EP2321848A4 - MORE CHIP-HEAD-ASSEMBLER - Google Patents
MORE CHIP-HEAD-ASSEMBLERInfo
- Publication number
- EP2321848A4 EP2321848A4 EP08782947A EP08782947A EP2321848A4 EP 2321848 A4 EP2321848 A4 EP 2321848A4 EP 08782947 A EP08782947 A EP 08782947A EP 08782947 A EP08782947 A EP 08782947A EP 2321848 A4 EP2321848 A4 EP 2321848A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- assembler
- printhead
- chip printhead
- chip
- printhead assembler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/AU2008/001199 WO2010019985A1 (en) | 2008-08-19 | 2008-08-19 | Multi-chip printhead assembler |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2321848A1 EP2321848A1 (en) | 2011-05-18 |
EP2321848A4 true EP2321848A4 (en) | 2012-11-07 |
Family
ID=41706750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08782947A Withdrawn EP2321848A4 (en) | 2008-08-19 | 2008-08-19 | MORE CHIP-HEAD-ASSEMBLER |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2321848A4 (ko) |
KR (1) | KR101178010B1 (ko) |
WO (1) | WO2010019985A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013101693B9 (de) * | 2013-02-20 | 2015-11-12 | Notion Systems GmbH | Oberflächenbearbeitungsvorrichtung |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6086641A (en) * | 1996-02-20 | 2000-07-11 | Nec Corporation | Die bonder for a semiconductor producing apparatus |
US20050088666A1 (en) * | 2003-10-24 | 2005-04-28 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting apparatus and electronic component mounting method |
KR20070037824A (ko) * | 2005-10-04 | 2007-04-09 | 삼성전자주식회사 | Boc형 반도체 패키지 제조용 다이 본딩 장치 및 방법 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06268050A (ja) * | 1993-03-15 | 1994-09-22 | Matsushita Electron Corp | ダイスボンディング装置 |
JP3027911B2 (ja) * | 1995-01-19 | 2000-04-04 | 松下電器産業株式会社 | ダイボンディング装置 |
JP3511841B2 (ja) * | 1997-03-27 | 2004-03-29 | 松下電器産業株式会社 | チップの供給装置 |
US5924833A (en) * | 1997-06-19 | 1999-07-20 | Advanced Micro Devices, Inc. | Automated wafer transfer system |
JP3304295B2 (ja) * | 1997-11-17 | 2002-07-22 | エヌイーシーマシナリー株式会社 | ダイボンダ |
US6481558B1 (en) * | 1998-12-18 | 2002-11-19 | Asyst Technologies, Inc. | Integrated load port-conveyor transfer system |
JP4334892B2 (ja) * | 2003-03-20 | 2009-09-30 | パナソニック株式会社 | 部品実装方法 |
-
2008
- 2008-08-19 KR KR1020117000773A patent/KR101178010B1/ko active IP Right Grant
- 2008-08-19 WO PCT/AU2008/001199 patent/WO2010019985A1/en active Application Filing
- 2008-08-19 EP EP08782947A patent/EP2321848A4/en not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6086641A (en) * | 1996-02-20 | 2000-07-11 | Nec Corporation | Die bonder for a semiconductor producing apparatus |
US20050088666A1 (en) * | 2003-10-24 | 2005-04-28 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting apparatus and electronic component mounting method |
KR20070037824A (ko) * | 2005-10-04 | 2007-04-09 | 삼성전자주식회사 | Boc형 반도체 패키지 제조용 다이 본딩 장치 및 방법 |
Non-Patent Citations (1)
Title |
---|
See also references of WO2010019985A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP2321848A1 (en) | 2011-05-18 |
KR20110036038A (ko) | 2011-04-06 |
KR101178010B1 (ko) | 2012-08-28 |
WO2010019985A1 (en) | 2010-02-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20110316 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL BA MK RS |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20121008 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 21/67 20060101AFI20121001BHEP Ipc: H05K 13/04 20060101ALI20121001BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: ZAMTEC LIMITED |
|
18W | Application withdrawn |
Effective date: 20130416 |