EP2363882A1 - Dispositif de dissipateur de chaleur pour fournir un débit d'air froid - Google Patents

Dispositif de dissipateur de chaleur pour fournir un débit d'air froid Download PDF

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Publication number
EP2363882A1
EP2363882A1 EP20100155052 EP10155052A EP2363882A1 EP 2363882 A1 EP2363882 A1 EP 2363882A1 EP 20100155052 EP20100155052 EP 20100155052 EP 10155052 A EP10155052 A EP 10155052A EP 2363882 A1 EP2363882 A1 EP 2363882A1
Authority
EP
European Patent Office
Prior art keywords
cold
heat
fan
end surface
hot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20100155052
Other languages
German (de)
English (en)
Inventor
Kuo-Len Lin
LIN Chen-Hsiang LIN
Ken Hsu
Chih-Hung Cheng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CpuMate Inc
Golden Sun News Techniques Co Ltd
Original Assignee
CpuMate Inc
Golden Sun News Techniques Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CpuMate Inc, Golden Sun News Techniques Co Ltd filed Critical CpuMate Inc
Priority to EP20100155052 priority Critical patent/EP2363882A1/fr
Publication of EP2363882A1 publication Critical patent/EP2363882A1/fr
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/001—Particular heat conductive materials, e.g. superconductive elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat-dissipating device, and in particular to a heat-dissipating device for supplying cold airflow.
  • a computer host In general, the interior of a computer host is equipped with various electronic elements or devices (such as a central processing unit, a power supply, a hard disk driver or the like) that generate a great amount of heat in operation. Further, a sealed casing is mounted outside the computer host to protect the computer host but unfortunately affect the heat dissipation of the computer host, which causes the accumulation of heat in the computer host together with an elevated temperature. A common solution is to install a heat-dissipating device on the computer host to reduce the inside temperature, thereby protecting the electronic elements and devices in the computer host from suffering damage to affect their normal operation.
  • various electronic elements or devices such as a central processing unit, a power supply, a hard disk driver or the like
  • a conventional heat-dissipating solution is to install a heat-dissipating fan on a rear surface of the computer host. External air is introduced into the computer host by the heat-dissipating fan to reduce the temperature in the computer host.
  • the temperature of external air is usually in the range of 25 to 35°C.
  • the above heat-dissipating fan merely blows warm air into the computer host rather than cold air. Therefore, the heat-dissipating effect of the heat-dissipating fan is limited.
  • thermoelectric cooling chips With the development of thermoelectric cooling chips, many manufacturers propose a novel heat-dissipating device for the computer host, in which a thermoelectric cooling chip is combined with a fan. After the thermoelectric cooling chip is supplied with electricity, one surface of the thermoelectric cooling chip is heated up and this surface is referred to as a "hot-end surface”. The other surface of the thermoelectric cooling chip is cooled down and this surface is referred to as a "cold-end surface".
  • the temperature of the external air will be reduced to form a cold airflow. Then, the cold airflow is introduced into the computer host to lower the temperature of the electronic elements therein.
  • thermoelectric cooling chip In practice, after the thermoelectric cooling chip is supplied with electricity, the temperature of the cold-end surface will be lower than 0°C, thereby generating a strong cooling effect. However, if the external air does not exchange heat with the thermoelectric cooling chip to form a cold airflow, frost will be generated on the cold-end surface. As a result, when a user turns off the computer host or de-energizes the thermoelectric cooling chip, the frost on the cold-end surface will be melted to become condensed droplets, which will rust the electronic elements in the computer host and even generate a short circuit.
  • the conventional heat-dissipating device utilizing the thermoelectric cooling chip still has problems as follows.
  • Some manufacturers utilize a finned cooler to be brought into contact with the cold-end surface, thereby increasing the contact area between the external air and the cold-end surface.
  • the actual contact area between the finned cooler and the cold-end surface still remains the area of the cold-end surface.
  • frost will still be generated around the contacting portion between the cold-end surface and the finned cooler. As a result, the frost will be melted to form condensed droplets, and the problems of rust and short circuit still exist.
  • the contact area between the fined cooler and the cold-end surface is limited, the heat-exchanging distance between the external air and the finned cooler is also restricted.
  • the external air cannot be heat-exchanged sufficiently with the cold-end surface, and thus the cold generated by the cold-end surface cannot be distributed uniformly in the external air.
  • the air close to the cold-end surface is cooler but the air away from the cold-end surface is warmer.
  • Such a temperature gradient becomes larger especially when the travelling distance of the cold airflow is longer in the heat-dissipating device.
  • the present Inventor proposes a novel and reasonable structure based on his expert experience and deliberate researches.
  • the present invention is to provide a heat-dissipating device for supplying cold airflow, in which the cold generated by the cold-end surface of the thermoelectric cooling chip can be conducted to other places rapidly and uniformly.
  • the present invention is to provide a heat-dissipating device for supplying cold airflow, which is capable of generating a cold airflow with a consistent temperature.
  • the present invention is to provide a heat-dissipating device for supplying cold airflow, which includes a casing provided with a first air inlet, a second air inlet, a cold air outlet, and a hot air outlet in communication with its interior; a thermal insulation plate disposed in the casing for dividing the interior of the casing into a hot air zone and a cold air zone separated completely from the hot air zone, the first air inlet and the cold air outlet being in communication with the cold air zone, the second air inlet and the hot air outlet being in communication with the hot air zone, the thermal insulation plate having a through-hole; a thermoelectric cooling chip having a cold-end surface and a hot-end surface opposite to the cold-end surface, the thermoelectric cooling chip being disposed in the through-hole with the hot-end surface facing the hot air zone; a heat-dissipating body disposed in the hot air zone to abut against the hot-end surface; a cold-airflow supplying module disposed in the cold air zone to a
  • the present invention is to provide a heat-dissipating device for supplying cold airflow, which includes a casing provided with a first air inlet, a hot air outlet, and a cold air outlet in communication with its interior; a thermal insulation plate disposed in the casing for dividing the interior of the casing into a hot air zone and a cold air zone partially communicated with the hot air zone, the first air inlet and the cold air outlet being in communication with the cold air zone, the hot air outlet being in communication with the hot air zone, the thermal insulation plate having a through-hole; a thermoelectric cooling chip having a cold-end surface and a hot-end surface opposite to the cold-end surface, the thermoelectric cooling chip being disposed in the through-hole with the hot-end surface facing the hot air zone; a heat-dissipating body disposed in the hot air zone to abut against the hot-end surface; a cold-airflow supplying module disposed in the cold air zone to abut against the cold-end surface, the cold-air
  • the present invention has advantageous features as follows.
  • the present invention is provided with a cold-airflow supplying module contacting the cold-end surface of the thermoelectric cooling chip, and the cold-airflow supplying module comprises a plurality of super heat pipes, a cooler contacting the super heat pipes, and a first fan, the cold generated by the cold-end surface can be rapidly and uniformly conducted to the cooler by means of the super heat pipes.
  • the combination of the super heat pipes and the cooler significantly increases the contact area and heat-exchanging distance with the cold-end surface.
  • the external air introduced in the heat-dissipating device from the first air inlet can be heat-exchanged with the cooler in the cold air zone sufficiently and uniformly.
  • frost and condensed droplets will not be generated on the cold-end surface.
  • the external air introduced in the heat-dissipating device from the first air inlet can be heat-exchanged with the cooler in the cold air zone sufficiently and uniformly, the temperature of the cold air in the cold air zone is so consistent that the airflow finally flowing into a computer host is cold enough.
  • FIG. 1 is an exploded perspective view according to a first embodiment of the present invention
  • FIG. 3 is an assembled perspective view according to the first embodiment of the present invention.
  • the present invention provides a heat-dissipating device 1 for supplying cold airflow, which includes a casing 10, a thermal insulation plate 20, a thermoelectric cooling chip 30, a heat-dissipating body 40, and a cold-airflow supplying module 50.
  • the casing 10 is a rectangularly cuboidal casing constituted of an upper shell 11 and a lower shell 12.
  • the upper shell 11 is formed into an inverted U shape, while the lower shell 12 is formed into a U shape correspondingly.
  • the upper shell 11 and the lower shell 12 are assembled with each other by screws (not shown).
  • the top surface of the upper shell 11 is provided with a first air inlet 111 and a second air inlet 112.
  • the bottom surface of the lower shell 12 is provided with a cold air outlet 121.
  • a hot air outlet 122 FIG. 3
  • the casing 10 may be an integral casing as long as the surfaces of the casing 10 are provided with the first air inlet 111, the second air inlet 112, the cold air outlet 121 and the hot air outlet 122.
  • the thermal insulation plate 20 is formed into an L shape and has a short portion 21 and a long portion 22 connected to the short portion 21.
  • the thermal insulation plate 20 is disposed in the right-handed portion of the casing 10 to divide the interior of the casing 10 into a hot air zone ZH located in the upper-right corner and a cold air zone ZC completely separated from the hot air zone ZH. It can be seen clearly from FIG. 4 that the first air inlet 111 and the cold air outlet 121 are in communication with the cold air zone ZC, while the second air inlet 112 and the hot air outlet 122 are in communication with the hot air zone ZH.
  • the long portion 22 of the thermal insulation plate 20 is provided with a through-hole 221 ( FIG. 2 ) in which the thermoelectric cooling chip 30 is disposed.
  • thermoelectric cooling chip 30 is also referred to as a thermoelectric cooling module or thermoelectric power generating module, in which a N-type semiconductor and a P-type semiconductor are connected to form an electric dipole for generating power after being supplied with a DC current.
  • a thermoelectric cooling module or thermoelectric power generating module, in which a N-type semiconductor and a P-type semiconductor are connected to form an electric dipole for generating power after being supplied with a DC current.
  • the heat around the P-type semiconductor will be absorbed to reduce its temperature.
  • the surface close to the P-type semiconductor is called a cold-end surface.
  • the other surface opposite to the cold-end surface will be heated up, so that this surface is called a hot-end surface.
  • the amount of heat absorbed or released depends on the value of the electric current. Since the thermoelectric cooling chip is well-known, the description thereof is omitted herein for clarity.
  • the form of the thermoelectric cooling chip is not limited to a specific one in the present invention.
  • the thermoelectric cooling chip 30 has a cold-end surface 31 and a hot-end surface 32 opposite to the cold-end surface 31.
  • the thermoelectric cooling chip 30 is disposed in the through-hole 221 of the thermal insulation plate 20 with the hot-end surface 32 facing the hot air zone ZH.
  • the cold-end surface 31 faces downwards while the hot-end surface 32 faces upwards.
  • the heat-dissipating body 40 is provided in the hot air zone 20 and disposed on the long portion 22 of the thermal insulation plate 20 to abut against the hot-end surface 32 of the thermoelectric cooling chip 30.
  • the heat-dissipating body 40 is constituted of aluminum-extruded heat-dissipating fins for conducting and dissipating the heat of the hot-end surface 32.
  • the cold-airflow supplying module 50 comprises a metallic cold-conducting plate 51, a plurality of super heat pipes 52, a cooler 53, and a first fan 54.
  • the upper surface of the metallic cold-conducting plate 51 is a flat surface for contacting the cold-end surface 31 of the thermoelectric cooling chip 30, thereby rapidly conducting the cold generated by the cold-end surface 31 to other places.
  • the lower surface of the metallic cold-conducting plate 51 is formed with a plurality of curved grooves 511 for allowing the super heat pipes 52 to be disposed therein and increasing the contact area with the super heat pipes 52.
  • the metallic cold-conducting plate 51 is disposed between the cold-end surface 31 and the super heat pipes 52.
  • Each of the super heat pipes 52 is an elongated pipe and has an excellent thermo-conductivity.
  • the cooler 53 is disposed in the cold air zone ZC to contact the super heat pipes 52.
  • the cooler 53 is constituted of an upper cooling portion 531 and a lower cooling portion 532.
  • the upper cooling portion 531 is adjacent to the first air inlet 111
  • the lower cooling portion 532 is adjacent to the cold air outlet 121.
  • the super heat pipe 52 are connected between the upper cooling portion 531 and the lower cooling portion 532, so that the cold generated by the cold-end surface 31 can be conducted rapidly to the cooler 53 along the length of the super heat pipes 52 and a direction perpendicular to the super heat pipes 52.
  • the airflow in the cold air zone ZC can be heat-exchanged uniformly with the upper cooling portion 531 and the lower cooling portion 532, thereby generating a cold airflow with a consistent temperature.
  • the cooler 53 is not limited to be constituted of the upper cooling portion 531 and the lower cooling portion 532.
  • the cooler 53 may be constituted of integral aluminum-extruded fins as long as it extends into the cold air zone ZC as far as possible to contact the super heat pipes 52 and uniformly conducts the cold of the super heat pipes 52 to the cold air zone ZC.
  • the first fan 54 is fixed to the cold air outlet 121 of the lower casing 12 for guiding external air to enter the cold air zone ZC via the first air inlet 111 and be ejected from the cold air outlet 121.
  • the external air After the external air enters the casing 10 via the first air inlet 111, the external air contacts the upper cooling portion 531 of the cooler 53 first to be cooled.
  • the airflow is then guided by the inner wall of the casing 10 to flow to the lower cooling portion 532. Since the upper cooling portion 531 and the lower cooling portion 532 contact the super heat pipes 52 directly with the same temperature, the cold airflow in the whole cold air zone ZC can be kept at a specific temperature.
  • the cold airflow in the cold air zone ZC can be ejected from the cold air outlet 121 and enter a desired computer host (not shown) by means of the suction force generated when the first fan 54 is rotating.
  • the present invention further includes a second fan 60 fixed to the second air inlet 112 of the upper casing 11 for guiding external air to enter the hot air zone ZH via the second air inlet 112, thereby heat-exchanging with the heat-dissipating body 40 to form a hot airflow.
  • a second fan 60 fixed to the second air inlet 112 of the upper casing 11 for guiding external air to enter the hot air zone ZH via the second air inlet 112, thereby heat-exchanging with the heat-dissipating body 40 to form a hot airflow.
  • the heat generated by the hot-end surface 32 of the heat-dissipating body 40 can be dissipated via the hot air outlet 122.
  • the purpose of the hot air zone ZH is to dissipate the heat of the hot-end surface 32 to the outside of the casing 10, thereby maintaining the normal operation of the thermoelectric cooling chip 30.
  • the thermal insulation plate 30 separates the hot air zone ZH from the cold air zone ZC completely, so that the hot airflow in the hot air zone ZH cannot flow into the cold air zone ZC (and vice versa).
  • the hot airflow can be only exhausted to the outside via the hot air outlet 122.
  • a third fan 70 can be further provided in the first air inlet 111.
  • the third fan 70 is fixed to the upper shell 11.
  • a fourth fan 80 may be provided in the cold air zone ZC in a flowing path between the first air inlet 111 and the first fan 54, thereby the cold airflow passing through the upper cooling portion 531 can be guided rapidly to flow to the lower cooling portion 532 without staying in the cold air zone ZC.
  • both sides of the fourth fan 80 are fixed to the cooler 53 by means of a bracket 81 ( FIG.1 ) respectively, so that the fourth fan 81 can be fixedly disposed in the cold air zone ZC.
  • FIG. 6 showing the second embodiment of the present invention.
  • the difference between the second embodiment and the first embodiment lies in that the fourth fan 80 is omitted.
  • the second embodiment is applied in such a case that the inner space of the casing 10 is too small to be mounted by the fourth fan 80 therein.
  • the inner space of the casing 10 is smaller, it is not necessary to provide the fourth fan 80 because the cold airflow does not stay in the cold air zone ZC easily.
  • FIG. 7 showing the third embodiment of the present invention.
  • the difference between the third embodiment and the first embodiment lies in that the third fan 70 is not provided in the first air inlet 111.
  • the external air is guided compulsively by the fourth fan 80 to enter the first air inlet 111.
  • FIGs. 8 to 10 showing the fourth embodiment of the present invention.
  • the difference between the fourth embodiment and the first embodiment lies in that the thermal insulation plate 10 and the thermoelectric cooling chip 30 are positioned in an inverted manner.
  • the casing 10 is constituted of an upper shell 11 and a lower shell 12.
  • the upper shell 11 is formed into an inverted U shape.
  • the upper surface of the upper shell 11 is provided with a first air inlet 111', and the lower edge of a side surface thereof is provided with a second air inlet 112'.
  • the lower shell 12 is formed into a U shape correspondingly.
  • the lower surface of the lower shell 12 is provided with a cold air outlet 121'.
  • the upper shell 11 and the lower shell 12 are assembled with each other by screws (not shown).
  • a hot air outlet 122' ( FIG. 9 ) is formed between the upper shell 11 and the lower shell 12 when they are assembled with each other.
  • FIG. 8 is illustrative only, and the casing 10 may be an integral casing as long as the surfaces of the casing 10 are provided with the first air inlet 111', the second air inlet 112', and the hot air outlet 122'.
  • the thermal insulation plate 20 is formed into an L shape and has a short portion 21 and a long portion 22 connected to the short portion 21.
  • the thermal insulation plate 20 is disposed in the right-handed portion of the casing 10 to divide the interior of the casing 10 into a hot air zone ZH located in the lower-right corner and a cold air zone ZC partially communicated with the hot air zone ZH. It can be seen clearly from FIG. 10 that the first air inlet 111' and the cold air outlet 121' are in communication with the cold air zone ZC, while the second air inlet 112' and the hot air outlet 122' are in communication with the hot air zone ZH.
  • the long portion 22 of the thermal insulation plate 20 is provided with a through-hole 221 ( FIG. 2 ) in which a thermoelectric cooling chip 30 is disposed.
  • thermoelectric cooling chip 30 has a cold-end surface 31 and a hot-end surface 32 opposite to the cold-end surface 31.
  • the thermoelectric cooling chip 30 is disposed in the through-hole 221 of the thermal insulation plate 20 with the hot-end surface 32 facing the hot air zone ZH.
  • the cold-end surface 31 faces upwards while the hot-end surface 32 faces downwards.
  • the heat-dissipating body 40 is provided in the hot air zone ZH and disposed below the long portion 22 of the thermal insulation plate 20 to abut against the hot-end surface 32 of the thermoelectric cooling chip 30.
  • the heat-dissipating body 40 is constituted of aluminum-extruded heat-dissipating fins for conducting and dissipating the heat of the hot-end surface 32.
  • the cold-airflow supplying module 50 comprises a metallic cold-conducting plate 51, a plurality of super heat pipes 52, a cooler 53, and a first fan 54.
  • the lower surface of the metallic cold-conducting plate 51 is a flat surface for contacting the cold-end surface 31 of the thermoelectric cooling chip 30, thereby rapidly conducting the cold generated by the cold-end surface 31 to other places.
  • the upper surface of the metallic cold-conducting plate 51 is formed with a plurality of curved grooves (not shown) for allowing the super heat pipes 52 to be disposed therein and increasing the contact area with the super heat pipes 52.
  • the metallic cold-conducting plate 51 is disposed between the cold-end surface 31 and the super heat pipes 52.
  • Each of the super heat pipes 52 is an elongated pipe and has an excellent thermal or cold conductivity.
  • the cooler 53 is disposed in the cold air zone ZC to contact the super heat pipes 52.
  • the cooler 53 is constituted of an upper cooling portion 531 and a lower cooling portion 532, both of which are constituted of aluminum-extruded fins.
  • the upper cooling portion 531 is adjacent to the first air inlet 111'
  • the lower cooling portion 532 is adjacent to the cold air outlet 121'.
  • the super heat pipe 52 are connected between the upper cooling portion 531 and the lower cooling portion 532, so that the cold generated by the cold-end surface 31 can be conducted rapidly to the cooler 53 along the length of the super heat pipes 52 and a direction perpendicular to the super heat pipes 52.
  • the airflow in the cold air zone ZC can be heat-exchanged uniformly with the upper cooling portion 531 and the lower cooling portion 532, thereby generating a cold airflow with a consistent temperature.
  • the cooler 53 is not limited to be constituted of the upper cooling portion 531 and the lower cooling portion 532.
  • the cooler 53 may be constituted of integral aluminum-extruded fins as long as it extends into the cold air zone ZC as far as possible to contact the super heat pipes 52 and uniformly conducts the cold of the super heat pipes 52 to the cold air zone ZC.
  • the first fan 54 is fixed to the cold air outlet 121' of the lower casing 12 for guiding external air to enter the cold air zone ZC via the first air inlet 111' and be ejected from the cold air outlet 121'.
  • the external air After the external air enters the casing 10 via the first air inlet 111', the external air contacts the upper cooling portion 531 of the cooler 53 first to reduce its temperature.
  • the airflow is then guided by the inner wall of the casing 10 to flow to the lower cooling portion 532. Since the upper cooling portion 531 and the lower cooling portion 532 contact the super heat pipes 52 directly with the same temperature, the cold airflow in the whole cold air zone ZC can be kept in a consistent temperature.
  • the cold airflow in the cold air zone ZC can be ejected from the cold air outlet 121' and enter a desired computer host (not shown) by means of the suction force generated when the first fan 54 is rotating.
  • the present invention further includes a second fan 60 fixed in the hot air zone ZH for guiding a portion of the cold airflow to enter the hot air zone ZH, thereby heat-exchanging with the heat-dissipating body 40 to form a hot airflow.
  • a second fan 60 fixed in the hot air zone ZH for guiding a portion of the cold airflow to enter the hot air zone ZH, thereby heat-exchanging with the heat-dissipating body 40 to form a hot airflow.
  • the purpose of the hot air zone ZH is to dissipate the heat of the hot-end surface 32 to the outside of the casing 10, thereby maintaining the normal operation of the thermoelectric cooling chip 30.
  • the hot air zone ZH is partially communicated with the cold air zone ZC, a portion of the cold airflow in the cold air zone ZC can flow into the hot air zone ZH by bypassing the thermal insulation plate 20.
  • a third fan 70 is further provided in the first air inlet 111'.
  • the third fan 70 is fixed to the upper shell 11.
  • a fourth fan 80 may be provided in the cold air zone ZC in a flowing path between the first air inlet 111' and the first fan 54, whereby the cold airflow passing through the upper cooling portion 531 can be guided rapidly to flow to the lower cooling portion 532 without staying in the cold air zone ZC.
  • both sides of the fourth fan 80 are fixed to the cooler 53 by means of a bracket 81 ( FIG.8 ) respectively, so that the fourth fan 81 can be fixedly disposed in the cold air zone ZC.
  • the thermal insulation plate 20 does not separate the cold air zone ZC from the hot air zone ZH completely, a portion of the cold airflow in the cold air zone ZC can be guided to enter the hot air zone ZH by means of the first fan 54.
  • the second air inlet 112' is not provided for introducing external air into the casing 10, only using a portion of the cold airflow in the cold air zone ZC is sufficient for the heat dissipation of the heat-dissipating body 40.
  • the present invention has advantageous features as follows.
  • the present invention is provided with a cold-airflow supplying module 50 contacting the cold-end surface 31 of the thermoelectric cooling chip 30, and the cold-airflow supplying module 50 comprises a plurality of super heat pipes 52, a cooler 53 contacting the super heat pipes 52 and a first fan 54, the cold generated by the cold-end surface 31 can be rapidly and uniformly conducted to the cooler 53 by means of the super heat pipes 52.
  • the combination of the super heat pipes 52 and the cooler 53 significantly increases the contact area and heat-exchanging distance with the cold-end surface 31.
  • the external air introduced in the heat-dissipating device 1 from the first air inlet 111 can be heat-exchanged with the cooler 53 in the cold air zone ZC sufficiently and uniformly.
  • frost and condensed droplets will not be generated on the cold-end surface 31.
  • the external air introduced in the heat-dissipating device 1 from the first air inlet 111 can be heat-exchanged with the cooler 53 in the cold air zone ZC sufficiently and uniformly, the temperature of the cold air in the cold air zone ZC is so consistent that the airflow finally flowing into a computer host is cold enough.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP20100155052 2010-03-01 2010-03-01 Dispositif de dissipateur de chaleur pour fournir un débit d'air froid Withdrawn EP2363882A1 (fr)

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EP20100155052 EP2363882A1 (fr) 2010-03-01 2010-03-01 Dispositif de dissipateur de chaleur pour fournir un débit d'air froid

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3262909B1 (fr) * 2015-02-27 2020-09-30 Laird Thermal Systems, Inc. Dissipateurs thermiques comprenant des caloducs et procédés connexes
CN116997168A (zh) * 2023-09-27 2023-11-03 苏州钧灏电力有限公司 一种变流器通风结构及其工作方法

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EP0127711A1 (fr) * 1981-12-28 1984-12-12 Jack Fairchild Moorehead Séchoir d'air et procédé pour déshumidifier l'air
WO2001069694A1 (fr) * 2000-03-12 2001-09-20 Active Cool Ltd. Systeme de refroidissement pour boitier d'elements thermosensibles et procede
US20040207983A1 (en) * 2003-04-18 2004-10-21 Cheng-Yi Lu Heat dissipation module with twin centrifugal fans
WO2005031992A1 (fr) * 2003-10-01 2005-04-07 Utstarcom Korea Limited Unite compacte d'echange thermique de mode de refroidissement thermoelectrique utilisant un caloduc
DE102006021829A1 (de) * 2006-05-10 2007-11-15 Macs Technology Inc., Lu-Chu Wärmestrahler mit einem thermoelektrischen Kühler und mit mehreren Wärmestrahlmodulen sowie deren Anwendungsmethode
US20080113603A1 (en) * 2006-10-19 2008-05-15 Atallah Jean G Computer system cooling system
US20080232063A1 (en) * 2007-03-21 2008-09-25 Samsung Electronics Co., Ltd. Computer
WO2009036542A2 (fr) * 2007-09-18 2009-03-26 Whirlpool S.A. Station d'accueil d'ordinateur

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0127711A1 (fr) * 1981-12-28 1984-12-12 Jack Fairchild Moorehead Séchoir d'air et procédé pour déshumidifier l'air
WO2001069694A1 (fr) * 2000-03-12 2001-09-20 Active Cool Ltd. Systeme de refroidissement pour boitier d'elements thermosensibles et procede
US20040207983A1 (en) * 2003-04-18 2004-10-21 Cheng-Yi Lu Heat dissipation module with twin centrifugal fans
WO2005031992A1 (fr) * 2003-10-01 2005-04-07 Utstarcom Korea Limited Unite compacte d'echange thermique de mode de refroidissement thermoelectrique utilisant un caloduc
DE102006021829A1 (de) * 2006-05-10 2007-11-15 Macs Technology Inc., Lu-Chu Wärmestrahler mit einem thermoelektrischen Kühler und mit mehreren Wärmestrahlmodulen sowie deren Anwendungsmethode
US20080113603A1 (en) * 2006-10-19 2008-05-15 Atallah Jean G Computer system cooling system
US20080232063A1 (en) * 2007-03-21 2008-09-25 Samsung Electronics Co., Ltd. Computer
WO2009036542A2 (fr) * 2007-09-18 2009-03-26 Whirlpool S.A. Station d'accueil d'ordinateur

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3262909B1 (fr) * 2015-02-27 2020-09-30 Laird Thermal Systems, Inc. Dissipateurs thermiques comprenant des caloducs et procédés connexes
CN116997168A (zh) * 2023-09-27 2023-11-03 苏州钧灏电力有限公司 一种变流器通风结构及其工作方法
CN116997168B (zh) * 2023-09-27 2023-12-29 苏州钧灏电力有限公司 一种变流器通风结构及其工作方法

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