EP2321444A4 - ELECTRICAL CONTACTS FOR USE WITH VACUUM DEPOSITION SOURCES - Google Patents

ELECTRICAL CONTACTS FOR USE WITH VACUUM DEPOSITION SOURCES

Info

Publication number
EP2321444A4
EP2321444A4 EP09806957A EP09806957A EP2321444A4 EP 2321444 A4 EP2321444 A4 EP 2321444A4 EP 09806957 A EP09806957 A EP 09806957A EP 09806957 A EP09806957 A EP 09806957A EP 2321444 A4 EP2321444 A4 EP 2321444A4
Authority
EP
European Patent Office
Prior art keywords
electrical contacts
vacuum deposition
deposition sources
sources
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP09806957A
Other languages
German (de)
French (fr)
Other versions
EP2321444B1 (en
EP2321444A2 (en
Inventor
Scott W Priddy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Veeco Instruments Inc
Original Assignee
Veeco Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Veeco Instruments Inc filed Critical Veeco Instruments Inc
Publication of EP2321444A2 publication Critical patent/EP2321444A2/en
Publication of EP2321444A4 publication Critical patent/EP2321444A4/en
Application granted granted Critical
Publication of EP2321444B1 publication Critical patent/EP2321444B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0623—Sulfides, selenides or tellurides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Resistance Heating (AREA)
  • Photovoltaic Devices (AREA)
EP09806957.8A 2008-08-11 2009-08-11 Electrical contacts for use with vacuum deposition sources Active EP2321444B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US18867108P 2008-08-11 2008-08-11
PCT/US2009/004593 WO2010019218A2 (en) 2008-08-11 2009-08-11 Electrical contacts for use with vacuum deposition sources

Publications (3)

Publication Number Publication Date
EP2321444A2 EP2321444A2 (en) 2011-05-18
EP2321444A4 true EP2321444A4 (en) 2012-03-14
EP2321444B1 EP2321444B1 (en) 2013-07-24

Family

ID=41651737

Family Applications (2)

Application Number Title Priority Date Filing Date
EP09806957.8A Active EP2321444B1 (en) 2008-08-11 2009-08-11 Electrical contacts for use with vacuum deposition sources
EP09806953.7A Not-in-force EP2321443B1 (en) 2008-08-11 2009-08-11 Vacuum deposition sources having heated effusion orifices

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP09806953.7A Not-in-force EP2321443B1 (en) 2008-08-11 2009-08-11 Vacuum deposition sources having heated effusion orifices

Country Status (3)

Country Link
US (3) US8328561B2 (en)
EP (2) EP2321444B1 (en)
WO (2) WO2010019213A2 (en)

Families Citing this family (24)

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WO2010019213A2 (en) 2008-08-11 2010-02-18 Veeco Instruments Inc. Vacuum deposition sources having heated effusion orifices
US20100095892A1 (en) * 2008-10-22 2010-04-22 Applied Materials, Inc. Evaporator device, method of mounting an evaporator device, method of operating an evaporator device, and coating device
WO2012012376A1 (en) * 2010-07-22 2012-01-26 First Solar, Inc Deposition system
EP2468917B1 (en) 2010-12-27 2013-07-10 Riber Injector for a vacuum evaporation source
US8662941B2 (en) * 2011-05-12 2014-03-04 Applied Materials, Inc. Wire holder and terminal connector for hot wire chemical vapor deposition chamber
DE102011121148A1 (en) * 2011-12-15 2013-06-20 Dr. Eberl Mbe-Komponenten Gmbh Device for evaporating a vaporized product
DE102012102210A1 (en) 2012-03-15 2013-09-19 Solibro Gmbh Heating system for a vacuum deposition source and vacuum separation device
US9578718B2 (en) 2012-05-04 2017-02-21 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing light-emitting element and deposition apparatus
JP6223675B2 (en) * 2012-11-29 2017-11-01 株式会社オプトラン Vacuum deposition source and vacuum deposition method using the same
KR20140078284A (en) * 2012-12-17 2014-06-25 삼성디스플레이 주식회사 Deposition source and Deposition appatatus using the same
US9196768B2 (en) * 2013-03-15 2015-11-24 Jehad A. Abushama Method and apparatus for depositing copper—indium—gallium selenide (CuInGaSe2-CIGS) thin films and other materials on a substrate
US10491467B2 (en) * 2014-05-23 2019-11-26 Nant Holdings Ip, Llc Fabric-based virtual air gap provisioning, systems and methods
DE102014221561A1 (en) 2014-10-23 2016-04-28 Beijing Apollo Ding Rong Solar Technology Co., Ltd. Apparatus for receiving evaporating material and method for producing a device
US11319624B2 (en) * 2016-03-23 2022-05-03 Hon Hai Precision Industry Co., Ltd. Vapor deposition apparatus, vapor deposition method, and method for manufacturing organic EL display apparatus
TWI737718B (en) 2016-04-25 2021-09-01 美商創新先進材料股份有限公司 Deposition systems including effusion sources, and related methods
CN106191788B (en) * 2016-10-09 2019-03-05 北京帕托真空技术有限公司 Organic evaporating source for electric resistor heating type evaporation coating machine
CN109175746B (en) * 2018-10-26 2020-09-22 浙江飞剑科技有限公司 Manufacturing process of vacuum heat-preservation titanium cup
CN209619438U (en) * 2019-01-17 2019-11-12 云谷（固安）科技有限公司 A kind of evaporation source and evaporated device
FR3102189B1 (en) 2019-10-17 2022-08-05 Riber Evaporation cell for vacuum evaporation chamber and associated evaporation process
EP3840012A1 (en) * 2019-12-20 2021-06-23 Essilor International Optimized crucible assembly and method for physical vapor deposition
WO2022221038A1 (en) * 2021-04-15 2022-10-20 Applied Materials, Inc. Evaporation source cooling mechanism
JP2024531190A (en) 2021-08-12 2024-08-29 アプライド マテリアルズ インコーポレイテッド Evaporators for evaporation over a wide surface area
JP2025507048A (en) * 2022-03-14 2025-03-13 マツクス－プランク－ゲゼルシヤフト ツール フエルデルング デル ヴイツセンシヤフテン エー フアウ Raw material equipment and TLE system
CN117239455B (en) * 2023-09-18 2026-03-24 常州捷佳创精密机械有限公司 Wiring structure for vacuum heating chambers and vacuum drying coating equipment

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Publication number Priority date Publication date Assignee Title
WO2001098054A1 (en) * 2000-06-19 2001-12-27 Husky Injection Molding Systems Ltd. Thick film heater apparatus
US6689992B1 (en) * 2002-01-31 2004-02-10 Sierratherm Production Furnaces, Inc. Connector for an electrical heating element
US20070077821A1 (en) * 2005-09-30 2007-04-05 Husky Injection Molding Systems Ltd. Electrical connector assembly for an arcuate surface in a high temperature environment and an associated method of use
WO2007086560A1 (en) * 2006-01-30 2007-08-02 Rohm Co., Ltd. Molecular beam cell having purge function

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US5558720A (en) 1996-01-11 1996-09-24 Thermacore, Inc. Rapid response vapor source
JPH09209126A (en) * 1996-02-08 1997-08-12 Idemitsu Kosan Co Ltd Vacuum deposition equipment
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DE10316228B3 (en) * 2003-04-09 2004-12-16 Dr. Eberl Mbe-Komponenten Gmbh Effusion cell with improved crucible temperature control
US8123862B2 (en) * 2003-08-15 2012-02-28 Semiconductor Energy Laboratory Co., Ltd. Deposition apparatus and manufacturing apparatus
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WO2010019213A2 (en) 2008-08-11 2010-02-18 Veeco Instruments Inc. Vacuum deposition sources having heated effusion orifices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001098054A1 (en) * 2000-06-19 2001-12-27 Husky Injection Molding Systems Ltd. Thick film heater apparatus
US6689992B1 (en) * 2002-01-31 2004-02-10 Sierratherm Production Furnaces, Inc. Connector for an electrical heating element
US20070077821A1 (en) * 2005-09-30 2007-04-05 Husky Injection Molding Systems Ltd. Electrical connector assembly for an arcuate surface in a high temperature environment and an associated method of use
WO2007086560A1 (en) * 2006-01-30 2007-08-02 Rohm Co., Ltd. Molecular beam cell having purge function

Also Published As

Publication number Publication date
US9187821B2 (en) 2015-11-17
US20100031878A1 (en) 2010-02-11
EP2321443B1 (en) 2015-07-22
EP2321444B1 (en) 2013-07-24
US8871027B2 (en) 2014-10-28
US8328561B2 (en) 2012-12-11
EP2321443A2 (en) 2011-05-18
WO2010019213A2 (en) 2010-02-18
WO2010019218A3 (en) 2010-06-10
US20130118409A1 (en) 2013-05-16
WO2010019218A2 (en) 2010-02-18
EP2321444A2 (en) 2011-05-18
EP2321443A4 (en) 2012-03-14
US20100031888A1 (en) 2010-02-11
WO2010019213A3 (en) 2010-05-20

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