Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
  • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
  • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
  • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
  • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
  • B32B17/10018—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
  • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
  • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
  • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
  • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
  • B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
  • B32B17/10045—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets with at least one intermediate layer consisting of a glass sheet
  • B32B17/10055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets with at least one intermediate layer consisting of a glass sheet with at least one intermediate air space
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
  • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
  • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
  • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
  • B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
  • B32B17/10761—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing vinyl acetal
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
  • H05K1/0203—Cooling of mounted components
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/18—Printed circuits structurally associated with non-printed electric components
  • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
  • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/01—Dielectrics
  • H05K2201/0104—Properties and characteristics in general
  • H05K2201/0108—Transparent
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/08—Magnetic details
  • H05K2201/083—Magnetic materials
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10106—Light emitting diode [LED]
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10431—Details of mounted components
  • H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB

Definitions

• the invention relates to an electronic component such as a light emitting element, to a panel adapted for attaching in a detachable way such an electronic component and to a lighting electronic structure comprising a panel and at least one electronic component.
• Lighting electronic structures such as glass panels comprising light emitting diodes are known.
• EP 1 467 215 Al describes a pane comprising a luminous element consisting of light emitting diodes.
• the integration of electric or electronic components in such layered structures leads to heat dissipation problems. This is especially true when the electronic components used are of relatively high power. For instance, 5 W LEDs generate more heat than can be dissipated through a glass panel of ordinary design, resulting in temperature increase if the LEDs are used continuously. LEDs are known to see their lifetime reduced when in a higher temperature environment. This implies that such lighting electronic structures are up to now more used as decorative panels than as panels really having the pur- pose of lighting the surrounding, e.g. of lighting a room. Additionally, such layered panels require numerous production steps and a defect, such as a faulty LED, cannot be repaired and requires the panel to be discarded.
• US 2007/154705 Al describes a method for producing composite element/s having two glass panes and at least one insert, such as a light emitting diode, which is placed there between.
• One of the glass panes has through holes in which LEDs can be placed.
• the invention thereto relates to a panel with an inventive structure, a method of as- sembly of the panel with an electronic module and the resulting assembled lighting electronic structure.
• the present invention relates to a panel comprising at least one module comprising at least one electronic component.
• the present invention relates to a panel for electrically and mechanically attaching at least one module comprising at least one electronic component in a removable way.
• the mod- ule(s) are definitively attached to the panel.
• This panel comprises a substrate carrying at least one electrically conductive path on a first side, wherein at least a portion of said substrate is transparent or translucent and wherein said electronic component is electrically connected to one of said electrically conductive path.
• At least one of said module comprises an electronic component which is a light emitting diode (which can be a semiconductor light emitting diode “LED” or an organic light emitting diode “OLED”), said module has its light emitting diode facing a transparent or translucent portion of said substrate.
• a light emitting diode which can be a semiconductor light emitting diode “LED” or an organic light emitting diode “OLED”
• the cover layer is a thermally conductive cover layer for dis- sipating heat generated by said electronic component, said thermally conductive cover layer being in thermal contact with said electronic component of said module.
• an electrically insulating spacer such as e.g. a spacing layer (which can be made of an electrically insulating material such as plastic or air or other materials) covering part of said electrically conductive path and separating said electrically conduc- tive path from said thermally conductive layer.
• Both said thermally conductive cover layer and said spacer comprise at least one through opening for giving access to the electrically conductive path not covered by said spacer, each of said at least one through opening facing a transparent or translucent portion of said substrate.
• Each opening in the spacer is at least overlapping (or occupying the same area as) an opening in the thermally conductive cover layer so that access to the electrically conductive path is given.
• spacer are electrically insulating isolated pieces or a lattice
• "comprise at least one through opening” must be construed as meaning that no electrically insulating isolated pieces or no frame walls, are present where a hole in the cover layer is present. In such a way, access to the electrically conductive path is given to the electronic component of the module.
• the present invention relates to a method for producing an electronic structure according to the first aspect of the present invention, comprising the steps of:
• At least one module comprising an electronic component and a thermally conductive support in thermal contact with said electronic component, wherein at least one of said modules is a light emitting module (e.g. a module comprising at least one LED or at least one OLED),
• a light emitting module e.g. a module comprising at least one LED or at least one OLED
• a panel comprising a substrate carrying at least an electrically conductive path on a first side, wherein at least a portion of said substrate is transparent or translucent, which panel further comprises a thermally conductive cover layer for dissipating heat gener- ated by said electronic component, said thermally conductive cover layer facing said first side of said substrate, and which panel additionally comprises an electrically insulating spacer separating said electrically conductive path from said thermally conductive cover layer, wherein both said thermally conductive cover layer and said spacing layer comprise one through opening per module, and
• a further aspect of the present invention relates to a lighting electronic structure, com- prising a panel and at least one module.
• the panel comprises a substrate carrying at least an electrically conductive path on a first side, wherein at least a portion of said substrate is transparent or translucent.
• the panel also comprises a thermally conductive cover layer for dissipating heat generated by said electronic component, said thermally conductive cover layer facing said first side of said substrate, said thermally conductive cover layer being in thermal contact with said electronic components of each of said modules.
• the panel further comprises an electrically insulating spacer separating said electrically conductive path from said thermally conductive cover layer.
• Both said thermally conductive cover layer and said spacing layer comprise at least one through opening for giving access to the electrically conductive path not covered by said electrically insulating layer, each of said at least one through opening facing a transparent or translucent portion of said substrate.
• the module comprises an electronic component, said electronic component being electrically connected to one of said electrically conductive path, wherein each of said module has its electronic component facing a transparent or translucent portion of said substrate, wherein at least one of said modules is a light emitting module.
• Such an electronic structure advantageously permits the heat generated by the electronic components to be dissipated in the thermally conductive cover layer. This is made possible because the thermally conductive element is in thermal contact with the electronic com- ponent of each of the modules. The thermal contact can be assured via a direct physical contact between the cover layer and the component or via a thermally conductive support of a module.
• a thermally conductive intermediate flexible and/or resilient interlayer may be present between said cover layer and said support and/or said components.
• the thermally conductive cover layer (e.g. a single cover layer) has a lar- ger surface area than any of the electronic modules. This does not merely allow heatspread- ing, but additionally offers the option of establishing a further thermal contact between the cover layer and a heat sink at a location remote from the sensitive and vulnerable electronic modules.
• the heat sink could be a specific body that is part of the electronic structure. Alternatively, it may be a body external to the electronic structure, such as the earth or any me- chanical construction, including bridges, walls, luminaries and the like.
• the function of the electrically insulating spacer separating said electrically conductive path from said thermally conductive cover layer is to prevent short circuits between the electronic paths and the thermally conductive cover layer when said layer is also electrically conductive.
• the prevention of short-circuit is not merely needed for the correct operation of the electronic module, but also for safety reasons, since the thermally conductive cover layer may be at the outside and thus accessible for persons.
• the spacer can be made of electrically insulating isolated pieces (e.g. studs or bumbs) and the air present between said pieces. These pieces can be homogeneously distributed over the surface of the substrate or not. Also possible is to use an electrically insulting frame which walls support said cover layer.
• the air in the free space inside the frame provide most of the electrical insulation.
• an insulating two dimensional lattice made of inter-crossing electrically insulating walls that would serve as the spacer.
• the lattice could de- fine two or more windows or free space area.
• the pieces, frame or lattice merely serving the purpose of keeping the cover layer apart from the electrically conductive paths present on the substrate.
• the electrical insulation is merely provided by air.
• the spacer can also be a layer of electrically insulating material.
• At least one module is attached in a detachable way to said panel.
• At least one module of the panel can be detached from its position on the panel to be attached at another position of the panel or to be replaced by another module having a different color and/or color temperature and/or lighting profile and/or intensity and/or function (such as lighting, detection of person, detection of temperature, ...) and/or performance(s).
• another module having a different color and/or color temperature and/or lighting profile and/or intensity and/or function (such as lighting, detection of person, detection of temperature, ...) and/or performance(s).
• one may change at least one of the color, the color temperature, and lighting profile (area illuminated by the luminaire).
• Such a change of properties of the lighting electronic structure during its 'use'-phase - as opposed to a 'design '-phase - is particularly relevant for theatre and similar applications. Different atmospheres and lighting is needed in subsequent moments in time, while there is merely limited space for panels.
• a replacement of electronic modules to create another lighting design is then a need, analogous to the replacement of light bulbs in more traditional lighting technology
• the detachable connection of panel and module is provided with an adhesive, preferably an electrically conductive adhesive.
• mechanical means are used for the detachable connection.
• the detachable connection of panel and module is embodied with magnets.
• the panel and the module each comprise at least one magnet or at least one comple- mentary component that is magnetically attractable by a magnet. Magnets are advantageous because they permit an easy placing and removing of the modules.
• magnets are used in pairs of a magnet with a negative pole and a magnet with a positive pole.
• the pair of magnets is present in either the panel or the module, and there is one or more complementary component in the other one of the panel and the module.
• the magnets and complementary components may also serve to assure the electric connection between the electronic component of the module and the electrically conductive path. It has been found that when using a pair of magnets as part of the electric connection, an electronic module may be attached or detached with merely a limited or even no disturbance on other electronic modules attached to the panel. Though the magnets constitute a resistance leading to increased heat dissipation, they do not have a major impact on the overall heat management. The magnets are at worst a thermal barrier between the modules an the substrate, but the heat is generated and substantially removed from the modules without passing these magnets constituting a thermal barrier.
• said thermally conductive support may be used as a magnet or a complementary component.
• This embodiment is particularly advantageous as it simplify greatly the manufacturing process of the modules.
• the substrate carries at least two electrically conductive paths and at least two components selected from a magnet and a com- plementary component attractable by a magnet
• the module comprise at least two components selected from a magnet and a complementary component attractable by a magnet complementary to said components in the panel.
• each of the components attached to the substrate is electrically connected to one of the conductive paths.
• a first of the conductive path is coupled to one voltage supply line, and a second conductive path is coupled to a line on another voltage.
• the other voltage is typically ground, but could also have another voltage level.
• These paths and the one or more modules coupled to the paths form a unit cell.
• the lighting electronic structure suitably comprises a plurality of unit cells.
• One may have one or more than one electronic modules per unit cell.
• a suitable number of electronic modules is in the range of 2 to 4 (but more than 4 modules, e.g. 10 or 100 modules are also suitable).
• the unit cell is designed such that the voltage difference over each electronic module is equal.
• the modules are coupled in parallel. This is suitable so as to minimize impact on neighbouring modules.
• a voltage-controlled power supply Use of a current-controlled power supply is however not excluded. When used, then preferably in combination with either current regulation in each module, or a special design of the power supply to provide current in equivalents of a nominal current, or exchanging a module with a resistor module consuming the same current as the module comprising the light source, e.g. LED or OLED.
• the use of a special design of the power supply would for instance operate with a nominal current of 500 mA.
• the other currents are then multiples thereof, eg. 2 equivalents (IA), 4 equivalents (2A), 10 equivalents (5A).
• IA 2 equivalents
• 2A 4 equivalents
• 5A 10 equivalents
• the magnetic element/s of the module/s are magnets
• the magnetic element/s of the panel are element/s, formed of a material, which is magnetically attractable by a magnet.
• the magnetic element/s of the module/s are element/s, formed of a material, which is magneti- cally attractable by a magnet, whereas the magnetic element/s of the panel (i.e. the means) are magnets.
• the magnetic element/s of the mod- ule/s are magnets
• the magnetic element/s of the panel are also magnets.
• the magnetic element/s of the module/s can be connected to the module/s by an electrically conductive adhesive (such as Epotecny E212) and/or by welding and/or by soldering for example to a metallic element of the module.
• an electrically conductive adhesive such as Epotecny E212
• the magnetic element/s of the module/s can have numerous other shapes.
• the magnetic ele- ment/s of the module/s can be ring shaped.
• the panel can comprise a plurality of conductive paths and/or magnetic elements.
• the lighting electronic structure can comprise a plurality of modules.
• the panel can comprise a number of magnetic elements which is about twice the number of the modules.
• the magnetic elements of the panel can be arranged in a regular pattern.
• the magnetic elements of the panel can be arranged in lines and/or rows.
• the magnetic elements of the panel can be arranged in a matrix of lines and rows.
• the modules may be arranged in a regular pattern.
• the modules can be arranged in lines and/or rows.
• the modules can be arranged in a matrix of lines and rows. This is advantageous as it permits for instance to use the lighting electronic structure as a display.
• the magnets and complementary components have coded shapes and/or have coded magnetic pole orientations and/or are arranged according to a code for avoiding polarity errors - or poling errors / errors in connecting wrong/reverse polarities.
• anodic and cathodic magnetic element/s of the module/s can have dif- ferent shapes and/or different magnetic pole orientations and/or magnetic element/s of the module/s can be formed so that they have positive structures where the corresponding magnetic element/s of the panel have negative structures, or vice versa.
• the light emitting module comprises a light emitting semiconductor component (such as a LED and/or an OLED).
• the lighting electronic structure may be a luminaire which can be used to illuminate the space or can be used for decorative purpose.
• the at least one light emitting element can be a packaged LED (such as surface mount type LED or ampoule type LED) or a die LED, an RGB LED (for Red Blue Green LED) or a phosphor LED.
• each LED has a power from 3 W to 3OW, more preferably 4 W to 20 W, even more preferably from 4 W to 10 W, most preferably from 4W to 6W or around 5W.
• a module comprises a sensor, for example presence sensors or infrared sensors/receivers.
• Presence sensor can be understood a sensor, which is adapted to switch on other electronic components when detecting the presence of a user and/or to switch off other electronic components when detecting the absence of a user.
• a module comprises several electronic components, these components are preferably connected so to each other that the number of necessary outgoing and incoming electrical sig- nal paths is reduced, for example to two.
• Modules further may include any semiconductor component needed for driving, addressing and signal processing, such as micro-controllers, signal decoders, dimmers, switches and remote controllable components, such as infrared remote controllable components. At least some of these components may alternatively or additionally be present in the panel.
• the electronic structure comprises a plurality of modules, e.g. at least two, preferably more than 10 and optionally more than 50. It is an advantage of the present invention that the power use per module does not need to be equal for all modules.
• At least one module comprises a presence sensor and/or an infrared sensor.
• each module can comprise at least one light-emitting element (which can be a semiconductor light-emitting diode “LED” or an organic light-emitting diode “OLED”) and a built-in intelligence, such as a microcontroller and/or signal decoder, in particular for receiving signals via the conductive paths, processing the signal's information and behaving independently to create an image.
• a light-emitting element which can be a semiconductor light-emitting diode "LED” or an organic light-emitting diode “OLED”
• a built-in intelligence such as a microcontroller and/or signal decoder, in particular for receiving signals via the conductive paths, processing the signal's information and behaving independently to create an image.
• a lighting electronic structure as luminous structure, window, shop window, building front, communicating building facade, building roof element, display, such as a video display panel, and/or decorative element or as windshield, side window, roof window, rear window, front light, rear light and/or indicator of a power driven, terrestrial, nautical or aeronautical vehicle.
• Fig. 1 is a cross sectional view of an embodiment of a lighting electronic structure according to the invention
• Fig. 2 is a cross sectional view of another embodiment of a lighting electronic structure according to the invention.
• Fig. 3 is a cross sectional view of yet another embodiment of a lighting electronic struc- ture according to the invention.
• Fig. 4 is a cross sectional view of yet another embodiment of a lighting electronic structure according to the invention.
• Fig. 5 is a cross sectional view of another embodiment of a lighting electronic structure according to the invention.
• Fig. 6 is a cross sectional view of the module shown in Figures 1, 2 and 3;
• Fig. 7 is a cross sectional view of the module shown in Figure 5;
• Fig. 8 is a cross sectional view of the module shown in Figure 4.
• Fig. 9 is a cross sectional view of the panel shown in Figure 1 and 2;
• Fig. 10 is a cross sectional view of a further embodiment of an electronic structure according to the invention.
• Fig. 11 is a cross sectional view of a further embodiment of an electronic structure according to the invention.
• Fig. 12 is a cross sectional view of the embodiment of Figure 11 when the lighting modules 11 are short-circuited;
• the term "in a detachable manner" is intended to mean with respect to the present invention that the at least one module, compris- ing at least one electronic component and a thermally conductive support, can be detached from a panel by a user of the lighting electronic structure while maintaining the function of the electronic component.
• a attached directly to B implies a direct contact between A and B while the term “A attached indirectly to B” implies no direct contact between A and B.
• A could be indirectly attached to B via an intermediate element itself directly attached to both A and B.
• magnetic element relates to a magnet or an element that is magnetically attractable by a magnet.
• a component which is magnetically attractable by a magnet can for instance be an element comprising or consisting of a ferromagnetic or ferrimagnetic material, in particular a metal or a metal alloy, such as iron, cobalt or nickel. It goes without saying that, for a magnetic attraction either both magnetic elements are magnets, which are arranged so that opposite poles are facing each other, or one magnetic element is a magnet, whereas the other magnetic element is an element, which is magnetically attractable by a magnet.
• Figure 1 is a cross sectional view of a first particular embodiment of a lighting electronic structure according to the invention.
• the electronic structure comprises a panel 1 and a matrix of at least one module(s) 11. For clarity, only one module is represented on figure 1.
• the lighting electronic structure is for instance a luminaire (or a decorative device) wich can be attached to the roof of a room and which illuminates the space under it thanks to the module(s).
• At least one module comprises at least one light emitting element (such as a LED and/or an OLED and/or a bulb and/or a discharge tube) and the electronic structure may be a luminaire which can be used to illuminate the space.
• the at least one light emitting element can be a packaged LED (such as surface mount type LED or ampoule type LED) or a die LED, an RGB LED (for Red Blue Green LED) or a phosphor LED.
• the LED can for instance be a CL-L220-HC16N-A from Citizen Electronics.
• the panel 1 comprises two conductive paths 2a, 2b (which can be chosen to be transparent : for instance conductive coatings such as fluorine-doped tin dioxide (SnO 2 IF) or Indium Tin Oxide (ITO) coatings or which can be chosen to be very conductive : for instance silver paste deposited by a serigraphy technique) and two magnetic elements 3 a, 3b.
• conductive paths 2a, 2b and the magnetic elements 3a, 3b of the panel 1 are arranged on a transparent substrate layer 7 for instance made of glass.
• the magnetic elements 3a, 3b are thereby partially arranged on the conductive paths 2a, 2b.
• Figure 1 shows that the magnetic elements 3a, 3b are arranged at least essentially in the plane of the conductive paths 2a, 2b or rather of the conductive paths layer 2a, 2b.
• the conductive paths 2a, 2b extend to two opposite edges of the panel 1. In this way, the conductive paths 2a, 2b can be electrically connected to a power supply and/or control device (not illustrated).
• the panel 1 is a composite element, which additionally comprises a thermally conductive cover layer 4, for instance made of metal (such as steel or aluminium or any other metal), having a matrix of through openings 5 (such as holes realized in the cover layer), and an electrically insulating spacer (here a linking layer) 6.
• a thermally conductive cover layer 4 for instance made of metal (such as steel or aluminium or any other metal)
• a matrix of through openings 5 such as holes realized in the cover layer
• an electrically insulating spacer here a linking layer
• the linking layer 6 for instance a plastic interlayer (e.g. PVB for Poly Vynil Butyral), is arranged on the conductive paths layer 2a, 2b so that the magnetic elements 3a, 3b are only partially covered by the linking layer 6.
• the cover layer 4 is again arranged on the linking layer 6, whereas the through opening is positioned so that the magnetic elements 3a, 3b are at least partially accessible via a through opening 5 in the cover layer 4. In this way, the module 11 can be inserted through the through opening 5 in the cover layer 4 and be placed on the magnetic elements 3a, 3b of the panel 1.
• the module 11 comprises an electronic component 12, two magnetic elements 13a, 13b, and a thermally conductive support 14.
• the magnetic elements 13a, 13b are both electrically connected to the electronic component 12.
• the magnets are arranged on one side of the electronic component 12.
• the support 14 is thereby arranged on the side of the electronic component 12, which is opposite to the side on which the magnetic elements 13a, 13b are arranged.
• the electronic component 12 can for example be or comprise a light emitting diode, for instance a diode with the reference CL-L220-HC16N-A from Citizen Electronics.
• Figure 1 illustrates, that the module 11 is, mechanically and electrically attached to the panel 1 in a detachable manner by magnetic attraction between the magnetic elements 13a, 13b of the module 11 and the magnetic elements 3 a, 3b of the panel 1.
• the magnetic elements 13a, 13b of the module 11 are magnets
• the magnetic elements 3a, 3b of the panel 1 are elements formed of a material, which is magnetically attractable by a magnet
• the magnetic elements 13a, 13b of the modules 11 are elements formed of a material, which is magnetically attractable by a magnet
• the magnetic elements 3a, 3b of the panel 1 are magnets.
• some magnetic elements 13a, 13b of the modules 11 are magnets
• the corresponding magnetic elements 3a, 3b of the panel 1 are elements formed of a material, which is magnetically attractable by a magnet
• some of the magnetic elements 13 a, 13b of the modules 11 are elements formed of a material, which is magnetically attractable by a magnet
• the corresponding magnetic elements 3a, 3b of the panel 1 are magnets.
• all elements 13 a, 13b, 3a, 3b are magnets.
• a user can pull on the module 11 by exerting a force that at least compensates the magnetic attraction between the magnetic elements 13a, 13b of the module 11 and the magnetic elements 3a, 3b of the panel 1.
• the number of module(s) 11, pair of conductive paths layer 2a, 2b, pair of the mag- netic elements 3 a, 3b and opening(s) 5 can be chosen from one to an unspecified number.
• the lighting electronic structure according to the invention can comprise a number of pair of conductive paths layer 2a, 2b, pair of the magnetic elements 3a, 3b and opening(s) 5 that is different to the number of modules.
• At least one module 11 of the panel can be detached from its position on the panel :
• LED(s) performance(s) such as lighting intensity, temperature stability,
• the panel of the electronic structure do not comprise a linking layer 6 but comprise a simple spacer and the insulation is performed by air.
• the module(s) 11 are directly placed on the magnetic elements 3a, 3b of the panel 1.
• Figure 2 is a cross sectional view of another embodiment of a lighting electronic structure according to the invention.
• the second embodiment thereby differs from the first embodiment in that the transparent substrate layer 7 is a double glazing.
• the transparent substrate layer 7 is a double glazing.
• FIG 3 is a cross sectional view of yet another embodiment of a lighting electronic structure according to the invention.
• a recess in the thermally conductive cover layer 4 permits the fitting of the thermally conductive support 14 of the module.
• an optional thermally conductive flexible (and/or resilient) material 15 is present to improve the thermal contact between the thermally conductive support 14 and the thermally conductive cover layer 4.
• Figure 4 is a cross sectional view of yet another embodiment of a lighting electronic structure according to the invention.
• the magnetic elements 3a, 3b of the panel 1 are at the interface between the linking layer 6 and the thermally conductive cover layer 4.
• the magnetic elements 13a, 13b of the modules 11 are magnets present on top of the thermally conductive support 14. The electrical connection between the module and the panel is assured by electrical connectors 17.
• FIG. 5 is a cross sectional view of yet another embodiment of a lighting electronic structure according to the invention.
• the magnetic elements 3a, 3b of the panel 1 are at the interface between the linking layer 6 and the thermally conductive cover layer 4.
• the magnetic elements 13 a, 13b of the modules 11 are not present. There presence is not necessary anymore since the thermally con- ductive support 14 is now a magnet. The electrical connection between the module and the panel is assured by electrical connectors 17.
• FIG 6 is a cross sectional view of the module shown in Figures 1 , 2 and 3.
• the module 11 comprises an electronic component 12, two magnetic elements 13a, 13b, and a thermally conductive support 14.
• the magnetic elements 13a, 13b are both electrically con- nected to the electronic component 12.
• the magnets are arranged on one side of the electronic component 12.
• the support 14 is thereby arranged on the side of the electronic component 12, which is opposite to the side on which the magnetic elements 13 a, 13b are arranged.
• the electronic component 12 can for example be or comprise a light emitting diode, for instance a diode with the reference CL-L220-HC16N-A from Citizen Electronics.
• FIG 7 is a cross sectional view of the module shown in Figure 5.
• the module 11 comprises an electronic component 12, two electrical connectors 17, and a thermally conductive support 14 which is also a magnet 13.
• the magnetic support 13, 14 is thereby arranged on the side of the electronic component 12, which is opposite to the side on which the electrical connectors are arranged.
• the electronic component 12 can for example be or comprise a light emitting diode, for instance a diode with the reference CL-L220-HC16N-A from Citizen Electronics.
• Figure 8 is a cross sectional view of the module shown in Figure 4.
• Figure 9 is a cross sectional view of the panel shown in Figure 1.
• Figure 10 is a cross sectional view of a further embodiment of an electronic structure according to the invention, which is a lighting device comprising several lighting modules 11 (not illustrated) that can be added and removed at the will of the user.
• the panel is a composite element and comprises a thermally conductive cover layer (represented as being transparent for the ease of drawing only) having four through openings 5, a linking layer (not illustrated), a transparent substrate layer 7, several conductive paths 3, 3' forming current feeder circuits and eight magnetic elements, symbolized by the rough shaded rectangles. The eight magnetic elements (rough shaded rectangles) are electrically connected to the conductive paths 3, 3'.
• FIG. 5 illustrates that the magnetic elements (rough shaded rectangles) are positioned so that they are each accessible via one through opening 5 in the cover layer 4. Via these four through openings 5 four modules 11 (not illustrated) are inserted and mechanically and electrically attached in a detachable manner to the panel by magnetic attraction between their magnetic elements (not illustrated) and the magnetic elements (rough shaded rectangles) of the panel.
• the four modules 11 comprise each one light emitting device as electronic component.
• the four modules 11 are connected in parallel.
• a power supply can thereby be voltage-controlled.
• the addition and removal of modules 11 from the current feeder circuits 3, 3' shown in Figure 5 does not disturb the functioning of other modules 11.
• Figures 11 and 12 are a cross sectional views of a fourth embodiment of a lighting electronic structure according to the invention, in which one module 16 contains a function, which is different to the function of the other modules 11, for example lighting modules 11.
• the differing module 16 can comprise an infra-red sensor module which allows to communicate with a remote control and which allows to dim the intensity of the lighting modules 11.
• the differing module 16 can comprise an infra-red receiver, a decoder, a micro-controller and a switch as electronic components.
• the infra-red receiver can receive signals from an adapted remote control, the signals can then be decoded by the decoder and sent to the micro-controller that actuates a switch, for example by adapting the cycle ratio of a controllable switch, for instance by increasing the cycle ratio - and thereby the average current - when a higher power is requested and by decreasing the cycle ratio- and thereby the average current - when a reduction in power is requested.
• Figures 11 and 12 show that the fourth embodiment differs from the embodiment shown in Figure 10 in that one lighting module 11 is replaced by a module 16 comprising an infra-red receiver, a decoder, a micro-controller and a switch as electronic components, whereas the current feeder circuits formed by the conductive paths 3, 3', 3" is adapted.
• the module 16 adjusts the period during which it creates short cir- cuit 3 ' ' between the positive 3 and the negative 3 ' terminal, whereas the lighting modules 11 are short-circuited and extinct (see Figure 12) and the period during which the diodes are fed (see Figure 11)
• the conductive paths may extend to terminals, for instance at least one edge of the substrate.
• the conductive paths and the modules attached thereto can be connected to a power supply and/or control device, for example via bus bars.
• the electrically conductive paths can for example comprise (or rather consist of) conductive polymers, in particular transparent conductive polymers, metals, such as silver, copper or aluminium, or metal alloys, or conductive oxides such as tin oxides, or semiconducting materials, such as fluorine-doped tin dioxide (SnO 2 IF) or Indium Tin Oxide (ITO).
• the conductive paths can also be realized from laser patterning of a layer of such a transparent conductive coating initially deposited on a surface of the substrate.
• the conductive paths can also be chosen to be very conductive : for instance can comprise (or rather consist of) silver paste deposited by a serigraphy technique.
• the substrate is transparent or translucent.
• the substrate is a transparent or translucent layer such as e.g. a glass substrate layer.
• a transparent or translucent polymer substrate layer for instance : a polycarbonate layer, a plexiglass layer, a PET layer, a PVB layer, an EVA layer, ...) or any other transparent or translucent plastic layer.
• the horizontal cross section of the holes is preferably smaller or equal to 7.5 cm, more preferably smaller or equal to 5 cm.
• At least one surface of a transparent or translucent substrate layer can be, at least partially, treated by sandblasting or serigraphy, painting or any other surface treatment.
• a partial serigraphy or painting of a transparent substrate is an example of way to obtain a substrate wherein at least a portion of said substrate is transparent or translucent.
• the transparent or translucent portions of the substrate are at least quasi transparent or translucent.
• quasi transparent substrate can thereby under- stood substrates, which comprise structures, which do not transmit light, but are so small that the resulting effect is invisible to the naked human eye.
• the substrate can for example be a glass substrate layer or a transparent polymer substrate layer.
• the substrate can be a bare glass substrate, a special glass substrate, such as a security glass substrate or a mirror glass substrate, or an acrylic glass (plexiglass) substrate.
• a security glass substrate or a mirror glass substrate
• an acrylic glass (plexiglass) substrate can be used as a security glass substrate or a mirror glass substrate.
• a portion of substrate can be considered transparent or translucent if it transmits at least 70% of the visible light .
• a portion of mirror glass panel which is not painted can be considered transparent if it transmits at least 70% of the visible light.
• a portion of mirror glass panel which is not painted and comprising 100 mg/m 2 of silver is transparent.
• the transparent portion of substrate will transmit at least 80%, preferably at least 85% and most preferably at least 90% of the visible light.
• translucent relates to substrates admitting and diffusing light so that an object beyond cannot be clearly distinguished.
• An example of such a glass is a matted glass (e.g. acid etched or sand blasted). Such substrates are preferred as they distribute light in all the directions.
• the substrate may be a composite element, for example a composite glass element, such as a double glazing or a laminated panel, for example a laminated glass element.
• the panel can be an element comprising:
• the substrate having at least a transparent or translucent portion (e.g. the substrate can be a transparent or translucent substrate layer),
• one or more magnetic element/s such as one or more magnets or one or more magnetically attractable components.
• the transparent substrate layer can thereby be a single layer, double glazed layer or a multi glazed layer.
• the transparent substrate layer can thereby be formed of glass or a transparent polymer, for example of bare glass, a special glass, such as a security glass or a mirror glass, or an acrylic glass (plexiglass).
• the conductive paths or rather the conductive paths layer is preferably transparent or at least quasi transparent or tansluscent.
• conductive paths and conductive paths layer can thereby understood conductive paths and conductive paths layer, respectively, whose non light transmitting structures are so small that the resulting effect is invisible to the naked eye.
• at least some of the conductive paths extend to the edge of the transparent substrate layer.
• These conductive paths can then be con- nected to a power supply and/or control device, for example via bus bars.
• the magnetic element/s of the panel i.e. the magnet/s or magnetically attractable componoent/s
• the term "essentially” means that the magnetic element/s of the panel can - independently of each other - be arranged on top of one or more conductive paths, under one or more conductive paths or in the plane of the conductive paths.
• the magnetic element/s of the panel can be are arranged, in particular fixed, on the substrate layer.
• the panel can be a composite element, comprising:
• thermally conductive cover layer having at least one through opening, for example for inserting at least one module
• an electrically insulating spacer such as a linking layer, for example a lamination layer,
• the panel is a composite element comprising:
• thermally conductive cover layer comprising at least one through opening, for example for inserting at least one module
• linking layer is arranged, in particular fixed, on the conductive paths layer
• the magnetic element/s are arranged at least essentially in the plane of the conductive path layer and are at most partially covered by the linking layer
• the conductive path layer is arranged, in particular fixed, on the substrate layer
• the magnetic element/s are positioned so that they are at least partially accessible via a through opening in the cover layer.
• the thermally conductive cover layer can be opaque, for example formed of metal (such as steel, stainless steel, aluminium, copper, zinc, or any other metal or alloy of metals).
• its thermal conductivity is at least 10 W/mK, preferably at least 100 W/mK and more preferably 200 W/mK.
• its thickness can be from 0.5 to 6 mm, preferably from 1 to 3 mm.
• the cover layer can comprise at least one through opening.
• the cover layer can comprise a plurality of through openings.
• the through openings can be arranged in a regular pattern.
• the through openings can be arranged in lines and/or rows.
• the through openings can be arranged in a matrix of lines and rows.
• the area of the cover layer is typically sufficient to cover all modules (in the case of non-removable modules enclosed by a cover layer not comprising holes) or is sufficient to permit thermal connection with all modules via their thermally conductive supports (in the case of removable modules in through holes).
• the electrically insulating spacer is in particular linking the cover layer to the conductive paths layer and the substrate. It is also insulating electrically the electrically conductive paths from the cover layer (when this one is electrically conductive). It is preferably a layer (called hereinafter an electrically insulating spacing layer or a linking layer).
• the linking layer can be transparent or translucent or opaque.
• the linking layer for example can be a thermoplastic resin or can be formed of an adhesive or of any adequate polymer.
• the linking layer can be a lamination layer, such as a layer comprising or consisting of polyvinyl butyral (PVB).
• the electronic structure can comprises a power supply and/or control device, in particular for supplying the electronic components with and/or for controlling the electronic components.
• the module can comprise a thermally conductive support, in particular a metallic support. If magnets are presents, they can for example be arranged, in particular fixed, on one side of the support. On the same side of the support or on the other side of the support, an electronic device, such as a light emitting diode, can be arranged, in particular fixed.
• the thermally conductive support can both be a support and a magnetic element formed of a material, which is magnetically attractable by at least a magnet provided on the panel.
• the thermally conductive support can be a magnet.
• the thermally conductive support can be for example formed of metal (such as steel, stainless steel, aluminium, copper, zinc, or any other metal or alloy of metals).
• its thermal conductivity is at least 10 W/mK, preferably at least 100 W/mK and more preferably 200 W/mK.
• its thickness can be from 0.5 to 6 mm, preferably from 1 to 3 mm.
• the area of its largest surface is preferably greater or equal to 15 cm 2 , preferably greater or equal to 20 cm 2 .
• the length of the support can be between 5cm and 15 cm (e.g. diameter in the case of a circular support).
• the dimen- sions of the support should be such that it does not fit in the holes present in the cover layer.
• the module do not need a radiator, a simple flat thermally conductive plate is suitable as a thermally conductive support. This saves place and is economical.
• the thermally conductive support of the module has dimensions such that it extends beyond the electronic component.
• the thermally conductive support is preferably (completely) overlapping on all sides of the electronic component.
• the electronic component is preferably within the con- fine of the thermally conductive support (which is for instance a metal plate).
• the electronic component is preferably mounted on the thermally conductive support (e.g. a metallic plate) in such a way that the thermally conductive support (e.g. a metallic plate) provides free thermally conductive material (e.g. metal) on all sides of the electronic component.
• the plane comprising the interface between the thermally conductive support and the electronic component is taken as a reference plane
• the projection of the electronic component in said plane (and perpendicularly to said plane) is preferably enclosed in said plane.
• the present invention relates to a panel for electrically and mechanically attaching light emitting or detecting modules in a removable way, comprising:
• a substrate (7) carrying at least one electrically conductive path on a first side, wherein at least a portion of said substrate is transparent or translucent,
• thermally conductive cover layer for dissipating heat generated by said light emitting or detecting modules, said thermally conductive cover layer facing said first side of said substrate,
• both said thermally conductive cover layer and said spacing layer comprise at least one through opening for giving access to the electrically conductive path not covered by said electrically insulating layer, each of said at least one through opening facing a transparent or translucent portion of said substrate.
• the present invention may relate a panel comprising at least one substrate having at least one transparent or translucent portion, said substrate layer carrying at least one conductive path and at least magnetic element (which can be a magnet or one element magnetically attractable by a magnet), whereas the magnetic element is electrically con- nected to the conductive path, the panel further comprising a thermally conductive cover layer.
• a module having at least one magnetic element in particular a module according to the present invention, may be advantageously in a detachable manner, mechanically and electrically attachable by magnetic attraction between the magnetic element of the module and the magnetic element of the panel.
• a panel comprising at least one transparent or translucent substrate layer carrying at least one conductive path and at least one magnet, whereas the magnet is electrically connected to the conductive path, the panel further comprising a thermally conductive cover layer.
• a module having at least one magnetic element in particular a module according to the present invention, is advanta- geously in a detachable manner, mechanically and electrically attachable by magnetic attraction between the magnetic element of the module and the magnet of the panel.
• the panel may comprise at least two magnets, which are electrically connected to the conductive path/s of the panel.
• the panel can comprise at least two conductive paths and at least two magnetic elements, whereas each magnetic element is electrically connected to a conductive path.
• the magnets may be electrically connected to different poled conductive paths.
• a module having at least two magnetic elements in particular a module according to the invention, is advantageously in a detachable manner, mechanically and electrically attachable by magnetic attraction between the magnetic elements of the module and the magnets of the panel.
• the assembly of the panel and the module may comprise following steps:
• the magnet can for instance be on the overlapping portion of said support being on the side of the electronic component or facing away from the electronic component.
• the assembly may comprise the steps of:
• At least two magnetic elements in particular magnets, can be electrically connected to one or more electronic components.
• the magnetic element/s can be electrically and mechanically connected to the elec- tronic component by a conductive adhesive (such as Epotecny E212) and/or by welding and/or by soldering for example to a metallic element of the module or the electronic component.
• a conductive adhesive such as Epotecny E212
• this method can also comprise the steps:
• thermally conductive support attaching at least one electronic component to the support, in such a way, and the relative dimensions of both the electronic component and the thermally conductive support being such, that said support overlaps on all sides of the electronic component, and
• At least one magnetic element (which can be a magnet or one element magnetically attractable by a magnet) to the support.
• the magnetic element/s and electronic component/s can thereby be attached to the support by a conductive adhesive (such as Epotecny E212) and/or by welding and/or by soldering.
• a conductive adhesive such as Epotecny E212
• a panel at least two conductive paths can be provided.
• at least two magnetic elements (which can be a magnet or one element formed of a material, which is magnetically attractable by a magnet) can be electrically connected to one or more conductive paths.
• the magnetic element/s can be electrically and mechanically connected to the conduc- tive path/s by a conductive adhesive (such as Epotecny E212) and/or by welding and/or by soldering for example to a metallic element of the panel, for instance to the conductive path.
• a conductive adhesive such as Epotecny E212
• the conductive path/s can be support of a conductive paths layer.
• the conductive path/s and/or the conductive paths layer can for example be applied to the panel by laser structuring of a conductive material layer or by screen printing of conductive inks or lacquers, for example comprising conductive polymers, in particular transparent conductive polymers, metals, such as silver, silver paste, metal alloys or semiconducting materials, such as fluorine- doped tin dioxide (SnO2:F).
• the panel comprising at least one conductive path can for example be produced by providing a transparent substrate layer, such as a bare or special glass layer, and applying at least one conductive path or a conductive paths layer on the transparent or translucent substrate layer.
• the panel may be produced by first providing a thermally conductive cover layer, which comprises at least one through opening.
• the cover layer can for example be produced by drilling holes in a thermally conductive plate (such as a metal plate) by making use of drilling means conventional in the metal industry.
• the cover layer may be lami- nated on the conductive path layer / the transparent or translucent substrate layer by means of a linking layer, in particular lamination layer, between the cover layer and the conductive path layer / transparent substrate layer.
• a linking layer in particular lamination layer, between the cover layer and the conductive path layer / transparent substrate layer.
• Such linking layer is the spacer. In this manner, the magnetic element/s are at most partially covered by the linking layer and at least partially accessible via a through opening in the cover layer.
• an electronic module comprising a light emitting or detecting module, comprising at least one electronic component, at least one thermo conductive support in thermal contact with said electronic component, said thermoconductive support having dimensions such that it extends beyond said electronic component, and at least a means for attaching said module to a substrate, said means is a magnet or a component which is magnetically attractable by a magnet.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Metallurgy (AREA)
• Manufacturing & Machinery (AREA)
• Chemical & Material Sciences (AREA)
• Ceramic Engineering (AREA)
• Inorganic Chemistry (AREA)
• Electroluminescent Light Sources (AREA)
• Coils Or Transformers For Communication (AREA)
• Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
• Non-Portable Lighting Devices Or Systems Thereof (AREA)

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• 2009
  • 2009-05-14 EP EP09779481A patent/EP2422593A2/de not_active Withdrawn
  • 2009-05-14 WO PCT/EP2009/055844 patent/WO2010121666A2/en active Application Filing
  • 2009-11-17 EP EP09755896A patent/EP2422589A2/de not_active Withdrawn
  • 2009-11-17 WO PCT/EP2009/065329 patent/WO2010121674A2/en active Application Filing

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