EP2179248A1 - Optischer positionssensor auf organischer basis - Google Patents
Optischer positionssensor auf organischer basisInfo
- Publication number
- EP2179248A1 EP2179248A1 EP08786947A EP08786947A EP2179248A1 EP 2179248 A1 EP2179248 A1 EP 2179248A1 EP 08786947 A EP08786947 A EP 08786947A EP 08786947 A EP08786947 A EP 08786947A EP 2179248 A1 EP2179248 A1 EP 2179248A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- optical sensor
- organic
- photodiodes
- sensor according
- sensors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 2
- 238000004146 energy storage Methods 0.000 claims 1
- 238000013086 organic photovoltaic Methods 0.000 claims 1
- 238000012360 testing method Methods 0.000 abstract description 9
- 238000005259 measurement Methods 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 9
- 238000001514 detection method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000011888 foil Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000301 poly(3-hexylthiophene-2,5-diyl) polymer Polymers 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- -1 Rium Chemical compound 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920000144 PEDOT:PSS Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- MCEWYIDBDVPMES-UHFFFAOYSA-N [60]pcbm Chemical compound C123C(C4=C5C6=C7C8=C9C%10=C%11C%12=C%13C%14=C%15C%16=C%17C%18=C(C=%19C=%20C%18=C%18C%16=C%13C%13=C%11C9=C9C7=C(C=%20C9=C%13%18)C(C7=%19)=C96)C6=C%11C%17=C%15C%13=C%15C%14=C%12C%12=C%10C%10=C85)=C9C7=C6C2=C%11C%13=C2C%15=C%12C%10=C4C23C1(CCCC(=O)OC)C1=CC=CC=C1 MCEWYIDBDVPMES-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002159 nanocrystal Substances 0.000 description 1
- 239000002070 nanowire Substances 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
- H10K39/30—Devices controlled by radiation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
- H10K39/30—Devices controlled by radiation
- H10K39/32—Organic image sensors
Definitions
- the invention relates to an optical sensor such as for non-contact position and motion measurement with integrated or glued detectors ("on-demand”), for triangulation with one or more optical sensors, for laser tests (beam symmetry), for aligning several Objects, for testing for roughness, flatness, etc., for positioning X-ray sources and beams, for vibration testing and also for sighting can be used.
- an optical sensor such as for non-contact position and motion measurement with integrated or glued detectors ("on-demand"), for triangulation with one or more optical sensors, for laser tests (beam symmetry), for aligning several Objects, for testing for roughness, flatness, etc., for positioning X-ray sources and beams, for vibration testing and also for sighting can be used.
- Exact position detection is gaining in importance in an increasing number of applications in the industrial and medical sectors.
- a contactless precise position determination as it is detected by quadrant sensors, for example, is important.
- the conventional position sensors are accordingly expensive and difficult to manufacture and stiff to handle due to conventional semiconductor technology.
- the price increases disproportionately.
- Object of the present invention is therefore to provide a sensor for position determination, which is mass production suitable and inexpensive to produce.
- the general operating principle involves the detection of a light beam, wherein the light beam to be detected has a diameter which is smaller than the total diode area but larger than the distance between the diode segments.
- quadrant sensors work after
- the circle formed by the photodiodes is subdivided, for example, into 4 photodiodes, so that, according to the invention, a so-called quadrant sensor of organic photodiodes is formed.
- the currents may be represented as voltages according to the prior art.
- Organic sensors for position determination can be produced over a large area over several square centimeters.
- the organic diodes are manufactured at low temperatures ( ⁇ 200 ° C). They are therefore suitable for integration on flexible objects that need to be precisely aligned.
- Figure 1 shows the scheme of a quadrant sensor with several combined diodes and an incident light beam.
- FIG. 2 shows the scheme for the construction of an organic photodiode
- FIG. 3 shows a schematic of peelable quadrant sensors on continuous foil.
- FIG. 1 shows the diagram of a quadrant sensor with combined photodiodes and an incident light beam.
- the light beam falls on all 4 quadrants A, B, C and D of the circle, so that the detection of the position signal is performed by the formula already explained above.
- FIG. 2 shows the diagram of a structure of an organic quadrant diode. In the plan view, all four quadrants are visible, whereas in cross section the layer structure of a quadrant or segment is shown as representative of all.
- the blend 4 of the two components P3HT (absorber and hole transport component) and PCBM (electron acceptor and transport component) is here the absorbing layer and acts as a so-called "Buik Heterojunction", i. the separation of the charge carriers occurs at the interfaces of the two materials, which form within the entire layer volume.
- the illumination of the Competitionrantensensors can be done by the top or bottom electrode.
- highly transparent diodes By choosing a highly transparent material for the absorbing layer and / or by diluting the light-absorbing layer, highly transparent diodes can be produced.
- an infrared detector transparent to visible light.
- the transparent position sensor can be mounted almost invisibly.
- FIG. 2 shows a possible structure for the photodiodes.
- the substrate and the lower electrode or the upper electrode and the passivation are made of an at least semi-transparent material and in a correspondingly thin layer thickness (e.g., ⁇ 20 nm metal layer).
- only one of the two electrodes is structured as a circular segment.
- the counterelectrode and the active organic layers can be deposited unstructured, or else roughly structured by a shadow mask or the like.
- a quadrant sensor is composed of several, for example, four individual photodiodes.
- FIG. 3 shows how the structure shown in the preceding figures presents a very simple and cost-effectively producible optical sensor solution.
- Depicted are preferably detachable quadrant sensors on endless substrate or continuous foil 1, which is for example a PET film.
- the advantages of the arrangement are made possible by the availability of organic photosensitive materials.
- the structure illustrated in the figures enables a very simple and inexpensive producible integrable optical sensor solution.
- the sensor can also be used with strong electromagnetic sensors. Due to the option of a construction on flexible substrates, a very simple adaptation to different surfaces (geometries) is conceivable.
- the quadrant detector can also be manufactured in any size and matched to the spectral properties of the light source.
- the organic quadrant sensor can also be sterilized (e.g., by UV irradiation).
- the complete sensor can be flexibly designed.
- An organic solar cell could supply the necessary energy to supply the electronic components. If the sensor is operated in photovoltaic mode, the detector surface itself generates energy in order, for example, to supply a wireless transmission of the measurement signals and position to a receiving unit.
- the invention relates to an optical sensor such as for non-contact position and motion measurement with integrated or glued detectors ("on-demand"), for triangulation with multiple optical sensors, for laser tests (beam symmetry), for alignment of multiple objects, for tests on roughness, flatness, etc., for positioning of X-ray sources and beams, for vibration testing and also for sighting can be used. In contrast to the conventional expensive and inflexible quadrant sensors, these are manufactured on the basis of organic photodiodes.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007038905A DE102007038905A1 (de) | 2007-08-17 | 2007-08-17 | Optischer Positionssensor auf organischer Basis |
| PCT/EP2008/060341 WO2009024467A1 (de) | 2007-08-17 | 2008-08-06 | Optischer positionssensor auf organischer basis |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP2179248A1 true EP2179248A1 (de) | 2010-04-28 |
Family
ID=39876603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP08786947A Withdrawn EP2179248A1 (de) | 2007-08-17 | 2008-08-06 | Optischer positionssensor auf organischer basis |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP2179248A1 (de) |
| DE (1) | DE102007038905A1 (de) |
| WO (1) | WO2009024467A1 (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009038487A1 (de) * | 2009-08-21 | 2011-05-05 | Siemens Aktiengesellschaft | System zur Positionsermittlung |
| DE102010011025B3 (de) * | 2010-03-11 | 2011-07-28 | Siemens Aktiengesellschaft, 80333 | Sensoranordnung |
| DE202011102825U1 (de) * | 2011-06-15 | 2012-09-18 | Leuze Electronic Gmbh & Co. Kg | Optischer Sensor |
| DE102017209498A1 (de) | 2017-06-06 | 2018-12-06 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Sensorbauelement und Verfahren zum Herstellen desselben |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3918814A (en) * | 1974-05-13 | 1975-11-11 | Weiser Robodyne Corp | Optical position sensor |
| GB1511265A (en) * | 1974-05-31 | 1978-05-17 | Nasa | Apparatus for sensing the relative position of two object |
| JP2001284631A (ja) * | 2000-03-30 | 2001-10-12 | Toshiba Corp | 光検出器及び光検出システム |
| US20030121976A1 (en) * | 2002-01-03 | 2003-07-03 | Nokia Corporation | Organic light sensors for use in a mobile communication device |
| US6726099B2 (en) * | 2002-09-05 | 2004-04-27 | Honeywell International Inc. | RFID tag having multiple transceivers |
| DE10244177A1 (de) | 2002-09-23 | 2004-04-08 | Siemens Ag | Bilddetektor für Röntgeneinrichtungen mit rückseitig kontaktierten, organischen Bild-Sensoren |
| DE10301071A1 (de) * | 2003-01-14 | 2004-07-22 | Siemens Ag | Vorrichtung und Verfahren zum Einstellen der Brennfleckposition einer Röntgenröhre |
| JP2005032852A (ja) * | 2003-07-09 | 2005-02-03 | Matsushita Electric Ind Co Ltd | 有機光電変換素子 |
| DE102006025469A1 (de) * | 2006-05-30 | 2007-12-06 | Siemens Ag | Lichtschranke |
| DE102007015471B3 (de) * | 2007-03-30 | 2008-08-14 | Siemens Ag | Umgebungslichtsensor |
-
2007
- 2007-08-17 DE DE102007038905A patent/DE102007038905A1/de not_active Ceased
-
2008
- 2008-08-06 EP EP08786947A patent/EP2179248A1/de not_active Withdrawn
- 2008-08-06 WO PCT/EP2008/060341 patent/WO2009024467A1/de not_active Ceased
Non-Patent Citations (2)
| Title |
|---|
| None * |
| See also references of WO2009024467A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102007038905A1 (de) | 2009-04-02 |
| WO2009024467A1 (de) | 2009-02-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| 17P | Request for examination filed |
Effective date: 20100209 |
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| AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR |
|
| AX | Request for extension of the european patent |
Extension state: AL BA MK RS |
|
| 17Q | First examination report despatched |
Effective date: 20100706 |
|
| DAX | Request for extension of the european patent (deleted) | ||
| RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: SIEMENS AKTIENGESELLSCHAFT |
|
| RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: SIEMENS HEALTHCARE GMBH |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
| 18D | Application deemed to be withdrawn |
Effective date: 20170930 |