EP2360418A2 - Lichtemittierende Vorrichtung und Beleuchtungsvorrichtung - Google Patents

Lichtemittierende Vorrichtung und Beleuchtungsvorrichtung Download PDF

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Publication number
EP2360418A2
EP2360418A2 EP11154161A EP11154161A EP2360418A2 EP 2360418 A2 EP2360418 A2 EP 2360418A2 EP 11154161 A EP11154161 A EP 11154161A EP 11154161 A EP11154161 A EP 11154161A EP 2360418 A2 EP2360418 A2 EP 2360418A2
Authority
EP
European Patent Office
Prior art keywords
light
substrate
emitting
emitting device
sealing member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11154161A
Other languages
English (en)
French (fr)
Other versions
EP2360418A3 (de
Inventor
Soichi Shibusawa
Kozo Ogawa
Kiyoshi Nishimura
Nobuhiko Betsuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Lighting and Technology Corp
Original Assignee
Toshiba Lighting and Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2010029544A external-priority patent/JP2011166036A/ja
Priority claimed from JP2011016408A external-priority patent/JP2012156440A/ja
Application filed by Toshiba Lighting and Technology Corp filed Critical Toshiba Lighting and Technology Corp
Publication of EP2360418A2 publication Critical patent/EP2360418A2/de
Publication of EP2360418A3 publication Critical patent/EP2360418A3/de
Withdrawn legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/24—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/28—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
    • F21V3/0625—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics the material diffusing light, e.g. translucent plastics
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Definitions

  • Embodiments described herein relate generally to a light-emitting device and illumination device using a light-emitting element such as a light-emitting diode (LED) or the like.
  • a light-emitting element such as a light-emitting diode (LED) or the like.
  • illumination devices using a plurality of light-emitting diodes as a light source have been put into practical use.
  • the illumination devices of this type are used as, for example, so-called surface-mounted general lighting which is directly mounted on the indoor ceiling.
  • a light-emitting diode is mounted on a substrate, and is sealed with a sealing member.
  • a sealing member for example, a material obtained by mixing a fluorescent substance into a transparent silicon resin or the like is used.
  • a plurality of light-emitting diodes are arranged and mounted on a surface of a substrate in a matrix-form, and the entire surface of the substrate is sealed with a sealing member.
  • the sealing member as described above, the amount of the used sealing member becomes large, and material cost becomes high correspondingly.
  • a method of arranging and mounting a plurality of light-emitting diodes on a surface of a substrate in a plurality of lines, and sealing the light-emitting diodes of each line with a long and thin sealing member is conceivable.
  • this method it is possible to reduce the amount of the sealing member, and suppress the manufacturing cost of the illumination device correspondingly.
  • a light-emitting device 1 comprises a substrate 2 on which a plurality of light-emitting elements 3 are arranged and mounted in two lines; and sealing members 4a and 4b of two lines each sealing the plurality of light-emitting elements of each line.
  • a distance B between the lines of the sealing members is 0.5 to 2 times a width A of the sealing member of each line.
  • FIGS. 1 to 6 show a light-emitting device 1
  • FIG. 7 shows an illumination device 100 using this light-emitting device 1. It should be noted that in each drawing, the same parts are denoted by the same reference symbols, and a duplicate description is omitted.
  • the light-emitting device 1 serving as an illumination light source comprises a substrate 2, a plurality of light-emitting elements 3, and a pair of sealing members 4a and 4b.
  • the substrate 2 is formed of a synthetic resin material such as a glass epoxy resin.
  • the substrate 2 is formed into a long and thin shape having a pair of long sides 2a and 2b, and a pair of short sides 2c and 2d.
  • the substrate 2 has a first surface 5a, second surface 5b positioned on the opposite side of the first surface 5a, and outer peripheral surface 5c connecting the first surface 5a and second surface 5b to each other. Both the first and second surfaces 5a and 5b are flat surfaces.
  • a length of the substrate 2 along the long side 2a or 2b is 230 mm, and width thereof along the short side 2c or 2d is 35 mm. Furthermore, it is desirable that a thickness of the substrate 2 be 0.5 mm to 1.8 mm. In this embodiment, a substrate 2 having a thickness dimension of 1.0 mm is used.
  • the shape of the substrate 2 is not limited to the rectangular shape, and may be a square or circular shape. Further, as the material for the substrate 2, ceramics material or other synthetic resin materials can be used. Furthermore, in order to enhance the heat radiation performance of each light-emitting element 3, a metallic substrate in which an insulating layer is formed on one surface of a base plate made of aluminum or the like, having high thermal conductivity, and excellent in heat radiation may be used as the substrate 2.
  • a plurality of piercing parts 6 are formed at end edges defining the long sides 2a and 2b of the substrate 2.
  • the piercing parts 6 are arcuate cutout parts opened to the outer peripheral surface 5c of the substrate 2, and pierce through the substrate 2 in a thickness direction. Furthermore, the piercing parts 6 are arranged at intervals in the longitudinal direction of the substrate 2.
  • a plurality of screws 8 are inserted through the respective piercing parts 6.
  • the screws 8 are an example of fixing parts configured to fix the substrate 2 to a base of the illumination device, and are screwed into the base through the piercing parts 6.
  • the end edge of the substrate 2 is held between head parts of the screws 8 and the base.
  • the substrate 2 is fixed to the base.
  • a first conductor pattern 10 and second conductor pattern 11 are formed on the first surface 5a of the substrate 2.
  • the first conductor pattern 10 includes, for example, nine pads 12, a positive power supply conductor 13, negative power supply conductor 14, and relay conductor 15.
  • the pads 12 have a rectangular shape, and are arranged in line at intervals in the longitudinal direction of the substrate 2.
  • Each pad 12 is divided into a first mounting area 16a and second mounting area 16b by a slit 12a.
  • the slit 12a linearly extends in a central part of the pad 12 in the longitudinal direction of the substrate 2, and is opened to one end of the pad 12.
  • Six depressed parts 17 are formed in the first mounting area 16a of each pad 12. The depressed parts 17 are opened to one side edge of the pad 12, and are arranged in line at intervals in the longitudinal direction of the substrate 2.
  • six depressed parts 17 are formed in the second mounting area 16b of each pad 12. The depressed parts 17 are opened to the slit 12a, and are arranged in line at intervals in the longitudinal direction of the substrate 2.
  • each of the pads 12 other than one pad 12 positioned at the left end of the substrate 2 has a pair of extension parts 19a and 19b.
  • the extension parts 19a and 19b linearly extend from one end of the pad 12 in the longitudinal direction of the substrate 2, and are arranged in parallel with each other with an interval held between them.
  • Each of the extension parts 19a and 19b has six power supply terminals 20.
  • the power supply terminals 20 are projected from the extension parts 19a and 19b, and are arranged in line at intervals in the longitudinal direction of the substrate 2.
  • One extension part 19a of each pad 12 extends along one side edge of the adjacent pad 12.
  • the power supply terminals 20 of the extension part 19a are inserted into the respective depressed parts 17 opened to one side edge of the pad 12.
  • the extension part 19a and the side edge of the pad 12 are electrically separated from each other by providing an insulating space between them.
  • the power supply terminals 20 of the extension part 19a and depressed parts 17 are electrically separated from each other by providing insulating spaces between them.
  • each pad 12 is inserted into the slit 12a of the adjacent pad 12.
  • the power supply terminals 20 of the extension part 19b are inserted into the respective depressed parts 17 opened to the slit 12a.
  • the extension part 19b and pad 12 are electrically separated from each other by an insulating space positioned inside the slit 12a.
  • the power supply terminals 20 of the extension part 19b and depressed parts 17 are electrically separated from each other by providing insulating spaces between them.
  • the plurality of pads 12 are arranged in line in the longitudinal direction of the substrate 2, in a state where the extension parts 19a and 19b are alternately reversed in the width direction of the substrate 2.
  • the positive power supply conductor 13 extends over the whole length of the substrate 2 to run along the long side 2b of the substrate 2.
  • the negative power supply conductor 14 extends in the longitudinal direction of the substrate 2 to run along the long side 2b of the substrate 2.
  • the left end of the negative power supply conductor 14 is connected to the pad 12 positioned at the left end of the substrate 2.
  • the positive power supply conductor 13 has a positive electrode terminal 21.
  • the negative power supply conductor 14 has a negative electrode terminal 22.
  • the positive electrode terminal 21 and negative electrode terminal 22 are arranged side by side with an interval held between them at the left end part of the substrate 2.
  • the relay conductor 15 extends in the longitudinal direction of the substrate 2 to run along the long side 2b of the substrate 2.
  • the relay conductor 15 is positioned at a right end part of the substrate 2.
  • the relay conductor 15 includes a pair of power supply patterns 24a and 24b.
  • the power supply patterns 24a and 24b linearly extend in the longitudinal direction of the substrate 2, and are arranged in parallel with each other with an interval held between them.
  • Each of the power supply patterns 24a and 24b has six power supply terminals 25.
  • the power supply terminals 25 are projected from the power supply patterns 24a and 24b, and are arranged in line at intervals in the longitudinal direction of the substrate 2.
  • One power supply pattern 24a extends along one side edge of the pad 12 positioned at the right end of the substrate 2.
  • the power supply terminals 25 of the power supply pattern 24a are inserted into the respective depressed parts 17 opened to the side edge of the pad 12.
  • the power supply pattern 24a and side edge of the pad 12 are electrically separated from each other by providing an insulating space between them.
  • the power supply terminals 25 of the power supply pattern 24a and the depressed parts 17 of the pad 12 are electrically separated from each other by providing insulating spaces between them.
  • the other power supply pattern 24b is inserted into the slit 12a of the pad 12 positioned at the right end of the substrate 2.
  • the power supply terminals 25 of the power supply pattern 24b are inserted into the respective depressed parts 17 opened to the slit 12a.
  • the power supply pattern 24b and pad 12 are electrically separated from each other by an insulating space positioned inside the slit 12a.
  • the power supply terminals 25 of the power supply pattern 24b and the depressed parts 17 of the pad 12 are electrically separated from each other by providing insulating spaces between them.
  • a power supply connector 26 is soldered to the positive electrode terminal 21 and negative electrode terminal 22.
  • the power supply connector 26 is positioned on the first surface 5a of the substrate 2, and is electrically connected to a power supply circuit through lead wires 26a. Furthermore, the negative power supply conductor 14 and relay conductor 15 are short-circuited through a relay connector 27.
  • the first conductor pattern 10 including the pads 12 has a three-layer structure including a copper layer 28, nickel-plated layer 29, and silver-plated layer 30.
  • the copper layer 28 is formed by etching a copper foil layer formed on the first surface 5a of the substrate 2.
  • the nickel-plated layer 29 is formed on the copper layer 28 by subjecting the copper layer 28 to electrolytic plating.
  • the silver-plated layer 30 is formed on the nickel-plated layer 29 by subjecting the nickel-plated layer 29 to electrolytic plating.
  • the silver-plated layer 30 covers the nickel-plated layer 29, and constitutes a reflecting layer exposed on the surface of the first conductor pattern 10. Therefore, the surface of the first conductor pattern 10 is a light-reflecting surface. The total reflectivity of this light-reflecting surface is about 90%.
  • the nickel-plated layer 29 should have a film thickness of 5 ⁇ m or more.
  • the silver-plated layer 30 should have a film thickness of 1 ⁇ m or more.
  • the second conductor pattern 11 is used for maintaining all the pads 12 at the same potential when the pads 12 of the first conductor pattern 10 are subjected to electrolytic plating. More specifically, the second conductor pattern 11 includes a common line 32 and a plurality of branch lines 33 as shown in FIG. 2 .
  • the common line 32 linearly extends over the whole length of the substrate 2 to run along the long side 2a of the substrate 2. At the same time, the common line 32 is separate from the end edge of the substrate 2 by a predetermined distance D, the end edge defining the long side 2a of the substrate 2.
  • the common line 32 has a plurality of curved parts 34 at positions corresponding to the piercing parts 6 of the substrate 2.
  • Each of the curved parts 34 is arcuately curved in a direction in which a distance from the edge of the piercing part 6 becomes larger.
  • the common line 32 is separate from the edges of the piercing parts 6, by at least the same distance as the distance D at positions corresponding to the piercing parts 6.
  • the branch lines 33 are branched from the common line 32, and linearly extend toward the pads 12.
  • the branch lines 33 are arranged at intervals in the longitudinal direction of the substrate 2. Distal ends of the branch lines 33 are electrically connected to all the pads 12 and power supply pattern 24a of the relay conductor 15. In other words, all the pads 12 and relay conductor 15 are electrically connected to the common line 32 through the branch lines 33.
  • the second conductor pattern 11 is formed on the first surface 5a of the substrate 2 simultaneously with the first conductor pattern 10, and has the same three-layer structure as that of the first conductor pattern 10. Therefore, the surface of the second conductor pattern 11 is formed of a silver-plated layer, and has light reflectivity.
  • Each of the plurality of light-emitting elements 3 is constituted of a paired chip of light-emitting diodes (LEDs).
  • white light is emitted through the light-emitting device 1, and hence light-emitting elements 3 configured to emit blue light are used.
  • the LED paired chip 3 is, for example, an InGaN-based element, in which light-emitting layers are formed on a translucent sapphire element board.
  • the light-emitting layers are formed by depositing an n-type nitride semiconductor layer, InGaN light-emitting layer, and p-type nitride semiconductor layer one on top of another.
  • electrodes configured to cause a current to flow through the light-emitting layers are constituted of a positive electrode formed of a p-type electrode pad on the p-type nitride semiconductor layer, and negative electrode formed of an n-type electrode pad on the n-type nitride semiconductor layer.
  • the light-emitting elements 3 are individually attached to the first mounting area 16a and second mounting area 16b of each pad 12 through a silicon resin adhesive 36. More specifically, six light-emitting elements 3 are arranged in the first mounting area 16a of each pad 12 in line at intervals in the longitudinal direction of the substrate 2, and six light-emitting elements 3 are arranged in the second mounting area 16b of each pad 12 in line at intervals in the longitudinal direction of the substrate 2. Accordingly, each pad 12 includes twelve light-emitting elements 3.
  • each line of fifty-four light-emitting elements 3 is arranged in the longitudinal direction of the substrate.
  • the light-emitting elements 3 of each of the two lines arranged in the longitudinal direction of the substrate 2 are sealed with a long and thin sealing member 4a or 4b as shown in FIG. 1 .
  • the lines of the light-emitting elements 3 may be three lines or more.
  • each light-emitting element 3 is electrically connected to the pad 12 to which the light-emitting element 3 is affixed, through a bonding wire 38.
  • the negative electrode of each light-emitting element 3 is electrically connected to each of the power supply terminals 20 of the adjacent pad 12 and each of power supply terminals 25 of the power supply patterns 24a and 24b by another bonding wire 39.
  • These bonding wires 38 and 39 are constituted of a gold (Au) thin wire and, for the purpose of improving the mounting strength, and reducing the damage of the LED paired chip, are connected through bumps a chief ingredient of which is gold (Au).
  • the light-emitting device 1 has nine parallel circuits 40a, 40b, 40c, 40d, 40e, 40f, 40g, 40h, and 40i, in each of which twelve light-emitting elements 3 are connected in parallel. Furthermore, the nine parallel circuits 40a, 40b, 40c, 40d, 40e, 40f, 40g, 40h, and 40i are connected in series.
  • a capacitor 41 is connected to each of the nine parallel circuits 40a, 40b, 40c, 40d, 40e, 40f, 40g, 40h, and 40i.
  • a capacitor 41 is also connected to a circuit configured to connect the parallel circuits 40a, 40b, 40c, 40d, 40e, 40f, 40g, 40h, and 40i in series.
  • the capacitors 41 are mounted on the first surface 5a of the substrate 2.
  • the power supply terminals 20 and 25 to which the bonding wires 39 are connected are inserted into the depressed parts 17 of the adjacent pad 12.
  • the power supply terminals 20 and 25 advance toward the central parts of the first and the second mounting areas 16a and 16b, and hence the light-emitting elements 3 can be affixed to the central parts of the first and the second mounting areas 16a and 16b, without changing the lengths of the bonding wires 38 and 39. Therefore, it is possible to conduct the heat generated by the light-emitting elements 3 to a wide range of the first and the second mounting areas 16a and 16b, and efficiently radiate the heat from the pads 12.
  • the second conductor pattern 11 configured to maintain all the pads 12 at the same potential becomes useless after the first conductor pattern 10 is subjected to electrolytic plating. Therefore, in this embodiment, after the first conductor pattern 10 is subjected to electrolytic plating, the common line 32 of the second conductor pattern 11 is removed to thereby sever electrical connection between the pads 12 obtained by the second conductor pattern 11.
  • a depressed part 45 is formed in the first surface 5a of the substrate 2.
  • the depressed part 45 is traces which are left after the common line 32 is removed, and extends along the long side 2a of the substrate 2.
  • the depressed part 45 is a groove which is defined by a bottom surface 45a and a pair of side surfaces 45b and 45c, and is opened to the first surface 5a of the substrate 2.
  • the depressed part 45 has a plurality of curved parts 46 at positions corresponding to the piercing parts 6 of the substrate 2.
  • the curved parts 46 are formed into a shape coinciding with the shape of the curved parts 34 of the common line 32 in such a manner that the parts 46 detour around the piercing parts 6.
  • the depressed part 45 having the above structure is positioned between the end edge of the substrate 2, which defines the long side 2a of the substrate 2, and the pads 12, and is separate from the end edge of the substrate 2 by a predetermined distance.
  • the depressed part 45 has a width dimension of 1 mm, and depth dimension of 0.3 mm.
  • a creepage distance from the end edge of the substrate 2 which defines the long side 2a of the substrate 2 to the pads 12 is a value obtained by adding the height dimensions of the side surfaces 45b and 45c of the depressed part 45 to the original distance. Therefore, the creepage distance becomes longer than the clearance (spatial distance) from the end edge of the substrate 2 to the pads 12 by a dimension corresponding to the depth of the depressed part 45.
  • the shape of the depressed part 45 is not limited to that of this embodiment.
  • the depressed part 45 may have a V-shaped or U-shaped cross section in the direction perpendicular to the longitudinal direction of the substrate 2.
  • the sealing members 4a and 4b seal the light-emitting elements 3 which are arranged in two lines, and bonding wires 38 and 39 on the pads 12.
  • the sealing members 4a and 4b are made of a transparent silicon resin in which an adequate amount of a fluorescent substance such as YAG, Ce or the like is mixed, are formed by coating in such a manner that their cross-sectional shape becomes a flat mountain shape, and linearly extend in the longitudinal direction of the substrate 2. A desirable cross-sectional shape of the sealing members 4a and 4b will be described later in detail.
  • the fluorescent substance is excited by light emitted from the light-emitting element 3, and radiates light of a color different from the color of the light emitted from the light-emitting element 3.
  • the light-emitting element 3 emits blue light, and hence a yellow fluorescent substance configured to radiate light of the yellow color in a complementary chromatic relationship to the blue color of the light is used as the fluorescent substance so that the light-emitting device 1 can emit light of the white color.
  • the first surface 5a of the substrate 2 is covered with a white resist layer 48, except for areas on which parts such as the light-emitting elements 3 and capacitors 41 are mounted.
  • a white resist layer 48 except for areas on which parts such as the light-emitting elements 3 and capacitors 41 are mounted.
  • At least a part to which a light-emitting element 3 (LED paired chip) is affixed, i.e., a mounting part of the light-emitting element 3 corresponds to the area in which no resist layer 48 is formed.
  • the area is buried by the sealing member 4a or 4b to be sealed as shown in FIG. 1 and FIG. 5 .
  • the resist layer 48 has light reflectivity.
  • the resist layer 48 continuously covers the first conductor pattern 10, branch lines 33, and depressed part 45 except the above-mentioned areas. Therefore, the first conductor pattern 10, branch lines 33, and depressed part 45 on the first surface 5a of the substrate 2 are not easily viewed.
  • the pads 12 are formed on the first surface 5a of the substrate 2, and the resist layer 48 is formed on the pads 12.
  • the resist layer 48 is formed of a white photoresist material. Further, the resist layer 48 bears a function of reflecting light emitted from the light-emitting element 3 in the frontward direction (upward direction in FIG. 5 ), and function of preventing the metallic layers such as the pads 12, power supply conductors 13 and 14, and the like from being corroded.
  • the thickness of each pad 12 is set at 35 ⁇ m
  • thickness of the resist layer 48 is set at 40 ⁇ m
  • height of the light-emitting element 3 is set at 80 ⁇ m. It is desirable that the thickness of the resist layer 48 be set at a value from 30 to 40 ⁇ m and, for example, when the thickness of the resist layer 48 is to be changed to 30 ⁇ m, it is sufficient if the thickness of the pad 12 is made less than 30 ⁇ m.
  • the heat-radiation sheets 50 are an example of conductors, and are formed of copper foil excellent in thermal conductivity.
  • the heat-radiation sheets 50 are arranged in two lines at intervals in the longitudinal direction of the substrate 2 in such a manner that the sheets 50 correspond to the pads 12 on the first surface 5a.
  • Heat-radiation sheets 50 adjacent to each other are thermally separated from each other by a first slit 51 extending in the longitudinal direction of the substrate 2, and a plurality of second slits 52 each extending in a lateral direction perpendicular to the longitudinal direction of the substrate 2.
  • the heat-radiation sheets 50 and second surface 5b of the substrate 2 are covered with a resist layer 53.
  • the thermal radiation performance of the substrate 2 can be enhanced.
  • the second slits 52 extending in the direction perpendicular to the longitudinal direction of the substrate 2 between the heat-radiation sheets 50 adjacent to each other, it is possible to suppress a warp and deformation of the substrate 2 caused by heat.
  • the first conductor pattern 10 and second conductor pattern 11 are formed on the first surface 5a of the substrate 2. More specifically, the copper foil deposited on the first surface 5a is etched, whereby copper layers 28 of the first and second conductor patterns 10 and 11 are formed. In the copper layer 28 of the first conductor pattern 10, parts constituting the pads 12 are electrically connected to each other through the copper layer 28 of the second conductor pattern 11. Therefore, all the parts of the copper layer 28 of the first conductor pattern 10 each constituting the pads 12 are maintained at the same potential.
  • the copper layer 28 of the first conductor pattern 10 is subjected to electrolytic plating, whereby a nickel-plated layer 29 is formed on the copper layer 28.
  • the nickel-plated layer 29 is subjected to electrolytic plating, whereby a silver-plated layer 30 is formed on the nickel-plated layer 29.
  • all the parts in the copper layer 28 of the first conductor pattern 10 each constituting the pads 12 are maintained at the same potential.
  • the nickel-plated layer 29 and silver-plated layer 30 are formed on the copper layer 28 of the first conductor pattern 10 by using the copper layer 28 of the first conductor pattern 10 as a negative electrode, using a metal identical with the metal of the layer to be formed by plating as a positive electrode, and causing an electric current to flow between both the electrodes.
  • the nickel-plated layer 29 and silver-plated layer 30 are also formed on the copper layer 28 of the second conductor pattern 11 simultaneously with the first conductor pattern 10. This state is shown in FIG. 2 .
  • the common line 32 of the second conductor pattern 11 is removed from the first surface 5a of the substrate 2. More specifically, the common line 32 on the first surface 5a is scraped away. As a result, electrical connection between the pads 12 of the first conductor pattern 10 and second conductor pattern 11 is severed, and the pads 12 are maintained in a state where the pads 12 are electrically independent.
  • a groove-like depressed part 45 is formed in the first surface 5a.
  • the depressed part 45 has the curved parts 46 which are curved to detour around the piercing parts 6, at positions corresponding to the piercing parts 6 of the substrate 2.
  • the depressed part 45 intersects the bases of the branch lines 33 branching off from the common line 32. As a result, the branch lines 33 are left on the first surface 5a of the substrate 2 in a state where the branch lines 33 are electrically separated from each other.
  • the positive electrodes of the light-emitting elements 3 are electrically connected to the pads 12 to which the light-emitting elements 3 are affixed by bonding wires 38.
  • the negative electrodes of the light-emitting elements 3 are connected to the power supply terminals 20 of the adjacent pads 12, and power supply terminals 25 of the power supply patterns 24a and 24b by bonding wires 39.
  • a pattern of the resist layer 48 is formed on the conductor patterns 10 and 11.
  • the pattern of the resist layer 48 is formed on the substrate surface except the mounting areas of the light-emitting elements 3, and mounting positions of the other electronic components.
  • the resist layer 48 is formed by using a white photoresist material. Accordingly, the resist layer 48 is irradiated with ultraviolet rays to carry out exposure and development, whereby the pattern of the area is formed.
  • the process of forming the pattern of the resist layer 48 can also be carried out before the removal process of the above-mentioned second conductor pattern 11.
  • the resist layer 48 is formed after the second conductor pattern 11 is removed, and hence the depressed part 45 appearing after the second conductor pattern 11 is scraped away is filled with the resist layer 48 as shown in FIG. 1 and FIG. 5 .
  • the depressed part 45 is exposed on the surface of the light-emitting device 1.
  • the light-emitting elements 3 arranged in two lines and the bonding wires 38 and 39 are sealed on the pads 12 by using the sealing members 4a and 4b.
  • the light-emitting device 1 as shown in FIG. 1 and FIG. 5 is formed.
  • the sealing members 4a and 4b are applied to the light-emitting elements 3 of each row and bonding wires 38 and 39 in a form of a straight line as shown in FIG. 1 in an uncured state where the members 4a and 4b are adjusted to appropriate viscosity in such a manner that the members 4a and 4b do not flow out thoughtlessly, and maintain a flat mountain shape a cross section of which is shown in FIG. 5 . Further, after the sealing members 4a and 4b are heated to be cured, or after the sealing members 4a and 4b are left as they are for a predetermined time, the sealing members 4a and 4b are cured and fixed to the above-mentioned areas of the resist layer 48.
  • the illumination device 100 in which the above-mentioned light-emitting device 1 is incorporated will be described below with reference to FIG. 7 .
  • the illumination device 100 to be described is, for example, an illumination device of the ceiling mounting type which is mounted on the ceiling of a room to be used.
  • the illumination device 100 is provided with a main body case 101 having substantially a long and thin parallelepiped-shape.
  • a main body case 101 having substantially a long and thin parallelepiped-shape.
  • a plurality of (two in this embodiment) light-emitting devices 1 described above are connected and arranged side by side in the longitudinal direction.
  • a power supply unit (not shown) provided with a power supply circuit (not shown) is incorporated in the main body case 101.
  • a front cover 102 having light-diffusing properties is attached to a lower opening part of the main body case 101.
  • a plurality of light-emitting elements 3 are turned on all at once, and light is emitted from each of the plurality of light-emitting elements 3.
  • the light emitted from each of the plurality of light-emitting elements 3 passes through a sealing member 4a or 4b, and front cover 102 in sequence, and is utilized as white illumination light. That is, the illumination device 100 is used as a surface light source.
  • the pads 12 function as a heat spreader configured to spread heat generated from the light-emitting elements 3. Further, while the light-emitting devices 1 are emitting light, part of the light emitted from the light-emitting elements 3, the part of the light being directed toward the substrate 2 side, is reflected from the reflecting layer on the surface side of the pads 12 mostly in the light-utilization direction. Accordingly, it is possible to make the light-extraction efficiency excellent.
  • each of the sealing members 4a and 4b sealing the plurality of light-emitting elements 3 bears a function of diffusing light emitted from each light-emitting element 3.
  • the front cover 102 bears a function of further diffusing light passing therethrough. That is, by providing the sealing members 4a and 4b, and front cover 102, luminance unevenness peculiar to a light-emitting device 1 using a point light source is suppressed.
  • luminance unevenness is liable to be caused in the illumination light from the illumination device 100 by the characteristics of the luminance and directivity of the light-emitting diode. That is, like in this embodiment, when long and thin sealing members 4a and 4b of the divided two lines are provided as shown in FIG. 1 and FIG. 5 in order to reduce the applied amount of the sealing members, a dark part is liable to be caused at a separation part 4c between the lines of the sealing members. In this case, stripe-like luminance unevenness due to the linear dark part is liable to be caused, and the appearance as an illumination device 100 is made poor.
  • the inventors of the present invention have variously changed the width A of each of the sealing members 4a and 4b of the two lines, and space B between them to observe the luminance unevenness and light distribution range of the illumination light.
  • the space B was made 0.5 to 2 times, or more desirably, 0.5 to 1 times the width A, illumination light of the desired light distribution range having no luminance unevenness could be obtained.
  • the layout of the light-emitting elements 3 is predetermined due to the convenience of the design, i.e., when the space between the lines of the light-emitting elements 3 is predetermined, it is possible to set the above-mentioned ratio B/A at an appropriate value by controlling the width A of the sealing member 4a or 4b, and application position of the sealing member 4a or 4b.
  • the surface of the resist layer 48 is exposed.
  • the surface of the resist layer 48 reflects part of the light emitted from each of the light-emitting elements 3 in the lines on both sides toward the front side.
  • the surface of the resist layer 48 has high reflectivity as described previously, and hence the light reflected from the separation part 4c partially bears a function of making the dark part inconspicuous. That is, the surface of the resist layer 48 at the separation part 4c functions as an intermediate member configured to suppress luminance unevenness.
  • the angular color differences of the light-emitting device are also influenced by the cross-sectional shape of each sealing member 4a or 4b.
  • the sealing member 4a or 4b is formed into substantially a spherical shape with a diameter-to-height ratio of, for example, 2.0 to 7.8 : 1.
  • the angular color differences of the light-emitting device 1 can be reduced. The contents will be described below in detail with reference to FIGS. 8 to 10 . It should be noted that a correlated color temperature difference is small implies that an angular color difference is small.
  • FIG. 10 shows relationships between the emission angle and correlated color temperature for some cases of different diameter-to-height ratios.
  • the "diameter” mentioned herein implies the width A of each sealing member 4a or 4b.
  • the "height” mentioned herein implies the distance C ( FIG. 5 ) from the light-emitting surface of the light-emitting element 3 to the surface of the top part of the sealing member 4a or 4b.
  • the light-emitting surface of the light-emitting element 3 is set slightly higher than the surface of the resist layer 48 or is set at a height substantially equal to the height of the surface of the resist layer 48, and hence it is considered that the "height" of the sealing member 4a or 4b corresponds to the protrusion height of the sealing member 4a or 4b from the surface of the resist layer 48.
  • the cross-sectional shape of the sealing member 4a or 4b is hemispherical. As the diameter-to-height ratio increases, the cross-sectional shape of the sealing member 4a or 4b becomes more flat.
  • the "emission angle” is the angle formed between the vertically downward direction set as the reference (0°) and direction in which light is emitted.
  • FIG. 8 shows the relationship between the diameter-to-height ratio and correlated color temperature difference.
  • the "correlated color temperature difference” implies the difference between the maximum and minimum values of the correlated color temperature in an emission angle range from 0° to a predetermined angle (e.g., 75°). For example, a point A in FIG. 8 indicates that the correlated color temperature difference is about 1,000 K when the diameter-to-height ratio is about 2.08. This is obtained from the fact that a difference d between the maximum and minimum values on a graph line in FIG. 10 for the diameter-to-height ratio of 2.08 is about 1,000 K.
  • the correlated color temperature difference can be confined to 1,000 K or less. Within this range, the angular color difference is too small to make the user conscious of.
  • the correlated color temperature for each emission angle depends on the length of an optical path from each light-emitting diode 3 to the surface of the sealing member 4a or 4b.
  • the cross-sectional shape of each sealing member 4a or 4b is hemispherical (i.e., when the diameter-to-height ratio is 2.0)
  • optical path lengths at various points are equal to each other, and hence the angular color difference should be the smallest.
  • the above result of analysis indicates that the angular color difference is the smallest when each sealing member 4a or 4b has a flat shape.
  • the diameter-to-height ratio of the sealing member 4a or 4b is, for example, 4.4 to 6.2 : 1
  • the correlated color temperature difference is below 600 K, and hence the angular color difference can be made smaller.
  • experimental conditions for analyses of FIGS. 8 to 10 include a phosphor weight density of 10% and correlated color temperature of 5,000 K. It should be noted that when different phosphor densities are used in a state where the correlated color temperature is set constant, the shape of the sealing members 4a and 4b is similarly varied in size. Accordingly, even when the phosphor weight density varies, experimental conditions similar to the aforementioned ones can be obtained for the angular color difference. Further, it has been ascertained by the inventors of the present invention that experimental conditions similar to the aforementioned ones can also be obtained for all the so-called white color temperatures (e.g., 4,000 to 6,000 K). That is, enabling the angular color difference to be reduced by confining the diameter-to-height ratio of each sealing member 4a or 4b to 2.0 to 7.8 : 1 is not limited to the aforementioned experimental conditions.
  • white color temperatures e.g., 4,000 to 6,000 K
  • FIG. 9 shows the relationship between the diameter-to-height ratio and luminous efficacy.
  • the luminous efficacy hardly varies even when the diameter-to-height ratio is greatly changed. That is, the luminous efficacy of the light-emitting device 1 is hardly reduced even when the shape of the sealing members 4a and 4b is changed in order to make the correlated color temperature difference smaller.
  • the range in which the diameter-to-height ratio of each sealing member 4a or 4b is 2.0 to 5.2 : 1 can be said to be desirable in consideration of the luminous efficacy, since the light-emitting device 1 can maintain higher (though slightly) luminous efficacy. Further, in consideration of robustness, the range in which the diameter-to-height ratio of each sealing member 4a or 4b is 5.2 to 7.8 : 1 is desirable.
  • the diameter and height are, for example, 4 and 0.675 mm, respectively, the diameter-to-height ratio is 5.93. In this case, even when the diameter and height change within the range of ⁇ 0.1 mm, the ratio varies only from 5.29 to 6.78, and the fluctuation is restricted to a small value.
  • the second conductor pattern 11 which maintains the pads 12 of the first conductor pattern 10 at the same potential is constituted of the common line 32 and the branch lines 33 that are branched off from the common line 32 and reach the pads 12. Therefore, electrical connection between the pads 12 obtained by the second conductor pattern 11 can be severed by removing the common line 32 from the substrate 2.
  • the depressed part 45 which is left after the common line 32 is scraped away is separate from the end edge of the substrate 2 by the predetermined distance, and is positioned between the end edge of the substrate 2 and pads 12.
  • the creepage distance between the end edge of the substrate 2 and pads 12 becomes longer than the clearance (spatial distance) between the end edge of the substrate 2 and pads 12 by a length corresponding to the depth of the depressed part 45, and it is possible to secure an insulation distance from the end edge of the substrate 2 to the pads 12.
  • the depressed part 45 has the curved parts 46 which are curved to detour around the piercing parts 6 at positions corresponding to the piercing parts 6 of the substrate 2. Therefore, it is possible to equally secure insulating distances from the edges of the piercing parts 6 to the curved parts 46, and improve the dielectric strength of the substrate 2. Thus, even when the screws 8 to be inserted through the piercing parts 6 are formed of metal, insulation between the screws 8 and pads 12 can be sufficiently secured, and the reliability of electrical insulation of the light-emitting device 1 can be improved.
  • the surface of the resist layer 48 is formed at a position lower than the height of the top surface of the light-emitting element 3, and hence it is possible to reduce the degree to which the resist layer 48 is a hindrance to the light emitted from the light-emitting elements 3, and enhance the luminous efficacy.
  • the ratio B/A of the space B between the sealing members 4a and 4b to the width A of the sealing member 4a or 4b is made 0.5 to 2, or more desirably, 0.5 to 1, and hence it is possible to prevent a dark part from occurring between the sealing members 4a and 4b, and prevent stripe-like luminance unevenness from being caused.
  • the surface of the resist layer 48 at the separation part 4c between the sealing members 4a and 4b functions as a reflecting surface having high reflectivity, and hence it is possible to make the dark part between the sealing members 4a and 4b more inconspicuous.
  • the ratio of the diameter, i.e., the width A of the sealing member 4a or 4b to the height C thereof is made 2.0 to 7.8 : 1.
  • the front cover 102 is provided at the lower opening part thereof, whereby it is possible to further diffuse the light in which the luminance unevenness is suppressed, and angular color difference is made inconspicuous as described above, and radiate uniform and high-quality illumination light.
  • the light-emitting device 60 of this embodiment has the same structure as the light-emitting device 1 of the first embodiment described above except for that the device 60 has a long and thin intermediate member 62 extending in the longitudinal direction of a substrate 2 on a surface of a resist layer 48 at a separation part 4c between sealing members 4a and 4b. Accordingly, constituent elements functioning in the same manner as the first embodiment are denoted by the same reference symbols, and a detailed description of them will be omitted.
  • FIG. 11 is a plan view corresponding to FIG. 1
  • FIG. 12 is a cross-sectional view corresponding to FIG. 5 .
  • two light-emitting devices 60 are connected to each other to be incorporated into an illumination device 100 as shown in FIG. 7 in the same manner as the light-emitting device 1 of the first embodiment.
  • the intermediate member 62 is configured by applying a silicon resin having translucency to the separation part 4c in substantially the same length as the sealing members 4a and 4b as shown in FIG. 11 . That is, the intermediate member 62 is provided to be in close contact with the inner side surface of each sealing member 4a or 4b, and bury the separation part 4c. It should be noted that it is desirable that the height of the surface of the intermediate member 62 be higher than or equal to the height of the top part of each of the sealing members 4a and 4b on both sides thereof.
  • part of light emitted from each of the light-emitting elements 3 of each line is made incident on the intermediate member 62.
  • the light made incident on the intermediate member 62 is guided through the intermediate member 62 to be diffused, and part of the diffused light is reflected from the surface of the resist layer at the separation part 4c.
  • the light diffused by the intermediate member 62 including the reflected light is emitted from the surface of the intermediate member 62.
  • the width B of the separation part 4c is set at a value 0.5 to 2 times the width A of the sealing member 4a or 4b. Further, the width A of the sealing member 4a or 4b is set at a value 2.0 to 7.8 times the height C thereof. As a result, in this embodiment too, it is possible to prevent the luminance unevenness and angular color difference as described above.
  • the light-emitting device 60 of this embodiment has the intermediate member 62 between the sealing members 4a and 4b, and hence luminance unevenness is hardly caused even when the width B of the separation part 4c exceeds twice the width A of the sealing member 4a or 4b. That is, by providing the intermediate member 62, it is possible to enhance the luminance at the separation part 4c, and hence there is no possibility of luminance unevenness being caused even when the width B of the separation part 4c is made somewhat larger. In other words, by providing the intermediate member 62, it is possible to slightly widen the width B of the separation part 4c between the sealing members 4a and 4c, and also widen the light distribution range of the illumination device 100.
  • the light-emitting device 70 of this embodiment has substantially the same structure as the light-emitting device 60 of the second embodiment described above except for that the device 70 has no resist layer 48 at a separation part 4c between sealing members 4a and 4b. Accordingly, here, constituent elements functioning in the same manner as the second embodiment are denoted by the same reference symbols, and a detailed description of them will be omitted.
  • FIG. 13 is a cross-sectional view corresponding to FIG. 12 .
  • two light-emitting devices 70 are also connected to each other to be incorporated into an illumination device 100 as shown in FIG. 7 in the same manner as the light-emitting device 1 of the first embodiment.
  • an intermediate member 72 is provided in place of providing a resist layer 48 between the sealing members 4a and 4b.
  • the intermediate member 72 is, like the intermediate member 62 of the second embodiment described above, formed of a silicon resin having translucency. Further, it is desirable that the height of the surface of the intermediate member 72 be also higher than or equal to the height of the top part of each of the sealing members 4a and 4b on both sides thereof. It should be noted that in this embodiment, the intermediate member 72 is provided in contact with a surface of a silver-plated layer 30 of a pad 12. Accordingly, in this embodiment, part of light made incident on the intermediate member 72, the light being part of light emitted from each of light-emitting elements 3 of each line, is reflected from the surface of the silver-plated layer 30.
  • part of the light made incident on the intermediate member 72 is reflected from the silver-plated layer 30 having higher reflectivity, and it is possible to further enhance the luminance of the intermediate member 72 at the separation part 4c.
  • by providing no resist layer 48 at the separation part 4c it is possible to reduce the amount of light blocked by the resist layer 48, and further enhance the luminance at the separation part 4c at which the intermediate member 72 is present correspondingly.
  • the width B of the separation part 4c is set at a value 0.5 to 2 times the width A of the sealing member 4a or 4b. Further, the width A of the sealing member 4a or 4b is set at a value 2.0 to 7.8 times the height C thereof. As a result, in this embodiment too, it is possible to prevent the luminance unevenness and angular color difference described above from being caused.
  • the light-emitting device 80 of this embodiment has substantially the same structure as the light-emitting device 1 of the aforementioned first embodiment except for that the device 80 is provided with, in place of the sealing members 4a and 4b, sealing members 4d configured to individually cover and seal light-emitting elements 3. Accordingly, parts identical with or corresponding to those of the first embodiment are denoted by the identical reference symbols, and a duplicate description will be omitted.
  • the plurality of sealing members 4d individually sealing the light-emitting elements 3 have the same shape and size, and are applied to a substrate 2 in two lines in a longitudinal direction of the substrate 2. That is, widths A or heights C of the sealing members 4d in a lateral direction (width direction) of the substrate 2 are all of the same size. Further, in this case, a separation part 4c between each line of the sealing members 4d is set at a width B as shown in FIG. 14 .
  • the width B of the separation part 4c is set at a value 0.5 to 2 times the width A of the sealing member 4a or 4b. Further, the width A of the sealing member 4a or 4b is set at a value 2.0 to 7.8 times the height C thereof.
  • the sealing members 4d are provided for all the light-emitting elements 3 in a studding manner, and hence it is possible, as compared with the first embodiment, to reduce the amount of the material for the sealing members, and also reduce the material cost correspondingly.
  • each light-emitting element 3 the configuration is not limited to this, and the plurality of light-emitting elements may be divided into blocks, and each block may be sealed with a sealing member.
  • FIG. 15 shows a plan view of a light-emitting device 90 according to a fifth embodiment.
  • the light-emitting device 90 has the same structure as the light-emitting device 80 of the aforementioned fourth embodiment except for that an intermediate member 92 identical with the intermediate member 62 of the aforementioned second embodiment is provided between lines of sealing members 4d. Accordingly, here, constituent elements functioning in the same manner as the light-emitting device 80 of the fourth embodiment are denoted by the same reference symbols, and a detailed description of them will be omitted.
  • the width B of a separation part 4c is set at a value 0.5 to 2 times the width A of the sealing member 4a or 4b. Further, the width A of the sealing member 4a or 4b is set at a value 2.0 to 7.8 times the height C thereof.
  • the intermediate member 92 in addition to that it is possible to exert the advantages identical with the light-emitting device 80 of the fourth embodiment, it is possible, by providing the intermediate member 92, to further enhance the luminance at the separation part 4c, and slightly widen the part between the lines of the sealing members 4d as in the second embodiment.
  • the intermediate members 62, 72, and 92 are formed of a silicon resin having translucency
  • the material for the intermediate member is not limited to this material, and other transparent resins such as an acrylic resin, and the like may be used. Any material may be used so long as the material can reduce a difference in relative luminance between the sealing members 4a, 4b, and 4d used for sealing the light emitting element 3.
  • the intermediate member 62, 72 or 92 is formed by applying a silicon resin having fluidity to the separation part 4c
  • the formation method thereof is not limited to this, and the intermediate member may be formed by using a hard material having no fluidity.
  • the sealing member 4a, 4b, or 4d with which the intermediate member is in contact is formed of a material having elasticity. As a result, it is possible to enhance the adhesion between the intermediate member and sealing member.
  • the intermediate member 62, 72 or 92 is formed by simply using a transparent silicon resin
  • a diffusing agent may be mixed into the intermediate member.
  • the diffusing agent include, for example, alumina, silica, and the like. As described above, by mixing the diffusing agent into the intermediate member 62, 72 or 82, it is possible to enhance the diffusion effect of the intermediate member.
  • the illumination device can be applied to a lighting fixture to be used indoors or outdoors, light source of a display device, and the like.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
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  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
EP11154161.1A 2010-02-12 2011-02-11 Lichtemittierende Vorrichtung und Beleuchtungsvorrichtung Withdrawn EP2360418A3 (de)

Applications Claiming Priority (2)

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JP2010029544A JP2011166036A (ja) 2010-02-12 2010-02-12 発光装置及び照明装置
JP2011016408A JP2012156440A (ja) 2011-01-28 2011-01-28 発光装置及び照明装置

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EP2645418A3 (de) * 2012-03-26 2013-10-23 Toshiba Lighting & Technology Corporation Lichtemittierendes Modul und Beleuchtungssystem
EP2642836A3 (de) * 2012-03-23 2014-06-11 Toshiba Lighting & Technology Corporation Leiterplattenvorrichtung, Lampe und Herstellungsverfahren für Leiterplattenvorrichtung

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