Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
  • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
  • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
  • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
  • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
  • B32B17/10018—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
  • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
  • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
  • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
  • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
  • B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
  • B32B17/10045—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets with at least one intermediate layer consisting of a glass sheet
  • B32B17/10055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets with at least one intermediate layer consisting of a glass sheet with at least one intermediate air space
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
  • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
  • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
  • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
  • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
  • B32B17/10761—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing vinyl acetal
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
  • H05K1/0203—Cooling of mounted components
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/18—Printed circuits structurally associated with non-printed electric components
  • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
  • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/01—Dielectrics
  • H05K2201/0104—Properties and characteristics in general
  • H05K2201/0108—Transparent
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/08—Magnetic details
  • H05K2201/083—Magnetic materials
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10106—Light emitting diode [LED]
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10431—Details of mounted components
  • H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB

Definitions

• the invention relates to an electronic structure comprising a panel and at least one electronic component, such as a light emitting diode.
• an electronic structure comprising a panel comprising at least one transparent or translucent substrate layer carrying at least one conductive path and at least one magnetic element, whereas the magnetic element is electrically connected to the conductive path, and - at least one module, comprising at least one electronic component and at least one magnetic element, whereas the magnetic element is electrically connected to the electronic component, wherein the module is mechanically and electrically attached, in a detachable manner, to the panel by magnetic attraction between the magnetic element of the module and the magnetic element of the panel.
• the at least one module comprising at least one electronic component and at least one magnetic element
• the at least one module can be detached by a user of the electronic structure while maintaining the function of the electronic component and also maintaining the electrical connection of the magnetic element to the electronic component.
• Such an electronic structure advantageously makes it possible to attach and detach electronic modules in a simple manner to a panel comprising conductive paths. This can have the advantage that the manufacturing procedure is simplified. Furthermore, costs arising from panel damages during the production can advantageously be reduced by detaching the modules of the damaged panel and reattaching them on an intact panel. Moreover, the maintenance procedure can advantageously be simplified, for example by simplifying the exchange of electronic components, which become - for instance after three years - defective. Further, it can advantageously be possible to adapt the electronic structure to different applications, for example by exchanging a light emitting diode of one colour to a light emitting diode of another colour.
• At least one module of the panel can be detached from its position on the panel : to be attached at another position of the panel or to be replaced by another module having a different color and/or color temperature and/or lighting profile and/or intensity and/or function (such as lighting, detection of person, detection of temperature, ...) and/or performance(s), in order to change at least one of the : color color temperature, - lighting profile (area illuminated by the luminaire), of the light emitted by the luminaire, or in order to change LED(s) performance(s) (such as lighting intensity, temperature stability,
• heat dissipation problems which may occur in confined electronic components, can be reduced in an electronic structure according to the invention.
• the electronic structure can make it possible to operate electronic components, such as light emitting diodes, for example type 3W/LED, at high power.
• these electronic structures need not only be used as decorative device, but could be used also as lighting device.
• the size of the electronic components can be less restricted by the thickness of the panel than in known electronic structures.
• At least one of the modules comprises at least one light emitting element (such as a LED and/or an OLED and/or a bulb and/or a discharge tube) and the electronic structure is a luminaire which can be used to illuminate the space.
• the at least one light emitting element can be a packaged LED (such as surface mount type LED or ampoule type LED) or a die LED, an RGB LED (for Red Blue Green LED) or a phosphor LED.
• electrostatic structure and “electronic component” in particular include “electric structures” and “electric components”, respectively.
• a “magnetic element” can be a mag- net, in particular a permanent magnet, as well as an element, which is formed of a material, which is magnetically attractable by a magnet, for example a ferromagnetic or ferrimagnetic material, in particular a metal or a metal alloy, such as iron, cobalt or nickel.
• a magnet for a magnetic attraction either both magnetic elements are magnets, which are arranged so that opposite poles are facing each other, or one magnetic element is a magnet, whereas the other magnetic element is an element, which is formed of a material magnetically attractable by a magnet.
• the magnetic element/s of the module/s are magnets, whereas the magnetic element/s of the panel are element/s, formed of a material, which is magnetically attractable by a magnet.
• the magnetic element/s of the module/s are element/s, formed of a material, which is magnetically attractable by a magnet, whereas the magnetic element/s of the panel are magnets.
• the magnetic element/s of the module/s are magnets, whereas the magnetic element/s of the panel are also magnets.
• the panel comprises at least two conductive paths and at least two magnetic elements, whereas each magnetic element is electrically connected to a conductive path, and the module comprises at least two magnetic elements connected to the electronic component/s of the module.
• the module can in a detachable manner, mechanically and electrically be attached to the panel by magnetic attraction between the magnetic elements of the module and the magnetic elements of the panel.
• the panel can comprise a plurality of conductive paths and/or magnetic elements.
• the electronic structure can comprise a plurality of modules.
• the panel can comprise a number of magnetic elements which is about twice the number of the modules.
• the magnetic elements of the panel can be arranged in a regular pattern.
• the mag- netic elements of the panel can be arranged in lines and/or rows.
• the magnetic elements of the panel can be arranged in a matrix of lines and rows.
• the modules are arranged in a regular pattern.
• the modules can be arranged in lines and/or rows.
• the mod- ules can be arranged in a matrix of lines and rows.
• the conductive paths extend to at least one edge of the panel.
• the conductive paths and the modules attached thereto can be connected to a power supply and/or control device, for example via bus bars.
• the conductive paths can for example comprise (or rather consist of) conductive polymers, in particular transparent conductive polymers, metals, such as silver, copper or aluminium, or metal alloys, or conductive oxides such as tin oxides, or semiconducting materials, such as fluorine-doped tin dioxide (SnO 2 IF) or Indium Tin Oxide (ITO).
• the conductive paths can also be realized from laser patterning of a layer of such a transparent conductive coating initilally deposited on a surface of the panel.
• the conductive paths can also be chosen to be very conductive : for instance can comprise (or rather consist of) silver paste deposited by a serigraphy technique.
• a module can comprise one or more electronic component selected from the group consisting of diodes, for example light emitting diodes (LEDs) or organic light emitting diodes (OLEDs), sensors, for example presence sensors or infrared sensors/receivers, microcontrollers, signal decoders, dimmers, switches and remote controllable components, such as infrared remote controllable components.
• LEDs light emitting diodes
• OLEDs organic light emitting diodes
• sensors for example presence sensors or infrared sensors/receivers
• microcontrollers for example presence sensors or infrared sensors/receivers
• signal decoders dimmers
• switches remote controllable components, such as infrared remote controllable components.
• remote controllable components such as infrared remote controllable components.
• Presence sensor can be under- stood a sensor, which is adapted to switch on other electronic components when detecting the presence of a user and/or to switch off other electronic components when detecting the absence
• the electronic structure can comprise at least two modules, which comprise different electronic components, for example selected from the group consisting of diodes, for example light emitting diodes (LEDs) or organic light emitting diodes (OLEDs), sensors, for example presence sensors or infrared sensors, micro-controllers, signal decoders, dimmers, switches and remote controllable components, such as infrared remote controllable components.
• diodes for example light emitting diodes (LEDs) or organic light emitting diodes (OLEDs)
• sensors for example presence sensors or infrared sensors
• micro-controllers micro-controllers
• signal decoders dimmers
• switches remote controllable components, such as infrared remote controllable components.
• At least one module comprises a light emitting diode or at least one part of the modules comprises light emitting diodes.
• At least one module comprises a presence sensor and/or an infrared sensor.
• each module can comprise at least one light-emitting diode and a built-in intelligence, such as a microcontroller and/or signal decoder, in particular for receiving signals via the conductive paths, processing the signal's information and behaving independently to create an image.
• a built-in intelligence such as a microcontroller and/or signal decoder
• the magnetic element/s of the module/s can be connected to the module/s by a conductive adhesive (such as Epotecny E212) and/or by welding and/or by soldering for example to a metallic element of the module.
• a conductive adhesive such as Epotecny E212
• the magnetic element/s of the module/s can have numerous other shapes.
• the magnetic element/s of the module/s can be ring shaped.
• the at least one transparent or translucent substrate layer is a glass substrate layer.
• the at least one transparent or translucent substrate layer is a transparent or translucent polymer substrate layer (for instance : a polycarbonate layer, a plexiglass layer, a PET layer, a PVB layer, an EVA layer, ...) or any other transparent or translucent plastic layer.
• At least one surface of the at least one transparent or translucent substrate layer can be, at least partially, treated by sandblasting or serigraphy, painting or any other surface treatment.
• the panel is transparent or at least quasi transparent or transluscent.
• quasi transparent panel can thereby understood panels, which comprise structures, which do not transmit light, but are so small that the resulting effect is invisible to the naked human eye.
• the panel can for example be a glass substrate layer or a transparent polymer substrate layer.
• the panel can be a bare glass panel, a special glass panel, such as a security glass panel or a mirror glass panel, or an acrylic glass (plexiglass) panel.
• These panels possess - in particular for lighting purposes - advantages, since their materials can be transparent and can allow the passage of light.
• the magnetic element/s of the panel can for example be connected to the panel by a conductive adhesive (such as Epotecny E212) and/or by welding and/or by soldering for example to a metallic element, for example a conductive path, of the panel.
• a conductive adhesive such as Epotecny E212
• soldering for example to a metallic element, for example a conductive path, of the panel.
• the magnetic element/s of the panel can have numerous other shapes.
• the magnetic element/s of the panel can be ring shaped.
• the magnetic element/s of the panel and the magnetic element/s of the module/s have coded shapes and/or have coded magnetic pole orientations and/or are arranged according to a code, in particular for avoiding polarity errors / poling errors / errors in connecting wrong/reverse polarities, for example errors arising from wrong electrical pole connections.
• anodic and cathodic magnetic element/s of the module/s can have different shapes and/or different magnetic pole orientations and/or magnetic element/s of the module/s can be formed so that they have positive structures where the corresponding magnetic element/s of the panel have negative structures, or vice versa.
• the panel is a composite element, for example a composite glass element, such as a double glazing or a laminated panel, for example a laminated glass element.
• the panel can be an element comprising: - a transparent or translucent substrate layer, a conductive paths layer, and one or more magnetic element/s.
• the transparent substrate layer can thereby be a single layer, double glazed layer or a multi glazed layer.
• the transparent substrate layer can thereby be formed of glass or a transparent polymer, for example of bare glass, a special glass, such as a security glass or a mirror glass, or an acrylic glass (plexiglass).
• the conductive paths or rather the conductive paths layer is preferably transparent or at least quasi transparent or tansluscent.
• conductive paths and conductive paths layer can thereby understood conductive paths and conductive paths layer, respectively, whose non light transmitting structures are so small that the resulting effect is invisible to the naked eye.
• at least some of the conductive paths extend to the edge of the transparent substrate layer. These conductive paths can then be con- nected to a power supply and/or control device, for example via bus bars.
• the magnetic element/s of the panel can thereby be arranged at least essentially in the plane of the conductive path layer.
• the term "essentially” means that the magnetic element/s of the panel can - independently of each other - be arranged on top of one or more conductive paths, under one or more conductive paths or in the plane of the conductive paths.
• the magnetic element/s of the panel can be are arranged, in particular fixed, on the substrate layer.
• the panel can be a composite element, compris- ing: a cover layer having at least one through opening, for example for inserting at least one module, a linking layer, for example a lamination layer, a conductive paths layer, - one or more magnetic element/s, and a transparent substrate layer.
• the panel is a composite element comprising: - a cover layer comprising at least one through opening, for example for inserting at least one module, a linking layer, a conductive paths layer, one or more magnetic elements, and - a transparent substrate layer, whereas the cover layer is arranged, in particular fixed, on the linking layer, whereas the linking layer is arranged, in particular fixed, on the conductive paths layer, whereas the magnetic element/s are arranged at least essentially in the plane of the conductive path layer and are at most partially covered by the linking layer, whereas the conductive path layer is arranged, in particular fixed, on the substrate layer, whereas the magnetic element/s are positioned so that they are at least partially accessible via a through opening in the cover layer.
• the cover layer can thereby be transparent or translucent, for example formed of glass or a transparent or translucent polymer (for instance : a polycarbonate layer, a plexiglass layer, a PET layer, a PVB layer, an EVA layer, ...) or any other transparent or translucent plastic.
• the cover layer can in particular be a bare glass, a special glass, such as a security glass or a mirror glass, or an acrylic glass (plexiglass).
• the cover layer can also be opaque, for example formed of metal (such as steel, stainless steel, aluminium, copper, zinc, or any other metal or alloy of metals) or formed of any opaque plastic or formed of any opaque polymer.
• metal such as steel, stainless steel, aluminium, copper, zinc, or any other metal or alloy of metals
• the cover layer can be made of a thermally conductive material and the at least one module can be in thermal contact with the cover layer.
• the cover layer can act as a thermal radiator which allows to dissipate heat generated by the at least one electronic component.
• the cover layer can comprise at least one through opening.
• the cover layer can comprise a plurality of through openings.
• the through openings can be arranged in a regular pattern.
• the through openings can be arranged in lines and/or rows.
• the through openings can be arranged in a matrix of lines and rows.
• the linking layer is in particular linking the cover layer to the conductive paths layer and the transparent substrate layer.
• the linking layer can be transparent or translucent or opaque.
• the linking layer for example can be a thermoplastic resin or can be formed of an adhesive or of any adequate polymer.
• the linking layer can be a lamination layer, such as a layer comprising or consisting of polyvinyl butyral (PVB).
• the electronic structure can comprises a power supply and/or control device, in particular for supplying the electronic components with and/or for controlling the electronic components.
• Another aspect of the present invention is a module comprising at least one electronic component and at least one magnetic element (which can be a magnet or one element formed of a material, which is magnetically attractable by a magnet), whereas the magnetic element is electrically connected to the electronic component/s.
• a module is advantageously in a detachable manner, mechanically and electrically attachable to a panel having at least one magnetic element (at least a magnet or at least one element formed of a material, which is magnetically attractable by a magnet), in particular a panel according to the invention, by magnetic attraction between the magnetic element of the module and the magnetic element of the panel.
• a module comprising at least one electronic component and at least one magnet, whereas the magnet is electrically connected to the electronic component/s.
• a module is advantageously in a detachable manner, mechanically and electrically attachable to a panel having at least one magnetic element (at least a magnet or at least one element formed of a material, which is magnetically attractable by a magnet), in particular a panel according to the invention, by magnetic attraction between the magnet of the module and the magnetic element of the panel.
• the module comprises at least two magnets, which are electrically connected to the electronic component/s of the module.
• the magnets are electrically connected to different poles of the electronic component/s.
• Such a module is advantageously in a detachable manner, mechanically and electrically attachable to a panel having at least two magnetic elements, in particular a panel according to the invention, by magnetic attraction between the magnets of the module and the magnetic elements of the panel.
• the module preferably comprises a light emitting diode and/or an organic light emitting diode and/or a presence sensor and/or an infrared sensor and/or micro controller and/or a signal decoder.
• the module can comprise a support, in particular a metallic support.
• the mag- net/s can thereby for example be arranged, in particular fixed, on one side of the support.
• an electronic device such as a light emitting diode, can be arranged, in particular fixed.
• the metallic support can both be a support and a magnetic element formed of a material, which is magnetically attractable by at least a magnet provided on the panel.
• the module can further comprise a radiator.
• the radiator can be arranged, in particular fixed, on the side of the support, which is opposite to the side on which the electronic device, for example a light emitting diode, and the magnetic element/s are arranged, in particular fixed.
• a module comprising at least one transparent or translucent substrate layer carrying at least one conductive path and at least magnetic element (which can be a magnet or one element formed of a material, which is magnetically attractable by a magnet), whereas the magnetic element is electrically connected to the conductive path.
• a module having at least one magnetic element in particular a module according to the present invention, is advantageously in a detachable manner, mechanically and electrically attachable by magnetic attraction between the magnetic element of the module and the magnetic element of the panel.
• a panel comprising at least one transparent or translucent substrate layer carrying at least one conductive path and at least one magnet, whereas the magnet is electrically connected to the conductive path.
• a module having at least one magnetic element in particular a module according to the present invention, is advantageously in a detachable manner, mechanically and electrically attachable by magnetic attraction between the magnetic element of the module and the magnet of the panel.
• the panel comprises at least two magnets, which are electrically connected to the conductive path/s of the panel.
• the panel can comprise at least two conductive paths and at least two magnetic elements, whereas each magnetic element is electrically connected to a conductive path.
• the magnets are electrically connected to different poled conductive paths.
• a module having at least two magnetic elements in particular a module according to the invention, is advantageously in a detachable manner, mechanically and electrically attachable by magnetic attraction between the magnetic elements of the module and the magnets of the panel.
• Another aspect of the present invention is a method for producing a module according to the present invention, comprising the step:
• At least one magnetic element (which can be a magnet or one element formed of a material, which is magnetically attractable by a magnet), in particular magnet, to one or more electronic components.
• At least two magnetic elements in particular magnets, can be electrically connected to one or more electronic components.
• the magnetic element/s can be electrically and mechanically connected to the electronic component by a conductive adhesive (such as Epotecny E212) and/or by welding and/or by soldering for example to a metallic element of the module or the electronic component.
• a conductive adhesive such as Epotecny E212
• This method can furthermore comprise the steps:
• At least one magnetic element (which can be a magnet or one element formed of a material, which is magnetically attractable by a magnet) to the support.
• the magnetic element/s and electronic component/s can thereby be attached to the support by a conductive adhesive (such as Epotecny E212) and/or by welding and/or by soldering.
• a conductive adhesive such as Epotecny E212
• this method can comprise the step: Attaching a radiator to the support.
• the radiator can thereby also be attached to the support by a conductive adhesive (such as Epotecny E212) and/or by welding and/or by soldering.
• a conductive adhesive such as Epotecny E212
• Another aspect of the present invention is a method for producing a panel according to the present invention, comprising the step: - Providing a panel comprising at least one transparent or translucent substrate layer carrying at least one conductive path, and
• At least one magnetic element (which can be a magnet or one element formed of a material, which is magnetically attractable by a magnet), for example a metallic element, to the conductive path.
• a panel at least two conductive paths can be provided.
• at least two magnetic elements (which can be a magnet or one element formed of a material, which is magnetically attractable by a magnet) can be electrically connected to one or more conductive paths.
• the magnetic element/s can be electrically and mechanically connected to the conductive path/s by a conductive adhesive (such as Epotecny E212) and/or by welding and/or by soldering for example to a metallic element of the panel, for instance to the conductive path.
• a conductive adhesive such as Epotecny E212
• the conductive path/s can be part of a conductive paths layer.
• the conductive path/s and/or the conductive paths layer can for example be applied to the panel by laser structuring of a conductive material layer or by screen printing of conductive inks or lacquers, for example comprising conductive polymers, in particular transparent conductive polymers, metals, such as silver, silver paste, metal alloys or semiconducting materials, such as fluorine-doped tin dioxide (SnO2:F).
• the panel comprising at least one conductive path can for example be produced by providing a transparent substrate layer, such as a bare or special glass layer, and applying at least one conductive path or a conductive paths layer on the transparent or translucent substrate layer.
• This method can furthermore comprise the step: Providing a cover layer, which comprises at least one through opening.
• the cover layer can for example be produced by drilling holes in a transparent layer, such as a bare or special glass layer, by drilling means conventional in the glass industry or by drilling holes in an opaque layer such as a metallic layer.
• This method can furthermore comprise the step: Laminating the cover layer on the conductive path layer / the transparent or translucent substrate layer by means of a linking layer, in particular lamination layer, between the cover layer and the conductive path layer / transparent substrate layer, so that the magnetic element/s are at most partially covered by the linking layer and at least partially accessible via a through opening in the cover layer.
• a linking layer in particular lamination layer
• Another aspect of the present invention is a method for producing an electronic structure according to the invention comprising the steps:
• Another aspect of the present invention is the use of an electronic structure according to the present invention as luminous structure, window, shop window, building front, communicating building facade, building roof element, display, such as a video display panel, and/or decorative element or as windshield, side window, roof window, rear window, front light, rear light and/or indicator of a power driven, terrestrial, nautical or aeronautical vehicle.
• display such as a video display panel, and/or decorative element or as windshield, side window, roof window, rear window, front light, rear light and/or indicator of a power driven, terrestrial, nautical or aeronautical vehicle.
• Fig. 1 is a cross sectional view of a first embodiment of an electronic structure according to the invention
• Fig. 2 is a cross sectional view of a second embodiment of an electronic structure according to the invention
• Fig. 3 is a cross sectional view of the module shown in Figures 1 and 2;
• Fig. 4 is a cross sectional view of the panel shown in Figure 1;
• Fig. 5 is a cross sectional view of a third embodiment of an electronic structure according to the invention.
• Fig. 6a, 6b are a cross sectional views of a fourth embodiment of an electronic structure ac- cording to the invention. Deatiled description of the illustrated embodiments
• first, second, third and the like in the description and in the claims are used for distinguishing between similar elements and not necessarily for describ- ing a sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances and that the embodiments of the invention described herein are capable of operation in other sequences than described or illustrated herein. Moreover, the terms top, bottom, over, under and the like in the description and the claims are used for descriptive purposes and not necessarily for describing relative positions. It is to be understood that the terms so used are interchangeable under appropriate circumstances and that the embodiments of the invention described herein are capable of operation in other orientations than described or illustrated herein.
• Figure 1 is a cross sectional view of a first embodiment of an electronic structure according to the invention.
• the electronic structure comprises a transparent or at least quasi-transparent panel 1 and a matrix of at least one module(s) 11. For clarity, only one module is represented on figure 1.
• the electronic structure is for instance a luminaire (or a decorative device) wich can be attached to the roof of a room and which illuminates the space under it thanks to the module(s).
• at least one module comprises at least one light emitting element (such as a LED and/or an OLED and/or a bulb and/or a discharge tube) and the electronic structure is a luminaire which can be used to illuminate the space.
• the at least one light emitting element can be a packaged LED (such as surface mount type LED or ampoule type LED) or a die LED, an RGB LED (for Red Blue Green LED) or a phosphor LED.
• the panel 1 comprises two conductive paths 2a, 2b (which can be chosen to be transparent : for instance conductive coatings such as fluorine-doped tin dioxide (SnO 2 IF) or Indium Tin Oxide (ITO) coatings or which can be chosen to be very conductive : for instance silver paste deposited by a serigraphy technique) and two magnetic elements 3a, 3b.
• conductive paths 2a, 2b and the magnetic elements 3a, 3b of the panel 1 are arranged on a transparent substrate layer 7 for instance made of glass.
• the magnetic elements 3a, 3b are thereby partially arranged on the conductive paths 2a, 2b.
• Figure 1 shows that the magnetic elements 3 a, 3b are arranged at least essentially in the plane of the conductive paths 2a, 2b or rather of the conductive paths layer 2a, 2b.
• the conductive paths 2a, 2b extend to two opposite edges of the panel 1. In this way, the conductive paths 2a, 2b can be electrically connected to a power supply and/or control device (not illustrated).
• the panel 1 is a composite element, which addition- ally comprises a transparent or at least quasi transparent cover layer 4, for instance made of glass or metal (such as steel or aluminium or any other metal) or plastic, having a matrix of through openings 5 (such as holes realized in the glass cover layer), and a linking layer 6.
• a transparent or at least quasi transparent cover layer 4 for instance made of glass or metal (such as steel or aluminium or any other metal) or plastic, having a matrix of through openings 5 (such as holes realized in the glass cover layer), and a linking layer 6.
• the linking layer 6 for instance a plastic interlayer (e.g. PVB for Poly Vynil Butyral), is arranged on the conductive paths layer 2a, 2b so that the magnetic elements 3 a, 3b are only partially covered by the linking layer 6.
• the cover layer 4 is again arranged on the linking layer 6, whereas the through opening is positioned so that the magnetic elements 3a, 3b are at least partially accessible via a through opening 5 in the cover layer 4.
• the module 11 can be inserted through the through opening 5 in the cover layer 4 and be placed on the magnetic elements 3a, 3b of the panel 1.
• the module 11 comprises an electronic component 12, two magnetic elements 13a, 13b, a support 14 and a radiator 15, for example the radiator FISCHER ELEKTRONIK - ICK BGA 23x23.
• the magnetic elements 13a, 13b are both electrically connected to the electronic component 12 via a support 14.
• the magnets are arranged on one side of the support 14. On this side of the support 14 also the electronic component 12, for example a light emitting diode, is arranged.
• the radiator 15 is thereby arranged on the side of the support 14, which is opposite to the side on which the electronic component 12 and the magnetic elements 13a, 13b are arranged.
• the electronic component 12 can for example be a light emitting diode, for instance a diode with the reference CL-L220-HC16N-A from Citizen Electronics. In that case, the radiator 15 allows to dissipate heat generated by the electronic component 12.
• the cover layer is made of a thermally conductive material (such as steel, stainless steel, aluminium...) and the at least one module 11 is in thermal contact the cover layer (a thermal connection or junction is created between the at least one module and the cover layer).
• the support 14 is also made of thermally conductive material (such as steel, stainless steel, aluminium%) and the surface of the support is chosen bigger than the through opening 5 in the cover layer 4 (for example the through opening 5 has a 30mm diameter and the support has a 30mm diameter). Thanks to the thermal junction between the support 14 and the cover layer 4, the cover layer acts then as a surface radiator, allowing to dissipate heat generated by the electronic compo- nent 12 (and then, for instance; to use higher power/currents to drive the electronic component, e.g. to implement high luminous flux LEDs as electronic components). It further allows, if necessary, not to use the radiator 15 in the module 11.
• the thermal contact can be realized, for example, simply by contact, or by using spring metal parts ("rondelle Belleville").
• FIG 1 illustrates, that the module 11 is, mechanically and electrically attached to the panel
• I 1 are magnets
• the corresponding magnetic elements 3a, 3b of the panel 1 are elements formed of a material, which is magnetically attractable by a magnet
• some of the magnetic elements 13a, 13b of the modules 11 are elements formed of a material, which is magnetically attractable by a magnet
• the corresponding magnetic elements 3 a, 3b of the panel 1 are magnets.
• a user can pull on the module 11 by exerting a force that at least compensates the magnetic attraction between the magnetic elements 13a, 13b of the module 11 and the magnetic elements 3a, 3b of the panel 1.
• the number of module(s) 11, pair of conductive paths layer 2a, 2b, pair of the magnetic elements 3a, 3b and opening(s) 5 can be chosen from one to an unspecified number.
• the electronic structure according to the invention can comprise a number of pair of conduc- tive paths layer 2a, 2b, pair of the magnetic elements 3a, 3b and opening(s) 5 that is different to the number of modules.
• At least one module 11 of the panel can be detached from its position on the panel : to be attached at another position of the panel or to be replaced by another module having a different color and/or color temperature and/or lighting profile and/or intensity and/or function (such as lighting, detection of person, detection of temperature, ...) and/or performance(s), in order to change at least one of the : color color temperature,
• LED(s) performance(s) such as lighting intensity, temperature stability
• the panel of the electronic structure do not comprise the linking layer 6 and the cover layer 4.
• the module(s) 11 are directly placed on the magnetic elements 3a, 3b of the panel 1.
• Figure 2 is a cross sectional view of a second embodiment of an electronic structure according to the invention.
• the second embodiment thereby differs from the first embodiment in that the transparent substrate layer 7 is a double glazing.
• the transparent substrate layer 7 is a double glazing.
• Figure 3 is a cross sectional view of the module shown in Figures 1 and 2.
• Figure 4 is a cross sectional view of the panel shown in Figure 1.
• Figure 5 is a cross sectional view of a third embodiment of an electronic structure according to the invention, which is a lighting device comprising several lighting modules 11 (not illustrated) that can be added and removed at the will of the user.
• the panel is a composite element and comprises a cover layer having four through openings 5, a linking layer (not illustrated), a transparent substrate layer 7, several conductive paths 3, 3' forming current feeder circuits and eight magnetic elements, symbolized by the rough shaded rectangles.
• the eight magnetic elements (rough shaded rectangles) are electrically connected to the conductive paths 3, 3'.
• the different shadings 3, 3' thereby symbolize different applicable polarities, whereas for example 3 can be the negative terminal and 3 ' can be the positive terminal.
• Figure 5 illustrates that the magnetic elements (rough shaded rectangles) are positioned so that they are each accessible via one through opening 5 in the cover layer 4.
• four modules 11 are inserted and mechanically and electrically attached in a detachable manner to the panel by magnetic attraction between their magnetic elements (not illustrated) and the magnetic elements (rough shaded rectangles) of the panel.
• the four modules 11 comprise each one light emitting device as electronic component.
• the four modules 11 are connected in parallel.
• a power supply can thereby be voltage-controlled.
• the addition and removal of modules 11 from the current feeder circuits 3, 3' shown in Figure 5 does not disturb the functioning of other modules 11.
• Figures 6a and 6b are a cross sectional views of a forth embodiment of an electronic structure according to the invention, in which one module 16 contains a function, which is different to the function of the other modules 11, for example lighting modules 11.
• the differing module 16 can comprise an infra-red sensor module which allows to communicate with a remote control and which allows to dim the intensity of the lighting modules 11.
• the differing module 6 can comprise an infra-red receiver, a decoder, a microcontroller and a switch as electronic components.
• the infra-red receiver can receive signals from an adapted remote control, the signals can then be decoded by the decoder and sent to the microcontroller that actuates a switch, for example by adapting the cycle ratio of a con- trollable switch, for instance by increasing the cycle ratio - and thereby the average current - when a higher power is requested and by decreasing the cycle ratio- and thereby the average current - when a reduction in power is requested.
• FIGs 6a and 6b show that the forth embodiment differs from the third embodiment shown in Figure 5 in that one lighting module 11 is replaced by a module 16 comprising n infra-red receiver, a decoder, a microcontroller and a switch as electronic components, whereas the current feeder circuits formed by the conductive paths 3, 3', 3" is adapted.
• the module 16 adjusts the period during which it creates short circuit 3" between the positive 3 and the negative 3' terminal, whereas the lighting modules 11 are short- circuited and extinct (see Figure 6a) and the period during which the diodes are fed (see Figure 6a)

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Metallurgy (AREA)
• Manufacturing & Machinery (AREA)
• Chemical & Material Sciences (AREA)
• Ceramic Engineering (AREA)
• Inorganic Chemistry (AREA)
• Electroluminescent Light Sources (AREA)
• Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
• Non-Portable Lighting Devices Or Systems Thereof (AREA)
• Coils Or Transformers For Communication (AREA)

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• 2009
  • 2009-05-14 EP EP09779481A patent/EP2422593A2/de not_active Withdrawn
  • 2009-05-14 WO PCT/EP2009/055844 patent/WO2010121666A2/en active Application Filing
  • 2009-11-17 WO PCT/EP2009/065329 patent/WO2010121674A2/en active Application Filing
  • 2009-11-17 EP EP09755896A patent/EP2422589A2/de not_active Withdrawn

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