EP2247780A2

EP2247780A2 - Method for producing a floor covering substrate and method for producing a substrate layer for a floor covering substrate comprising at least one electronic construction element integrated therein

Info

Publication number: EP2247780A2
Application number: EP09713359A
Authority: EP
Inventors: Christl Lauterbach; Axel Steinhage; André BARTEL
Original assignee: Future-Shape GmbH; Future Shape GmbH
Current assignee: Future-Shape GmbH; Future Shape GmbH
Priority date: 2008-02-22
Filing date: 2009-02-20
Publication date: 2010-11-10
Anticipated expiration: 2029-02-20
Also published as: DE102008010530A1; US20110027520A1; WO2009103806A2; WO2009103806A3; EP2247780B1

Abstract

In a method for producing a floor covering substrate, at least one electronic construction element is embedded in a layer comprising at least one curable material. In a method for producing a substrate layer for a floor covering substrate, a substrate layer is provided wherein the substrate layer comprises a permeable structure or a mesh structure. Further, at least one electronic construction element is disposed in the substrate layer and/or applied to the substrate layer.

Description

description

A method of making a flooring pad and method of making a pad for a flooring pad having at least one electronic component integrated therein

The invention relates to a method for producing a Bodenbelagunterläge, a floor covering, a method for integrating at least one electronic component in a floor, a floor with at least one integrated electronic component, a method for producing a base layer for a floor covering, as well as a base layer for a floor covering ,

In a floor integrated RFID tags (Radio Frequency

IDentification tags, in German: Radio Frequency

Identification disks or radio tags), which are introduced in a regular grid in the floor, can be used as a radio Landmarks for the localization of robotic vehicles or other mobile devices. For this purpose, one makes use of the fact that each of these radio tags has its own ID number, in other words, a unique for the respective radio tag

Identification information. After installing the tags in the ground, a kind of map describing the physical location of each tag in the ground can be created.

The robots or other moving objects to be located are equipped with a RFID tag reader. In addition, the mapping information is made available to its local or central control unit. Thus, the readers can always, when they come with their reader antenna in the reception area of the antenna of a radio tag, read out its ID number and determine their exact location using the mapping information.

Examples of the localization and / or navigation by means of identification data carriers integrated in a floor are described for example in [1], [2] and [3], as well as in [4], which describes a wet wiping robot, and in [5], which describes a autonomously driving forklift describes.

The introduction of radio tags into a floor has hitherto usually been carried out in such a way that the radio tags are introduced individually into the ground. For example, [6] describes the encapsulation of encapsulated RFID tags with holes in the ground. This method requires considerable effort in drilling the holes in the ground,

Inserting the RFID labels and sealing the holes, as well as the subsequent calibration and the creation of a mapping.

Often radio tags with a cold glue layer are applied directly to the substrate (screed) below the floor covering for demonstration purposes. For this purpose, the substrate must be as level as possible, which can be achieved for example by a leveling of the screed. Since a grid that is as exact as possible must be adhered to, a batter board must also be produced before the radio tags are applied. There is a risk that when applying the flooring already a part of the radio tags is mechanically destroyed or the residual moisture, as it is particularly present in new buildings, destroys the electronics. In the case of elastic floor coverings (eg carpet, PVC, rubber, linoleum), the mechanical stresses during use can lead to the failure of the radio tags in a short time. When laying radio tags under tiles or stone floors, in turn, the tile adhesive destroys the RFID tags during installation. One possibility for equipping a textile impact sound insulation or a carpet during manufacture with a regular grid of radio tags is described in [7]. The system described in [7] is limited to carpet or parquet / laminate. However, especially in public or commercial buildings, nowadays usually a large part of the floors is equipped with stone covering, tiles, synthetic resin, terrazzo, PVC, rubber or linoleum. Under all these coverings the textile impact sound insulation described in [7] can not be used.

An underlying problem of the invention is to integrate radio tags or general electronic components in a simple and cost-effective manner in a floor while reliably protecting the radio tags or the electronic components from possible stresses to which they are exposed in the ground.

The problem is solved by a method for producing a floor covering, a floor covering, a

A method for integrating at least one electronic component in a floor, a floor with at least one integrated electronic component, a method for producing a base layer for a floor covering and a base layer for a

Floor covering with the features of the independent claims.

Exemplary embodiments of the invention will become apparent from the dependent claims. The other embodiments of the invention, which are described in connection with the method for producing the floor covering apply mutatis mutandis and as meaningful for the floor covering, the method for integrating the at least one electronic component in the floor, the floor, the method for producing the Base layer for the floor covering as well as the base layer.

In a method for producing a floor covering pad according to an exemplary embodiment, at least one electronic component is embedded in a layer which has at least one curable material.

A floor covering according to another embodiment comprises a layer comprising at least one curable material. Furthermore, the floor covering underlay has at least one electronic component which is embedded in the layer.

For the purposes of this application, a curable material or curable material may, for example, be understood as meaning a material which is of a first state with a low viscosity (illustratively a state in which the material is moldable, eg liquid, pourable, spreadable or spatula-capable) Substantially irreversibly can transition into a second state with a higher viscosity (for example by means of heating or tempering), wherein the material in the second state is dimensionally stable or hard (hard) .The transition may be referred to as curing of the material.

In one embodiment, the curable material of the layer may be processed in the first state and then converted to the second state (ie, the layer may be cured). For example, in the first state, the at least one electronic component can be introduced into the (not yet cured) layer and then embedded in it by hardening the layer firmly or without play. The layer comprising the at least one curable material is also referred to below as a curable layer. According to one embodiment, the at least one curable material comprises at least one of the following materials: a synthetic resin material (eg an epoxy resin or mixtures of epoxy resins), a dispersion adhesive material, a mineral primer material (eg concrete or cement). Alternatively, other suitable curable materials may be used.

Under an epoxy resin may in this context

Synthetic resin can be understood, which consists of polymers which give a duroplaεtischen plastic of high strength and chemical resistance depending on the reaction procedure with the addition of suitable hardener. If epoxy resin and hardener mixed, takes place depending upon composition and

Temperature usually within a few minutes to a few hours, the curing of the originally liquid mixture. In some cases, a longer period of time may pass until complete curing.

According to another embodiment, the thickness of the hardenable layer (for example the thickness of a synthetic resin layer) in which the electronic component is embedded is approximately 0.2 mm to several centimeters, for example approximately 0.2 mm to 2 cm, for example approximately 2 mm. Alternatively, the layer may have a different thickness.

According to another exemplary embodiment, the at least one electronic component is applied to a first part-layer comprising a first curable material and / or at least partially introduced into the first part-layer, and a second part-layer comprising a second curable material is applied the first sub-layer and the electronic component applied, so that the layer is formed with the embedded therein at least one electronic component. The first hardenable material and the second curable material may be the same material. Alternatively, the second curable material may be a different material than the first curable material. The first sub-layer is also referred to below as the first curable sub-layer, and the second sub-layer is also referred to below as the second curable sub-layer.

Clearly, according to the embodiment described above, a first curable sub-layer can be provided, and the electronic component is applied to the (not yet cured) first sub-layer and / or at least partially introduced therein. Subsequently, a second curable partial layer is applied to the first partial layer and the electronic component applied thereto and / or introduced therein, so that the component is arranged or embedded between the two partial layers. The first sub-layer and the second sub-layer can subsequently be cured, so that the electronic component is fixed (with another

Words, clearance) is embedded in the hardened sublayers.

According to another embodiment, the first curable material and / or the second curable material comprise at least one of the following materials: a synthetic resin material (eg, an epoxy resin or mixtures of epoxy resins), a dispersion adhesive material, a mineral primer material (eg, concrete or cement). Alternatively, other suitable curable materials may be used.

According to another embodiment, the at least one electronic component is introduced into a base layer and / or applied to the base layer, and the base layer with the electronic component is in the layer, which is the at least one curable Has material embedded. The introduction and / or application of the electronic component in the backing layer and / or on the backing layer can be carried out clearly before embedding the backing layer in the layer.

According to another embodiment, a plurality of electronic components is introduced into the backing layer and / or applied to the backing layer, for example in a regular grid. In other words, the electronic components may be arranged in a regular grid (e.g., a rectangular grid or a square grid) in and / or on the backing layer. The individual components may, for example, have a distance from one another of approximately 10 cm to 1 m in the grid, for example approximately 30 cm to 70 cm, for example approximately 50 cm, according to an exemplary embodiment. Alternatively, for example, depending on the desired application, the components may have a different distance from each other.

Furthermore, it is also possible that the spacing of the components is variable. For example, in the case of radio tags as electronic components, the distance of the RFID tags in the pad layer may vary and be adapted, for example, to a spatial resolution desired in a localization / navigation, for example such that in a first subregion of the pad layer the RFID tags have a first distance from each other and in a second subregion of the substrate layer have a second distance from each other, wherein the second distance may be, for example, smaller than the first distance, so that in the second subarea localization / navigation with higher spatial resolution is enabled.

According to one embodiment, the backing layer with the applied or applied thereto electronic components applied to the first curable sub-layer, and the second curable sub-layer is applied to the substrate layer.

According to another embodiment, the

Substrate layer on a permeable (in other words, a penetrable) structure. In other words, the backing layer may comprise or consist of a permeable (penetrable) material.

For the purposes of this application, a permeable or penetrable material may generally be understood as meaning a material which is at least partially permeable to another material or at least partially penetrated by the other material. In particular, a permeable material may be understood as meaning a material which is at least partially permeable to the at least one curable material, for example, or at least partially penetrated by it.

For example, the permeable material for the first curable material of the first curable sub-layer and / or the second curable material of the second curable sub-layer may be at least partially permeable or at least partially penetrated by the first and / or second curable material. In other words, the permeable structure may be arranged such that when the backing layer is applied to the first curable sub-layer and / or when the second curable sub-layer is applied to the backing layer

Material of the first curable sublayer and / or the material of the second curable sublayer can at least partially pass through the permeable structure of the substrate layer so that the materials of the first and second curable sub-layer through the substrate layer can come into contact with each other and thus after Curing the two Partial layers a firm connection between the sub-layers can be achieved.

According to one embodiment, the transmissive structure for another material (eg, for the at least one curable material) may have permeable openings (also referred to as holes), the openings having a size (eg, a diameter) of about 1 mm to 50 mm have, for example, about 3 mm to 10 mm, for example about 5 mm. Alternatively, the sizes of the openings may have a different value.

According to an exemplary embodiment, the permeable material used may be, for example, mesh fabrics made of glass fiber, carbon fiber, metal wire, polyester, polyethylene or stamped or perforated films, sheets or perforated paper. Alternatively, other materials may be used.

According to another embodiment, the

Base layer on a mesh structure. In other words, the backing layer may comprise or consist of a material having a mesh structure (for example, a mesh).

The mesh size of the mesh structure may be formed such that the mesh structure for the first curable material of the first curable sub-layer and / or the second curable material of the second curable sub-layer is at least partially permeable. In other words, the mesh size can be designed so that when applying the backing layer on the first curable sub-layer and / or when applying the second curable sub-layer on the backing layer, the material of the first curable sub-layer and / or the material of the second curable sub-layer at least partially pass through the mesh structure of the backing layer can / can, so that the materials of the first and second curable sub-layer through the base layer can come into contact with each other and thus a firm connection between the layers can be achieved after curing of the sub-layers.

For example, in one embodiment, the mesh size is about 1 mm to 50 mm, for example about 3 mm to 10 mm, for example about 5 mm. Alternatively, the mesh size may have a different value.

According to another embodiment, the backing layer is a reinforcing fabric. Under a reinforcing fabric can be understood in this context, a tissue or a tissue structure, the / to the

Reinforcement (also referred to as reinforcement or reinforcement) of a floor covering or a subfloor (screed) or generally a layer in the floor covering or the screed or the layer is inserted (embedded). A reinforcing fabric, for example, a higher

Have tensile strength and / or compressive strength as the object to be reinforced or reinforced, and / or greater durability against other influences (e.g., environmental influences such as water, frost, chemicals, etc.).

According to one embodiment, the reinforcing fabric comprises at least one of the following materials: a glass fiber material, polyethylene, polypropylene, polyester, a carbon fiber material, a natural fiber material. With others

In words, the reinforcing fabric may comprise or consist of one or more of the aforementioned materials.

According to another embodiment, the hardenable layer is applied to the backing layer (eg, the reinforcing fabric) with the applied or applied thereto applied electronic components. If the backing layer has a mesh structure or a permeable structure, then the material of the hardenable layer (eg, a synthetic resin layer) may at least partially pass through the meshes or openings of the backing layer and with a layer (eg, a substrate such as a screed) disposed under the backing layer ) come into contact and in a subsequent curing enter into a firm connection with this layer, at the same time the backing layer can be firmly embedded (or play) in the curable layer.

According to another embodiment, at least one recess is formed in the base layer, and the at least one electronic component is introduced into the at least one recess. According to one embodiment, the shape and size of the recess may be adapted to the electronic component to be incorporated therein. By means of the recess can be clearly achieved a height compensation between the base layer and the at least one electronic component integrated therein.

According to another embodiment, the at least one recess is formed by one of the following methods: laser cutting, punching, cutting, milling. Alternatively, other suitable methods of forming the recess may be used.

According to another embodiment, the at least one electronic component is encapsulated in an encapsulation layer (for example a plastic layer) prior to embedding in the curable layer. In other words, the electronic component is laminated with the encapsulation layer. By Verkapseins (also referred to as encapsulation) or laminating, for example, a height compensation between individual Components of the electronic component can be achieved. Furthermore, the electronic component can be protected by means of the encapsulation layer against mechanical and / or chemical influences and / or moisture.

According to another embodiment, the at least one electronic component is encapsulated in the encapsulation layer prior to introduction into the substrate layer and / or application to the substrate layer.

According to another embodiment, the at least one electronic component is bonded to the substrate layer using the encapsulation layer.

According to another embodiment, the at least one electronic component is a radio identification data carrier (also referred to as a radio tag), for example an RFID tag, for example a passive RFID tag. The radio identification data carrier can have a unique identifier information (ID number), which is used for

Example, by means of a suitable reader, which is introduced to the radio identification data carrier or past this, can be read.

In a method for integrating at least one electronic component in a floor according to another embodiment, a floor covering substrate is provided. Furthermore, a floor covering is applied to the floor covering.

A floor with at least one integrated electronic component according to another embodiment has a floor covering and a floor covering, which is applied to the floor covering, on.

The flooring pad may be formed according to any of the embodiments described herein. be. The flooring may be any type of flooring, such as stone, tile, concrete, resin, terrazzo, PVC, linoleum, carpet, parquet, laminate and other resilient coverings, with the exception of metal.

In a method for producing a backing layer for a floor covering according to another embodiment, a backing layer is provided, wherein the backing layer has a permeable structure or a mesh structure. Furthermore, at least one electronic component is introduced into the substrate layer and / or applied to the substrate layer.

A backing layer for a floor covering according to another embodiment comprises at least one electronic component, which is introduced into the base layer and / or applied to the base layer, wherein the base layer has a permeable structure or a mesh structure.

The backing layer may be formed according to any of the embodiments described herein.

Embodiments of the invention are illustrated in the figures and are explained in more detail below. In the figures, the same or similar elements, if appropriate, provided with the same or identical reference numerals. The illustrations shown in the figures are schematic and therefore not drawn to scale.

Show it FIGS. 1A to 3B show a method for producing a base layer for a floor covering underlay according to an exemplary embodiment;

4A and 4B show a method for producing a base layer for a floor covering pad according to another exemplary embodiment;

5A and 5B show a radio tag for use in a floor covering according to a

Embodiment;

Figure 6 is a schematic representation of a mapping of introduced into a backing layer RFID tags according to another

Embodiment;

FIG. 7A shows a method for producing a floor covering underlay according to an embodiment;

Figure 7B shows a floor with a floor covering pad according to another embodiment;

8A to 8C show a method for producing a floor covering according to another embodiment,

Figure 9A and Figure 9B show a method of making a floor covering according to another

Embodiment;

FIG. 10A shows a method for producing a

Floor covering under another embodiment; 10B, a floor with a floor covering pad according to another embodiment.

Hereinafter, with reference to FIGS. 1A to 3B, there will be described a method for producing a pad layer for a floor covering according to an embodiment.

According to this embodiment, a pad layer 20 is provided. 1A and 1B show a section of the base layer 20 in plan view (FIG. 1A) and in cross section (FIG. 1B). The backing layer 20 comprises a reinforcing fabric 9 having a mesh structure. According to the embodiment shown here, the reinforcing fabric 9 is formed as a glass fiber fabric. Alternatively, the reinforcing fabric may comprise other materials such as e.g. Polyethylene, polypropylene, polyester, carbon fibers, natural fibers or metal wires. The glass fiber fabric 9 has first glass fibers 6 which are arranged in a first direction (for example in the weft direction) and second glass fibers 7 which are arranged in a second direction (according to the embodiment shown perpendicular to the first direction, for example in the warp direction). Furthermore, the glass fiber fabric 9 has a plurality of meshes 9a, which are formed between the glass fibers 6, 7.

The glass fiber fabric 9 of the base layer 20 may, for example, have a thickness of approximately 0.1 mm to 5 mm, for example approximately 0.2 mm to 1 mm, for example 0.45 mm, according to one exemplary embodiment. The

Mesh width of the glass fiber fabric 9 may be, for example, about 1 mm to 50 mm, for example, about 3 mm to 10 mm, for example, about 5 mm according to an embodiment. According to one embodiment, the glass fiber fabric 9 can be rolled goods. In the base layer 20 (ie, in the glass fiber fabric 9) recesses 8 are formed in the size of RFID tags 1 to be integrated in a regular grid. FIGS. 2A and 2B show the backing layer 20 with a recess 8 formed therein as a plan view (FIG. 2A) and in cross-section (FIG. 2B). By way of illustration, only one recess 8 is shown in the figures, however, a plurality or a plurality of recesses 8 may be formed in the base layer 20.

For example, the recesses 8 may be punched or lasered into the backing layer 20. According to one embodiment, the recesses 8 may, for example, have a square cross-section with a size of, for example, approximately 5 cm × 5 cm, according to one exemplary embodiment. Alternatively, the recesses 8 may have a different cross-sectional shape (e.g., rectangular, round, oval, or any other shape) and / or size, for example, the shape and / or size of the tags to be integrated

(Generally, of electronic components to be integrated).

According to the embodiment shown, radio tags 1 are introduced into the base layer 20.

FIGS. 3A and 3B show the backing layer 20 with a radio tag 1 (shown in other words integrated therein) in plan view (FIG. 3A) and in cross-section (FIG. 3B). In addition to the radio tag 1 shown in FIGS. 3A and 3B, further radio tags 1 can be used in the

Base layer 20 may be incorporated (not shown).

According to the embodiment shown here, the radio tags 1 are encapsulated in an encapsulation layer 5 (with others) prior to introduction into the substrate layer 20

Words, with the encapsulation layer 5 laminated). According to the embodiment shown, the encapsulation layer 5 a thermoplastic layer, and the RFID tags 1 are laminated on both sides (ie, on the top and bottom) with the thermoplastic resin layer 5.

5A and 5B show a laminated radio tag 1, in other words a radio tag 1 after the encapsulation, as a plan view (FIG. 5A) and in cross section (FIG. 5B), according to an exemplary embodiment.

The RFID tags 1 may, for example, be radio tags (e.g., passive RFID tags) for the 13.56 MHz standard, with the reading distance with a handheld antenna being approximately 10 cm, for example. In other words, in this case, the radio tags can be read out to a distance of about 10 cm. Alternatively, radio tags which are set up for a different frequency range or standard can be used. The RFID tags 1 may have unique identifier information (e.g., ID number) for the respective RFID tag 1, which may be read out with a suitable reader.

Each radio tag 1 may, for example, be an antenna 2 (for example an induction coil) formed on the upper side of the radio tag 1, one on the

The top of the radio tag 1 formed chip 3 (e.g., silicon chip) coupled to the antenna 2 and a conductive bridge 4 (e.g., metal bridge) formed on the bottom of the radio tag 1 of the antenna 2, as shown in Fig. 5A and Fig. 5B.

By means of the lamination 5, the radio tag 1 can be protected, for example, from pressure, moisture and chemical influences. Furthermore, by means of the lamination 5, a height compensation of the radio tag 1 can be achieved. In other words, the laminated RFID tag 1 has a flat top and a flat bottom. The lamination 5 can for example be designed so that it is wider on one or more sides, for example on at least two opposite sides, than the RFID tag 1, for example about 0.5 cm to 1 cm wider according to an embodiment. In other words, the lamination 5 {the encapsulation layer 5) on one or more sides, for example on at least two opposite sides, protrude beyond the edge of the radio tag 1. According to the embodiment shown in FIGS. 5A and 5B, the lining 5 is designed so that it protrudes beyond all four edges of the RFID tag 1.

After laminating, the RFID tags 1 can be adjusted to the respective recess 8 of the substrate layer 20 and pressed under pressure and heat into the substrate layer 20. In this case, the protruding edges of the plastic layer 5 connect firmly to the reinforcing fabric 9 and fix the radio tags 1, at the same time the height differences can be compensated. In other words, the RFID tags 1 can be bonded to the backing layer 20 (for example, to the glass fiber fabric) using the plastic layer 5 {in general, the encapsulation layer 5}. FIG. 3A shows a radio tag 1 integrated into the reinforcing fabric 9 in FIG

Top view, Fig. 3B in cross section.

According to another embodiment, the formation of the recesses 8 in the base layer 20 may be dispensed with, for example if the material (for example the material of FIG

Glass fiber fabric 9) of the base layer 20 has a very coarse mesh structure. For example, can be dispensed with the recess (s) 8, if the mesh size of the fabric 9 is large enough that sensitive parts of the radio tags 1 and the wireless modules 1 (eg, the silicon chip 3 or the metal bridge 4 of the antenna coil 2) within a mesh 9a to come to rest. The radio tags 1 can be applied in this case on the base layer 20 {for example, the reinforcing fabric 9), for example, be glued to this according to an embodiment.

FIGS. 4A and 4B show a base layer 20 with a radio tag 1 integrated therein, the formation of the recess (s) in the fabric 9 being omitted during the production of the base layer as described above, and the radio tag 1 thus applied to the fabric 9 or is arranged so that the chip 3 of the radio tag 1 is within a mesh 9a of the fabric 9. In other words, FIGS. 4A and 4B show a plan view and a cross-section, respectively, of the integration of radio tags in a coarse-meshed fabric without a cutout. In the embodiment shown in FIGS. 4A and 4B, the radio tags 1 are on the

Applied underside of the fabric 9. Alternatively, the radio tags 1 can also be applied to the top of the fabric 9.

According to another embodiment, instead of a

Armierungsgewebes {in general, instead of a material with a mesh structure), a material having a permeable structure for the backing layer can be used, and the radio tags (in general, the electronic components) can be introduced and / or applied to the permeable material (not shown).

The production of the base layer 20 with the RFID tags 1 integrated therein according to one of the embodiments described above can be carried out, for example, on a machine which is suitable for roll-to-roll processing.

According to one exemplary embodiment, after the RFID tags 1 have been introduced into the backing layer 20, they can be read out with readers integrated in the process flow and their function can be tested. At the same time (for example Computerprogrammunterstützt or by software) a mapping of the ID numbers of the radio tags 1 are created on the role. The mapping can be delivered together with the roll and thus made available to a customer or installer. In which

Reading process, it is also possible to store manufacturer information in the radio tags 1 with. Thus, for example, a life-time monitoring of the pavement is possible, i. monitoring throughout the life of the pavement.

6 schematically shows a functional test of radio tags 1 integrated in a base layer 20 with a simultaneous mapping of the radio tags 1 on the reel according to an exemplary embodiment. The base layer 20 has a glass fiber fabric 9 with RFID tags 1 introduced therein and / or applied thereto. The glass fiber fabric 9 with the RFID tags 1 is formed as a roll material which can be unrolled from a first roller 18 and rolled up on a second roller 19, wherein between the two rollers 18, 19 by means of a plurality of readers

{6 an example, a first reader 21 and a second reader 22 are shown, alternatively, a different number of readers can be used} and a coupled to the readers 21, 22 control unit 23 read the RFID tags 1, a mapping of the RFID tags 1 created and a function test of the radio tags 1 can be performed. The mapping may for example be stored on a commercially available data carrier 24 or storage medium (for example CD-ROM, DVD-ROM, floppy disk, USB memory stick, etc.) and, for example, together with the

Base layer 20 to be delivered to a customer.

According to another embodiment, each individual radio tag may also contain the mapping information of the entire reel. For this purpose, the radio tags can be set up so that the memory of each radio tag is sufficiently large to accept the mapping information to save. According to one embodiment, the mapping can be created if all radio tags are already integrated in the reel.

Hereinafter, referring to FIG. 7A, a method of manufacturing a floor covering pad according to an embodiment will be described.

In the method, a base layer 20 having radio tags 1 incorporated therein is embedded in a layer 11 of a thermosetting resin material (for example, epoxy resin) so as to form a floor covering pad 25, as shown in Fig. 7A.

According to an alternative embodiment, instead of the synthetic resin layer 11, a layer of one or more other curable materials, e.g. a dispersion adhesive material or a mineral primer material.

The production of the base layer 20 with the RFID tags 1 introduced therein can be effected in accordance with the exemplary embodiment described in conjunction with FIG. 1A to FIG. 3B. Alternatively, the base layer 20 may be formed with the radio tags 1 {general, electronic components} integrated therein according to another of the embodiments described herein.

According to the embodiment shown in FIG. 7A, the base layer 20 with the radio tags 1 is as

Roll material or formed as a role, for example, in a similar manner as shown in Fig. 6 schematiεch.

The embedding of the base layer 20 with the RFID tags 1 integrated therein into the synthetic resin layer 11 and thus the formation of the floor covering underlay 25 can take place, for example, by virtue of the fact that the roll on site {ie where a floor covering is to be installed or laid} on a subfloor (screed) 10 is applied, glued to the bottom 10 with synthetic resin and covered at the same time. Fig. 7A shows the formed on the subfloor 10 flooring pad 25. Alternatively to a

Subfloor (screed), the flooring pad 25 can be arranged on a different surface.

According to an embodiment shown in FIGS. 8A to 8C, the embedding of the base layer 20 may be effected by applying to the underbody 10 a first partial layer IIa of synthetic resin (generally of a first hardenable material) {see FIG. 8A) and the backing layer 20 is applied to the first sub-layer IIa and / or at least partially introduced into the first sub-layer IIa (see FIG. 8B). Subsequently, a second sub-layer IIb of synthetic resin (in general, of a second curable material, which may or may not be the same as the first curable material) on the first sub-layer IIa and the substrate layer

20 are applied (see Fig. 8C). The first sub-layer IIa and the second sub-layer IIb are applied in a not yet cured state. If the base layer 20 has a mesh structure or a permeable structure, then the material of the first partial layer IIa can at least partially come into contact with the material of the second partial layer IIb, and a subsequent hardening of the two partial layers IIa, IIb results in a strong and robust one Connecting the first sub-layer IIa with the second sub-layer IIb, wherein the

Base layer 20 is embedded with the radio tags 1 in the layer 11 formed from the two sub-layers IIa, IIb. Furthermore, a firm connection of the first partial layer IIa with the underbody 10 results.

According to another embodiment, the backing layer 20 may be applied to the underbody 10 and not yet cured first sub-layer IIa introduced (eg embedded), and the sub-layer IIa with the introduced therein (eg embedded) backing layer 20 can then be cured to adhere the sub-layer IIa to the subfloor 10. After the first

Partial layer IIa is at least partially cured, the second sub-layer IIb can be applied to the first sub-layer IIa,

According to another shown in Figs. 9A and 9B

In the embodiment, embedding of the subbing layer 20 in the resin layer 11 may be performed by applying the subbing layer 20 to the subfloor 10 (see FIG. 9A), and then applying the resin layer 11 to the subbing layer 20 (see FIG. 9B).

If the base layer 20 has a mesh structure or a permeable structure, the material of the resin layer 11 may at least partially pass through the mesh / openings of the mesh / permeable structure and contact the subfloor 10, such that upon subsequent curing of the resin layer 11 results in a firm and robust connection of the synthetic resin layer 11 with the subfloor 10, at the same time the base layer 20 with the RFID tags 1 is firmly (or backlash-free) embedded in the cured resin layer 11.

According to another embodiment, a substrate preparation by means of grinding and / or milling and / or shot peening and / or suction can be carried out before the application of the first partial layer IIa or the layer 11 {eg a plastic resin layer) in order to achieve an improved composite of the first partial layer IIa or the Layer 11 to the substrate 10 produce. For example, any gross unevenness, cracks and voids in the substrate 10 can be remedied. Further, according to another embodiment, prior to the application of the first sub-layer IIa or the layer 11, the substrate 10 may be primed, for example with a synthetic resin (eg epoxy resin) or other suitable primer to remove the absorbency and pores in the substrate Substrate 10 to close. Subsequently, the backing layer 20 as described above firmly bonded to the substrate 10.

By means of arranged on the substrate 10

Flooring mat 25 provides a base for all common floor coverings, such as stone, tiles, carpet, parquet, laminate and elastic coverings, with the exception of metal.

A floor covering 1, 2 can then be applied to the floor covering support 25 so that a floor 50 having a plurality of integrated radio tags 1 is obtained, as shown in FIG. 7B. The floor 50 illustratively has a subfloor 10 (screed) and a

Floor covering 12, as well as arranged between the subfloor 10 and the floor covering 12 floor covering 25, which has a embedded in a curable layer 11 pad layer 20 with integrated RFID tags 1, for example, embedded in synthetic glass fiber fabric with integrated radio tags.

Next, referring to FIG. 10A, a method of manufacturing a floor covering according to another embodiment will be described.

The method differs from the method described in connection with FIG. 7A substantially in that when embedding the RFID tags 1 in the resin layer 11 (generally in a curable layer) on a

Base layer is omitted. In other words, the previously laminated radio tags 1 (generally the electronic components) according to this embodiment embedded directly in synthetic resin 11, so that the flooring pad 25 shown in Fig. 10A is obtained. This configuration can be used for example in small areas or strip-like introduction of the radio tags 1 in the floor covering or in the floor covering pad 25. According to one embodiment, the radio tags 1 can be laid by hand and coated with the synthetic resin layer 11. In this case, a mapping and / or a functional test of the radio tags 1 can take place, for example, by reading each radio tag 1 after installation by hand and measuring it in its surroundings. For example, the flooring pad 25 may be formed on a subfloor 10 (screed) as shown in FIG. 10A.

Further, any flooring 12 may be applied to the flooring pad 25 so that, in turn, a floor 50 having radio tags 1 integrated therein is obtained, as shown in FIG. 10B.

Hereinafter, characteristics and effects of exemplary embodiments of the invention will be described.

According to one embodiment, a method is provided which enables the introduction of electronic components (eg RFID tags) in a ground in a simple and cost-effective manner, at the same time the electronic components (eg the radio tags) reliably against high loads to which they be exposed to soil (eg pressure, moisture, chemicals).

According to another embodiment, a method is provided, with which a high quality floor covering for a floor can be produced, or a Floor covering (underlayer), which allows as free as possible a choice of overlying visible flooring.

An effect of embodiments described herein is that electronic components, in particular radio tags (RFID tags), can be integrated in or under any floor covering, whereby, for example, on any surface a location determination is made possible to movable objects with and without human To locate companions and / or robots of all types and / or vehicles and / or persons and to open the possibility of navigation via a central or local control.

Application examples of the above

Localization / navigation by means of radio tags integrated into the ground are, for example, the localization of cleaning robots or transport vehicles, customer counting and customer guidance systems in the supermarket, airports, hospitals or generally in public or private buildings.

Another effect of embodiments described herein is that RFID tags rationally integrated in a regular grid in a pad layer, among all common

Floor coverings - with the exception of metal - introduced and (for example, with resin) can be encapsulated so that they are protected from pressure, moisture and chemicals. At the same time, a mapping can be created when integrating the RFID tags into the backing layer, which eliminates the need for time-consuming individual mapping during on-site installation. According to one embodiment can be dispensed with the base and the laminated RFID tags can be embedded directly in the resin, for example, if only small quantities or individual tracks of radio tags to be laid. In this case, you can create a mapping information on site manual reading and calibration of the radio tags are performed.

According to one embodiment, a method is provided in which one or more radio tags

(In general, one or more electronic components) are introduced into a base layer (for example in a regular grid), as a backing layer in a floor covering for carpets, linoleum, PVC, all other conceivable sheets, tiles, stone floors, concrete floors, terrazzo or a synthetic resin coating suitable is.

According to one embodiment, the backing layer is rolled or larger sheets. Examples of such a backing layer are e.g.

Reinforcing mesh made of fiberglass, polyethylene, polypropylene, polyester, carbon fiber or natural fibers,

The radio tags (generally the electronic ones) are (for example in a regular grid) incorporated in this base layer

Components or electronic modules) introduced.

According to one exemplary embodiment, a recess in the base layer is produced for this purpose in the size of the radio tag in order to achieve height compensation between the module and the base layer. The recess can be produced, for example, by lasering, stamping, cutting, milling or other suitable method.

Is the backing layer of a very coarse-meshed

Tissue, can be dispensed according to another embodiment, the recess. In this case, the introduction of the RFID tags can be carried out so that sensitive areas of the RFID tags such as a silicon chip comes to rest within the mesh of the fabric. According to one exemplary embodiment, the radio tag can be encapsulated on both sides with an encapsulation splitter (for example a thermoplastic polymer layer) in order to compensate for the height of the radio label (between individual components of the radio tag, eg silicon chip, inlay,

To achieve tracks, etc.}, and to ensure protection against mechanical and chemical influences and moisture during installation.

According to one embodiment, the encapsulation layer is chosen to be slightly larger than the radio tag and, according to another embodiment, can thus also be used for gluing the radio tag into the substrate layer.

According to another embodiment, the radio tag is glued into the backing layer under pressure and heat.

According to another embodiment, when inserting the RFID tags in the backing layer by means of a

Reader read the ID number of each radio tag and thus realized a functional test. According to another embodiment, the ID numbers are simultaneously stored with a corresponding software. In this way, a mapping of the roll material can be obtained.

A reel can be supplied with this information (e.g., to a customer) so that after installation it is sufficient to read only the beginning and end of a web, for example, to the physical position of the individual

Quickly determine radio tags in the room.

According to another embodiment, the installation of the backing layer is accomplished by embedding in a curable layer, e.g. a synthetic resin layer

(For example, an epoxy resin layer), for example, has a slightly greater thickness than the substrate layer. The respective substrate (eg concretes and screeds of all kinds, in exceptional cases also tiles, stones of all kinds, artificial stones of all kinds, coatings) can be arranged so that it is free of separating substances, fats or oils. An underground preparation by means of grinding, milling,

Ballistic traction and suction can be carried out to produce an improved or optimal bond to the substrate. Any rough bumps, cracks and hollow parts can be removed or rehabilitated beforehand.

The respective substrate can be provided, for example, first by means of synthetic resin / epoxy resin or another suitable primer in order to remove the absorbency and to close the pores in the substrate. The fabric can then be bonded firmly to the substrate by means of synthetic resin / epoxy resin or another suitable material.

In one embodiment, the coverage of the fabric (eg, a reinforcement fabric) and / or the radio tag with the curable layer (eg, the resin layer) may be about 0.1 mm to 10 mm, for example about 0.5 mm to 4 mm, for example, about greater or equal 2 mm,

A floor covering (floor covering) of a floor may, according to one embodiment, be glued to the fabric with materials corresponding to the material in which the fabric is embedded. The range of the RFID tags is usually large enough to allow any other type of floor to be built on the floor, with the exception of metal floors, as these would shield the electromagnetic waves of a reader,

Will be an additional floor covering on the synthetic resin layer

(Generally, the curable layer) applied, the thickness of this layer can be minimized. According to one In this embodiment, the thickness of the synthetic resin layer may be about 0.1 mm to 2 mm, for example about 1 mm. Alternatively, the synthetic resin layer may have a different thickness.

According to another embodiment can be completely dispensed with the pad layer {eg if only very small areas or individual radio tags are to be laid), and, for example, encapsulated with a plastic layer, radio tags can be embedded directly in the resin layer. In this case, mapping can be done, for example, by reading each tag individually and measuring and mapping its position in space.

This document cites the following publications:

[1] WO 2005/006015 Al

[2] WO 2005/071597 Al

[3] US 6,377,888 p

[4] http://openpr.de/pdf/78770/Intelligenter-Boden-steuert- intelligent-Serviceroboter.pdf

[5] http: // www. stili. en / 9230.0.43. html

[6] http: // www. quiet. de /? id = 9240 # 35660

[7] WO 2007/033980 A2

Claims

claims

Anspruch [en] A method for producing a floor covering underlay, in which: • at least one electronic component in one

Layer, which has at least one curable material is embedded;

The at least one electronic component is introduced into a base layer and / or applied to a base layer;

The base layer is embedded with the electronic component in the layer comprising the at least one curable material;

The backing layer has a structure which is permeable to the at least one curable material or

Has mesh structure or a reinforcing fabric.

2. The method of claim 1, wherein the at least one curable material comprises at least one of the following materials:

• a synthetic resin material;

• a dispersion adhesive material;

• a mineral primer material;

• a mixture of the aforementioned materials.

3. A method according to claim 1 or 2, wherein:

The at least one electronic component is applied to a first part-layer, which has a first hardenable material, and / or is at least partially introduced into the first part-layer;

A second sub-layer, which has a second curable material, is applied to the first sub-layer and to the electronic component, so that the layer is formed with the at least one electronic component embedded therein.

4. The method according to claim 3, wherein the first curable material and / or the second curable material comprises / comprises at least one of the following materials:

• a synthetic resin material; • a dispersion adhesive material;

• a mineral primer material;

• or a mixture of the aforementioned materials.

5. The method according to claim 4, wherein a plurality of electronic components are introduced in a regular pattern in the substrate layer and / or applied to the substrate layer.

6. The method according to any one of claims 1 to 5, wherein the reinforcing fabric comprises at least one of the following materials:

• a fiberglass material;

• polyethylene;

• polypropylene; • polyester;

• a carbon fiber material;

• a natural fiber material;

• metal wires.

7. The method according to any one of claims 1 to 6, wherein in the base layer at least one recess is formed and the at least one electronic component is introduced into the at least one recess.

8. The method of claim 7, wherein the at least one recess is formed by one of the following methods:

• lasers; • punching;

• To cut;

• Milling.

9. The method of claim 1, wherein the at least one electronic component is encapsulated in an encapsulation layer prior to embedding.

10. The method according to claim 1, wherein the at least one electronic component is encapsulated in an encapsulation layer prior to introduction into the substrate layer and / or application on the substrate layer and bonded to the substrate layer using the encapsulation layer.

11. The method of claim 1, wherein the at least one electronic component is a radio identification tag.

12. A method for integrating at least one electronic component in a floor, in which:

• a flooring pad is provided by a method according to any one of claims 1 to 11;

• a floor covering is applied to the floor covering.

13. floor covering, •, with a layer comprising at least one curable material;

• having at least one electronic component embedded in the layer;

• with a backing layer; Wherein the at least one electronic component is introduced into the substrate layer and / or applied to the substrate layer;

• wherein the backing layer is embedded with the electronic component in the layer; and • wherein the backing layer has a structure permeable to the at least one curable material or a Has mesh structure or the backing layer is a reinforcing fabric.

14. The floor covering pad according to claim 13, wherein the at least one curable material comprises one of the following materials:

• a synthetic resin material;

• a dispersion adhesive material;

• a mineral primer material; • a mixture of the aforementioned materials.

15. Floorcovering according to claim 13 or 14, wherein:

The layer has a first part-layer and a second part-layer; The first sub-layer comprises a first curable material;

The second sub-layer comprises a second curable material;

The at least one electronic component is applied to the first partial layer and / or is at least partially introduced into the first partial layer,

• The second sub-layer is applied to the first sub-layer and the electronic component.

16. The floor covering substrate according to claim 15, wherein the first curable material and / or the second curable material comprise / comprises at least one of the following materials:

• a synthetic resin material; • a dispersion adhesive material;

• a mineral primer material;

• a mixture of the aforementioned materials.

17. Floorcovering according to one of claims 13 to 16, wherein a plurality of electronic components introduced in a regular pattern in the backing layer and / or applied to the backing layer.

18. The floor covering substrate according to claim 13, wherein the reinforcing fabric comprises at least one of the following materials: a glass fiber material;

• polyethylene, -

• polypropylene;

• polyester;

• a carbon fiber material; • a natural fiber material;

• metal wires.

19. Floorcovering according to one of claims 13 to 18, wherein in the base layer at least one recess is formed and the at least one electronic

Component is introduced into the at least one recess.

20. Floorcovering according to one of claims 13 to 19, wherein the at least one electronic component is encapsulated in an encapsulation layer.

21. The floor covering pad according to claim 13, wherein the at least one electronic component is encapsulated in an encapsulation layer and bonded to the substrate layer using the encapsulation layer.

22. Floorcovering according to one of claims 13 to 21, wherein the at least one electronic component is a radio identification data carrier.

23. floor with at least one integrated electronic component, comprising:

A flooring pad according to any one of claims 13 to 22; • a floor covering applied to the floor covering.

24. A method of making a backing layer for a floor covering underlay comprising:

Providing a backing layer, the backing layer having a permeable structure or a pattern structure;

• at least one electronic component is introduced into the substrate layer and / or applied to the substrate layer.

25. The method of claim 24, wherein a plurality of electronic components are introduced in a regular pattern in the substrate layer and / or applied to the substrate layer.

26. A method according to claim 24 or 25, wherein the backing layer is a reinforcing fabric.

27. The method of claim 26, wherein the reinforcing fabric comprises at least one of the following materials:

• a fiberglass material;

• polyethylene;

• polypropylene;

• polyester; • a carbon fiber material;

• a natural fiber material

• metal wires.

28. The method according to any one of claims 24 to 27, wherein in the substrate layer at least one recess is formed and the at least one electronic component is introduced into the at least one recess.

29. The method according to claim 28, wherein the at least one recess is formed by one of the following methods: • lasers;

• punching;

• To cut;

• Milling.

30. The method according to any one of claims 24 to 29, wherein the at least one electronic component is encapsulated in an encapsulation layer prior to introduction into the substrate layer and / or application to the substrate layer.

31. The method of claim 30, wherein the at least one electronic device is bonded to the backing layer using the encapsulation layer.

32. The method of claim 24, wherein the at least one electronic component is a radio identification data carrier.

33. Underlay for a floor covering, comprising:

• at least one electronic component, which is introduced into the substrate layer and / or applied to the substrate layer;

• wherein the backing layer has a permeable structure or a mesh structure.

34. The substrate layer according to claim 33, wherein a plurality of electronic components are introduced into the substrate layer in a regular pattern and / or applied to the substrate layer.

35. A backing layer according to claim 33 or 34, wherein the backing layer is a reinforcing fabric.

36. backing layer according to claim 35, wherein the reinforcing fabric comprises at least one of the following materials:

• a fiberglass material;

• polyethylene; • polypropylene;

• polyester;

• a carbon fiber material;

• a natural fiber material;

• metal wires.

37. The substrate layer according to claim 33, wherein at least one recess is formed in the substrate layer and the at least one electronic component is introduced into the at least one recess.

38. The substrate layer according to claim 33, wherein the at least one electronic component is encapsulated in an encapsulation layer.

39. The method of claim 38, wherein the at least one electronic device is bonded to the backing layer using the encapsulant layer.

40. Base layer according to one of claims 33 to 39, wherein the at least one electronic component is a radio identification data carrier.