EP2229470B1 - Verfahren zur gewinnung einer metallmikrostruktur und anhand dieses verfahrens gewonnene mikrostruktur - Google Patents
Verfahren zur gewinnung einer metallmikrostruktur und anhand dieses verfahrens gewonnene mikrostruktur Download PDFInfo
- Publication number
- EP2229470B1 EP2229470B1 EP08867895A EP08867895A EP2229470B1 EP 2229470 B1 EP2229470 B1 EP 2229470B1 EP 08867895 A EP08867895 A EP 08867895A EP 08867895 A EP08867895 A EP 08867895A EP 2229470 B1 EP2229470 B1 EP 2229470B1
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- European Patent Office
- Prior art keywords
- metal
- layer
- microstructure
- substrate
- photosensitive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 65
- 239000002184 metal Substances 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims abstract description 37
- 229920005989 resin Polymers 0.000 claims abstract description 43
- 239000011347 resin Substances 0.000 claims abstract description 43
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims description 23
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 22
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- 238000000151 deposition Methods 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 230000032798 delamination Effects 0.000 claims description 2
- 230000003213 activating effect Effects 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000037452 priming Effects 0.000 claims 1
- 238000009877 rendering Methods 0.000 claims 1
- 230000008021 deposition Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 60
- 239000004642 Polyimide Substances 0.000 description 12
- 229920001721 polyimide Polymers 0.000 description 12
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 5
- 238000005323 electroforming Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Natural products CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- URQUNWYOBNUYJQ-UHFFFAOYSA-N diazonaphthoquinone Chemical compound C1=CC=C2C(=O)C(=[N]=[N])C=CC2=C1 URQUNWYOBNUYJQ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- JUWOETZNAMLKMG-UHFFFAOYSA-N [P].[Ni].[Cu] Chemical compound [P].[Ni].[Cu] JUWOETZNAMLKMG-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/006—Nanostructures, e.g. using aluminium anodic oxidation templates [AAO]
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/024—Electroplating of selected surface areas using locally applied electromagnetic radiation, e.g. lasers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/005—Jewels; Clockworks; Coins
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/10—Bearings
Definitions
- the present invention relates to a method of manufacturing a metal microstructure by a LIGA type technology.
- the invention relates to such a method for producing such a microstructure having a core made of a first metal at least partially coated with a particularly functional layer, a second metal and the geometric dimensions of which are defined accurately. directly by the process.
- the invention also relates to such a metal part obtained by this method.
- the LIGA technique consists of depositing on a conductive substrate or coated with a conductive layer, a layer of a photosensitive resin, to be carried out through a mask corresponding to the contour of the desired microstructure X irradiation by means of a synchrotron; to develop, that is to say to remove by physical or chemical means the portions of the non-irradiated photoresist layer to define a mold having the contour of the microstructure, to galvanically deposit a metal typically nickel in the mold in photosensitive resin then to eliminate the mold to release the microstructure.
- microstructures obtained according to the processes of the prior art are metal microstructures made of a single metal, generally nickel, nickel-phosphorus copper, which is not always optimal depending on the application for which they are intended. Indeed, there are in particular applications for which one or the other of these materials does not have optimum properties from the mechanical point of view than tribological.
- a toothed wheel must be rigid enough to withstand breaking under strong stress but must also have teeth with a low coefficient of friction to facilitate meshing.
- the choice of nickel is therefore very interesting from the point of view of its mechanical strength, on the other hand nickel has tribological properties less interesting since it has a relatively high coefficient of friction.
- the present invention also aims to provide such a method that is simple and inexpensive to implement.
- This method therefore makes it possible to produce finished parts having a core made of a first metal coated with a layer of a second metal and whose desired geometric size precision is defined by the dimensions of the photosensitive resin mold in which the galvanic deposits of the two metals take place, ie in other words by the precision of the photolithography technique used.
- a judicious choice of the two metals forming the microstructure makes it possible to better adapt the mechanical properties of the part to a given application.
- the first metal may be deposited in the form of a thin layer, typically a nickel-phosphorus layer a few tens of micrometers in order to promote a lowering of the friction coefficient of the part and the second metal may be deposited in the form of a block typically nickel, the latter giving the piece the mechanical strength to the piece.
- the first and second metals have different mechanical properties in order to form a microstructure whose mechanical properties are optimized.
- the first metal has a lower coefficient of friction than the second metal, and the second metal has a higher mechanical strength than the first metal.
- the first metal is for example a nickel-phosphorus alloy and the second metal is, for example, nickel.
- said conductive surface of the substrate is formed of a stack of layers of chromium and gold and said conductive surface of the photoresist layer is formed by activation of said resin.
- This method makes it possible to produce several micromechanical structures on the same substrate.
- the method further comprises, before step h) a step of depositing a conducting conductive layer and a repetition of steps b) to g) with a second mask defining a second contour for a second level of the microstructure, for example for producing a gear having two teeth of different diameters.
- the method of the invention finds a particularly advantageous application for the manufacture of micromechanical parts of watch movements.
- the parts may be selected from the group consisting of gear wheels, escape wheels, anchors, pivoted parts, jumper springs, spirals, cams, and passive parts.
- the substrate 1 used in step a) of the process according to the invention is, for example, formed by a wafer of silicon, glass or ceramic to which a conductive layer has been deposited by evaporation. that is to say a layer able to start an electroforming reaction.
- the initiating conductive layer is formed of a sub-layer of chromium 2 and a layer of gold 3 ( figure 1 ).
- the substrate 1 may consist of stainless steel or another metal capable of starting the electroforming reaction. In the case of a stainless steel substrate, the latter will be degreased before use.
- the photosensitive resin 4 used in step b) of the process according to the invention is preferably an octofunctional epoxy-based resin available from Shell Chemical under the reference SU-8 and a photoinitiator chosen from triarylsulfonium such as those described in the patent US 4,058,401 .
- This resin is likely to be photo-polymerized under the action of UV radiation. It will be appreciated that a solvent which has been found suitable for this resin is gammabutyrolactone (GBL).
- GBL gammabutyrolactone
- a novolac-type phenolformaldehyde-based resin in the presence of a DNQ (DiazoNaphthoquinone) photoinitiator may also be used.
- the resin 4 is deposited on the substrate 1 by any suitable means, typically by spinning, to the desired thickness. Typically, the resin thickness is between 150 m ⁇ and 1 mm. Depending on the desired thickness and the deposition technique used the resin 4 will be deposited in one or more times.
- the resin 4 is then heated between 90 and 95 ° C for a time dependent on the deposited thickness to remove the solvent.
- step c) illustrated in figure 3 consists in irradiating the resin layer 4 by means of UV radiation through a mask defining the contour of the desired microstructure M and thus the insolated zones 4a and non-insolated zones 4b.
- this UV irradiation is 200 to 1'000 mJ.cm -2 , measured at a wavelength of 365 nm depending on the thickness of the layer.
- a step of annealing the layer may be necessary to complete the photopolymerization induced by the UV irradiation. This annealing step is preferably carried out at 90 ° C to 95 ° C for 15 to 30 minutes.
- the insolated areas 4a (photopolymerized) become insensitive to a large majority of solvents.
- non-insolated zones may subsequently be dissolved by a solvent.
- the next step d) illustrated in figure 4 consists in developing the non-insolated zones 4b of the photosensitive resin layer in order to reveal, in places, the conductive layer 3 of the substrate 1. This operation is carried out by dissolving the non-insolated zones 4b using a solvent chosen from GBL (gammabutyrolactone) ) and PGMEA (propylene glycol methyl ethyl acetate). An insolated photosensitive resin mold 4a having the contours of a metal structure is thus produced.
- GBL gammabutyrolactone
- PGMEA propylene glycol methyl ethyl acetate
- the following step e) illustrated in figure 5 is to deposit galvanically and uniformly on the mold a layer 5 of a first metal from said conductive layer 3 ensuring that the first layer extends only over a portion of the mold depth and also extends along the vertical walls of the mold.
- the resin layer 4 forming the mold has been activated in order to make it conductive or has been coated with a conductive primer layer.
- the thickness of the layer 5 of this first metal corresponds to the thickness of the lining of the microstructure that it is desired to obtain, typically the thickness of this layer may be between a few microns and a few tens of microns.
- step f) illustrated in figure 6 is to deposit galvanically in the mold coated with the layer 5, a layer 6 of a second metal different from the first to form a block substantially reaching the upper surface of the photoresist 4a, the block being formed of the layer 5 of the first metal and layer 6 of the second metal.
- metal in this context are of course included metal alloys.
- the first and second metals will be selected from the group consisting of nickel, copper, gold or silver, and, as an alloy, gold-copper, nickel-cobalt, nickel-iron, and nickel-phosphorus.
- the thickness of the layer 6 of the second metal may vary depending on the use of the desired microstructure M. Typically, the thickness of the layer 6 of the second metal may vary between 100 microns to 1 mm. In a particular application such as a cam or a pinion, it will be possible, for example, to make a microstructure comprising a layer 5 having good tribological qualities typically made of nickel-phosphorus, and a layer 6 of a second mechanically resistant metal, typically nickel.
- the electroforming conditions in particular the composition of the baths, the geometry of the system, the voltages and current densities, are chosen for each metal or alloy to be electrodeposited according to the techniques well known in the art of electroforming (cf. example Di Bari GA "electroforming” written Electroplating Engineering Handbook 4th Edition by LJ Durney, published by Van Nostrand Reinhold Company Inc., NY USA 1984 ).
- a subsequent step (g), illustrated in figure 7 the electroformed block is leveled with the resin layer.
- This step can be done by abrasion and polishing in order to directly obtain microstructures having a flat upper surface having in particular a surface state compatible with the requirements of the watch industry for the production of high-end movement.
- step h), illustrated in figure 8 consists in delaminating the resin layer and the electrodeposited block from the substrate. Once this delamination operation has been carried out, the photosensitive resin layer is removed from the delaminated structure in order to release the microstructure M thus formed.
- the photopolymerized resin is dissolved in a step i) by N-methylpyrrolidone (NMP) or this resin is removed by plasma etching.
- NMP N-methylpyrrolidone
- the microstructure M thus released can either be used directly or, if appropriate, after appropriate machining. It is understood that thanks to the geometric precision of the resin mold 4, the microstructure M, illustrated in FIG. figure 8 , comprises a core formed from the layer 6 of the second metal and a very precise liner formed from the layer 5 of the first metal. Thus, as illustrated in figure 8 it is possible to obtain a microstructure whose outer, inner and lower walls are coated with the layer 5 of the first metal.
- these walls can advantageously serve as a contact surface in the applications mentioned above such as a cam or a pinion.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nanotechnology (AREA)
- Micromachines (AREA)
- Electroplating Methods And Accessories (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Claims (9)
- Verfahren zur Herstellung einer bimetallisches Mikrostruktur (M), dadurch gekennzeichnet, dass es die folgenden Schritte umfasst:a) Vorsehen eines Substrats (1), wovon wenigstens eine (3) der Flächen leitend ist;b) Aufbringen einer Schicht (4) aus photoempfindlichem Harz auf die leitende Fläche (3) des Substrats (1);c) Bestrahlen der Harzschicht (4) durch eine Maske, die den Umriss (4a) der gewünschten Mikrostruktur definiert;d) Auflösen der nicht bestrahlten Zonen (4b) der Schicht (4) aus photoempfindlichem Harz, um die leitende Fläche (3) des Substrats (1) stellenweise freizulegen und um dann die bestrahlten Zonen (4a) leitend zu maschen;e) galvanisches und gleichmäßiges Abscheiden einer Schicht (5) eines ersten Metalls ausgehend von der leitenden Schicht (3) des Substrats (1) und der leitenden Flächen der Schicht (4a) aus photoempfindiichem Harz;f) galvanisches und gleichmäßiges Abscheiden einer Schicht (6) aus einem zweiten Metall ausgehend von der Schicht des ersten Metalls, um einen Block zu bilden, der im Wesentlichen das Niveau der oberen Oberfläche der Schicht (4) aus photoempfindiichem Harz erreicht;g) Einebnen des Harzes (4) und des abgelagerten Metalls (5, 6), um das Harz und den durch elektrische Ablagerung gebildeten Block auf dasselbe Niveau zu bringen;h) Trennen durch Delamination der Harzschicht (4) und des durch elektrisches Ablagern gebildeten Blocks von dem Substrat (1);i) Entfernen der Schicht (4) aus photoempfindlichem Harz der delaminierten Struktur, um die auf diese Weise gebildete Mikrostruktur (M) freizugeben.
- Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass das erste und das zweite Metall verschieden sind, um eine Mikrostruktur (M) zu bilden, deren mechanische Eigenschaften an eine gegebene Anwendung angepasst sind.
- Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass das erste Metall einen Reibkoeffizienten aufweist, der geringer ist als jener des zweiten Metalls, und dass das zweite Metall einen mechanischen Widerstand aufweist, der höher ist als jener des ersten Metalls.
- Verfahren nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass das erste Metall eine Nickei-Phosphor-Legierung ist und das zweite Metall Nickel ist.
- Verfahren nach einem der vorhergehenden Anspruche, dadurch gekennzeichnet, dass die leitende Fläche (3) des Substrats (1) aus einem Stapel von Chromschichten (2) und (Goldschichten (3) gebildet ist.
- Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die leitenden Flächen der Schicht (4a) aus photoempfindlichem Harz durch Aktivieren des Harzes gebildet werden.
- Verfahren nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass die leitenden Flächen der Schicht (4a) aus photoempfindlichem Harz durch Ablagern einer leitenden Auslöseschicht gebildet werden.
- Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass auf demselben Substrat mehrere mikromechanische Strukturen hergestellt werden.
- Verfahren nach einem der vorhergehenden Anspruche, dadurch gekennzeichnet, dass die metallische Mikrostruktur (M) ein mikromechanisches Teil eines Uhrwerks bildet.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH02036/07A CH704572B1 (fr) | 2007-12-31 | 2007-12-31 | Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé. |
PCT/EP2008/067969 WO2009083488A1 (fr) | 2007-12-31 | 2008-12-19 | Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2229470A1 EP2229470A1 (de) | 2010-09-22 |
EP2229470B1 true EP2229470B1 (de) | 2011-11-16 |
Family
ID=40590002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08867895A Active EP2229470B1 (de) | 2007-12-31 | 2008-12-19 | Verfahren zur gewinnung einer metallmikrostruktur und anhand dieses verfahrens gewonnene mikrostruktur |
Country Status (10)
Country | Link |
---|---|
US (1) | US8557506B2 (de) |
EP (1) | EP2229470B1 (de) |
JP (1) | JP5559699B2 (de) |
KR (1) | KR20100098425A (de) |
CN (1) | CN101918617B (de) |
AT (1) | ATE533873T1 (de) |
CH (1) | CH704572B1 (de) |
HK (1) | HK1151562A1 (de) |
RU (1) | RU2481422C2 (de) |
WO (1) | WO2009083488A1 (de) |
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CN102478765A (zh) * | 2011-05-10 | 2012-05-30 | 深圳光启高等理工研究院 | 一种制备微结构的方法 |
JP5854875B2 (ja) * | 2012-02-21 | 2016-02-09 | セイコーインスツル株式会社 | 電鋳部品 |
JP6211754B2 (ja) * | 2012-09-28 | 2017-10-11 | セイコーインスツル株式会社 | 機械部品の製造方法、及び機械部品 |
JP5294287B1 (ja) * | 2012-10-30 | 2013-09-18 | 株式会社Leap | コイル素子の製造方法 |
WO2014068614A1 (ja) * | 2012-10-30 | 2014-05-08 | 株式会社Leap | 樹脂基板を用い、電気鋳造によりコイル素子を製造する方法 |
EP3171229A1 (de) * | 2015-11-19 | 2017-05-24 | Nivarox-FAR S.A. | Uhrwerkskomponente |
HK1220859A2 (zh) * | 2016-02-29 | 2017-05-12 | Master Dynamic Ltd | 製作工藝 |
CN106000489A (zh) * | 2016-06-30 | 2016-10-12 | 中国科学院重庆绿色智能技术研究院 | 一种微通孔列阵生物芯片的热刺穿制作方法 |
EP3266738B1 (de) * | 2016-07-06 | 2019-03-06 | The Swatch Group Research and Development Ltd. | Herstellungsverfahren für ein uhrenbauteil, das mit einer mehrstufigen habillage ausgestattet ist |
JP6703674B2 (ja) * | 2016-09-21 | 2020-06-03 | 株式会社東海理化電機製作所 | Mems装置の製造方法 |
JP7102778B2 (ja) * | 2018-02-27 | 2022-07-20 | セイコーエプソン株式会社 | 時計用ムーブメントおよび時計 |
EP3536826B1 (de) * | 2018-03-09 | 2021-04-28 | The Swatch Group Research and Development Ltd | Herstellungsverfahren eines metalldekoreinsatzes auf einem zifferblatt, und mit diesem verfahren erzeugtes zifferblatt |
EP3575447A1 (de) * | 2018-05-28 | 2019-12-04 | The Swatch Group Research and Development Ltd | Herstellungsverfahren eines metalldekoreinsatzes auf einem ziffernblatt, und mit diesem verfahren erzeugtes ziffernblatt |
EP3670440A1 (de) | 2018-12-21 | 2020-06-24 | Rolex Sa | Verfahren zur herstellung einer uhrenkomponente |
EP3670441A1 (de) | 2018-12-21 | 2020-06-24 | Rolex Sa | Verfahren zur herstellung einer uhrenkomponente |
EP3839624B1 (de) * | 2019-12-18 | 2023-09-13 | Nivarox-FAR S.A. | Verfahren zur herstellung einer uhrkomponente |
EP3839626B1 (de) * | 2019-12-18 | 2023-10-11 | Nivarox-FAR S.A. | Verfahren zur herstellung einer uhrkomponente |
EP3839625A1 (de) | 2019-12-18 | 2021-06-23 | Nivarox-FAR S.A. | Verfahren zur herstellung einer uhrkomponente und nach diesem verfahren hergestellte komponente |
CN113060701A (zh) * | 2021-04-30 | 2021-07-02 | 苏州华易航动力科技有限公司 | 一种蒸发冷却微结构的制备方法 |
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US4058401A (en) * | 1974-05-02 | 1977-11-15 | General Electric Company | Photocurable compositions containing group via aromatic onium salts |
JPS57171682A (en) * | 1981-04-14 | 1982-10-22 | Citizen Watch Co Ltd | Manufacture of display plate for timepiece |
RU2050423C1 (ru) * | 1989-05-23 | 1995-12-20 | Геннадий Ильич Шпаков | Гальванопластический способ изготовления деталей, преимущественно матриц пресс-форм |
US5190637A (en) * | 1992-04-24 | 1993-03-02 | Wisconsin Alumni Research Foundation | Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers |
DE19607277A1 (de) * | 1995-03-29 | 1996-10-02 | Bosch Gmbh Robert | Lochscheibe, insbesondere für Einspritzventile |
US6136513A (en) * | 1997-06-13 | 2000-10-24 | International Business Machines Corporation | Method of uniformly depositing seed and a conductor and the resultant printed circuit structure |
SE523309E (sv) * | 2001-06-15 | 2010-03-02 | Replisaurus Technologies Ab | Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt |
US20040065554A1 (en) * | 2002-05-07 | 2004-04-08 | University Of Southern California | Method of and apparatus for forming three-dimensional structures integral with semiconductor based circuitry |
EP1596259A1 (de) | 2004-05-10 | 2005-11-16 | Precision Engineering AG | Verfahren zum Herstellen von metallischen Körpern geringer Höhe, insbesondere von Uhrenbestandteilen |
EP1835050A1 (de) * | 2006-03-15 | 2007-09-19 | Doniar S.A. | Verfahren zur Herstellung einer LIGA-UV metallischen Mehrschichtstruktur, deren Schichten nebeneinanderliegend und nicht völlig überlagert sind. |
EP1835339B1 (de) * | 2006-03-15 | 2012-05-16 | Rolex S.A. | LIGA Verfahren zur Herstellung einer einzel- oder mehrlagigen metallischen Struktur und damit hergestellte Struktur |
-
2007
- 2007-12-31 CH CH02036/07A patent/CH704572B1/fr not_active IP Right Cessation
-
2008
- 2008-12-19 WO PCT/EP2008/067969 patent/WO2009083488A1/fr active Application Filing
- 2008-12-19 RU RU2010132147/02A patent/RU2481422C2/ru active
- 2008-12-19 EP EP08867895A patent/EP2229470B1/de active Active
- 2008-12-19 AT AT08867895T patent/ATE533873T1/de active
- 2008-12-19 US US12/811,356 patent/US8557506B2/en active Active
- 2008-12-19 KR KR1020107014388A patent/KR20100098425A/ko not_active Application Discontinuation
- 2008-12-19 CN CN2008801236457A patent/CN101918617B/zh active Active
- 2008-12-19 JP JP2010540105A patent/JP5559699B2/ja active Active
-
2011
- 2011-06-07 HK HK11105663.2A patent/HK1151562A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
US20110020754A1 (en) | 2011-01-27 |
EP2229470A1 (de) | 2010-09-22 |
WO2009083488A1 (fr) | 2009-07-09 |
RU2010132147A (ru) | 2012-02-10 |
CN101918617B (zh) | 2012-05-02 |
ATE533873T1 (de) | 2011-12-15 |
CH704572B1 (fr) | 2012-09-14 |
RU2481422C2 (ru) | 2013-05-10 |
KR20100098425A (ko) | 2010-09-06 |
US8557506B2 (en) | 2013-10-15 |
JP2011521098A (ja) | 2011-07-21 |
HK1151562A1 (en) | 2012-02-03 |
CN101918617A (zh) | 2010-12-15 |
JP5559699B2 (ja) | 2014-07-23 |
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