Imaging Corp ズームレンズおよびそれを用いた撮像装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010094929A1 (en) * 2009-02-23 2010-08-26 Powell, Stephen, David Sensor systems and digital cameras

Also Published As

Publication number Publication date
CA2762725A1 (en) 2012-06-28
US8654215B2 (en) 2014-02-18
US20120162483A1 (en) 2012-06-28
CA2762725C (en) 2015-08-18
US20140111680A1 (en) 2014-04-24
EP2472581A2 (de) 2012-07-04

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