EP2435890A4 - Dispositif microtca - Google Patents

Dispositif microtca

Info

Publication number
EP2435890A4
EP2435890A4 EP10781282.8A EP10781282A EP2435890A4 EP 2435890 A4 EP2435890 A4 EP 2435890A4 EP 10781282 A EP10781282 A EP 10781282A EP 2435890 A4 EP2435890 A4 EP 2435890A4
Authority
EP
European Patent Office
Prior art keywords
microtca
microtca device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10781282.8A
Other languages
German (de)
English (en)
Other versions
EP2435890A2 (fr
Inventor
Michael John Franco
Richard A Schulte
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
N.A.T. GMBH
Original Assignee
NAT GmbH
N A T GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NAT GmbH, N A T GmbH filed Critical NAT GmbH
Publication of EP2435890A2 publication Critical patent/EP2435890A2/fr
Publication of EP2435890A4 publication Critical patent/EP2435890A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/185—Mounting of expansion boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1487—Blade assemblies, e.g. blade cases or inner arrangements within a blade
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20563—Forced ventilation of a gaseous coolant within sub-racks for removing heat from electronic boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
EP10781282.8A 2009-05-28 2010-05-28 Dispositif microtca Withdrawn EP2435890A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US18189109P 2009-05-28 2009-05-28
PCT/US2010/036592 WO2010138824A2 (fr) 2009-05-28 2010-05-28 Dispositif microtca

Publications (2)

Publication Number Publication Date
EP2435890A2 EP2435890A2 (fr) 2012-04-04
EP2435890A4 true EP2435890A4 (fr) 2014-12-03

Family

ID=43223379

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10781282.8A Withdrawn EP2435890A4 (fr) 2009-05-28 2010-05-28 Dispositif microtca

Country Status (4)

Country Link
EP (1) EP2435890A4 (fr)
JP (1) JP2012528408A (fr)
IL (1) IL216617A0 (fr)
WO (1) WO2010138824A2 (fr)

Families Citing this family (40)

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JP5724674B2 (ja) * 2011-06-24 2015-05-27 富士通株式会社 電子機器収納装置
CN102427693B (zh) 2011-11-29 2014-10-15 杭州华三通信技术有限公司 滑道支座及应用其的电子设备
US10133636B2 (en) 2013-03-12 2018-11-20 Formulus Black Corporation Data storage and retrieval mediation system and methods for using same
US9304703B1 (en) 2015-04-15 2016-04-05 Symbolic Io Corporation Method and apparatus for dense hyper IO digital retention
US9817728B2 (en) 2013-02-01 2017-11-14 Symbolic Io Corporation Fast system state cloning
CN103346898B (zh) * 2013-05-30 2017-02-15 迈普通信技术股份有限公司 热拔插板卡配置信息处理的方法和网络通信设备
DE102013109164A1 (de) * 2013-08-23 2015-02-26 Fujitsu Technology Solutions Intellectual Property Gmbh Servereinschub für ein Serverrack
KR200486256Y1 (ko) * 2013-11-07 2018-04-23 케스웰 인코포레이티드 다조식의 확장 모듈 신속 장착 구조
FR3014637B1 (fr) 2013-12-11 2016-02-05 Enensys Technologies Boitier pour au moins une carte electronique
KR20160142368A (ko) * 2014-04-07 2016-12-12 구글 인코포레이티드 섀시-결합 모듈식 모바일 전자 디바이스들을 구현하는 시스템들
JP2016057997A (ja) * 2014-09-12 2016-04-21 立端科技股▲分▼有限公司 プリント回路基板を収容可能な電気通信コンピューティングモジュール
JP2016081226A (ja) * 2014-10-15 2016-05-16 立端科技股▲分▼有限公司 産業用サーバシステム
JP2016081227A (ja) * 2014-10-15 2016-05-16 立端科技股▲分▼有限公司 産業用サーバシステム
JP2016081224A (ja) * 2014-10-15 2016-05-16 立端科技股▲分▼有限公司 産業用サーバシステム
EP3231267B1 (fr) * 2014-12-09 2020-09-30 Hewlett-Packard Enterprise Development LP Ensemble support à verrouillage
US9603279B2 (en) 2015-01-05 2017-03-21 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Central electronics complex (‘CEC’) and fan structure
US9609781B2 (en) 2015-02-10 2017-03-28 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Modular chassis with floating midplane carrier
CA2980303C (fr) * 2015-03-19 2023-06-20 Aerovironment, Inc. Systeme de montage pour carte de circuit imprime (pcb) resistante aux chocs mecaniques
US10061514B2 (en) 2015-04-15 2018-08-28 Formulus Black Corporation Method and apparatus for dense hyper IO digital retention
KR101605115B1 (ko) 2015-04-28 2016-03-22 주식회사 카티스 출입통제시스템의 통신랙용 쉘프
USD740817S1 (en) 2015-07-22 2015-10-13 Symbolic Io Corporation Front ear assembly—left
USD740818S1 (en) 2015-07-23 2015-10-13 Symbolic Io Corporation Assembly kit
USD742876S1 (en) 2015-07-27 2015-11-10 Symbolic Io Corporation Rack equipment handle
USD768135S1 (en) 2016-02-10 2016-10-04 Symbolic Io Corporation Bezel
USD768136S1 (en) 2016-06-01 2016-10-04 Symbolic Io Corporation Bezel
US10039203B2 (en) * 2016-07-12 2018-07-31 Hamilton Sundstrand Corporation Molded card guide chassis
USD786258S1 (en) 2016-11-04 2017-05-09 Symbolic Io Corporation Face plate
CN106793562B (zh) * 2016-12-13 2019-02-26 北京北广科技股份有限公司 一种封装技术的大面积钢网开窗方法
CN106937482A (zh) * 2017-03-31 2017-07-07 柳州译海网络科技有限公司 一种节能减排的电子产品生产制造方法
CN107402615A (zh) * 2017-09-13 2017-11-28 深圳市蓝豆芽科技有限公司 一种带有防震通风的计算机主机箱
JP2019096636A (ja) * 2017-11-17 2019-06-20 富士通株式会社 伝送装置および電子機器
CN107967038A (zh) * 2017-11-17 2018-04-27 常州信息职业技术学院 一种具有防尘功能的计算机主机箱
US10572186B2 (en) 2017-12-18 2020-02-25 Formulus Black Corporation Random access memory (RAM)-based computer systems, devices, and methods
CN108958412B (zh) * 2018-07-18 2020-04-03 山东交通职业学院 一种开闭式前面板的机箱
CN109164891B (zh) * 2018-09-11 2020-01-24 郑州航空工业管理学院 智能嵌入式网络安全信息处理装置
CN109308102B (zh) * 2018-09-11 2020-01-21 郑州航空工业管理学院 嵌入式网络智能信息处理服务器
US10725853B2 (en) 2019-01-02 2020-07-28 Formulus Black Corporation Systems and methods for memory failure prevention, management, and mitigation
CN111367391A (zh) * 2020-02-28 2020-07-03 深圳市久盟电子科技有限公司 一种降噪pc电源
EP3993582B1 (fr) * 2020-11-02 2024-06-26 Rohde & Schwarz GmbH & Co. KG Étagère pour le montage d'un dispositif électrique dans un bâti et bâti comprenant au moins une étagère de ce type
TWI807489B (zh) * 2021-11-18 2023-07-01 啟碁科技股份有限公司 插槽蓋及積體電路存取裝置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6329820A (ja) * 1986-07-23 1988-02-08 Canon Inc 電子機器の通電制御装置およびその外部メモリ
US20060221559A1 (en) * 2005-03-31 2006-10-05 Edoardo Campini Two-dimensional adjustable edge connector adaptor
US20070223209A1 (en) * 2006-01-13 2007-09-27 Tracewell Systems Very light enclosure for electronic systems
US20080298014A1 (en) * 2007-05-29 2008-12-04 Michael John Franco Modular electronic enclosure

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5751549A (en) * 1996-06-26 1998-05-12 Sun Microsystems, Inc. Hard disk drive assembly which has a plenum chamber and a fan assembly that is perpendicular to a rack chamber
US6166917A (en) * 1998-01-07 2000-12-26 3Com Corporation Techniques of assembling modular electronic equipment
TWM255963U (en) * 2004-04-06 2005-01-21 Tatung Co Improved structure of supporting stand
EP1845765B1 (fr) * 2006-04-11 2010-01-20 Schroff GmbH Baie électronique

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6329820A (ja) * 1986-07-23 1988-02-08 Canon Inc 電子機器の通電制御装置およびその外部メモリ
US20060221559A1 (en) * 2005-03-31 2006-10-05 Edoardo Campini Two-dimensional adjustable edge connector adaptor
US20070223209A1 (en) * 2006-01-13 2007-09-27 Tracewell Systems Very light enclosure for electronic systems
US20080298014A1 (en) * 2007-05-29 2008-12-04 Michael John Franco Modular electronic enclosure

Also Published As

Publication number Publication date
IL216617A0 (en) 2012-02-29
WO2010138824A3 (fr) 2011-02-24
JP2012528408A (ja) 2012-11-12
WO2010138824A2 (fr) 2010-12-02
EP2435890A2 (fr) 2012-04-04

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