EP2365552A3 - Boitier d'un dispositif électroluminescent avec une grille de connexion ayant une cavité - Google Patents

Boitier d'un dispositif électroluminescent avec une grille de connexion ayant une cavité Download PDF

Info

Publication number
EP2365552A3
EP2365552A3 EP11157086.7A EP11157086A EP2365552A3 EP 2365552 A3 EP2365552 A3 EP 2365552A3 EP 11157086 A EP11157086 A EP 11157086A EP 2365552 A3 EP2365552 A3 EP 2365552A3
Authority
EP
European Patent Office
Prior art keywords
recess
light emitting
emitting device
wall
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11157086.7A
Other languages
German (de)
English (en)
Other versions
EP2365552A2 (fr
Inventor
Sung Ho Park
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of EP2365552A2 publication Critical patent/EP2365552A2/fr
Publication of EP2365552A3 publication Critical patent/EP2365552A3/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)
EP11157086.7A 2010-03-09 2011-03-04 Boitier d'un dispositif électroluminescent avec une grille de connexion ayant une cavité Withdrawn EP2365552A3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100020834 2010-03-09

Publications (2)

Publication Number Publication Date
EP2365552A2 EP2365552A2 (fr) 2011-09-14
EP2365552A3 true EP2365552A3 (fr) 2015-03-25

Family

ID=44201872

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11157086.7A Withdrawn EP2365552A3 (fr) 2010-03-09 2011-03-04 Boitier d'un dispositif électroluminescent avec une grille de connexion ayant une cavité

Country Status (6)

Country Link
US (2) US8540387B2 (fr)
EP (1) EP2365552A3 (fr)
JP (1) JP2011187963A (fr)
KR (1) KR20110103929A (fr)
CN (1) CN102194981A (fr)
TW (1) TW201214804A (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130045687A (ko) * 2011-10-26 2013-05-06 엘지이노텍 주식회사 발광 장치 및 이를 구비한 조명 장치
CN102522487B (zh) * 2011-12-05 2014-10-15 深圳市华星光电技术有限公司 液晶显示装置及其led封装结构
US8814378B2 (en) 2011-12-05 2014-08-26 Shenzhen China Star Optoelectronics Technology Co., Ltd. LCD device and LED package structure thereof
JP2013222499A (ja) * 2012-04-12 2013-10-28 Sharp Corp 光源基板ユニット
TWI492427B (zh) * 2012-09-19 2015-07-11 一詮精密工業股份有限公司 發光二極體導線架的製造方法
KR20150025231A (ko) * 2013-08-28 2015-03-10 서울반도체 주식회사 광원 모듈 및 그 제조 방법, 및 백라이트 유닛
CN103912857A (zh) * 2014-04-22 2014-07-09 深圳市比速光电科技有限公司 工矿灯相变散热器的组合方法及其组合结构

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1548905A1 (fr) * 2002-09-30 2005-06-29 Sanyo Electric Co., Ltd. Element electroluminescent
EP1998380A2 (fr) * 2007-05-29 2008-12-03 Iwatani International Corporation and Iwatani Electronics Corporation Dispositif électroluminescent semi-conducteur
JP2009009956A (ja) * 2007-06-26 2009-01-15 Panasonic Corp 半導体発光装置用パッケージおよび半導体発光装置
US20090315056A1 (en) * 2008-06-23 2009-12-24 Choong Youl Kim Semiconductor device package

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163419A (ja) * 1997-11-26 1999-06-18 Rohm Co Ltd 発光装置
CN1212676C (zh) * 2001-04-12 2005-07-27 松下电工株式会社 使用led的光源装置及其制造方法
US6531328B1 (en) * 2001-10-11 2003-03-11 Solidlite Corporation Packaging of light-emitting diode
US6835960B2 (en) * 2003-03-03 2004-12-28 Opto Tech Corporation Light emitting diode package structure
KR200353789Y1 (ko) 2004-03-30 2004-06-22 엔 하이테크 주식회사 프레임과 도광판이 일체로 형성된 액정표시장치
KR100593943B1 (ko) * 2005-04-30 2006-06-30 삼성전기주식회사 발광 다이오드 패키지의 제조 방법
KR100634189B1 (ko) 2005-08-31 2006-10-16 루미마이크로 주식회사 박막형 발광 다이오드 패키지 및 그 제조 방법
KR100772433B1 (ko) 2006-08-23 2007-11-01 서울반도체 주식회사 반사면을 구비하는 리드단자를 채택한 발광 다이오드패키지
KR101220038B1 (ko) 2006-09-11 2013-01-18 엘지이노텍 주식회사 발광 장치
KR101367132B1 (ko) * 2006-12-05 2014-02-25 삼성디스플레이 주식회사 광원유닛, 발광 장치 및 이를 구비한 표시 장치
JP5168152B2 (ja) * 2006-12-28 2013-03-21 日亜化学工業株式会社 発光装置
KR20080069010A (ko) * 2007-01-22 2008-07-25 삼성전자주식회사 백라이트 및 이를 포함하는 표시 장치
KR101526567B1 (ko) 2008-05-07 2015-06-10 엘지이노텍 주식회사 발광 다이오드 패키지
US8049236B2 (en) * 2008-09-26 2011-11-01 Bridgelux, Inc. Non-global solder mask LED assembly
KR101491485B1 (ko) * 2008-11-18 2015-02-11 삼성전자주식회사 측면 방출형 발광장치 및 선광원형 발광장치
KR100888236B1 (ko) * 2008-11-18 2009-03-12 서울반도체 주식회사 발광 장치
KR101020992B1 (ko) * 2009-03-02 2011-03-09 엘지이노텍 주식회사 발광 모듈 및 이를 구비한 라이트 유닛
KR101060761B1 (ko) * 2009-04-23 2011-08-31 삼성엘이디 주식회사 발광 다이오드 패키지

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1548905A1 (fr) * 2002-09-30 2005-06-29 Sanyo Electric Co., Ltd. Element electroluminescent
EP1998380A2 (fr) * 2007-05-29 2008-12-03 Iwatani International Corporation and Iwatani Electronics Corporation Dispositif électroluminescent semi-conducteur
JP2009009956A (ja) * 2007-06-26 2009-01-15 Panasonic Corp 半導体発光装置用パッケージおよび半導体発光装置
US20090315056A1 (en) * 2008-06-23 2009-12-24 Choong Youl Kim Semiconductor device package

Also Published As

Publication number Publication date
US8540387B2 (en) 2013-09-24
US8783933B2 (en) 2014-07-22
US20110222312A1 (en) 2011-09-15
EP2365552A2 (fr) 2011-09-14
CN102194981A (zh) 2011-09-21
JP2011187963A (ja) 2011-09-22
US20130343068A1 (en) 2013-12-26
KR20110103929A (ko) 2011-09-21
TW201214804A (en) 2012-04-01

Similar Documents

Publication Publication Date Title
EP2365552A3 (fr) Boitier d'un dispositif électroluminescent avec une grille de connexion ayant une cavité
USD691255S1 (en) Dispenser housing
USD753912S1 (en) Apparatus for reducing theft and loss of small electronic devices
USD659775S1 (en) Pulley device for exercise
USD629889S1 (en) Inhaler
USD629504S1 (en) Inhaler
USD616555S1 (en) Orthopedic device
USD598308S1 (en) Spirit level device
USD619190S1 (en) Sight
EP2696379A3 (fr) Dispositif électroluminescent
USD723031S1 (en) Electronic device and swipe card combination
USD666266S1 (en) Trampoline frame
USD617904S1 (en) Lancet device
USD718258S1 (en) LED package
EP2416388A3 (fr) Dispositif électroluminescent et unité d'affichage d'image
USD623899S1 (en) Glass
USD600202S1 (en) Battery
USD638465S1 (en) Point of sale terminal
USD583812S1 (en) Handheld electronic speaking dictionary
USD627487S1 (en) Ladder top cap
EP2560205A3 (fr) Module électroluminescent
EP2709178A3 (fr) Dispositif électroluminescent
EP2682987A3 (fr) Emballage de dispositif électroluminescent
CA128526S (en) Bottle cap
WO2009106953A8 (fr) Courroie transporteuse avec moyen de guidage pour itinéraires curvilignes et modules associés

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20110304

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: LG INNOTEK CO., LTD.

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 33/60 20100101ALN20150218BHEP

Ipc: H01L 33/62 20100101ALN20150218BHEP

Ipc: H01L 33/64 20100101AFI20150218BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20150926