EP2377633A4 - Silver microparticle powder, method for producing said powder, silver paste using said powder, and method for using said paste - Google Patents

Silver microparticle powder, method for producing said powder, silver paste using said powder, and method for using said paste

Info

Publication number
EP2377633A4
EP2377633A4 EP09834511.9A EP09834511A EP2377633A4 EP 2377633 A4 EP2377633 A4 EP 2377633A4 EP 09834511 A EP09834511 A EP 09834511A EP 2377633 A4 EP2377633 A4 EP 2377633A4
Authority
EP
European Patent Office
Prior art keywords
powder
paste
silver
producing
microparticle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP09834511.9A
Other languages
German (de)
French (fr)
Other versions
EP2377633B1 (en
EP2377633A1 (en
Inventor
Shuji Kaneda
Kimikazu Motomura
Tatsuya Kariyasu
Yutaka Hisaeda
Kosuke Iha
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Electronics Materials Co Ltd
Original Assignee
Dowa Electronics Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Electronics Materials Co Ltd filed Critical Dowa Electronics Materials Co Ltd
Publication of EP2377633A1 publication Critical patent/EP2377633A1/en
Publication of EP2377633A4 publication Critical patent/EP2377633A4/en
Application granted granted Critical
Publication of EP2377633B1 publication Critical patent/EP2377633B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/0545—Dispersions or suspensions of nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIESĀ ; PREPARATION OF CARBON BLACKĀ  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/62—Metallic pigments or fillers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D17/00—Pigment pastes, e.g. for mixing in paints
    • C09D17/004—Pigment pastes, e.g. for mixing in paints containing an inorganic pigment
    • C09D17/006—Metal
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C22C5/08—Alloys based on silver with copper as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/04—Particle morphology depicted by an image obtained by TEM, STEM, STM or AFM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/11—Powder tap density
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/36—Selection of substances as active materials, active masses, active liquids
    • H01M4/38—Selection of substances as active materials, active masses, active liquids of elements or alloys
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
EP09834511.9A 2008-12-26 2009-12-25 Silver microparticle powder, method for producing said powder, silver paste using said powder, and method for using said paste Active EP2377633B1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008335188 2008-12-26
JP2009146921 2009-06-19
JP2009285691A JP5688895B2 (en) 2008-12-26 2009-12-16 Fine silver particle powder and silver paste using the powder
PCT/JP2009/007258 WO2010073705A1 (en) 2008-12-26 2009-12-25 Silver microparticle powder, method for producing said powder, silver paste using said powder, and method for using said paste

Publications (3)

Publication Number Publication Date
EP2377633A1 EP2377633A1 (en) 2011-10-19
EP2377633A4 true EP2377633A4 (en) 2014-03-26
EP2377633B1 EP2377633B1 (en) 2019-07-17

Family

ID=42287338

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09834511.9A Active EP2377633B1 (en) 2008-12-26 2009-12-25 Silver microparticle powder, method for producing said powder, silver paste using said powder, and method for using said paste

Country Status (7)

Country Link
US (2) US9034214B2 (en)
EP (1) EP2377633B1 (en)
JP (1) JP5688895B2 (en)
KR (1) KR101632304B1 (en)
CN (2) CN104801710B (en)
TW (1) TWI526262B (en)
WO (1) WO2010073705A1 (en)

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MD4075C1 (en) * 2009-12-31 2011-07-31 ŠŠ½Š°Ń‚Š¾Š»ŠøŠ¹ Š­Š¤ŠšŠŠ ŠŸŠ˜Š”Š˜Š” Process for obtaining highly dispersed colloidal silver
JP2011202265A (en) * 2010-03-26 2011-10-13 Dowa Electronics Materials Co Ltd Low temperature sinterable metal nanoparticle composition and electronic article formed using the composition
KR101240751B1 (en) * 2010-11-25 2013-03-07 ģ‚¼ģ„±ģ „źø°ģ£¼ģ‹ķšŒģ‚¬ A method of manufacturing fine metal powder and fine metal powder manufactured thereby
JP5741809B2 (en) * 2011-02-22 2015-07-01 äø‰č±ćƒžćƒ†ćƒŖć‚¢ćƒ«ę Ŗ式会ē¤¾ Bonding paste and method for bonding semiconductor element and substrate
US20140318618A1 (en) * 2011-11-21 2014-10-30 Hanwha Chemical Corporation Paste composition for front electrode of solar cell and solar cell using the same
JP5445721B1 (en) * 2012-03-07 2014-03-19 住友金属鉱山ę Ŗ式会ē¤¾ Silver powder and method for producing the same
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US10000651B2 (en) * 2012-07-24 2018-06-19 Dic Corporation Metal nanoparticle composite body, metal colloidal solution, and methods for producing these
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JP6029719B2 (en) * 2014-07-31 2016-11-24 ļ¼¤ļ½ļ½—ļ½ć‚Ø惬ć‚Æ惈惭惋ć‚Æć‚¹ę Ŗ式会ē¤¾ Silver powder, method for producing the same, and conductive paste
JP6029720B2 (en) 2014-07-31 2016-11-24 ļ¼¤ļ½ļ½—ļ½ć‚Ø惬ć‚Æ惈惭惋ć‚Æć‚¹ę Ŗ式会ē¤¾ Silver powder, method for producing the same, and conductive paste
JP6280497B2 (en) * 2014-12-12 2018-02-14 ę Ŗ式会ē¤¾ćƒŽćƒŖć‚æć‚±ć‚«ćƒ³ćƒ‘ćƒ‹ćƒ¼ćƒŖ惟惆惉 Silver paste and its use
CN108430670B (en) * 2015-12-25 2020-04-24 ę Ŗ式会ē¤¾åˆ™ę­¦ Silver powder and paste and use thereof
JP6920029B2 (en) 2016-04-04 2021-08-18 ę—„äŗœåŒ–å­¦å·„ę„­ę Ŗ式会ē¤¾ Metal powder sintered paste and its manufacturing method, conductive material manufacturing method
JP7007140B2 (en) * 2016-09-30 2022-01-24 ļ¼¤ļ½ļ½—ļ½ć‚Ø惬ć‚Æ惈惭惋ć‚Æć‚¹ę Ŗ式会ē¤¾ Joining material and joining method using it
CN106541149B (en) * 2016-12-07 2019-04-19 ꔂꞗē”µå­ē§‘ęŠ€å¤§å­¦ A kind of accurate-size controls the preparation method of extra small nano-Ag particles
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JP6859799B2 (en) * 2017-03-29 2021-04-14 äø‰č±ćƒžćƒ†ćƒŖć‚¢ćƒ«ę Ŗ式会ē¤¾ Paste-like silver powder composition, method for producing a bonded body, and method for producing a silver film
JP7090511B2 (en) * 2017-09-29 2022-06-24 ļ¼¤ļ½ļ½—ļ½ć‚Ø惬ć‚Æ惈惭惋ć‚Æć‚¹ę Ŗ式会ē¤¾ Silver powder and its manufacturing method
JP7164775B2 (en) * 2018-03-02 2022-11-02 ćƒ‡ćƒ„ćƒćƒ³ ć‚Ø惬ć‚Æ惈惭惋ć‚Æć‚¹ ć‚¤ćƒ³ć‚³ćƒ¼ćƒćƒ¬ć‚¤ćƒ†ćƒƒćƒ‰ Conductive paste for bonding
JP7120096B2 (en) * 2018-03-28 2022-08-17 äø‰č±ćƒžćƒ†ćƒŖć‚¢ćƒ«ę Ŗ式会ē¤¾ Silver porous sintered film and method for manufacturing joined body
US10782265B2 (en) * 2018-03-30 2020-09-22 Sharp Kabushiki Kaisha Analysis apparatus
WO2020002890A1 (en) * 2018-06-26 2020-01-02 Alpha Assembly Solutions Inc. Nano copper paste and film for sintered die attach and similar applications
CN113242774B (en) * 2018-12-26 2023-08-11 ę˜­č£åŒ–å­¦å·„äøšę Ŗ式会ē¤¾ Silver paste
CN113226596B (en) * 2018-12-26 2023-08-11 ę˜­č£åŒ–å­¦å·„äøšę Ŗ式会ē¤¾ Silver paste
US20220072607A1 (en) * 2018-12-26 2022-03-10 Shoei Chemical Inc. Silver paste
CN111545763B (en) * 2020-05-26 2022-01-04 ę±Ÿč‹å¤§ę–¹é‡‘å±žē²‰ęœ«ęœ‰é™å…¬åø Preparation method of modified copper-gold powder
CN112371993B (en) * 2020-10-16 2022-12-20 ę¹–å—äø­ä¼Ÿę–°é“¶ęę–™ē§‘ęŠ€ęœ‰é™å…¬åø Preparation method of silver powder
CN112404450B (en) * 2020-11-05 2023-04-07 ęˆéƒ½åø‚天ē”«é‡‘属ē²‰ä½“ęœ‰é™č“£ä»»å…¬åø Chemical synthesis method of high-dispersion high-sphericity porous silver powder
CN117324633B (en) * 2023-09-27 2024-08-13 ę·±åœ³åø‚å“ˆę·±ę™ŗꝐē§‘ęŠ€ęœ‰é™å…¬åø Silver powder and preparation method and application thereof

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JP2011021271A (en) 2011-02-03
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KR101632304B1 (en) 2016-06-21
CN102264494A (en) 2011-11-30
JP5688895B2 (en) 2015-03-25
US20110253949A1 (en) 2011-10-20
EP2377633B1 (en) 2019-07-17
EP2377633A1 (en) 2011-10-19
CN104801710B (en) 2017-05-03
US9721694B2 (en) 2017-08-01
CN102264494B (en) 2015-08-05
CN104801710A (en) 2015-07-29
KR20110110126A (en) 2011-10-06
US9034214B2 (en) 2015-05-19
TWI526262B (en) 2016-03-21

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