EP2282320A1 - Disque bimétallique embouti - Google Patents

Disque bimétallique embouti Download PDF

Info

Publication number
EP2282320A1
EP2282320A1 EP10007713A EP10007713A EP2282320A1 EP 2282320 A1 EP2282320 A1 EP 2282320A1 EP 10007713 A EP10007713 A EP 10007713A EP 10007713 A EP10007713 A EP 10007713A EP 2282320 A1 EP2282320 A1 EP 2282320A1
Authority
EP
European Patent Office
Prior art keywords
main element
electrical conductor
bimetallic snap
snap disk
switching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10007713A
Other languages
German (de)
English (en)
Inventor
Stefan Grosskopf
André Rudolph
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Limitor GmbH
Original Assignee
Limitor GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Limitor GmbH filed Critical Limitor GmbH
Publication of EP2282320A1 publication Critical patent/EP2282320A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/02—Details
    • H01H37/32—Thermally-sensitive members
    • H01H37/52—Thermally-sensitive members actuated due to deflection of bimetallic element
    • H01H37/54—Thermally-sensitive members actuated due to deflection of bimetallic element wherein the bimetallic element is inherently snap acting
    • H01H37/5418—Thermally-sensitive members actuated due to deflection of bimetallic element wherein the bimetallic element is inherently snap acting using cantilevered bimetallic snap elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H61/00—Electrothermal relays
    • H01H61/02—Electrothermal relays wherein the thermally-sensitive member is heated indirectly, e.g. resistively, inductively
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H61/00—Electrothermal relays
    • H01H61/01—Details
    • H01H61/0107—Details making use of shape memory materials

Definitions

  • the invention relates to a bimetallic snap disk according to the preamble of claim 1, with a curved main element whose curvature forms under the influence of temperature in the opposite direction. Furthermore, the invention relates to a switching element according to the preamble of claim 11, which has at least two switching contacts.
  • An abovementioned bimetallic snap disk is for example from EP 0 813 215 B1 known.
  • the known snap-action disc is installed in a temperature monitor and actuates a contact.
  • the contact is actuated when the fixed temperature point of the bimetallic snap disk is reached, whereby it jumps from its convex shape to a concave shape.
  • bimetal domes As overcurrent release. That is, the bimetallic snap disk is used to open an electric circuit when the current in the circuit assumes an inadmissibly high value.
  • a heating resistor is introduced into the circuit, which is usually arranged below the bimetallic snap disk. If an inadmissibly high current flows in the circuit, the heating resistor assumes a correspondingly high temperature, whereby the bimetallic snap disk is heated.
  • the bimetallic snap disk snaps from its convex shape into a concave shape, that is their curvature forms in the opposite direction. As a result, a regularly arranged at the highest point of the snap-action contact is moved, whereby the circuit is opened.
  • Bimetallic snap disk is understood to mean a metal disk consisting of two layers of different material, which is embossed in such a way that it has a curved curvature in different directions, which has a stable and a metastable state.
  • a bimetallic snap-action disc with a curved main element the curvature of which forms in the opposite direction under the influence of temperature, characterized in that a heating element designed as an electrical conductor is arranged on the main element.
  • a switching element having at least two switching contacts characterized in that a switching contact on the main element of a bimetallic snap disk according to the invention is arranged.
  • the main element of the bimetallic snap disk no longer indirectly but directly heated.
  • the reaction time of the bimetallic snap disk is significantly shortened.
  • the reaction time of the bimetallic snap disk can be influenced by a suitable choice of material of the electrical conductor.
  • the direct arrangement of the electrical conductor on the main element of the bimetallic snap disk the construction of a current monitor formed by means of a bimetallic snap disk is considerably simplified.
  • the bimetallic snap disc is less sensitive to external influences, which has a very beneficial effect on the reliability of a particular overcurrent monitor.
  • the direct mechanical connection of the electrical conductor to the main element of the bimetallic snap disk creates a compact element.
  • the electrical conductor is designed as a conductor track.
  • the electrical conductor can be arranged in a simple manner on the main element of the bimetallic snap disk.
  • the electrical conductor can be produced, for example, as a stamped part and fastened on the main part.
  • the bimetallic snap disk may preferably be embossed by a special embossing process such as ring or dome embossing or single or multiple embossing so that as a result it has firmly defined snap temperatures T1 / T2.
  • the temperatures result from the embossing process itself and the embossing depth and are specifically selectable for the respective desired application.
  • the electrical heating element is applied on the already embossed disc.
  • An embodiment of the invention in which the electrical conductor is embedded in a lacquer layer arranged on the main element is also very advantageous.
  • By embedding the electrical conductor in the lacquer layer not only a reliable connection of the electrical conductor to the main element can be made in a simple manner, but also the electrical conductor is arranged on the main element electrically isolated.
  • the insulation can also be done by means of an insulating film.
  • the electrical conductor and the main element designed as a plastic film, polyimide film or aluminum foil insulating film which is connected, for example by means of an adhesive layer consisting of Pyraluxkleber firmly on the one hand firmly to the main element and on the other hand with the heating element.
  • the insulation layer may consist of Meycoat bonded with acrylate adhesive or Dublocoll 384 TC Al foil.
  • the electrical conductor extends over the region of the highest elevation of the main element and the resistance of the electrical conductor in the region of the highest elevation of the main element has its greatest value. This will achieve that the power loss of the electrical conductor in the region of the highest elevation of the main element has its greatest value, with the result that the heating of the main element in the region of its highest elevation is greatest. This has a very advantageous effect on the snap behavior of the main part.
  • the increase in the resistance of the electrical conductor in the region of the highest elevation of the main element can be achieved in a simple manner, for example, in that the cross section of the electrical conductor in the region of the highest elevation of the main element is less than outside the region of the highest elevation of the main element.
  • the change in the cross section of the electrical conductor is effected by embossing or laser ablation.
  • the electrical conductor in the region of the highest elevation of the main element is annular, wherein the center of the ring is arranged on the highest elevation of the main element.
  • the main element in the region of its highest elevation can be specifically heated symmetrically. This also has a very beneficial effect on the switching function of the bimetallic snap disk.
  • the main element in plan view at least partially has the shape of two circular sections abutting one another with their chords, so that the chords of the circular sections extend in the direction of the greatest extent (length) of the main element form imaginary centerline of the main element.
  • Such a shape which is pronounced of a biconvex lens, has the great advantage that it has a very good snap behavior when it is clamped at one end.
  • the main element is flattened at the ends of its center line, whereby it has in plan view the shape of a barrel body in side view. This reduces the size of the main element, without this having a particularly adverse effect on the snap behavior of the main element.
  • a bimetallic snap disk has been found in which the length of the main element from tip to tip is 1.4 to 3 times as large as the transverse to the center line of the main element extending width of the main element.
  • the length of the main element is 2 to 2.75, preferably 2.5 times the width of the main element. If the main element is flattened at the ends of its center line, to calculate the length of the main element, the main element is theoretically supplemented by the omitted peaks and the length of the main element is then formed by the distance of the two imaginary tips.
  • Such a trained main element has the great advantage that distribute the material stresses in the main element very well, so that they have very little effect on the disposed on the main element electrical conductor.
  • the main element has latching elements which, for example, protrude significantly beyond the shape of the previously described shaping.
  • the locking elements are preferably symmetrical to the center line clearly on both sides of the main element. By locking elements can be achieved that the main element is prevented from snapping back snapping. For this purpose, the locking elements need only snap when snapping the main element with corresponding counter-elements, whereby the snap position of the main element is fixed.
  • Such a bimetallic snap disk is very well suited for a so-called safety shutdown. Even after the main element has cooled down, the snap-action disc no longer assumes its original position.
  • a switching contact is arranged on the main element of a bimetallic snap disk according to the invention, is achieved in an advantageous manner that a relatively fast interruption of a circuit can be achieved at overcurrent. Furthermore, the switching element according to the invention is designed very robust, which has a very advantageous effect on the reliability of the switching element.
  • arranged on the main element switching contact is connected to one end of the electrical conductor, wherein the other end of the electrical conductor forms the terminal of the switching contact.
  • a second heating element designed as an electrical resistor is arranged between the end of the electrical conductor forming the connection of the switching contact arranged on the main element and the switching contact not arranged on the main element. Since current only flows through the resistor when the switching element is open, the second resistor formed by the electrical resistance can Heating element serve to keep the main element at a temperature such that it does not snap back. In this way, similar to the locking elements, a permanent shutdown of the circuit can be achieved, but the main element snaps back when the power is turned off, that is, no current flows through the electrical resistance forming the second heating element.
  • the switching element is arranged in a housing which consists of a material insulated on at least one side, such as a plastic-coated sheet.
  • the housing is formed by folding a corresponding blank, wherein the edges of the blank are connected to each other by means of laser welding, for example.
  • a housing can be very easily and thus produce cost.
  • the housing is made waterproof in a simple manner.
  • a bimetallic snap disk has a main element 1, which in plan view partially in the form of two with their tendons abutting circular sections, wherein the chords of the circular sections extending in the direction of the largest recess (length) of the main element 1 imaginary center line 1 'of the main element 1 form.
  • the main element 1 is designed as a snap-action disc and has its highest elevation in the middle point 1c.
  • a tab 3 is connected to the main element 1 via a web 3b. The tab 3 has two openings 3b, for fixing the bimetallic snap disk.
  • the electrical conductor 2 On the main element 1 designed as a conductor electrical conductor 2 is arranged, which has a meandering course.
  • the electrical conductor 2 has an annular portion 2 c, which encloses the highest elevation 1 c of the main element 1.
  • the cross section of the electrical conductor 2 is reduced in the annular portion 2c, so that the resistance of the conductor 2 is greatest there.
  • the electrical conductor 2 is connected to a switching contact 7, which is welded to the main element 1 and the one end 2b of the electrical conductor 2.
  • the other end 2a of the electrical conductor 2 is formed as a tab and forms the electrical connection of the switching contact. 7
  • a polyimide film 5 is disposed between the conductor 2 of the electrical conductor 2 and the main element 1, which is connected by means of a Pyraluxklebers 6 fixed to the main element 1.
  • the conductor 2 is also connected by means of a Pyraluxklebers 6 fixed to the polyimide film 5.
  • the conductor track 2 can be applied to the main element in such a way that the material strip from which the main element 1 is separated and the material strip from which the conductor track 2 is separated, are guided in the blank and cleaned state into one and the same progressive compound tool.
  • an insulating film provided with an adhesive layer on both sides is introduced into the progressive die. On the adhesive layers, a non-adhesive release film is applied in each case. The insulating film is applied to the material band from which the main element 1 is separated or to the main element 1. Before application, however, the main element 1 facing release film is peeled off the adhesive layer of the insulating film in question.
  • the elements applied to one another are then connected to one another at a temperature of about 100 degrees Celsius to 250 degrees Celsius.
  • the conductor track 2 can also be embedded in a lacquer layer arranged on the main element 1.
  • the main element 1 is coated in a preceding process by means of a lacquer. This layer serves exclusively as electrical separation.
  • Another lacquer layer which serves as a compound adhesive layer, is applied to this insulating layer in the wet state. Thereafter, the contour of the main element 1 from the strip material, from which the main elements are separated, separated.
  • the conductor 2 is produced in a corresponding manner. That is, the strip material of the electrical conductor is also coated in an upstream process by means of an insulating varnish. On this insulating varnish layer, a bonding adhesive layer is applied in the wet state. Thereafter, the contour of the trace of the electrical conductor is separated from the strip material.
  • a module In the tool in which the blanks take place, a module can be arranged which is thermally insulated from the rest of the tool.
  • the module is heatable, so that the conductor of the electrical conductor in the module under a pressure of about 2 tons to 20 tons and a temperature of about 100 degrees Celsius to 250 degrees Celsius can be applied to the main element 1.
  • the pressure depends on the area of the components to be pressed.
  • the main element 1 has an optimum snap-action behavior when the width 1 "of the main element 1 is in a certain relation to the length of the main element 1.
  • the extension is in FIG. 2 represented by dashed lines.
  • the intersections of the extensions of the side lines form imaginary peaks 1a ', 1b'.
  • the length of the main element 1 required for determining the ratio corresponds to the length of the center line 1 'from the imaginary tip 1a' to the imaginary tip 1b '.
  • the length of the center line 1 ' that is, the theoretical length of the main element 1 required for calculating the ratio is 2.5 times as large as the width 1 "of the main element 1 extending transversely to the center line 1' of the main element.
  • the bimetallic snap disk with its tab 3 between an electrically non-conductive plastic existing elements 11 of a housing 10 a, 10 b is clamped.
  • the housing 10a, 10b consists of a sheet 10a, which is coated on one side with plastic 10b.
  • the housing 10a, 10b is electrically insulated on the outside.
  • the housing 10a, 10b is produced by folding a corresponding blank and then preferably laser welding.
  • the plastic elements 11 are applied to the blank prior to folding the blank at the appropriate positions. They can be applied as separate parts to the blank or produced by injection molding at the relevant positions.
  • the bimetallic snap disk is produced by means of an ultrasonic welding technique, clamping technology, embossing technique or pressing technique arranged on an element 11.
  • the bimetallic snap disk is then enclosed and, by virtue of the fact that the two plastic elements 11 face one another after folding, the bimetallic snap disk is pressed firmly against the housing.
  • the bimetallic snap disk is extremely reliably fixed in position.
  • a resistor 9 is arranged, then flows through the current when the arranged on the main element 1 switching contact 7 not with the fixed to the housing switching contact 8 is in contact.
  • the resistor 9 heats up, as a result of which the main element 1 is heated to such an extent that it remains in the position in which the two switching contacts 7, 8 are not in contact with one another.
  • FIG. 6 illustrated embodiment of a bimetallic snap disk according to the invention substantially corresponds to in FIG. 1 illustrated bimetallic snap disk. It differs only in that it has locking elements 4, which can be latched with retaining lugs 4 a, which are arranged in a housing of a switching element, as shown in FIG. 9 is shown.
  • the locking elements 4 are arranged symmetrically to the center line 1 'of the main element 1 and are clearly visible from the main element 1. They are edge regions of the main element 1, which are created by a corresponding punching embossing.
  • the retaining tabs 4a are connected to the plastic layer 10b of the housing and extend through an opening formed in the sheet 10a.
  • the locking elements 4 can latch with the retaining lugs 4a. This will prevent the bimetal snap-action disc from returning to its original position returns when she cools.
  • the bimetal snap disc thus performs a one-time switching function corresponding to a fuse.
  • FIGS. 8 and 9 can be removed, arranged on the housing switching contact 8 is arranged on a pedestal.
  • the pedestal is made by stamping from the sheet metal wall 10a of the housing. Due to the height of the pedestal, the switching time of the switch formed by the arrangement can be adjusted.
  • the electrical conductor 2 extends almost over the entire surface of the main element 1 and is not meandering as in the first-mentioned embodiment.

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Thermally Actuated Switches (AREA)
  • Push-Button Switches (AREA)
EP10007713A 2009-08-01 2010-07-24 Disque bimétallique embouti Withdrawn EP2282320A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009035829 2009-08-01

Publications (1)

Publication Number Publication Date
EP2282320A1 true EP2282320A1 (fr) 2011-02-09

Family

ID=43014170

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10007713A Withdrawn EP2282320A1 (fr) 2009-08-01 2010-07-24 Disque bimétallique embouti

Country Status (3)

Country Link
US (1) US20110025449A1 (fr)
EP (1) EP2282320A1 (fr)
CN (1) CN101989513A (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202013007062U1 (de) 2013-08-07 2014-11-12 Leoni Bordnetz-Systeme Gmbh Vorrichtung zur mechanischen Verriegelung eines Ladesteckers in einer Ladedose
DE202013007287U1 (de) 2013-08-15 2014-11-20 Leoni Bordnetz-Systeme Gmbh Schutzschalter
EP3240006A4 (fr) * 2014-12-24 2018-08-08 Ubukata Industries Co., Ltd. Commutateur de réponse thermique
DE102022211171A1 (de) 2022-10-21 2024-05-02 Robert Bosch Gesellschaft mit beschränkter Haftung Versiegelung für eine mikrofluidische Kammer
DE102022211170A1 (de) 2022-10-21 2024-05-02 Robert Bosch Gesellschaft mit beschränkter Haftung Kompartiment mit Versiegelung

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DE102011078636A1 (de) * 2011-07-05 2013-01-10 Siemens Aktiengesellschaft Überlastauslöser, insbesondere für einen Leistungsschalter
CN102412562A (zh) * 2011-11-03 2012-04-11 扬州五岳电器有限公司 电动机保护器
JPWO2015177925A1 (ja) * 2014-05-23 2017-04-20 株式会社生方製作所 熱応動開閉器
DE102019112074B4 (de) * 2019-05-09 2020-12-17 Marcel P. HOFSAESS Temperaturabhängiger Schalter

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US2293179A (en) * 1941-02-26 1942-08-18 Westinghouse Electric & Mfg Co Circuit breaker
US2636098A (en) * 1950-05-01 1953-04-21 Pierce John B Foundation Thermostatic switch
US2800555A (en) * 1954-08-18 1957-07-23 Sundt Engineering Company Low amperage circuit interrupter
DE1099299B (de) * 1957-07-11 1961-02-09 Siemens Ag Bi-Streifen aus zwei Glasstreifen oder -staeben verschiedener thermischer Ausdehnungskoeffizienten, der sich bei Erwaermung kruemmt
DE1180446B (de) * 1961-02-10 1964-10-29 Alfred Odenwald Knopfthermostat
JPS5112967U (fr) * 1974-07-16 1976-01-30
US4703298A (en) * 1986-11-04 1987-10-27 Texas Instruments Incorporated Thermostat with ceramic mounting pins of resistive material
EP0813215B1 (fr) 1996-06-13 2002-04-03 Marcel Hofsäss Thermostat avec une feuille de Kapton
JP2002204525A (ja) * 2000-12-28 2002-07-19 Sanyo Electric Co Ltd ブレーカとブレーカを内蔵するパック電池

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202013007062U1 (de) 2013-08-07 2014-11-12 Leoni Bordnetz-Systeme Gmbh Vorrichtung zur mechanischen Verriegelung eines Ladesteckers in einer Ladedose
DE202013007287U1 (de) 2013-08-15 2014-11-20 Leoni Bordnetz-Systeme Gmbh Schutzschalter
EP3240006A4 (fr) * 2014-12-24 2018-08-08 Ubukata Industries Co., Ltd. Commutateur de réponse thermique
DE102022211171A1 (de) 2022-10-21 2024-05-02 Robert Bosch Gesellschaft mit beschränkter Haftung Versiegelung für eine mikrofluidische Kammer
DE102022211170A1 (de) 2022-10-21 2024-05-02 Robert Bosch Gesellschaft mit beschränkter Haftung Kompartiment mit Versiegelung

Also Published As

Publication number Publication date
US20110025449A1 (en) 2011-02-03
CN101989513A (zh) 2011-03-23

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