EP2291666A1 - Procédé de détection du contact entre des aiguilles de mesure et un objet test - Google Patents

Procédé de détection du contact entre des aiguilles de mesure et un objet test

Info

Publication number
EP2291666A1
EP2291666A1 EP09769199A EP09769199A EP2291666A1 EP 2291666 A1 EP2291666 A1 EP 2291666A1 EP 09769199 A EP09769199 A EP 09769199A EP 09769199 A EP09769199 A EP 09769199A EP 2291666 A1 EP2291666 A1 EP 2291666A1
Authority
EP
European Patent Office
Prior art keywords
measuring
needle
contact
measuring needle
needles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09769199A
Other languages
German (de)
English (en)
Inventor
Ralf Heim
Klaus Rohfleisch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP2291666A1 publication Critical patent/EP2291666A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06794Devices for sensing when probes are in contact, or in position to contact, with measured object

Definitions

  • the invention relates to the testing of electrical components, chips on wafers and similar components, wherein an object to be tested is driven under one or more measuring needles. To produce a contact between the measuring needles and the object to be tested, they are moved against each other. The position at which the needles get the first contact with the object or with measuring points on it must be accurately recognized.
  • the problem of detecting the first mechanical contact between a measuring needle and a measurement object is solved by means of so-called mechanical edge probes.
  • the edge probes consist of additionally attached measuring needle pairs whose needles are arranged in pairs one behind the other in the area of the actual measuring needles.
  • the arrangement is set up such that the lower needles of the edge finder first comes into contact with the object to be measured, is pushed upwards, and thus contact is established with the second needle of a corresponding pair.
  • the current flowing therewith within the edge probes indicates that a contact has been made so that a drive down drive is reduced or zeroed.
  • a defined distance is moved further after this event in order to bring the measuring needles closer to the measuring object or to achieve a corresponding predetermined contact pressure of the needles.
  • the object of the invention is to describe a simple procedure with which the time of or the mutual position between the measuring needle tips and the surface of a test object can be detected.
  • the invention is based on the finding that, in a method for testing electrical assemblies, certain wafers and similar objects, the measuring needles that are usually necessary for this purpose, which are generally positioned several times next to one another, can be monitored in a simple manner by an optical system.
  • the optical system consists of illumination, generation of a transmitted light image of the needles and a line scan camera onto which the transmitted light image is projected.
  • the measuring needles are therefore displayed dark against a light background. As soon as a measuring needle touches the surface of the measurement object, one or more needles are deflected upwards and the image of the needle on the row of the line scan camera moves to one side.
  • the detection of the contact time between the measuring needle tips and the surface of the measuring object leads directly to the position of the two mutually approaching system parts, the measuring object surface and the measuring needle tips.
  • the contact position is reached, the production of the contact is detected by the image on a line scan camera.
  • no mechanical and electrical additional elements are necessary, as was the case with the use of edge scanners.
  • the method is non-contact and does not introduce any additional sources of interference into the measuring room.
  • the non-contact procedure excludes surface damage to the measurement objects.
  • FIG. 1 shows a measuring needle in side view
  • FIG. 2 shows an overview of the arrangement as seen from above
  • Figure 3 shows the arrangement according to the invention in front view
  • Figure 4 shows the arrangement in the front view when manufactured contact.
  • the measuring needle 1 is moved relative to the measuring object 3 in the direction of the double arrow in such a way that an approach takes place between the measuring needle 1 and the measuring object 3, a contacting leads directly to a Deflection or bending of the measuring needle 1.
  • This is optically detected and detected in accordance with FIG. 2 via the lateral illumination of measuring needles with transmitted-light imaging on a line scan camera 6.
  • the line of the line camera 6 is arranged such that it can differentiate deflections of the measuring needle according to FIG. 1 upwards and downwards.
  • an optic 5 of the line scan camera is to be used.
  • FIG. 3 again shows the illumination 4 from left to right, which guides light beams 7 sideways onto the measuring needles 1 and thus images them onto the line camera 6 via the optics 5.
  • FIG. 3 shows a corresponding image for the measuring needle state without a contact made on the line of the line scan camera 6.
  • FIG. 4 shows the test system with manufactured contact between measuring needles 1 and measuring points 2.
  • an image of the measuring needles with a corresponding change in relation to the mark according to FIG. Since the front view of the system is selected in FIGS. 3 and 4, the measuring needle 1, which is bent backwards and correspondingly formed in FIG. 1, is designed or suspended so resiliently that when the contact is made, a bend corresponding to FIG.
  • Front view is possible upwards. Ideally, all four measuring needles 1 set up simultaneously.
  • the illumination, optics and camera are located in the same coordinate system as the measuring needles, with the method of measurement set out, for example, where the measuring object 3 is moved upwards.
  • This distribution can also be varied depending on the requirement. It can be provided, for example, that the illumination and the line camera 6 are arranged in a defined geometric relationship to the measuring needles 1.
  • the lighting, the line scan camera 6 and the measuring needles 1 are combined in one assembly.
  • the detection of the production of a contact position of measuring needles on a mapping of a deflection of measuring needles on the line of a line scan camera represents a different overall approach to the problem of contact detection.
  • the method is non-contact and brings no additional sources of interference in the system.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

L'invention concerne un procédé de détection de la mise en place d'au moins une aiguille de mesure (1) sur un objet de mesure (3), procédé caractérisé en ce qu'une image par lumière transmise d'au moins une aiguille de mesure (1) est obtenue par éclairage latéral sur au moins une caméra à balayage linéaire (6), au moins une aiguille de mesure (1) et l'objet de mesure (3) étant rapprochés l'un de l'autre, et en ce que la mise en place d'au moins une aiguille de mesure (1) sur l'objet de mesure (3) peut être détectée par une déviation de l'aiguille de mesure (1), avec déplacement simultané de l'image sur la caméra à balayage linéaire (6).
EP09769199A 2008-06-26 2009-06-19 Procédé de détection du contact entre des aiguilles de mesure et un objet test Withdrawn EP2291666A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008030426 2008-06-26
PCT/EP2009/057676 WO2009156350A1 (fr) 2008-06-26 2009-06-19 Procédé de détection du contact entre des aiguilles de mesure et un objet test

Publications (1)

Publication Number Publication Date
EP2291666A1 true EP2291666A1 (fr) 2011-03-09

Family

ID=41278637

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09769199A Withdrawn EP2291666A1 (fr) 2008-06-26 2009-06-19 Procédé de détection du contact entre des aiguilles de mesure et un objet test

Country Status (2)

Country Link
EP (1) EP2291666A1 (fr)
WO (1) WO2009156350A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11204383B2 (en) * 2019-09-30 2021-12-21 Formfactor, Inc. Methods for maintaining gap spacing between an optical probe of a probe system and an optical device of a device under test, and probe systems that perform the methods

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5644245A (en) * 1993-11-24 1997-07-01 Tokyo Electron Limited Probe apparatus for inspecting electrical characteristics of a microelectronic element
US6972578B2 (en) * 2001-11-02 2005-12-06 Formfactor, Inc. Method and system for compensating thermally induced motion of probe cards
DE102004030881B4 (de) * 2003-07-01 2015-05-13 Cascade Microtech, Inc. Verfahren und Prober zur Kontaktierung einer Kontakfläche mit einer Kontaktspitze
DE602006021785D1 (de) * 2005-12-06 2011-06-16 Shibaura Mechatronics Corp Oberflächenrauhigkeitsprüfer

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2009156350A1 *

Also Published As

Publication number Publication date
WO2009156350A1 (fr) 2009-12-30

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