EP2341354B1 - Contactless measuring system - Google Patents
Contactless measuring system Download PDFInfo
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- EP2341354B1 EP2341354B1 EP11002225A EP11002225A EP2341354B1 EP 2341354 B1 EP2341354 B1 EP 2341354B1 EP 11002225 A EP11002225 A EP 11002225A EP 11002225 A EP11002225 A EP 11002225A EP 2341354 B1 EP2341354 B1 EP 2341354B1
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- European Patent Office
- Prior art keywords
- calibration
- signal
- contact structure
- contact
- contactless
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- 238000010168 coupling process Methods 0.000 claims abstract description 55
- 230000008878 coupling Effects 0.000 claims abstract description 54
- 238000005859 coupling reaction Methods 0.000 claims abstract description 54
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000004020 conductor Substances 0.000 claims description 21
- 239000000523 sample Substances 0.000 claims description 20
- 238000005259 measurement Methods 0.000 claims description 13
- 238000000605 extraction Methods 0.000 claims description 2
- 238000003012 network analysis Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 230000001939 inductive effect Effects 0.000 description 3
- 241001317374 Evides Species 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/07—Non contact-making probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/28—Measuring attenuation, gain, phase shift or derived characteristics of electric four pole networks, i.e. two-port networks; Measuring transient response
- G01R27/32—Measuring attenuation, gain, phase shift or derived characteristics of electric four pole networks, i.e. two-port networks; Measuring transient response in circuits having distributed constants, e.g. having very long conductors or involving high frequencies
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
- G01R1/24—Transmission-line, e.g. waveguide, measuring sections, e.g. slotted section
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/312—Contactless testing by capacitive methods
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/315—Contactless testing by inductive methods
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
- G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references
Definitions
- the invention relates to a calibration substrate for a contactless measuring system, comprising at least one measuring tip, which forms part of a coupling structure for contactless coupling of a signal on a signal waveguide, wherein on the calibration substrate at least one calibration element, in particular short-circuit standard, no-load standard, Resistor standard, line standard, is formed, wherein the at least one calibration element is electrically connected to at least one signal waveguide, in particular microstrip line or coplanar line, according to the preamble of claim 1.
- the determination of scattering parameters of electrical components embedded within a complex circuit by means of a contactless vector network analysis is, for example, off T. Zelder, H. Eul, "Contactless Network Analysis with Improved Dynamic Range Using Diversity Calibration", Proceedings of the 36th European Microwave Conference, Manchester, UK, pp. 478-481, September 2006 or T. Zelder, H. Rabe, H. Eul, "Contactless electromagnetic measuring system using conventional calibration algorithms to determine scattering parameters", Advances in Radio Science - Kleinheubacher Reports 2006, Volume 5, 2007 known.
- the internal directional couplers of a network analyzer are replaced by contactless near-field probes, which are directly connected to connected to the vectorial measuring points of the analyzer.
- the measuring probes are positioned over the signal lines of the measuring object.
- the probes can act inductively and / or capacitively on the electromagnetic field of the planar line.
- conventional calibration methods are used, as used in contact-based network analysis.
- At least one measuring probe such as a conductor loop or two capacitive probes, is required for each test port of an unknown test object (DUT - D evice U nder T est).
- DUT - D evice U nder T est an unknown test object
- contactless vector network analysis has the potential to characterize components without contact, so far no contactless Scattering parameter measurement performed by embedded within a circuit RF and microwave components.
- the positions of the non-contact probes must be changed during and after calibration.
- this requires a lot of effort to reproduce the probe position during the measurement of the calibration standards and the test object, because the smallest deviations in the probe positioning already lead to significantly large measurement errors.
- the invention is based on the object, a contactless measuring system of o.g. Design such a way that an expensive and complex positioning of coupling probes can be omitted.
- At least one contact structure is designed and arranged such that this contact structure is electrically isolated from the signal waveguide, forming part of the coupling structure, is arranged completely in the near field of the signal waveguide and at least one contact point has, which is electrically contacted by a contact of a measuring tip.
- the contact structure is formed as a conductor on the circuit board.
- a particularly good signal decoupling is achieved in that the contact structure is designed such that it can be contacted by an impedance-controlled measuring tip.
- At least one contact structure is formed, for example, as a coupling waveguide with inner conductor and outer conductor or as at least one contact point or contact surface for a contact of a measuring tip.
- the contact structure and / or the signal waveguide are formed as printed conductors on the circuit board.
- the circuit board is formed as a printed circuit board (PCB) or wafer.
- PCB printed circuit board
- the coupling structure has at least one, in particular two, contact structures per test port.
- the circuit board is a multilayer board having a plurality of substrate layers, wherein the signal waveguide is formed on a first substrate layer of the multilayer board and at least one contact structure on the first or at least one other substrate layer of the multilayer board.
- At least two of the contact structures are arranged on different substrate layers of the multilayer board.
- the at least one contact structure has contact points which are designed and arranged in such a way that contacting with on-wafer or PCB measuring tips results in an impedance-controlled transition.
- At least one calibration element is additionally formed on the circuit board, which is connected to at least one signal waveguide on which at least one contact structure is arranged such that the arrangement of the contact structure on the signal waveguide of a calibration Arrangement of the contact structures on the signal waveguides of the electrical circuit corresponds.
- At least one calibration element is connected to a number of signal waveguides corresponding to the number of measurement gates of the non-contact measurement system.
- At least one contact structure assigned to a measuring port of the contactless measuring system is identically formed on the signal waveguides of the calibration elements as the at least one contact structure assigned to this measuring port of the contactless measuring system on the signal waveguides the electrical circuit.
- the calibration substrate is formed as a circuit board on which at least one contact structure is formed and arranged such that this contact structure is electrically isolated from the signal waveguide, forms part of the coupling structure, completely in the near field of the signal waveguide is arranged and has at least one contact point, which is electrically contacted by a contact of a measuring tip.
- the contactless measuring system is preferably designed as described above, wherein it is particularly preferred here for at least one contact structure assigned to a measuring port of the contactless measuring system to be identical to the signal waveguides of the calibrating elements, as for the at least one contact structure assigned to this measuring port of the contactless measuring system Signal waveguides of the electrical circuit.
- At least one calibration element is connected to a number of signal waveguides corresponding to the number of measurement gates of the non-contact measurement system.
- At least one electrical circuit with at least one signal waveguide is formed on the circuit board of the calibration substrate, on which at least one contact structure is arranged such that the arrangement of the contact structure on the signal waveguide of the electrical circuit of the arrangement of the contact structures on the signal waveguides corresponds to a calibration.
- At least one contact structure assigned to a measuring port of the contactless measuring system is identical to the signal waveguides of the calibration elements, as are the at least one contact structure on the calibration substrate on the signal waveguides of the electrical circuit assigned to this measuring port of the contactless measuring system.
- a non-contact measuring system comprises a vector network analyzer 10 with a signal source 12, signal conductors 14 and 16 and a contact structure with four coupling waveguides 18, each having an inner conductor 20 and an outer conductor 22.
- the coupling waveguides 18 are formed as printed conductors on a printed circuit board 24.
- a signal waveguide 26 is formed as a printed wiring.
- the signal waveguide 26 is part of an otherwise not shown, formed on the printed circuit board 26 electronic circuit with corresponding electronic components.
- the coupling waveguides 18 in each case form, together with a measuring tip 28, a coupling structure for the contactless measuring system in order to decouple a contactless electromagnetic wave traveling on the signal waveguide 26.
- the measuring tips 28 on the one hand make electrical contact with one each Coupling waveguide 18 and on the other hand with the test ports 30, 32, 34, 36 of the vectorial network analyzer 10 ago.
- the coupling waveguide 18 can be formed almost arbitrarily. It is particularly advantageous to form the coupling waveguides 18 impedance-controlled, i. the characteristic characteristic impedances of the arrangement are known and optimized for low reflection.
- the advantage of an impedance-controlled contact structure is that an optimal directivity or a broadband insulated gate can be achieved.
- the in Fig. 2 illustrated coupling waveguide 18 includes the U-shaped inner conductor 20 and the outer conductor 22.
- the outer conductor 22 can be designed differently.
- the coupling waveguide 18 corresponds to a bent coplanar line.
- Another advantage of the contact structure according to the invention is that no vias to ground (rear base metallization of the circuit board 24) are necessary. However, the ability to connect the outer conductors 22 of the coupling waveguides 18 by means of vias to ground, not limited.
- the coupling waveguide 18 may be on the same substrate as the respective signal waveguide 26, but also in a multilayer board on another substrate.
- the contact structure with the coupling waveguides 18 is then connected to, for example, a commercially symmetrical on-wafer or PCB probe tip.
- the reference numeral 42 denotes in FIGS. 2 and 3 The contact positions of the contacts of measuring tips with the contact structure or the respective coupling waveguide 18.
- the probes 28 are connected to (vectorial) receivers of, for example, a conventional network analyzer, as in Fig. 1 shown.
- the measuring method for measuring by means of at least one impedance-controlled contact structure or at least one non-impedance-controlled contact structure within planar circuits of embedded measuring objects is described below.
- the method is basically based on the method of contactless vector network analysis.
- the disadvantage of the contactless vector network analysis is that the application of the method for obtaining accurate measured values is very much dependent on the positioning accuracy of the contactless probes.
- it is now intended to use printed contact structures in combination with conventional measuring tips, instead of a complex automatic positioning system in combination with complete contactless probes. In this case, all signal leads of the test objects and the calibration elements, which are necessary for a system error calibration, must be provided with at least one coupling waveguide 18 (contact structure).
- FIG Fig. 4 An example of a practical realization of a calibration substrate with embedded test objects (DUT3, DUT4) using contact structures with printed coupling waveguides 18 is shown in FIG Fig. 4 shown.
- the contact structure for each signal waveguide 26 in each case comprises two coupling waveguides 18 which, for example, according to the embodiment of FIG Fig. 2 are formed.
- a contact structure with at least N coupling waveguide 18 per signal waveguide 26 is necessary.
- each signal waveguide 26 of the embedded test object must have the same contact structure that is used in the calibration.
- the method thus includes the placement of a contact structure, for example in the form of a coupling waveguide 18 in the near field of the signal waveguide 26 of the calibration and test objects on a circuit board 24.
- the coupling waveguide 18 are arranged and formed on the circuit board 24 such that On the one hand, they hardly disturb the function of a circuit and, on the other hand, they can be interconnected with, for example, conventional on-wafer or PCB measuring tips.
- the Fig. 5 to 13 illustrated various exemplary embodiments for contact structures 44.
- the contact structures 44 may have very specific shapes. In principle, any shape can be used.
- the contact structure 44 In order to produce a reproducible coupling between the signal waveguide 26 and the coupling waveguide 18 or the signal waveguide 26 and the measuring probe 28 or the signal waveguide 26 and the coupling waveguide 18 and the measuring probe 28, has the contact structure 44, if it comprises a material surface, either holes in which the measuring tip is positioned, or a distinctive geometry on which the measuring tip is positioned.
- the contact structure 44 may also be formed as a notch in the substrate.
- Fig. 14 shows a second preferred embodiment of a calibration according to the invention, which is formed on a circuit board 46. Functionally identical parts are denoted by the same reference numerals as in Fig. 1 and 4 so that their explanation to the above description of Fig. 1 and 4 is referenced.
- Several calibration elements 48 are arranged on the calibration substrate and each calibration element 48 is connected to one, two or three signal waveguides 26. On the signal waveguides 26 are different from the first embodiment according to Fig. 4 no coupling waveguides, but contact structures 44 as in Fig. 5 to 13 illustrated, formed. Optionally, signals are applied to the signal waveguides 26 at respective pads 50.
- This calibration substrate includes various 1-port, 2-port and 3-port calibration standards 48 and various contact structures 44.
- Fig. 15 shows a third preferred embodiment of a calibration substrate according to the invention, which is formed on a circuit board 46.
- Functionally identical parts are denoted by the same reference numerals as in Fig. 1 . 4 and 14 so that their explanation to the above description of Fig. 1 . 4 and 14 is referenced.
- an electronic circuit 52 with components to be tested 54 (DUTs) is additionally formed on the circuit board 46 of the calibration substrate.
- Calibration elements 48 are arranged.
- the contact structure 44 for a specific test port on the signal waveguides 26 of the calibration elements are formed identically to the contact structure 44 for this test port on the signal waveguides 26 of the electronic circuit 52.
- the measuring system For the correct measurement of the scattering parameters of an N-gate, the measuring system must be calibrated. Depending on the calibration, M different N-port calibration standards (calibration elements 48) that are known or only partially known are required. For calibration using M calibration standards, the geometry and position of the contact structure and the signal waveguides 26 must each be identical for one gage, but may be different between the N gauges.
- three 2-port calibration standards are necessary for an LLR calibration. These may be, for example, two different lengths of wire and two short circuits, the short circuits each representing a 1-port object, but together corresponding to a 2-port object.
- the three 2-port standards can have two different feed lines (signal waveguide 26) per gate.
- the contact structure 44 may also be different in position and geometry at each lead (each signal waveguide 26). However, the signal waveguides 26 and the contact structure 44 at the respective ports 1 of the calibration standards and DUTs 48 must be identical. Also at port 2 of the calibration standards, the signal waveguides 26 and the contact structure 44 must coincide with each other, however, they may be different from those at the port 1.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Measurement Of Resistance Or Impedance (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
Die Erfindung betrifft ein Kalibriersubstrat für ein kontaktloses Messsystem, mit wenigstens einer Messspitze, die einen Teil einer Koppelstruktur zum kontaktlosen Auskoppeln eines auf einem Signal-Wellenleiter laufenden Signals ausbildet, wobei auf dem Kalibriersubstrat wenigstens ein Kalibrierelement, insbesondere Kurzschluss-Standard, Leerlauf-Standard, Widerstands-Standard, Leitungs-Standard, ausgebildet ist, wobei das wenigstens eine Kalibrierelement elektrisch mit wenigstens einem Signal-Wellenleiter, insbesondere Mikrostreifenleitung oder Koplanarleitung, verbunden ist, gemäß dem Oberbegriff des Anspruchs 1.The invention relates to a calibration substrate for a contactless measuring system, comprising at least one measuring tip, which forms part of a coupling structure for contactless coupling of a signal on a signal waveguide, wherein on the calibration substrate at least one calibration element, in particular short-circuit standard, no-load standard, Resistor standard, line standard, is formed, wherein the at least one calibration element is electrically connected to at least one signal waveguide, in particular microstrip line or coplanar line, according to the preamble of claim 1.
Die Bestimmung von Streuparametern von innerhalb einer komplexen Schaltung eingebetteten elektrischen Bauteilen mittels einer kontaktlosen Vektornetzwerkanalyse ist beispielsweise aus
Bei der kontaktlosen Vektornetzwerkanalyse wird für jedes Messtor eines unbekannten Testobjektes (DUT - Device Under Test) mindestens eine Messsonde, wie beispielsweise eine Leiterschleifen oder zwei kapazitive Sonden, benötigt. Aus
Obwohl die kontaktlose Vektornetzwerkanalyse das Potenzial hat, kontaktlos Bauteile zu charakterisieren, wurde bislang keine kontaktlose Streuparametermessung von innerhalb einer Schaltung eingebetteten HF- und Mikrowellenkomponenten durchgeführt. Wenn innerhalb einer Schaltung gemessen werden soll, müssen die Positionen der kontaktlosen Sonden während und nach der Kalibrierung verändert werden. Dies bedingt jedoch einen hohen Aufwand, die Messsondenposition während der Messung der Kalibrierstandards und des Testobjektes zu reproduzieren, denn die kleinsten Abweichungen bei der Sondenpositionierung führen bereits zu bedeutend großen Messfehlern.Although contactless vector network analysis has the potential to characterize components without contact, so far no contactless Scattering parameter measurement performed by embedded within a circuit RF and microwave components. When measuring within a circuit, the positions of the non-contact probes must be changed during and after calibration. However, this requires a lot of effort to reproduce the probe position during the measurement of the calibration standards and the test object, because the smallest deviations in the probe positioning already lead to significantly large measurement errors.
Der Erfindung liegt die Aufgabe zugrunde, ein kontaktloses Messsystem der o.g. Art derart auszugestalten, dass eine teure und aufwändige Positionierung von Koppelsonden entfallen kann.The invention is based on the object, a contactless measuring system of o.g. Design such a way that an expensive and complex positioning of coupling probes can be omitted.
Diese Aufgabe wird erfindungsgemäß durch ein Kalibriersubstrat der o.g. Art mit den in Anspruch 1 gekennzeichneten Merkmalen gelöst. Vorteilhafte Ausgestaltungen der Erfindung sind in den weiteren Ansprüchen beschrieben.This object is achieved by a calibration substrate of the o.g. Art solved with the features characterized in claim 1. Advantageous embodiments of the invention are described in the further claims.
Bei einem kontaktlosen Messsystem der o.g. Art ist es erfindungsgemäß vorgesehen, dass auf der Schaltungsplatine wenigstens eine Kontaktstruktur derart ausgebildet und angeordnet ist, dass diese Kontaktstruktur von dem Signal-Wellenleiter galvanisch getrennt ist, einen Teil der Koppelstruktur ausbildet, vollständig im Nahfeld des Signal-Wellenleiters angeordnet ist und wenigstens einen Kontaktpunkt aufweist, der von einem Kontakt einer Messspitze elektrisch kontaktierbar ist.In a non-contact measuring system of o.g. It is inventively provided that on the circuit board at least one contact structure is designed and arranged such that this contact structure is electrically isolated from the signal waveguide, forming part of the coupling structure, is arranged completely in the near field of the signal waveguide and at least one contact point has, which is electrically contacted by a contact of a measuring tip.
Dies hat den Vorteil, dass die Kontaktstruktur und damit die gesamte Koppelstruktur eine genau definierte geometrische Anordnung zum Signal-Wellenleiter aufweist, wobei eine manuelle Positionierung der Koppelstruktur entfallen kann. Es wird auf einfache Weise eine reproduzierbare Kopplung zwischen dem Signal-Wellenleiter und der Koppelstruktur erzielt.This has the advantage that the contact structure and thus the entire coupling structure has a precisely defined geometric arrangement to the signal waveguide, wherein a manual positioning of the coupling structure can be omitted. It is achieved in a simple manner, a reproducible coupling between the signal waveguide and the coupling structure.
Zweckmäßigerweise ist die Kontaktstruktur als Leiterbahn auf der Schaltungsplatine ausgebildet.Conveniently, the contact structure is formed as a conductor on the circuit board.
Ein besonders gute Signalauskopplung erzielt man dadurch, dass die Kontaktstruktur derart ausgebildet ist, dass diese von einer Messspitze impedanzelektrisch kontrolliert kontaktierbar ist.A particularly good signal decoupling is achieved in that the contact structure is designed such that it can be contacted by an impedance-controlled measuring tip.
Wenigstens eine Kontaktstruktur ist beispielsweise als Koppel-Wellenleiter mit Innenleiter und Außenleiter oder als wenigstens ein Kontaktpunkt oder Kontaktfläche für einen Kontakt einer Messspitze ausgebildet.At least one contact structure is formed, for example, as a coupling waveguide with inner conductor and outer conductor or as at least one contact point or contact surface for a contact of a measuring tip.
Zweckmäßigerweise sind die Kontaktstruktur und/oder der Signal-Wellenleiter als gedruckte Leiterbahnen auf der Schaltungsplatine ausgebildet.Conveniently, the contact structure and / or the signal waveguide are formed as printed conductors on the circuit board.
Beispielsweise ist die Schaltungsplatine als gedruckte Schaltungsplatine (PCB) oder Wafer ausgebildet.For example, the circuit board is formed as a printed circuit board (PCB) or wafer.
Eine optimale Richtdämpfung bzw. ein breitbandig isoliertes Tor erzielt man dadurch, dass die Kontaktstruktur als Wellenleiter ausgebildet ist, wobei das Verhältnis des induktiven zum kapazitiven Koppelfaktor gleich dem Produkt der Wellenwiderstände der einzelnen Wellenleiter der Kontaktstruktur ist.An optimal directivity or a broadband insulated gate achieved by the fact that the contact structure is formed as a waveguide, wherein the ratio of the inductive to the capacitive coupling factor is equal to the product of the characteristic impedance of the individual waveguide of the contact structure.
In einer beispielhaften Ausführungsform weist die Koppelstruktur wenigstens eine, insbesondere zwei, Kontaktstrukturen je Messtor auf.In an exemplary embodiment, the coupling structure has at least one, in particular two, contact structures per test port.
In einer bevorzugten Ausführungsform ist die Schaltungsplatine eine Mehrlagenplatine mit mehreren Substratlagen, wobei der Signal-Wellenleiter auf einer ersten Substratlage der Mehrlagenplatine und wenigstens eine Kontaktstruktur auf der ersten oder wenigstens einer anderen Substratlage der Mehrlagenplatine ausgebildet ist.In a preferred embodiment, the circuit board is a multilayer board having a plurality of substrate layers, wherein the signal waveguide is formed on a first substrate layer of the multilayer board and at least one contact structure on the first or at least one other substrate layer of the multilayer board.
Beispielsweise sind wenigstens zwei der Kontaktstrukturen auf verschiedenen Substratlagen der Mehrlagenplatine angeordnet.For example, at least two of the contact structures are arranged on different substrate layers of the multilayer board.
In einer besonders bevorzugten Ausführungsform weist die wenigstens eine Kontaktstruktur Kontaktpunkte auf, welche derart ausgebildet und angeordnet sind, dass eine Kontaktierung mit On-Wafer- oder PCB-Messspitzen einen impedanzkontrollierten Übergang ergibt.In a particularly preferred embodiment, the at least one contact structure has contact points which are designed and arranged in such a way that contacting with on-wafer or PCB measuring tips results in an impedance-controlled transition.
Zur schnellen und einfachen Kalibrierung des kontaktlosen Messsystems ist auf der Schaltungsplatine zusätzliche wenigstens ein Kalibrierelement ausgebildet, welches mit wenigstens einem Signal-Wellenleiter verbunden ist, an dem wenigstens eine Kontaktstruktur derart angeordnet ist, dass die Anordnung der Kontaktstruktur an dem Signal-Wellenleiter eines Kalibrierelementes der Anordnung der Kontakstrukturen an den Signal-Wellenleitern der elektrischen Schaltung entspricht.For quick and easy calibration of the contactless measuring system, at least one calibration element is additionally formed on the circuit board, which is connected to at least one signal waveguide on which at least one contact structure is arranged such that the arrangement of the contact structure on the signal waveguide of a calibration Arrangement of the contact structures on the signal waveguides of the electrical circuit corresponds.
Wenigstens ein Kalibrierelement ist mit einer Anzahl von Signal-Wellenleitern verbunden, die der Anzahl von Messtoren des kontaktlosen Messsystems entspricht.At least one calibration element is connected to a number of signal waveguides corresponding to the number of measurement gates of the non-contact measurement system.
Um an den Kalibrierelementen und der elektrischen Schaltung identische Koppelverhältnisse mit optimaler Kalibrierung herzustellen, ist wenigstens eine einem Messtor des kontaktlosen Messsystems zugeordnete Kontaktstruktur an den Signal-Wellenleitern der Kalibrierelemente identisch ausgebildet wie die wenigstens eine diesem Messtor des kontaktlosen Messsystems zugeordnete Kontaktstruktur an den Signal-Wellenleitern der elektrischen Schaltung.In order to produce identical coupling ratios with optimum calibration at the calibration elements and the electrical circuit, at least one contact structure assigned to a measuring port of the contactless measuring system is identically formed on the signal waveguides of the calibration elements as the at least one contact structure assigned to this measuring port of the contactless measuring system on the signal waveguides the electrical circuit.
Bei einem Kalibriersubstrat der o.g. Art ist es erfindungsgemäß vorgesehen, dass das Kalibriersubstrat als Schaltungsplatine ausgebildet ist, auf dem wenigstens eine Kontaktstruktur derart ausgebildet und angeordnet ist, dass diese Kontaktstruktur von dem Signal-Wellenleiter galvanisch getrennt ist, einen Teil der Koppelstruktur ausbildet, vollständig im Nahfeld des Signal-Wellenleiters angeordnet ist und wenigstens einen Kontaktpunkt aufweist, der von einem Kontakt einer Messspitze elektrisch kontaktierbar ist.For a calibration substrate of the above mentioned It is inventively provided that the calibration substrate is formed as a circuit board on which at least one contact structure is formed and arranged such that this contact structure is electrically isolated from the signal waveguide, forms part of the coupling structure, completely in the near field of the signal waveguide is arranged and has at least one contact point, which is electrically contacted by a contact of a measuring tip.
Dies hat den Vorteil, dass die Kontaktstruktur und damit die gesamte Koppelstruktur eine genau definierte geometrische Anordnung zum Signal-Wellenleiter aufweist, wobei eine manuelle Positionierung der Koppelstruktur entfallen kann. Es wird auf einfache Weise eine reproduzierbare Kopplung zwischen dem Signal-Wellenleiter und der Koppelstruktur erzielt.This has the advantage that the contact structure and thus the entire coupling structure has a precisely defined geometric arrangement to the signal waveguide, wherein a manual positioning of the coupling structure can be omitted. It is achieved in a simple manner, a reproducible coupling between the signal waveguide and the coupling structure.
Das kontaktlose Messsystem ist bevorzugt wie zuvor beschrieben ausgebildet, wobei es hierbei besonders bevorzugt ist, dass wenigstens eine einem Messtor des kontaktlosen Messsystems zugeordnete Kontaktstruktur an den Signal-Wellenleitern der Kalibrierelemente identisch ausgebildet ist wie die wenigstens eine diesem Messtor des kontaktlosen Messsystems zugeordnete Kontaktstruktur an den Signal-Wellenleitern der elektrischen Schaltung.The contactless measuring system is preferably designed as described above, wherein it is particularly preferred here for at least one contact structure assigned to a measuring port of the contactless measuring system to be identical to the signal waveguides of the calibrating elements, as for the at least one contact structure assigned to this measuring port of the contactless measuring system Signal waveguides of the electrical circuit.
Wenigstens ein Kalibrierelement ist mit einer Anzahl von Signal-Wellenleitern verbunden, die der Anzahl von Messtoren des kontaktlosen Messsystems entspricht.At least one calibration element is connected to a number of signal waveguides corresponding to the number of measurement gates of the non-contact measurement system.
Zweckmäßigerweise ist auf der Schaltungsplatine des Kalibriersubstrates wenigstens eine elektrische Schaltung mit wenigstens einem Signal-Wellenleiter ausgebildet, an dem wenigstens eine Kontaktstruktur derart angeordnet ist, dass die Anordnung der Kontaktstruktur an dem Signal-Wellenleiter der elektrischen Schaltung der Anordnung der Kontaktstrukturen an den Signal-Wellenleitern eines Kalibrierelementes entspricht.Expediently, at least one electrical circuit with at least one signal waveguide is formed on the circuit board of the calibration substrate, on which at least one contact structure is arranged such that the arrangement of the contact structure on the signal waveguide of the electrical circuit of the arrangement of the contact structures on the signal waveguides corresponds to a calibration.
In einer bevorzugten Ausführungsform ist wenigstens eine einem Messtor des kontaktlosen Messsystems zugeordnete Kontaktstruktur an den Signal-Wellenleitern der Kalibrierelemente identisch ausgebildet wie die wenigstens eine diesem Messtor des kontaktlosen Messsystems zugeordnete Kontaktstruktur auf dem Kalibriersubstrat an den Signal-Wellenleitern der elektrischen Schaltung.In a preferred embodiment, at least one contact structure assigned to a measuring port of the contactless measuring system is identical to the signal waveguides of the calibration elements, as are the at least one contact structure on the calibration substrate on the signal waveguides of the electrical circuit assigned to this measuring port of the contactless measuring system.
Die Erfindung wird im Folgenden anhand der Zeichnung näher erläutert. Diese zeigt in:
- Fig. 1
- ein schematisches Blockschaltbild einer bevorzugten Ausführungsform eines erfindungsgemäßen kontaktlosen Messsystems mit einem vektoriellen Netzwerkanalysator,
- Fig. 2
- eine erste bevorzugte Ausführungsform einer Kontaktstruktur für das erfindungsgemäße kontaktlose Messsystem,
- Fig. 3
- eine zweite bevorzugte Ausführungsform einer Kontaktstruktur für das erfindungsgemäße kontaktlose Messsystem und
- Fig. 4
- eine erste bevorzugte Ausführungsform eines erfindungsgemäßen Kalibriersubstrats für das erfindungsgemäße kontaktlose Messsystem in Draufsicht,
- Fig. 5
- eine beispielhafte, alternative Ausführungsform einer Kontaktstruktur für das erfindungsgemäße kontaktlose Messsystem,
- Fig. 6
- eine weitere beispielhafte, alternative Ausführungsform einer Kontaktstruktur für das erfindungsgemäße kontaktlose Messsystem,
- Fig. 7
- eine weitere beispielhafte, alternative Ausführungsform einer Kontaktstruktur für das erfindungsgemäße kontaktlose Messsystem,
- Fig. 8
- eine weitere beispielhafte, alternative Ausführungsform einer Kontaktstruktur für das erfindungsgemäße kontaktlose Messsystem,
- Fig. 9
- eine weitere beispielhafte, alternative Ausführungsform einer Kontaktstruktur für das erfindungsgemäße kontaktlose Messsystem,
- Fig. 10
- eine weitere beispielhafte, alternative Ausführungsform einer Kontaktstruktur für das erfindungsgemäße kontaktlose Messsystem,
- Fig. 11
- eine weitere beispielhafte, alternative Ausführungsform einer Kontaktstruktur für das erfindungsgemäße kontaktlose Messsystem,
- Fig. 12
- eine weitere beispielhafte, alternative Ausführungsform einer Kontaktstruktur für das erfindungsgemäße kontaktlose Messsystem,
- Fig. 13
- eine weitere beispielhafte, alternative Ausführungsform einer Kontaktstruktur für das erfindungsgemäße kontaktlose Messsystem,
- Fig. 14
- eine zweite bevorzugte Ausführungsform eines erfindungsgemäßen Kalibriersubstrats für das erfindungsgemäße kontaktlose Messsystem in Draufsicht und
- Fig. 15
- eine dritte bevorzugte Ausführungsform eines erfindungsgemäßen Kalibriersubstrats für das erfindungsgemäße kontaktlose Messsystem in Draufsicht.
- Fig. 1
- 3 is a schematic block diagram of a preferred embodiment of a contactless measuring system according to the invention with a vectorial network analyzer,
- Fig. 2
- A first preferred embodiment of a contact structure for the contactless measuring system according to the invention,
- Fig. 3
- a second preferred embodiment of a contact structure for the contactless measuring system according to the invention and
- Fig. 4
- a first preferred embodiment of a calibration substrate according to the invention for the contactless measuring system according to the invention in plan view,
- Fig. 5
- an exemplary, alternative embodiment of a contact structure for the contactless measuring system according to the invention,
- Fig. 6
- a further exemplary, alternative embodiment of a contact structure for the contactless measuring system according to the invention,
- Fig. 7
- a further exemplary, alternative embodiment of a contact structure for the contactless measuring system according to the invention,
- Fig. 8
- a further exemplary, alternative embodiment of a contact structure for the contactless measuring system according to the invention,
- Fig. 9
- a further exemplary, alternative embodiment of a contact structure for the contactless measuring system according to the invention,
- Fig. 10
- a further exemplary, alternative embodiment of a contact structure for the contactless measuring system according to the invention,
- Fig. 11
- a further exemplary, alternative embodiment of a contact structure for the contactless measuring system according to the invention,
- Fig. 12
- a further exemplary, alternative embodiment of a contact structure for the contactless measuring system according to the invention,
- Fig. 13
- a further exemplary, alternative embodiment of a contact structure for the contactless measuring system according to the invention,
- Fig. 14
- a second preferred embodiment of a calibration substrate according to the invention for the contactless measuring system according to the invention in plan view and
- Fig. 15
- a third preferred embodiment of a calibration substrate according to the invention for the contactless measuring system according to the invention in plan view.
Die in
Die Koppel-Wellenleiter 18 bilden jeweils zusammen mit einer Messspitze 28 eine Kopplungsstruktur für das kontaktlose Messsystem aus, um eine auf dem Signal-Wellenleiter 26 laufende, elektromagnetische Welle kontaktlos auszukoppeln. Die Messspitzen 28 stellen einerseits einen elektrischen Kontakt mit jeweils einem Koppel-Wellenleiter 18 und andererseits mit den Messtoren 30, 32, 34, 36 des vektoriellen Netzwerkanalysators 10 her.The coupling waveguides 18 in each case form, together with a measuring
Die Koppel-Wellenleiter 18 können nahezu beliebig geformt sein. Es ist besonders vorteilhaft, die Koppel-Wellenleiter 18 impedanzkontrolliert auszubilden, d.h. die charakteristischen Wellenwiderstände der Anordnung sind bekannt und auf Reflexionsarmut optimiert. Der Vorteil einer impedanzkontrollierten Kontaktstruktur liegt darin, dass eine optimale Richtdämpfung bzw. ein breitbandig isoliertes Tor erzielt werden kann.The
Zwei Beispiele eines derartigen impedanzkontrollierten Koppel-Wellenleiters 18 zeigen die
Ein weiterer Vorteil der erfindungsgemäßen Kontaktstruktur ist, dass keine Durchkontaktierungen gegen Masse (rückwärtige Grundmetallisierung der Schaltungsplatine 24) notwendig sind. Jedoch ist die Möglichkeit, die Außenleiter 22 der Koppel-Wellenleiter 18 mittels Durchkontaktierungen mit Masse zu verbinden, nicht eingeschränkt.Another advantage of the contact structure according to the invention is that no vias to ground (rear base metallization of the circuit board 24) are necessary. However, the ability to connect the
Für die Energieauskopplung von dem Signal-Wellenleiter 26 eines Testobjektes (DUT - Devide Under Test) wird jeweils mindestens eine Kontaktstruktur bzw. Koppel-Wellenleiter 18 in das Nahfeld des jeweiligen Signal-Wellenleiters 26 gebracht. Dabei kann sich der Koppel-Wellenleiter 18 auf demselben Substrat wie der jeweilige Signal-Wellenleiter 26, aber auch bei einer Mehrlagenplatine auf einem anderen Substrat befinden. Die Kontaktstruktur mit den Koppel-Wellenleitern 18 wird dann beispielsweise mit einer kommerziellen symmetrischen On-Wafer- oder PCB-Messspitze verbunden. Das Bezugszeichen 42 kennzeichnet in
Die Geometrie der Koppel-Wellenleiter 18 und der Messspitze 28 beeinflussen beide den Koppelfaktor der Anordnung. Die Messspitzen 28 werden mit (vektoriellen) Empfängern beispielsweise eines herkömmlichen Netzwerkanalysators verbunden, wie in
Das Messverfahren zum Messen mit Hilfe mindestens einer impedanzkontrollierten Kontaktstruktur oder mindestens einer nicht impedanzkontrollierten Kontaktstruktur innerhalb von planaren Schaltungen eingebetteter Messobjekte wird im Folgenden beschrieben.The measuring method for measuring by means of at least one impedance-controlled contact structure or at least one non-impedance-controlled contact structure within planar circuits of embedded measuring objects is described below.
Das Verfahren beruht grundsätzlich auf dem Verfahren der kontaktlosen Vektornetzwerkanalyse. Der Nachteil der kontaktlosen Vektornetzwerkanalyse ist, dass die Anwendung des Verfahrens zum Erzielen genauer Messwerte sehr stark von der Positioniergenauigkeit der kontaktlosen Messsonden abhängt. Erfindungsgemäß ist es nunmehr vorgesehen, gedruckte Kontaktstrukturen in Kombination mit herkömmlichen Messspitzen, anstatt eines aufwändigen automatischen Positioniersystems in Kombination mit vollständigen kontaktlosen Sonden, zu verwenden. Dabei müssen alle Signalzuleitungen der Testobjekte und der Kalibrierelemente, die für eine Systemfehlerkalibrierung notwendig sind, mit mindestens einem Koppel-Wellenleiter 18 (Kontaktstruktur) versehen werden.The method is basically based on the method of contactless vector network analysis. The disadvantage of the contactless vector network analysis is that the application of the method for obtaining accurate measured values is very much dependent on the positioning accuracy of the contactless probes. According to the invention, it is now intended to use printed contact structures in combination with conventional measuring tips, instead of a complex automatic positioning system in combination with complete contactless probes. In this case, all signal leads of the test objects and the calibration elements, which are necessary for a system error calibration, must be provided with at least one coupling waveguide 18 (contact structure).
Ein Beispiel für eine praktische Realisierung eines Kalibriersubstrates mit eingebetteten Testobjekten (DUT3, DUT4) unter Verwendung von Kontaktstrukturen mit gedruckten Koppel-Wellenleiter 18 ist in
Aufgrund der kleinen Dimensionen der Koppel-Wellenleiter 18 können beispielsweise On-Wafer- oder PCB-Messspitzen reproduzierbar auf die identischen Koppel-Wellenleiter 18 der einzelnen Kalibrierelemente (LINE1, LINE2, LINE3, LINE4, OPEN, SHORT) positioniert werden. Nach dem das System kalibriert worden ist, können beispielsweise die Streuparameter von eingebetteten Bauteilen bestimmt werden. Jedoch müssen die Signalleitungen der Bauteile die gleichen Eigenschaften besitzen (Geometrie, Wellenwiderstand, etc.) wie die der Kalibrierelemente. Zudem muss auf der planaren Schaltung an jedem Signal-Wellenleiter 26 des eingebetteten Testobjektes (DUT) die gleiche Kontaktstruktur, die auch bei der Kalibrierung verwendet wird, vorhanden sein.Due to the small dimensions of the
Das Verfahren beinhaltet also die Platzierung einer Kontaktstruktur beispielsweise in Form eines Koppel-Wellenleiters 18 im Nahfeld des Signal-Wellenleiters 26 der Kalibrier- und Testobjekte auf einer Schaltungsplatine 24. Die Koppel-Wellenleiter 18 sind dabei auf der Schaltungsplatine 24 derart angeordnet und ausgebildet, dass sie zum einen die Funktion einer Schaltung kaum stören und zum anderen mit beispielsweise herkömmlichen On-Wafer- bzw. PCB-Messspitzen verschaltet werden können.The method thus includes the placement of a contact structure, for example in the form of a
Die
Für die richtige Messung der Streuparameter eines N-Tores muss das Messsystem kalibriert werden. Je nach Kalibrierung werden M verschiedene N-Tor-Kalibrierstandards (Kalibrierelemente 48), die bekannt oder nur teilweise bekannt sind, benötigt. Für eine Kalibrierung unter Verwendung von M Kalibrierstandards müssen die Geometrie und die Position der Kontaktstruktur und der Signal-Wellenleiter 26 jeweils für ein Messtor identisch sein, können aber zwischen den N-Messtoren unterschiedlich sein.For the correct measurement of the scattering parameters of an N-gate, the measuring system must be calibrated. Depending on the calibration, M different N-port calibration standards (calibration elements 48) that are known or only partially known are required. For calibration using M calibration standards, the geometry and position of the contact structure and the
Sollen beispielsweise die Streuparameter eines 2-Tor-Objektes gemessen werden, sind für eine LLR-Kalibrierung drei 2-Tor-Kalibrierstandards notwendig. Dies können zum Beispiel zwei unterschiedlich lange Leitungen und zwei Kurzschlüsse sein, wobei die Kurzschlüsse jeweils ein 1-Tor-Objekt darstellen, aber zusammen einem 2-Tor-Objekt entsprechen. Die drei 2-Tor-Standards können je Tor zwei unterschiedliche Zuleitungen (Signal-Wellenleiter 26) besitzen. Die Kontaktstruktur 44 können ebenfalls an jeder Zuleitung (jedem Signal-Wellenleiter 26) unterschiedlich in der Position und der Geometrie sein. Jedoch müssen die Signal-Wellenleiter 26 und die Kontaktstruktur 44 an den jeweiligen Toren 1 der Kalibrierstandards und DUTs 48 identisch sein. Auch am Tor 2 der Kalibrierstandards müssen die Signal-Wellenleiter 26 und die Kontaktstruktur 44 untereinander übereinstimmen, jedoch können sie sich zu denen am Tor 1 unterscheiden.If, for example, the scattering parameters of a 2-port object are to be measured, three 2-port calibration standards are necessary for an LLR calibration. These may be, for example, two different lengths of wire and two short circuits, the short circuits each representing a 1-port object, but together corresponding to a 2-port object. The three 2-port standards can have two different feed lines (signal waveguide 26) per gate. The
Claims (4)
- Calibration substrate for a contactless measuring system, comprising at least one probe tip which comprises part of a coupling structure for contactless extraction of a signal travelling along a signal waveguide (26), wherein at least one calibration element (48) is provided on the calibration substrate, in particular a short-circuit standard, an open circuit standard, a resistance standard or a conductor standard, wherein the at least one calibration element is electrically connected to at least one signal waveguide (26), particularly a microstrip line or a coplanar line, characterised in that the calibration substrate is configured as a circuit board (46) on which at least one contact structure (44) is configured and arranged such that said contact structure (44) is galvanically isolated from the signal waveguide (26), and comprises part of the coupling structure, is entirely arranged in the near field region of the signal waveguide (26) and comprises at least one contact point (42) which is electrically contactable by a contact of a probe tip (28).
- Calibration substrate according to claim 1, characterised in that at least one calibration element (48) is connected to a number of signal waveguides (26) which corresponds to the number of measurement ports of the contactless measuring system.
- Calibration substrate according to one of the claims 1 or 2, characterised in that arranged on the circuit board (46) of the calibration substrate is at least one electrical circuit (52) comprising at least one signal waveguide (26), at which at least one contact structure (44) is arranged such that the arrangement of the contact structure (44) at the signal waveguide (26) of the electrical circuit (52) corresponds to the arrangement of the contact structures (44) at the signal waveguides (26) of a calibration element (44).
- Calibration substrate according to claim 3, characterised in that at least one contact structure (44) allocated to a measurement port of the contactless measuring system and arranged at the signal waveguides (26) of the calibration elements (48) is configured identically to the at least one contact structure (44) allocated to said measurement port of the contactless measurement system and arranged on the calibration substrate at the signal waveguides (26) of the electrical circuit (52).
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DE202007010784U DE202007010784U1 (en) | 2007-08-03 | 2007-08-03 | Contactless measuring system |
EP08785051A EP2174151B1 (en) | 2007-08-03 | 2008-07-24 | Contactless measuring system |
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DE202008009469U1 (en) | 2008-07-15 | 2008-09-11 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | probe |
DE202008010533U1 (en) | 2008-08-07 | 2008-10-30 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Contactless loop probe |
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CN103064011B (en) * | 2012-12-27 | 2015-12-23 | 广州中大微电子有限公司 | Examining system and method in a kind of rfid interrogator chip |
CN104101854B (en) * | 2014-07-22 | 2017-03-01 | 中国电子科技集团公司第四十一研究所 | A kind of integrated waveguide calibrating device by Electromagnetic Drive |
CN104569888B (en) * | 2014-12-24 | 2017-06-06 | 北京无线电计量测试研究所 | A kind of utilization micro-strip collimation method calibrates the system and method for near field probes modifying factor |
US11815347B2 (en) * | 2016-09-28 | 2023-11-14 | Kla-Tencor Corporation | Optical near-field metrology |
JP6884082B2 (en) * | 2017-10-11 | 2021-06-09 | 株式会社Screenホールディングス | Film thickness measuring device, substrate inspection device, film thickness measuring method and substrate inspection method |
US10852344B2 (en) | 2017-12-12 | 2020-12-01 | Micron Technology, Inc. | Inductive testing probe apparatus for testing semiconductor die and related systems and methods |
CN110208674B (en) * | 2019-05-08 | 2021-05-25 | 天津大学 | Directional coupling near-field probe and system for nonlinear radiation signal detection |
CN110531161B (en) * | 2019-07-29 | 2020-10-23 | 北京航空航天大学 | Non-contact type on-line testing device for input impedance of each position of printed circuit board |
WO2023223541A1 (en) * | 2022-05-20 | 2023-11-23 | 日本電信電話株式会社 | Dielectric spectrometry device |
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2007
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2010
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US20110260743A1 (en) | 2011-10-27 |
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EP2341354A1 (en) | 2011-07-06 |
CN101790690A (en) | 2010-07-28 |
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WO2009018928A1 (en) | 2009-02-12 |
US20140300381A1 (en) | 2014-10-09 |
CN101790690B (en) | 2013-03-06 |
JP2010535329A (en) | 2010-11-18 |
EP2174151A1 (en) | 2010-04-14 |
HK1159253A1 (en) | 2012-07-27 |
HK1145041A1 (en) | 2011-03-25 |
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