EP2380746B1 - Tampon de gaufrage et procédé de gaufrage à chaud - Google Patents

Tampon de gaufrage et procédé de gaufrage à chaud Download PDF

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Publication number
EP2380746B1
EP2380746B1 EP11158305.0A EP11158305A EP2380746B1 EP 2380746 B1 EP2380746 B1 EP 2380746B1 EP 11158305 A EP11158305 A EP 11158305A EP 2380746 B1 EP2380746 B1 EP 2380746B1
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EP
European Patent Office
Prior art keywords
embossing
temperature
hot
insert
stamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP11158305.0A
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German (de)
English (en)
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EP2380746A2 (fr
EP2380746A3 (fr
Inventor
Thomas Löchner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hinderer and Muehlich KG
Original Assignee
Hinderer and Muehlich KG
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Publication of EP2380746A3 publication Critical patent/EP2380746A3/fr
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
    • B44B5/00—Machines or apparatus for embossing decorations or marks, e.g. embossing coins
    • B44B5/02—Dies; Accessories
    • B44B5/028—Heated dies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/16—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like
    • B44C1/165—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like for decalcomanias; sheet material therefor
    • B44C1/17—Dry transfer
    • B44C1/1712—Decalcomanias applied under heat and pressure, e.g. provided with a heat activable adhesive
    • B44C1/1729—Hot stamping techniques

Definitions

  • the invention relates to an embossing punch for transferring a transfer layer of a hot stamping foil to a substrate and to a hot embossing method.
  • embossing dies are used, for example, in the graphic arts industry to decorate paper substrates and to provide them with an embossed surface.
  • a transfer sheet of a hot stamping sheet is transferred to the paper substrate by applying temperature and pressure.
  • blind embossed areas may be provided, which are indeed embossed, but not decorated.
  • the hot stamp can be recessed in the blind areas to be embossed, and it can be provided to then cold stamp these areas in a second operation.
  • the transfer layer of the hot stamping foil must have corresponding recesses.
  • an undesired thermal impairment of the embossing substrate can occur in the blind embossing area.
  • the embossing substrate may yellow when exposed to the embossing temperature.
  • An embossing stamp of the usual kind is out GB 2 276 350 known.
  • Object of the present invention is to provide an embossing die, which avoids the disadvantages mentioned and which makes it possible to perform decorating using hot stamping and blind embossing in one operation.
  • this object is achieved with an embossing stamp for transferring a transfer layer of a hot stamping foil to a substrate, wherein it is provided that the embossing stamp has an embossing plate of a first material, wherein a motif region is provided in the embossing plate, and that the embossing stamp comprises at least one blind stamping insert a second material, wherein the thermal conductivity of the second material is much smaller than the thermal conductivity of the first material.
  • the stamper according to the invention has a higher surface temperature than in the area of the blind embossing insert when it is uniformly heated from the rear side.
  • the surface temperature of the embossing plate can be adjusted so that the transfer layer of the hot stamping foil is safely transferred to the substrate during hot stamping and the surface temperature of the dummy embossing insert is adjusted so that the transfer layer of the hot stamping foil during hot stamping not on the substrate is transferred, and further that the substrate is not thermally affected.
  • the thermal conductivity ⁇ of the first material at room temperature is in the range from 50 to 400 W / (m ⁇ K), preferably in the range from 100 to 300 W / (m ⁇ K).
  • the thermal conductivity ⁇ of the first material should be as high as possible in order to achieve a good function of the stamping die during hot stamping.
  • the thermal conductivity ⁇ of the second material at room temperature in the range of 0.1 to 5 W / (m • K), preferably in the range of 0.1 to 1 W / (m • K).
  • the thermal conductivity ⁇ of the second material should be as low as possible in order to achieve a good function of the embossing punch during blind embossing.
  • thermo conductivity ⁇ is temperature-dependent. Under room temperature is here a temperature range, which includes 300 K, understood.
  • the thermal conductivity of the second material is less than 1% to 5%, preferably less than 1% of the thermal conductivity of the first material.
  • the first material is a copper or aluminum alloy.
  • the thermal conductivity ⁇ of the alloys preferably used is between 100 W / (m ⁇ K) and 200 W / (m ⁇ K).
  • the second material is a plastic or a plastic mixture.
  • the plastic is of the type of the two-component plastic, for example an epoxy resin with a hardener component.
  • the embossing plate has at least one opening, which is penetrated by the at least one dummy embossing insert.
  • the dummy embossing insert is designed to be replaceable. In this way it is possible to compensate for different wear of the die and the blind embossing insert, d. H. To extend the service life of the stamping die by changing the worn blind embossing insert.
  • the breakthrough may have a conical extension at the back of the stamping plate.
  • the conical widening of the opening can correspond to a conical elevation at the rear portion of the blind embossing insert, so that the blind embossing insert is secured in a form-fitting manner during embossing against pushing out of the embossing plate.
  • the object of the invention is further achieved by a hot embossing method for transferring a transfer layer of a hot stamping film at an embossing temperature and an embossing pressure on a substrate, wherein the transfer layer is arranged on a carrier film and a release layer is arranged between the transfer layer and the carrier film and / or on the Transfer layer is disposed an adhesive layer, wherein it is provided that an embossing die is provided, which comprises a stamping plate made of a first material, in which a motif area is provided, and at least one arranged in the embossing blank dummy insert a second material, wherein the thermal conductivity of the second material is less than the thermal conductivity of the first material; the back side of the embossing stamp is heated to a temperature in which the motif area has the embossing temperature and the blind embossing insert has a lower temperature than the embossing temperature, the hot embossing film is arranged between the embossing stamp and
  • a hot stamping film is used whose embossing temperature is in the range of 60 ° C to 190 ° C, preferably 60 ° C to 120 ° C.
  • the Fig. 1 and 2 show an embossing stamp 1 for hot stamping, ie for transferring a transfer layer of a hot stamping foil on a substrate.
  • the embossing stamp 1 is preferably an embossing stamp which can be used in the graphic industry and indeed embossed in relief.
  • embossing relief embossing a decoration of the substrate is made with the transfer layer of a hot stamping foil with simultaneous deformation of the substrate, wherein act through the hot stamping process pressure and heat to the substrate during the deformation or relief-like deformation.
  • This technology is also referred to as one-off relief embossing.
  • only a decoration of the substrate with the transfer layer of a hot stamping film is made during hot stamping, without deformation of the substrate.
  • the embossing stamp 1 has an embossing plate 11 made of a metal alloy with high thermal conductivity and a blind embossing insert 12 made of a plastic having a comparatively low thermal conductivity.
  • the blind embossing insert 12 passes through an opening 11d formed in the embossing plate 11.
  • the aperture 11d has in its rear portion a conical extension 11k, which corresponds to a conical elevation at the rear portion of the dummy embossing insert 12, so that the blind embossing insert 12 during embossing against pushing out of the die 11 is positively secured.
  • the substrate is shaped without the action of heat or deformed in a relief-like manner.
  • the embossing plate 11 has a motif area 11 m, which is delimited by the end face of a peripheral embossing edge 11p. Within the motif area 11 m, the blind embossing area 12 b is arranged, in which the substrate is shaped or deformed into a relief in the form of the blind embossing insert 12 in cooperation with the corresponding counterpart shaped male part 13 in this area.
  • the embossing edge 11p represents, in the example shown in the figures, the motif of the hot embossing area, i. the narrow end face of the embossing edge 11p transmits the transfer layer of a hot embossing film as a narrow line in this example as a decoration or coating on the substrate.
  • the flat in this area formed patrix 13 serves here as an abutment for applying the embossing pressure.
  • the motif of the motif area 11 m thus consists in this simple example of two parallel, relatively broad, relief-like elevations and / or depressions as blind embossing in the center of the motif and a circumferential hot embossed edge, d. H. a decorative edge applied by means of hot stamping, without the substrate being simultaneously shaped in relief in this edge region.
  • blind embossing area 12 and embossing area 11p no decoration or deformation / deformation of the motif takes place in the area shown here.
  • embossing stamp 1 acts when embossing in Fig. 3 shown patrix 13 together, which is complementary to the surface of the die 1 Surface has.
  • guide elements for example, with corresponding holes cooperating guide pins may be arranged to achieve the exact position between the embossing plate 11 and the male part 13 during the embossing process.
  • the material of the dummy embossment insert 12 has a much smaller thermal conductivity than the material of the embossing plate 11.
  • the thermal conductivity ⁇ is a temperature-dependent substance constant and, in the case of porous substances, also depends on the moisture content of the substance.
  • the embossing plate 11 may preferably be formed of a copper or aluminum alloy.
  • the thermal conductivity ⁇ may preferably be in the range of 50 to 400 W / (m ⁇ K), based on room temperature.
  • copper has a thermal conductivity ⁇ of about 350 to 370 W / (m ⁇ K).
  • aluminum having a purity of 99.5% has a thermal conductivity ⁇ of about 221 W / (m ⁇ K) but, like copper, is less suitable for embossing plates because of lower hardness than the said alloys.
  • the blind embossing insert 12 may preferably be formed of a two-component plastic in order to be able to easily mold it, as described below.
  • the blind embossing insert 12 may be formed interchangeable, for example, to easily replace a worn blind embossing insert 12 or to make the dummy embossed part of the subject variable, for example, customizable.
  • the plastic may preferably have a thermal conductivity ⁇ in the range of 0.1 1 to 5 W / (m ⁇ K), based on
  • the thermal conductivities of the embossing plate 11 and the dummy embossing insert 12 should preferably differ by at least one order of magnitude at the operating temperature. If now the embossing plate 11 is heated with inserted dummy embossment insert 12 from the back side, then the surface temperature of the blind embossing insert 12 is significantly lower than the surface temperature of the embossing plate 11 on the embossing side facing away from the back surface.
  • the surface temperature of the embossing plate 11 must be so high that the Transfer layer of the hot stamping foil in the image area 11 b is securely transferred to the substrate during embossing, and the surface temperature of the dummy embossment insert 12 must be so low that the transfer layer of the hot stamping foil in the blind embossing 12 b of the blind embossing insert remains during embossing on the carrier layer of the hot stamping foil. It should be noted that the stamping process is very short in time, maximum in the range of a few seconds.
  • the difference in thermal conductivity of the materials used within the time of the embossing operation produces a temperature difference between the blank embossing area (comparatively low temperature, room temperature) and the hot embossing area (comparatively high temperature, ie, desired embossing temperature) on the front side of the embossing die facing the substrate, while the Temperature on the side facing away from the subject back of the embossing stamp by the heating element arranged there over the entire surface of the motif is substantially constant or area varies only slightly.
  • the heating element arranged on the rear side of the embossing stamp can also be arranged such that it heats the blind embossing area less.
  • the heating element can either be correspondingly shaped and / or a heat-insulating and / or heat-reflecting shield can be provided between the heating element and the rear side of the blind embossing area.
  • Fig. 4 shows a holding frame 14 with an opening 14d for receiving the dummy embossing insert 12.
  • the opening 14d has at its rear portion a conical enlargement 14k.
  • the two-component plastic consists of a resin component and a hardener component, which form a pourable mass after mixing and then react with each other with release of heat and cure by polymerization.
  • the female mold 15 can be made of a plastic, wherein before the molding, the surface of the female mold facing the dummy embossing insert is coated with a release agent that prevents adhesion of the mother mold to the thermosetting two-component plastic.

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Duplication Or Marking (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Claims (12)

  1. Tampon de gaufrage (1) servant à transférer sur un substrat une couche de transfert d'un film de gaufrage à chaud,
    sachant que le tampon de gaufrage (1) présente une plaque de gaufrage (11) constituée d'un premier matériau et qu'une zone de motifs (11m) est prévue dans la plaque de gaufrage (11), caractérisé en ce que le tampon de gaufrage (1) présente au moins un insert de gaufrage aveugle (12) constitué d'un deuxième matériau, sachant que la conductibilité thermique du deuxième matériau est inférieure à la conductibilité thermique du premier matériau.
  2. Tampon de gaufrage selon la revendication 1,
    caractérisé en ce que
    la conductibilité thermique λ du premier matériau à température ambiante est comprise dans la plage allant de 50 à 400 W/(m*K).
  3. Tampon de gaufrage selon la revendication 1 ou 2,
    caractérisé en ce que
    la conductibilité thermique λ du deuxième matériau à température ambiante est comprise dans la plage allant de 0,1 à 5 W/(m*K).
  4. Tampon de gaufrage selon l'une quelconque des revendications précédentes,
    caractérisé en ce que
    la conductibilité thermique du deuxième matériau est inférieure à 1 % de la conductibilité thermique du premier matériau.
  5. Tampon de gaufrage selon l'une quelconque des revendications précédentes,
    caractérisé en ce que
    le premier matériau est un alliage de cuivre, un alliage d'aluminium ou un acier.
  6. Tampon selon l'une quelconque des revendications précédentes,
    caractérisé en ce que
    le deuxième matériau est une matière plastique ou un mélange de matières plastiques.
  7. Tampon de gaufrage selon la revendication 5,
    caractérisé en ce que
    la matière plastique est du type d'une matière plastique à deux composants.
  8. Tampon de gaufrage selon l'une quelconque des revendications précédentes,
    caractérisé en ce que
    la plaque de gaufrage (11) présente au moins un passage (11d), qui est traversé par l'insert de gaufrage aveugle (12) au moins au nombre de un.
  9. Tampon de gaufrage selon la revendication 8,
    caractérisé en ce que
    l'insert de gaufrage aveugle (12) est réalisé de manière interchangeable.
  10. Tampon de gaufrage selon la revendication 8 ou 9,
    caractérisé en ce que
    le passage (11d) présente au niveau du côté arrière de la plaque de gaufrage (11), une extension (11k) conique.
  11. Procédé de gaufrage à chaud servant à transférer sur un substrat une couche de transfert d'un film de gaufrage à chaud à une température de gaufrage et à une pression de gaufrage, sachant que la couche de transfert est disposée sur un film de support et qu'une couche de séparation est disposée entre la couche de transfert et le film de support et/ou qu'une couche de colle est disposée sur la couche de transfert,
    sachant
    qu'un tampon de gaufrage (1) est fourni, lequel présente une plaque de gaufrage (11) constituée d'un premier matériau, dans laquelle est prévue une zone de motifs (11m), et au moins un insert de gaufrage aveugle (12) disposé dans la plaque de gaufrage (11) et constitué d'un deuxième matériau, sachant que la conductibilité thermique du deuxième matériau est inférieure à la conductibilité thermique du premier matériau,
    que le côté arrière du tampon de gaufrage (1) est réchauffé à une température, à laquelle la zone de motifs (11m) présente la température de gaufrage et l'insert de gaufrage aveugle présente une température inférieure à la température de gaufrage, que le film de gaufrage à chaud est disposé entre le tampon de gaufrage (1) et le substrat, et que le tampon de gaufrage réchauffé est pressé sous l'effet d'une pression sur le film de gaufrage à chaud et sur le substrat de sorte que la couche de transfert du film de gaufrage à chaud soit transférée dans la zone de motifs (11m), sur le substrat, et sachant que la couche de transfert du film de gaufrage à chaud est réchauffée dans la zone de l'insert de gaufrage aveugle (12) à une température inférieure à la température de gaufrage et n'est pas transférée sur le substrat.
  12. Procédé de gaufrage à chaud selon la revendication 11,
    caractérisé en ce que
    un film de gaufrage à chaud, dont la température de gaufrage est comprise dans la plage allant de 60 à 190°C, est utilisé.
EP11158305.0A 2010-03-24 2011-03-15 Tampon de gaufrage et procédé de gaufrage à chaud Active EP2380746B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE201010012734 DE102010012734B3 (de) 2010-03-24 2010-03-24 Heißprägeverfahren und Prägestempel

Publications (3)

Publication Number Publication Date
EP2380746A2 EP2380746A2 (fr) 2011-10-26
EP2380746A3 EP2380746A3 (fr) 2012-12-05
EP2380746B1 true EP2380746B1 (fr) 2013-12-11

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DE (1) DE102010012734B3 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012207231A1 (de) * 2012-05-02 2013-11-07 Robert Bosch Gmbh Prägeverfahren und ein mittels des Prägeverfahrens hergestelltes Werkstück
JP7007265B2 (ja) * 2015-06-23 2022-01-24 レオンハード クルツ シュティフトゥング ウント コー． カーゲー スタンピングフォイルの装飾セクションを転写する方法及び装置
CN108944223B (zh) * 2018-08-13 2024-06-14 广东志德胜科技有限公司 一种具有加热功能压花机
CN115257159A (zh) * 2022-08-10 2022-11-01 汤凯甯 一种在至少两种材料的构成物上成型图文的方法及设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2276350B (en) * 1993-03-26 1996-05-08 Falcontec Ltd Rotary blocking die
US5494431A (en) * 1994-05-31 1996-02-27 Telfer; Mark A. Device for emblemizing indicia onto the soles of shoes for identification and individually purposes
DE102004014373B4 (de) * 2004-03-24 2006-09-21 Hinderer + Mühlich Kg Prägestempel zum Heiss- oder Kaltprägen

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Publication number Publication date
DE102010012734B3 (de) 2011-10-06
EP2380746A2 (fr) 2011-10-26
EP2380746A3 (fr) 2012-12-05

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