EP2173114A4 - Diaphragm structure and acoustic sensor - Google Patents
Diaphragm structure and acoustic sensorInfo
- Publication number
- EP2173114A4 EP2173114A4 EP07859774A EP07859774A EP2173114A4 EP 2173114 A4 EP2173114 A4 EP 2173114A4 EP 07859774 A EP07859774 A EP 07859774A EP 07859774 A EP07859774 A EP 07859774A EP 2173114 A4 EP2173114 A4 EP 2173114A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- acoustic sensor
- diaphragm structure
- diaphragm
- acoustic
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0001—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means
- G01L9/0008—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations
- G01L9/0016—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations of a diaphragm
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pressure Sensors (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Micromachines (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007164647 | 2007-06-22 | ||
PCT/JP2007/073881 WO2009001488A1 (en) | 2007-06-22 | 2007-12-11 | Diaphragm structure and acoustic sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2173114A1 EP2173114A1 (en) | 2010-04-07 |
EP2173114A4 true EP2173114A4 (en) | 2011-10-19 |
Family
ID=40185318
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP07859774A Withdrawn EP2173114A4 (en) | 2007-06-22 | 2007-12-11 | Diaphragm structure and acoustic sensor |
Country Status (6)
Country | Link |
---|---|
US (1) | US8146437B2 (en) |
EP (1) | EP2173114A4 (en) |
JP (1) | JP2009033698A (en) |
CN (1) | CN101682821A (en) |
TW (1) | TW200901803A (en) |
WO (1) | WO2009001488A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI428030B (en) * | 2009-12-08 | 2014-02-21 | Ind Tech Res Inst | Thin film structure and sound sensing device |
JP5267627B2 (en) * | 2011-08-30 | 2013-08-21 | オムロン株式会社 | Acoustic sensor and manufacturing method thereof |
JP2016095284A (en) * | 2014-11-17 | 2016-05-26 | セイコーエプソン株式会社 | Electronic device, physical quantity sensor, pressure sensor, altimeter, electronic apparatus and movable body |
US10470674B2 (en) | 2016-03-17 | 2019-11-12 | Intel Corporation | Technologies for a fabric acoustic sensor |
US9869598B1 (en) * | 2016-06-24 | 2018-01-16 | Honeywell International Inc. | Low cost small force sensor |
EP3703389A1 (en) * | 2016-08-26 | 2020-09-02 | Sonion Nederland B.V. | Vibration sensor with low-frequency roll-off response curve |
KR101776752B1 (en) | 2016-09-02 | 2017-09-08 | 현대자동차 주식회사 | Microphone |
US11649717B2 (en) | 2018-09-17 | 2023-05-16 | Saudi Arabian Oil Company | Systems and methods for sensing downhole cement sheath parameters |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10126621A1 (en) * | 2000-06-05 | 2001-12-06 | Denso Corp | Semiconductor pressure sensor with a rounded corner part of a membrane for picking up pressure has a recess on a semiconductor substrate with a sidewall, a bottom wall acting as a membrane and a corner part with a bending radius |
US20040056560A1 (en) * | 2002-09-25 | 2004-03-25 | Intel Corporation | Fabrication of film bulk acoustic resonators on silicon <110> wafers using crystal-orientation-dependent anisotropic etching |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60138434A (en) * | 1983-12-27 | 1985-07-23 | Fuji Electric Co Ltd | Manufacture of semiconductor electrostatic capacity type pressure sensor |
US5146435A (en) * | 1989-12-04 | 1992-09-08 | The Charles Stark Draper Laboratory, Inc. | Acoustic transducer |
US5289721A (en) * | 1990-09-10 | 1994-03-01 | Nippondenso Co., Ltd. | Semiconductor pressure sensor |
DE4238571C1 (en) * | 1992-11-16 | 1994-06-01 | Kernforschungsz Karlsruhe | Process for the production of membranes spanned by a frame |
JP3482028B2 (en) * | 1995-03-01 | 2003-12-22 | 株式会社リコー | Micro sensor |
JPH1073505A (en) * | 1996-08-30 | 1998-03-17 | Matsushita Electric Works Ltd | Manufacture of semiconductor device |
TW457504B (en) * | 1999-06-25 | 2001-10-01 | Tokyo Sensor Co Ltd | Elongated shape switch and its manufacturing method |
JP3873630B2 (en) | 2001-01-29 | 2007-01-24 | セイコーエプソン株式会社 | Manufacturing method of condenser microphone |
US7497962B2 (en) * | 2004-08-06 | 2009-03-03 | Canon Kabushiki Kaisha | Method of manufacturing liquid discharge head and method of manufacturing substrate for liquid discharge head |
US7373835B2 (en) * | 2005-01-31 | 2008-05-20 | Sanyo Electric Industries, Ltd. | Semiconductor sensor |
JP2007097116A (en) * | 2005-08-29 | 2007-04-12 | Sanyo Electric Co Ltd | Sensor |
US20090074211A1 (en) * | 2005-08-30 | 2009-03-19 | Yamaha Corporation | Capacitor microphone and method for manufacturing capacitor microphone |
JP3876915B1 (en) * | 2005-08-30 | 2007-02-07 | ヤマハ株式会社 | Condenser microphone and method of manufacturing condenser microphone |
-
2007
- 2007-12-06 JP JP2007315540A patent/JP2009033698A/en active Pending
- 2007-12-11 CN CN200780053193A patent/CN101682821A/en active Pending
- 2007-12-11 WO PCT/JP2007/073881 patent/WO2009001488A1/en active Application Filing
- 2007-12-11 EP EP07859774A patent/EP2173114A4/en not_active Withdrawn
-
2008
- 2008-01-21 TW TW097102248A patent/TW200901803A/en unknown
-
2009
- 2009-12-03 US US12/630,179 patent/US8146437B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10126621A1 (en) * | 2000-06-05 | 2001-12-06 | Denso Corp | Semiconductor pressure sensor with a rounded corner part of a membrane for picking up pressure has a recess on a semiconductor substrate with a sidewall, a bottom wall acting as a membrane and a corner part with a bending radius |
US20040056560A1 (en) * | 2002-09-25 | 2004-03-25 | Intel Corporation | Fabrication of film bulk acoustic resonators on silicon <110> wafers using crystal-orientation-dependent anisotropic etching |
Non-Patent Citations (1)
Title |
---|
See also references of WO2009001488A1 * |
Also Published As
Publication number | Publication date |
---|---|
US20100077863A1 (en) | 2010-04-01 |
CN101682821A (en) | 2010-03-24 |
WO2009001488A1 (en) | 2008-12-31 |
EP2173114A1 (en) | 2010-04-07 |
TW200901803A (en) | 2009-01-01 |
JP2009033698A (en) | 2009-02-12 |
US8146437B2 (en) | 2012-04-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20100120 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL BA HR MK RS |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20110915 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 29/84 20060101ALI20110909BHEP Ipc: G01L 9/00 20060101ALI20110909BHEP Ipc: H04R 19/04 20060101AFI20110909BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20111017 |