Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
  • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
  • H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K1/00—Soldering, e.g. brazing, or unsoldering
  • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
  • B23K1/0016—Brazing of electronic components
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K1/00—Soldering, e.g. brazing, or unsoldering
  • B23K1/005—Soldering by means of radiant energy
  • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
  • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2101/00—Articles made by soldering, welding or cutting
  • B23K2101/36—Electric or electronic devices
  • B23K2101/38—Conductors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
  • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
  • H01L2224/45001—Core members of the connector
  • H01L2224/4501—Shape
  • H01L2224/45012—Cross-sectional shape
  • H01L2224/45015—Cross-sectional shape being circular
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
  • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
  • H01L2224/45001—Core members of the connector
  • H01L2224/45099—Material
  • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
  • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
  • H01L2224/45147—Copper (Cu) as principal constituent
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
  • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L24/42—Wire connectors; Manufacturing methods related thereto
  • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
  • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L24/42—Wire connectors; Manufacturing methods related thereto
  • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01006—Carbon [C]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01029—Copper [Cu]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01033—Arsenic [As]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/0105—Tin [Sn]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01068—Erbium [Er]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01077—Iridium [Ir]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01082—Lead [Pb]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/013—Alloys
  • H01L2924/014—Solder alloys
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/10—Details of semiconductor or other solid state devices to be connected
  • H01L2924/11—Device type
  • H01L2924/12—Passive devices, e.g. 2 terminal devices
  • H01L2924/1204—Optical Diode
  • H01L2924/12042—LASER
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E10/00—Energy generation through renewable energy sources
  • Y02E10/50—Photovoltaic [PV] energy

Definitions

• the invention relates to a method for soldering contact wires to a solar cell, as is carried out in particular during assembly, including electrical interconnection of a plurality of solar cells to form a composite or a module.
• the cells In order to reduce mechanical stresses caused by the different expansion coefficients of the materials to be joined, and thus to avoid cell breakage, the cells should be preheated.
• the required preheating of the cell under circumstances up to almost the liquidus temperature of the solder, and the subsequent soldering process can cause a fracture of the solar cell in the worst case, especially if it has already been weakened by microcracks.
• the invention has for its object to provide an aforementioned method, can be avoided with the disadvantages of the prior art and in particular mechanical stresses in the solar cell by the preheating or the soldering process itself as possible reduced or even eliminated altogether.
• the solar cell has at least one metallized contact region, which is advantageously strip-shaped.
• This contact region may also be metallized instead of metallized, that is not as a metallized coating of the solar cell, but rather a metal part.
• a contact wire is soldered to electrically connect the solar cell.
• the soldering time or the duration of the energy input from the outside to the soldering area, ie in particular to the contact wire is less than 800 ms.
• the soldering time or the energy input duration is even less than 500 ms, for example 300 ms to 400 ms.
• the energy input for soldering takes place with a predetermined temperature profile over time.
• a temperature profile looks particularly advantageous in such a way that the energy input or thus the temperature at the soldering area or the solder at the beginning of the soldering process rises very sharply to a maximum temperature. After reaching this maximum temperature, it can be kept short and should then fall off relatively quickly, so that, so to speak, the solder is heated very quickly to melting temperature. Then there is another, but lower energy input to produce the flow of the solder and a connection to the contact area. Therefore, after reaching the maximum temperature, a lower temperature is sufficient to continue the soldering process or to produce the solder joint safely and permanently. A drop in temperature can be made to about 60% of the maximum temperature. Thereafter, the energy input stops again relatively abruptly and the soldering process or the energy input is quickly terminated by rapid drop in temperature without energy input, so that the solder can solidify and the solder joint is completed.
• the soldering process or the energy input is advantageously a controlled process, ie not just the controlled departure of a predetermined curve for the energy input or the like with a temperature measuring device, advantageous a pyrometer, the temperature development at the soldering area are monitored. This temperature is returned as a control variable to the power generation for precise control, so that the energy input is just regulated so that a predetermined course is achieved, in particular to achieve the prescribed temperature profile.
• a temperature measuring device advantageous a pyrometer
• the solar cell is preheated before the soldering process similar to the prior art.
• preheating advantageously takes place at a temperature of less than 80 ° C.
• the solar cell is particularly advantageously preheated to approximately the average working temperature of the subsequent operation, since it is sufficiently designed for this load and thus does not generate any mechanical stresses at this temperature through the connection become. This may be, for example, a little less than 65 ° C.
• mechanical stresses or strains on the solar cell are avoided by the preheating itself.
• the preheating can be improved by the effect of preheating the soldering and the soldering time can be reduced.
• Preheating the solar cell before soldering can be done in the usual way. Above all, the preheating also serves to ensure that the soldered connection is as good as possible, since the solder then flows sufficiently well on the metallized or metallic region.
• the solder melting temperature is about 200 0 C, depending on the solder used. Should lead-free solder are used, the solder melt temperature is again 30 ° C to 40 0 C higher.
• a certain cooling is made. This can, for example, by blowing with cooling air or the like. be achieved. Although the cooling effect is limited here, it still exerts a certain effect. Thus, spreading heat into the solar cell, which is considered harmful, can be avoided.
• the energy input during the soldering process can be carried out with a laser, which also enables a very fast and sufficiently high energy input.
• a light spot of the laser preferably projects laterally over the contact wire and irradiates either the slightly wider metallized or metallic contact area or the solar cell itself.
• the light spot for example, in its diameter be about twice as large as the width of the illuminated contact wire, so that it heats the solar cell in each case about one quarter of its diameter or the corresponding pitch circle.
• an aforementioned larger light spot of the laser it is possible for an aforementioned larger light spot of the laser that the laser is defocused in its edge region, in particular in an edge region of 10% to 50% and advantageously about 30% of its diameter.
• the energy input therein can be lower and thus lower than the amount of energy input necessary for the solder melting temperature, so that virtually less heating is carried out here.
• a compensation of the temperature distribution and thus the occurrence of mechanical stresses can be avoided.
• the metallic or metallized strip-shaped contact region of the solar cell, to which the contact wire is soldered is elongate., In particular over the entire length of the solar cell goes the contact wire is soldered at several points, for example, two or three points, especially at a distance of 1cm to 2cm. These distributed solder joints suffice for a sufficiently good mechanical and electrical connection.
• a contact wire tinned copper wire may be provided.
• it can be provided with solder immediately, so that the separate supply is eliminated.
• the contact wire is a flat wire. He can be several times wider than thick.
• the width can be between 1mm and 3mm, advantageously between 1, 3mm and 2.5mm. Its thickness can be about one-twentieth to one-tenth of the width.
• Fig. 2 is a side view of the two solar cells of FIG. 1 with
• Fig. 3 is an enlarged plan view of the laser spot in the soldering area
• the upper side 15 carries two narrow, strip-shaped contact regions 18a, which are produced in the usual way by a metal coating on the solar cell. There may also be three such contact areas.
• At the bottom 16 are corresponding metal coated contact areas 18b provided, which also extend over the entire length of the solar cell 11 and 11 '.
• Contact wires 20 extend over most of the length of the upper contact regions 18a of the solar cell 11 and are then bent in the space down to again have a projection 21 with a parallel projection. This projection 21 is about one-third as long as the resting on the top 15 contact wire 20th
• the projection 21 abuts the left ends of the lower contact regions 18b of the solar cell 11 '.
• the solder joint is made.
• FIG. 2 shows a preheating 23 which, in a manner known per se, preheats the underside 16 of the solar cell 11 ', at which the soldering takes place, to an initially mentioned temperature.
• the preheating 23 may be formed as usual, for example an IR radiant heater or the like.
• the soldering process is carried out with a laser 25 and its laser beam 26 or laser spot 27.
• the laser spot 27 lies in the soldering region 32, as can be seen from the enlargement in FIG. 3.
• the soldering process is monitored with respect to the resulting temperature by means of a pyrometer 29.
• preheating 23, laser 25 and pyrometer 29 are connected to a controller 30 which controls the individual components and the entire soldering process and simultaneously monitors or regulates.
• an outer laser spot region 27b which is shown in phantom. is is. It not only overlaps the contact wire 20 or its projection 21 a good distance, but even the lower contact region 18b. Furthermore, an inner laser spot 27a is provided, which is shown in dashed lines and whose diameter is indeed larger than the width of the projection 21 of the contact wire 20, but approximately in the range of the width of the lower contact portion 18b. The laser axis 28 is aligned exactly to the center of the supernatant 21.
• the inner laser spot region 27a In the area of the inner laser spot area 27a, such a high energy input by the laser 25 takes place that soldering takes place in the soldering area 32, ie, for example, that the surface of the solder forming the supernatant 21 melts and forms a solder connection with the lower contact area 18b. To heat it, the inner laser spot region 27 extends just over the width of the supernatant 21 for a corresponding heating.
• FIG. 4 shows how the energy input E can look over time t.
• the soldering process begins, the amount of energy increases very rapidly in a very short time up to the value E max . This can be done in a few ms, possibly even the laser 25 can start immediately with full power, ie E max .
• the maximum energy input E m3x is reached at time t2, shortly after t1, for example after 10ms. From then on, the energy input E drops again, down to a value Emin at time t3. The fall can either be approximately linear or over- or under-proportional.
• the Energy input E stops the Energy input E as quickly as possible and the soldering process or at least the energy input is completed.
• the soldering process can be terminated by solidification of the solder.
• the duration of the soldering process between t1 and t3 may be, for example, at the aforementioned 500 ms or even lower.
• a temperature resulting from the soldering process in the soldering region 32 is not shown, the course of the energy input E is rather similar in each case with a delay. It thus rises much more slowly than the energy input E, but then drops or falls somewhat more slowly After the time t3, although a bit stronger than before, but in the manner of a decaying curve.
• Such a predetermined temperature profile can represent, as it were, the controlled variable for the controller 30 in the soldering area 32.
• the controller 30 monitors the departure of this temperature profile via the pyrometer 29 with possible correction intervention on the energy input E.
• this soldering process is particularly suitable for punctiform solder areas 32, so no continuous soldering.

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• Engineering & Computer Science (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Mechanical Engineering (AREA)
• Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Life Sciences & Earth Sciences (AREA)
• Sustainable Development (AREA)
• Sustainable Energy (AREA)
• Manufacturing & Machinery (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Electromagnetism (AREA)
• General Physics & Mathematics (AREA)
• Photovoltaic Devices (AREA)

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• 2008
  • 2008-08-29 DE DE200810046330 patent/DE102008046330A1/de not_active Withdrawn
• 2009
  • 2009-08-28 EP EP09778197A patent/EP2329533A2/de not_active Withdrawn
  • 2009-08-28 JP JP2011524267A patent/JP2012501082A/ja active Pending
  • 2009-08-28 WO PCT/EP2009/006268 patent/WO2010022977A2/de active Application Filing
  • 2009-08-28 TW TW98129091A patent/TW201017916A/zh unknown
  • 2009-08-28 CA CA2736862A patent/CA2736862A1/en not_active Abandoned
• 2011
  • 2011-02-28 US US13/036,665 patent/US20110163085A1/en not_active Abandoned

Non-Patent Citations (1)

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