EP2376587A4 - Slurry composition containing non-ionic polymer and method for use - Google Patents

Slurry composition containing non-ionic polymer and method for use

Info

Publication number
EP2376587A4
EP2376587A4 EP09837913.4A EP09837913A EP2376587A4 EP 2376587 A4 EP2376587 A4 EP 2376587A4 EP 09837913 A EP09837913 A EP 09837913A EP 2376587 A4 EP2376587 A4 EP 2376587A4
Authority
EP
European Patent Office
Prior art keywords
composition containing
slurry composition
containing non
ionic polymer
ionic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09837913.4A
Other languages
German (de)
French (fr)
Other versions
EP2376587A1 (en
Inventor
Steven Grumbine
Chul-Woo Nam
William Ward
Ramasubramanyam Nagarajan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials Inc
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of EP2376587A1 publication Critical patent/EP2376587A1/en
Publication of EP2376587A4 publication Critical patent/EP2376587A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/08—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with saw-blades of endless cutter-type, e.g. chain saws, i.e. saw chains, strap saws
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M125/00—Lubricating compositions characterised by the additive being an inorganic material
    • C10M125/08—Metal carbides or hydrides
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M173/00—Lubricating compositions containing more than 10% water
    • C10M173/02—Lubricating compositions containing more than 10% water not containing mineral or fatty oils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/06—Metal compounds
    • C10M2201/061—Carbides; Hydrides; Nitrides
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/10—Compounds containing silicon
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/02—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/04—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds containing monomers having an unsaturated radical bound to an alcohol or ester thereof; bound to an aldehyde, ketonic, ether, ketal or acetal radical
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/12—Polysaccharides, e.g. cellulose, biopolymers
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2217/00—Organic macromolecular compounds containing nitrogen as ingredients in lubricant compositions
    • C10M2217/02—Macromolecular compounds obtained from nitrogen containing monomers by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2217/028—Macromolecular compounds obtained from nitrogen containing monomers by reactions only involving carbon-to-carbon unsaturated bonds containing monomers having an unsaturated radical bound to a nitrogen-containing hetero ring
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2040/00—Specified use or application for which the lubricating composition is intended
    • C10N2040/20—Metal working
    • C10N2040/22—Metal working with essential removal of material, e.g. cutting, grinding or drilling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mining & Mineral Resources (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Lubricants (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
EP09837913.4A 2008-12-19 2009-12-17 Slurry composition containing non-ionic polymer and method for use Withdrawn EP2376587A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/317,254 US8157876B2 (en) 2007-07-31 2008-12-19 Slurry composition containing non-ionic polymer and method for use
PCT/US2009/068466 WO2010080495A1 (en) 2008-12-19 2009-12-17 Slurry composition containing non-ionic polymer and method for use

Publications (2)

Publication Number Publication Date
EP2376587A1 EP2376587A1 (en) 2011-10-19
EP2376587A4 true EP2376587A4 (en) 2014-10-29

Family

ID=42316721

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09837913.4A Withdrawn EP2376587A4 (en) 2008-12-19 2009-12-17 Slurry composition containing non-ionic polymer and method for use

Country Status (10)

Country Link
US (1) US8157876B2 (en)
EP (1) EP2376587A4 (en)
JP (1) JP6001858B2 (en)
KR (1) KR20110099744A (en)
CN (1) CN102257092B (en)
IL (1) IL213230A (en)
MY (1) MY150761A (en)
SG (1) SG172276A1 (en)
TW (1) TWI413681B (en)
WO (1) WO2010080495A1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
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FR2947831B1 (en) * 2009-07-09 2012-02-03 Saint Gobain Ct Recherches SUSPENSION OF ABRASIVE GRAINS
GB2473628A (en) * 2009-09-17 2011-03-23 Rec Wafer Norway As Process for cutting a multiplicity of wafers
WO2011044718A1 (en) * 2009-10-16 2011-04-21 Dow Global Technologies Llc Aqueous cutting fluid for use with diamond wiresaw
JP5420498B2 (en) * 2010-08-03 2014-02-19 ユシロ化学工業株式会社 Water-soluble machining fluid for fixed abrasive wire saws
CN102229212A (en) * 2010-08-23 2011-11-02 蒙特集团（香港）有限公司 Wet silicon carbide sand for solar silicon chip wire cutting
CN102242010A (en) * 2010-09-16 2011-11-16 蒙特集团（香港）有限公司 Mortar prepared by nonstandard silicon carbide sand aggregate for cutting solar energy silicon chips
CN102230282B (en) * 2010-12-29 2013-10-09 蒙特集团（香港）有限公司 Production method of solar wafer line cutting wear-resistant steel wires
JP2014000735A (en) * 2012-06-19 2014-01-09 Ohbayashi Corp Method for decomposing structure
JP6039935B2 (en) * 2012-06-29 2016-12-07 出光興産株式会社 Aqueous processing fluid
KR102155205B1 (en) * 2012-08-31 2020-09-11 가부시키가이샤 후지미인코퍼레이티드 Polishing composition and method for producing substrate
CN105189676B (en) 2013-05-15 2021-03-23 巴斯夫欧洲公司 Chemical mechanical polishing composition comprising one or more polymers selected from the group consisting of N-vinyl homopolymers and N-vinyl copolymers
CN104293205A (en) * 2013-07-16 2015-01-21 鸿富锦精密工业（深圳）有限公司 Water-based diamond polishing solution and preparation method thereof
JP2015203080A (en) * 2014-04-15 2015-11-16 株式会社フジミインコーポレーテッド polishing composition
FR3048903B1 (en) * 2016-03-15 2018-04-13 Saint-Gobain Placo METHOD AND DEVICE FOR CUTTING A PLATE OR A PANEL OF POROUS CONSTRUCTION MATERIAL
CN107201266B (en) * 2017-06-14 2020-11-24 合肥工业大学 Biodegradable environment-friendly type wire cutting emulsion and preparation method thereof
TWI632041B (en) * 2017-09-11 2018-08-11 環球晶圓股份有限公司 Ingot slicing method and slicing abrasive kit
CN108084887A (en) * 2017-12-21 2018-05-29 惠州市米特仑科技有限公司 A kind of preparation method of silica polishing fluid
JP6819619B2 (en) * 2018-01-22 2021-01-27 信越半導体株式会社 Work cutting method and wire saw
US10954411B2 (en) 2019-05-16 2021-03-23 Rohm And Haas Electronic Materials Cmp Holdings Chemical mechanical polishing composition and method of polishing silicon nitride over silicon dioxide and simultaneously inhibiting damage to silicon dioxide
US10787592B1 (en) 2019-05-16 2020-09-29 Rohm And Haas Electronic Materials Cmp Holdings, I Chemical mechanical polishing compositions and methods having enhanced defect inhibition and selectively polishing silicon nitride over silicon dioxide in an acid environment

Citations (3)

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JPH10237479A (en) * 1997-02-25 1998-09-08 Neos Co Ltd Cutting fluid for wire saw
JP2000087059A (en) * 1998-09-16 2000-03-28 Hisafuku Yamaguchi Cutting liquid and cutting of work
US20060049143A1 (en) * 2004-09-09 2006-03-09 Fujimi Incorporated Polishing composition and polishing method using the same

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GB2287758B (en) 1994-03-19 1998-06-24 Hydrair Ltd Pumps for shear sensitive material
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US7585340B2 (en) * 2006-04-27 2009-09-08 Cabot Microelectronics Corporation Polishing composition containing polyether amine
ATE510899T1 (en) 2006-08-30 2011-06-15 Saint Gobain Ceramics CONCENTRATED ABRASIVE SLUDGE COMPOSITIONS, METHOD FOR THE PRODUCTION THEREOF AND METHOD FOR THE USE THEREOF
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Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10237479A (en) * 1997-02-25 1998-09-08 Neos Co Ltd Cutting fluid for wire saw
JP2000087059A (en) * 1998-09-16 2000-03-28 Hisafuku Yamaguchi Cutting liquid and cutting of work
US20060049143A1 (en) * 2004-09-09 2006-03-09 Fujimi Incorporated Polishing composition and polishing method using the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2010080495A1 *

Also Published As

Publication number Publication date
US8157876B2 (en) 2012-04-17
TWI413681B (en) 2013-11-01
JP6001858B2 (en) 2016-10-05
JP2012512951A (en) 2012-06-07
KR20110099744A (en) 2011-09-08
CN102257092A (en) 2011-11-23
MY150761A (en) 2014-02-28
SG172276A1 (en) 2011-07-28
CN102257092B (en) 2013-12-18
TW201033341A (en) 2010-09-16
WO2010080495A1 (en) 2010-07-15
EP2376587A1 (en) 2011-10-19
US20090126713A1 (en) 2009-05-21
IL213230A0 (en) 2011-07-31
IL213230A (en) 2015-02-26

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