EP2173114A4 - Diaphragm structure and acoustic sensor - Google Patents

Diaphragm structure and acoustic sensor

Info

Publication number
EP2173114A4
EP2173114A4 EP07859774A EP07859774A EP2173114A4 EP 2173114 A4 EP2173114 A4 EP 2173114A4 EP 07859774 A EP07859774 A EP 07859774A EP 07859774 A EP07859774 A EP 07859774A EP 2173114 A4 EP2173114 A4 EP 2173114A4
Authority
EP
European Patent Office
Prior art keywords
acoustic sensor
diaphragm structure
diaphragm
acoustic
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07859774A
Other languages
German (de)
French (fr)
Other versions
EP2173114A1 (en
Inventor
Takeuchi Yusuke
Ogura Hiroshi
Miyoshi Yuishi
Yamaoka Tohru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of EP2173114A1 publication Critical patent/EP2173114A1/en
Publication of EP2173114A4 publication Critical patent/EP2173114A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0001—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means
    • G01L9/0008—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations
    • G01L9/0016—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations of a diaphragm
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
EP07859774A 2007-06-22 2007-12-11 Diaphragm structure and acoustic sensor Withdrawn EP2173114A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007164647 2007-06-22
PCT/JP2007/073881 WO2009001488A1 (en) 2007-06-22 2007-12-11 Diaphragm structure and acoustic sensor

Publications (2)

Publication Number Publication Date
EP2173114A1 EP2173114A1 (en) 2010-04-07
EP2173114A4 true EP2173114A4 (en) 2011-10-19

Family

ID=40185318

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07859774A Withdrawn EP2173114A4 (en) 2007-06-22 2007-12-11 Diaphragm structure and acoustic sensor

Country Status (6)

Country Link
US (1) US8146437B2 (en)
EP (1) EP2173114A4 (en)
JP (1) JP2009033698A (en)
CN (1) CN101682821A (en)
TW (1) TW200901803A (en)
WO (1) WO2009001488A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI428030B (en) * 2009-12-08 2014-02-21 Ind Tech Res Inst Thin film structure and sound sensing device
JP5267627B2 (en) * 2011-08-30 2013-08-21 オムロン株式会社 Acoustic sensor and manufacturing method thereof
JP2016095284A (en) * 2014-11-17 2016-05-26 セイコーエプソン株式会社 Electronic device, physical quantity sensor, pressure sensor, altimeter, electronic apparatus and movable body
US10470674B2 (en) 2016-03-17 2019-11-12 Intel Corporation Technologies for a fabric acoustic sensor
US9869598B1 (en) * 2016-06-24 2018-01-16 Honeywell International Inc. Low cost small force sensor
DK3279621T5 (en) * 2016-08-26 2021-05-31 Sonion Nederland Bv VIBRATION SENSOR WITH LOW FREQUENCY ROLL-OFF RESPONSE CURVE
KR101776752B1 (en) 2016-09-02 2017-09-08 현대자동차 주식회사 Microphone
US11649717B2 (en) 2018-09-17 2023-05-16 Saudi Arabian Oil Company Systems and methods for sensing downhole cement sheath parameters

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10126621A1 (en) * 2000-06-05 2001-12-06 Denso Corp Semiconductor pressure sensor with a rounded corner part of a membrane for picking up pressure has a recess on a semiconductor substrate with a sidewall, a bottom wall acting as a membrane and a corner part with a bending radius
US20040056560A1 (en) * 2002-09-25 2004-03-25 Intel Corporation Fabrication of film bulk acoustic resonators on silicon <110> wafers using crystal-orientation-dependent anisotropic etching

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60138434A (en) * 1983-12-27 1985-07-23 Fuji Electric Co Ltd Manufacture of semiconductor electrostatic capacity type pressure sensor
US5146435A (en) * 1989-12-04 1992-09-08 The Charles Stark Draper Laboratory, Inc. Acoustic transducer
US5289721A (en) 1990-09-10 1994-03-01 Nippondenso Co., Ltd. Semiconductor pressure sensor
DE4238571C1 (en) * 1992-11-16 1994-06-01 Kernforschungsz Karlsruhe Process for the production of membranes spanned by a frame
JP3482028B2 (en) * 1995-03-01 2003-12-22 株式会社リコー Micro sensor
JPH1073505A (en) * 1996-08-30 1998-03-17 Matsushita Electric Works Ltd Manufacture of semiconductor device
TW457504B (en) * 1999-06-25 2001-10-01 Tokyo Sensor Co Ltd Elongated shape switch and its manufacturing method
JP3873630B2 (en) 2001-01-29 2007-01-24 セイコーエプソン株式会社 Manufacturing method of condenser microphone
US7497962B2 (en) 2004-08-06 2009-03-03 Canon Kabushiki Kaisha Method of manufacturing liquid discharge head and method of manufacturing substrate for liquid discharge head
US7373835B2 (en) * 2005-01-31 2008-05-20 Sanyo Electric Industries, Ltd. Semiconductor sensor
JP2007097116A (en) * 2005-08-29 2007-04-12 Sanyo Electric Co Ltd Sensor
KR20080031467A (en) 2005-08-30 2008-04-08 야마하 가부시키가이샤 Capacitor microphone and method for manufacturing capacitor microphone
JP3876915B1 (en) * 2005-08-30 2007-02-07 ヤマハ株式会社 Condenser microphone and method of manufacturing condenser microphone

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10126621A1 (en) * 2000-06-05 2001-12-06 Denso Corp Semiconductor pressure sensor with a rounded corner part of a membrane for picking up pressure has a recess on a semiconductor substrate with a sidewall, a bottom wall acting as a membrane and a corner part with a bending radius
US20040056560A1 (en) * 2002-09-25 2004-03-25 Intel Corporation Fabrication of film bulk acoustic resonators on silicon <110> wafers using crystal-orientation-dependent anisotropic etching

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2009001488A1 *

Also Published As

Publication number Publication date
TW200901803A (en) 2009-01-01
US20100077863A1 (en) 2010-04-01
CN101682821A (en) 2010-03-24
US8146437B2 (en) 2012-04-03
EP2173114A1 (en) 2010-04-07
WO2009001488A1 (en) 2008-12-31
JP2009033698A (en) 2009-02-12

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20110915

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 29/84 20060101ALI20110909BHEP

Ipc: G01L 9/00 20060101ALI20110909BHEP

Ipc: H04R 19/04 20060101AFI20110909BHEP

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